类别是'嵌入式 - 微控制器'
嵌入式 - 微控制器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 最大功率耗散 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 界面 | 内存大小 | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | uPs/uCs/外围ICs类型 | 比特数 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 电源电流-最大值 | 位元大小 | 访问时间 | 有ADC | DMA 通道 | 数据总线宽度 | 脉宽调制通道 | 数模转换器通道 | 定时器/计数器的数量 | 地址总线宽度 | 密度 | 核心架构 | EEPROM 大小 | 片上程序 ROM 宽度 | 处理器系列 | 边界扫描 | 低功率模式 | 筛选水平 | A/D转换器数量 | 外部数据总线宽度 | 可编程I/O数 | 格式 | 集成缓存 | 内存(字) | UART 通道数 | ADC通道数量 | 定时器数量 | 外部中断数量 | PWM通道数 | 总线兼容性 | I2C通道数 | 桶式移位器 | 内部总线架构 | SPI 通道数 | USB 通道数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||||||
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![]() | MSP430F6779IPZ | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 62 | 有 | 32K x 8 | ACTIVE (Last Updated: 5 days ago) | Gold | 表面贴装 | 表面贴装 | 100-LQFP | 100 | A/D 8x10b | -40°C~85°C TA | Tray | MSP430F6xx | e4 | yes | 活跃 | 3 (168 Hours) | 100 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 25MHz | 未说明 | MSP430 | 100 | 不合格 | 3.6V | 2/3.3V | I2C, IrDA, LIN, SPI, UART, USART | Internal | 512kB | 1.8V~3.6V | 微处理器电路 | CPUXV2 | Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT, 7x24b Sigma Delta Converter | FLASH | 16-Bit | 512KB 512K x 8 | I2C, IrDA, LINbus, SPI, UART/USART | 16 | YES | 32b | 4 | 8 | 32 | I2C; SPI; UART | 1.6mm | 14mm | 14mm | 1.4mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MC9S08QG4CPAE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 4 | 通孔 | 8-DIP (0.300, 7.62mm) | NO | A/D 4x10b | -40°C~85°C TA | Tube | 1999 | S08 | e3 | 活跃 | 不适用 | 8 | 3A991.A.2 | 哑光锡 | DUAL | 未说明 | 3V | 未说明 | MC9S08QG4 | R-PDIP-T8 | 不合格 | 3.6V | 1.8/3.6V | 1.8V | Internal | 20MHz | 256 x 8 | 1.8V~3.6V | MICROCONTROLLER | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 4KB 4K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | NO | 9.779mm | 7.62mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | PIC18F6723-I/PT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 54 | 有 | 3.8K x 8 | 表面贴装 | 表面贴装 | 64-TQFP | 64 | A/D 12x12b | -40°C~85°C TA | Tray | PIC® 18F | e3 | yes | 活跃 | 3 (168 Hours) | 64 | Matte Tin (Sn) | 1W | QUAD | 鸥翼 | 260 | 5V | 40MHz | 40 | PIC18F6723 | 64 | 5V | I2C, SPI, UART, USART | Internal | 128kB | 4.2V~5.5V | MICROCONTROLLER | 8 | PIC | Brown-out Detect/Reset, HLVD, POR, PWM, WDT | FLASH | 8-Bit | 128KB 64K x 16 | I2C, SPI, UART/USART | 8 | YES | NO | 8b | 5 | 1 Mb | 1K x 8 | PIC | 1 | 12 | 14 | 2 | 1.05mm | 10mm | 10mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | ATSAM4SD16CA-AUR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 79 | 有 | 160K x 8 | Tin | 表面贴装 | 表面贴装 | 100-LQFP | A/D 16x12b; D/A 2x12b | -40°C~85°C TA | Cut Tape (CT) | 2015 | SAM4S | e3 | Discontinued | 3 (168 Hours) | 100 | 3A991.A.2 | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 1.2V | 0.5mm | 120MHz | 40 | ATSAM4SD16 | S-PQFP-G100 | 不合格 | 1.32V | 1.2V | 1.08V | EBI/EMI, I2C, I2S, IrDA, SPI, UART, USART, USB | Internal | 1MB | 1.62V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | Brown-out Detect/Reset, DMA, POR, PWM, WDT | FLASH | 32-Bit | 1MB 1M x 8 | EBI/EMI, I2C, IrDA, Memory Card, SPI, SSC, UART/USART, USB | 32 | YES | YES | 32b | YES | 6 | 24 | ARM | CORTEX-M4 | 16 | 14mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S9S08DZ60F2CLH | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 53 | 表面贴装 | 64-LQFP | A/D 24x12b | -40°C~85°C TA | Tray | 1996 | S08 | yes | 活跃 | 3 (168 Hours) | 260 | 40 | S9S08DZ60 | External | 40MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | FLASH | 8-Bit | 60KB 60K x 8 | CANbus, I2C, LINbus, SCI, SPI | 2K x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MC56F8165VFGE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 49 | 524288 | 表面贴装 | 128-LQFP | YES | A/D 16x12b | -40°C~105°C TA | Tray | 1998 | 56F8xxx | e3 | 活跃 | 3 (168 Hours) | 128 | 3A991.A.2 | Matte Tin (Sn) | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 40 | MC56F8165 | R-PQFP-G128 | 不合格 | 2.75V | 2.53.3V | 2.25V | External | 40MHz | 16K x 16 | 2.25V~3.6V | DIGITAL SIGNAL PROCESSOR, OTHER | 56800E | POR, PWM, WDT | 120MHz | FLASH | 16-Bit | 512KB 256K x 16 | EBI/EMI, SCI, SPI | 16 | 11 | YES | YES | 4 | 固定点 | YES | MULTIPLE | 1.6mm | 20mm | 14mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S9S12G64F0MLF | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 40 | 65536 | Automotive grade | 表面贴装 | 48-LQFP | YES | A/D 12x10b | -40°C~125°C TA | Tray | 2008 | HCS12 | 活跃 | 3 (168 Hours) | 48 | 8542.31.00.01 | QUAD | 鸥翼 | 5V | 0.5mm | S9S12G64 | S-PQFP-G48 | 不合格 | 5.5V | 3.3/5V | 3.13V | Internal | 25MHz | 4K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, IrDA, LINbus, SCI, SPI | 16 | YES | NO | YES | 2K x 8 | CPU12 | AEC-Q100 | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TMS320F2801PZQ | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | EEPROM, FLASH | 6K x 16 | ACTIVE (Last Updated: 6 days ago) | 表面贴装 | 表面贴装 | 100-LQFP | 100 | 635.596308mg | A/D 16x12b | -40°C~125°C TA | Tray | Automotive, AEC-Q100, C2000™ C28x Fixed-Point | e4 | yes | 活跃 | 2 (1 Year) | 100 | Nickel/Palladium/Gold (Ni/Pd/Au) | ALSO REQUIRES 3.3V SUPPLY | QUAD | 鸥翼 | 260 | 1.8V | 0.5mm | 100MHz | 320F2801 | 100 | 1.8V | CAN, I2C, SCI, SPI, UART, USART | Internal | 32kB | 1.71V~1.89V | DIGITAL SIGNAL PROCESSOR, OTHER | C28x | POR, PWM, WDT | FLASH | 32-Bit | 32KB 16K x 16 | CANbus, I2C, SCI, SPI, UART/USART | 230mA | 32 | 32b | 6 | 256 kb | YES | YES | 16 | 35 | NO | 1 | 10 | 3 | NO | MULTIPLE | 1.6mm | 14mm | 14mm | 1.4mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||
![]() | S912XET256W1MAGR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 119 | 16384 | 262144 | Automotive grade | 表面贴装 | 144-LQFP | YES | A/D 24x12b | -40°C~125°C TA | Tape & Reel (TR) | 1996 | HCS12X | 活跃 | 3 (168 Hours) | 144 | 8542.31.00.01 | QUAD | 鸥翼 | 1.8V | 0.5mm | S-PQFP-G144 | 不合格 | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 16K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 100mA | 16 | YES | YES | YES | 23 | 4K x 8 | CPU12 | AEC-Q100 | 16 | 20mm | 20mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | PIC16C56AT-04I/SO | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 12 | 有 | 25 x 8 | 表面贴装 | 表面贴装 | 18-SOIC (0.295, 7.50mm Width) | 20 | EPROM | -40°C~85°C TA | Tape & Reel (TR) | 1998 | PIC® 16C | e3 | yes | 活跃 | 1 (Unlimited) | 18 | Matte Tin (Sn) | 800mW | DUAL | 鸥翼 | 260 | 5V | 4MHz | 40 | PIC16C56A | 18 | 5V | External | 1kB | 3V~5.5V | MICROCONTROLLER, RISC | PIC | POR, WDT | OTP | 8-Bit | 1.5KB 1K x 12 | 2.4mA | 8 | 4 μs | NO | NO | 8b | NO | NO | 1 | 12 | PIC | 2.64mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MKL24Z32VFM4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 23 | 32768 | 表面贴装 | 32-VFQFN Exposed Pad | YES | A/D 7x12b | -40°C~105°C TA | Tray | 2002 | Kinetis KL2 | 活跃 | 3 (168 Hours) | 32 | 3A991.A.2 | 8542.31.00.01 | QUAD | 无铅 | 260 | 1V | 0.5mm | 40 | MKL24Z32 | S-PQCC-N32 | 不合格 | 1.1V | 1.8/3.3V | 0.9V | Internal | 48MHz | 4K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 16MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, LINbus, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | CORTEX-M0 | 5mm | 5mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MSP430F5249IRGCT | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 53 | 有 | 8K x 8 | ACTIVE (Last Updated: 5 days ago) | 表面贴装 | 64-VFQFN Exposed Pad | YES | 64 | 227.391525mg | A/D 12x10b | -40°C~85°C TA | Tape & Reel (TR) | MSP430F5xx | e4 | yes | 活跃 | 3 (168 Hours) | 64 | Nickel/Palladium/Gold (Ni/Pd/Au) | QUAD | 260 | 3.3V | 0.5mm | 25MHz | MSP430 | 64 | 3.6V | 1.8V | I2C, IrDA, LIN, SPI, UART, USART | Internal | 128kB | 1.8V~3.6V | MICROCONTROLLER, RISC | CPUXV2 | Brown-out Detect/Reset, DMA, POR, PWM, WDT | FLASH | 16-Bit | 128KB 128K x 8 | I2C, IrDA, SPI, UART/USART | 16 | YES | YES | 16b | YES | NO | 4 | YES | YES | 10 | NO | 2 | 16 | 1mm | 9mm | 9mm | 880μm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||
![]() | MC9S08DZ128MLL | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 87 | 131072 | 表面贴装 | 100-LQFP | YES | A/D 24x12b | -40°C~125°C TA | Tray | 1996 | S08 | e3 | 活跃 | 3 (168 Hours) | 100 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3V | 0.5mm | 40 | MC9S08DZ128 | S-PQFP-G100 | 不合格 | 5.5V | 3/5V | 2.7V | External | 40MHz | 8K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 38.4MHz | FLASH | 8-Bit | 128KB 128K x 8 | CANbus, I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | 16 | 2K x 8 | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | PIC16LF747T-I/PT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 36 | 4096 | 有 | 368 x 8 | 表面贴装 | 表面贴装 | 44-TQFP | 44 | A/D 14x10b | -40°C~85°C TA | Tape & Reel (TR) | 2004 | PIC® 16F | e3 | yes | 活跃 | 3 (168 Hours) | 44 | EAR99 | Matte Tin (Sn) - annealed | OPERATES AT 2V MINIMUM SUPPLY @ 4 MHZ | QUAD | 鸥翼 | 260 | 5V | 0.8mm | 10MHz | 40 | PIC16LF747 | 44 | 5.5V | 2/5.5V | 3V | I2C, SPI, UART, USART | Internal | 7kB | 2V~5.5V | MICROCONTROLLER, RISC | PIC | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 8-Bit | 7KB 4K x 14 | I2C, SPI, UART/USART | 4.2mA | 8 | 12 μs | YES | NO | 8b | YES | NO | 3 | 14 | PIC | 1.2mm | 10mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||
![]() | ATSAM4S8CB-CN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 79 | 表面贴装 | 100-TFBGA | YES | A/D 16x12b; D/A 2x12b | -40°C~105°C TA | Tray | SAM4S | 活跃 | 3 (168 Hours) | 100 | BOTTOM | BALL | 1.2V | 0.8mm | ATSAM4S8 | S-PBGA-B100 | 1.32V | 1.08V | Internal | 120MHz | 128K x 8 | 1.62V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 20MHz | FLASH | 32-Bit | 512KB 512K x 8 | EBI/EMI, I2C, IrDA, Memory Card, SPI, SSC, UART/USART, USB | 32 | YES | YES | YES | YES | 24 | 8 | 8 | 1.1mm | 9mm | 9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MSP430FR6972IPMR | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 51 | 2K x 8 | ACTIVE (Last Updated: 3 days ago) | Gold | 表面贴装 | 表面贴装 | 64-LQFP | 64 | A/D 8x12b | -40°C~85°C TA | Tape & Reel (TR) | MSP430™ FRAM | e4 | yes | 活跃 | 3 (168 Hours) | 64 | QUAD | 鸥翼 | 260 | 2.2V | 16MHz | 未说明 | MSP430 | 64 | 3.6V | 1.8V | I2C, IrDA, SCI, SPI, UART, USART | Internal | 64kB | 1.8V~3.6V | MICROCONTROLLER, RISC | CPUXV2 | Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT | FRAM | 16-Bit | 64KB 64K x 8 | I2C, IrDA, SCI, SPI, UART/USART | 16 | YES | YES | YES | NO | 5 | YES | YES | 2 | 1.6mm | 10mm | 10mm | 1.4mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | PIC16LC62B-04/SO | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 22 | 2048 | 有 | 128 x 8 | 表面贴装 | 表面贴装 | 28-SOIC (0.295, 7.50mm Width) | 28 | EPROM | 0°C~70°C TA | Tube | 1999 | PIC® 16C | e3 | yes | 活跃 | 1 (Unlimited) | 28 | Matte Tin (Sn) | 1W | DUAL | 鸥翼 | 260 | 5V | 1.27mm | 4MHz | 40 | PIC16LC62B | 28 | 5.5V | 2.5V | I2C, SPI, SSP | External | 3.5kB | 2.5V~5.5V | MICROCONTROLLER, RISC | PIC | Brown-out Detect/Reset, POR, PWM, WDT | OTP | 8-Bit | 3.5KB 2K x 14 | I2C, SPI | 8 | 4 μs | YES | NO | 8b | YES | NO | 3 | 14 | PIC | 2.64mm | 17.87mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | S912ZVC12F0VKH | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 42 | 表面贴装 | 64-LQFP Exposed Pad | A/D 16x10b; D/A 1x8b | -40°C~105°C TA | Tray | 2011 | S12 MagniV | 活跃 | 3 (168 Hours) | Internal | 32MHz | 8K x 8 | 3.5V~40V | S12Z | DMA, POR, PWM, WDT | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, I2C, SCI, SPI | 2K x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | STM32F446VET7 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 81 | 524288 | 128K x 8 | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 100-LQFP | YES | 100 | A/D 16x12b; D/A 2x12b | -40°C~105°C TA | Tray | STM32F4 | 活跃 | 3 (168 Hours) | 100 | 3A991.A.2 | QUAD | 鸥翼 | 0.5mm | 180MHz | STM32F446 | 不合格 | 1.8/3.3V | CAN, EBI/EMI, I2C, IrDA, LIN, SD, SPI, UART, USART, USB | Internal | 512kB | 1.7V~3.6V | ARM® Cortex®-M4 | Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, LINbus, SAI, SD, SPDIF-Rx, SPI, UART/USART, USB, USB OTG | 125mA | 32 | ARM | 8 | CORTEX-M4F | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TM4C1233E6PMI | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 43 | 32K x 8 | 表面贴装 | 表面贴装 | 64-LQFP | 64 | A/D 12x12b | -40°C~85°C TA | Tray | Tiva™ C | e4 | yes | 活跃 | 3 (168 Hours) | 64 | Nickel/Palladium/Gold (Ni/Pd/Au) | QUAD | 鸥翼 | 260 | 1.2V | 0.5mm | 80MHz | 未说明 | M4C1233 | 不合格 | 3.3V | CAN, I2C, I2S, SPI, UART | Internal | 128kB | 1.08V~3.63V | MICROCONTROLLER, RISC | 12 | ARM® Cortex®-M4F | Brown-out Detect/Reset, DMA, POR, WDT | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB | 32 | YES | YES | 32b | YES | NO | ARM | 2K x 8 | 8 | 4 | 1 | 1.45mm | 10.2mm | 10.2mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | PIC32MX270F256B-50I/ML | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 19 | 有 | 64K x 8 | 表面贴装 | 表面贴装 | 28-VQFN Exposed Pad | 44 | 369.989626mg | A/D 9x10b | -40°C~85°C TA | Tube | 2011 | PIC® 32MX | e3 | 活跃 | 1 (Unlimited) | 28 | Matte Tin (Sn) - annealed | QUAD | 无铅 | 260 | 3.3V | 50MHz | 40 | PIC32MX270F256B | 3.6V | I2C, I2S, IrDA, LIN, SPI, UART, USART, USB | Internal | 256kB | 2.3V~3.6V | MICROCONTROLLER, RISC | MIPS32® M4K™ | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | FLASH | 32-Bit | 256KB 256K x 8 | I2C, IrDA, LINbus, SPI, UART/USART, USB OTG | 32 | YES | YES | 32b | YES | 5 | PIC | 21 | 13 | 2 | 1 | 950μm | 6mm | 6mm | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | PIC12F675-E/MD | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 5 | 有 | 64 x 8 | Tin | 表面贴装 | 表面贴装 | 8-VDFN Exposed Pad | 8 | A/D 4x10b | -40°C~125°C TA | Tube | 2005 | PIC® 12F | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 800mW | DUAL | 260 | 5V | 20MHz | 40 | PIC12F675 | 8 | RS-232, USB | Internal | 1.8kB | 2V~5.5V | MICROCONTROLLER, RISC | PIC | POR, WDT | FLASH | 8-Bit | 1.75KB 1K x 14 | 3mA | 8 | 20 μs | YES | NO | 8b | NO | NO | 2 | 128 x 8 | 14 | PIC | 6 | 1mm | 4mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | ATTINY84A-PU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3 Weeks | 12 | 有 | 512 x 8 | Tin | 通孔 | 通孔 | 14-DIP (0.300, 7.62mm) | 14 | A/D 8x10b | -40°C~85°C TA | Tube | 1997 | AVR® ATtiny | e3 | yes | 活跃 | 1 (Unlimited) | 14 | DUAL | NOT APPLICABLE | 5V | 20MHz | NOT APPLICABLE | ATTINY84A | 不合格 | 5.5V | 4.5V | SPI | Internal | 8kB | 1.8V~5.5V | MICROCONTROLLER, RISC | AVR | Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT | FLASH | 8-Bit | 8KB 4K x 16 | USI | 8 | YES | NO | 8b | YES | 2 | 512 x 8 | 8 | 1 | 5.334mm | 19.69mm | 7.11mm | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AT89LP51ID2-20AU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 40 | 有 | 2.25K x 8 | 表面贴装 | 表面贴装 | 44-TQFP | 44 | A/D 7x10b | -40°C~85°C TA | Tray | 1997 | 89LP | e3 | yes | 活跃 | 3 (168 Hours) | 44 | Matte Tin (Sn) - annealed | QUAD | 鸥翼 | 3V | 0.8mm | 20MHz | AT89LP51ID2 | 5.5V | 2.5/5V | 2.4V | 2-Wire, EBI/EMI, I2C, SPI, UART, USART | Internal | 64kB | 2.4V~5.5V | MICROCONTROLLER | 8051 | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 8-Bit | 64KB 64K x 8 | EBI/EMI, I2C, SPI, UART/USART | 8 | YES | NO | 8b | YES | YES | 3 | 16 | 4K x 8 | 36 | 1.2mm | 10mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | PIC18F65K90-I/MR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 53 | 有 | 2K x 8 | 表面贴装 | 64-VFQFN Exposed Pad | YES | 64 | A/D 16x12b | -40°C~85°C TA | Tube | 2011 | PIC® XLP™ 18K | e3 | 活跃 | 1 (Unlimited) | 64 | 3A001.A.3 | Matte Tin (Sn) - annealed | 1W | QUAD | 260 | 3.3V | 0.5mm | 16MHz | 40 | PIC18F65K90 | 64 | 5.5V | 3V | I2C, LIN, SPI, UART, USART | Internal | 16kB | 1.8V~5.5V | MICROCONTROLLER | PIC | Brown-out Detect/Reset, LCD, POR, PWM, WDT | FLASH | 8-Bit | 32KB 16K x 16 | I2C, LINbus, SPI, UART/USART | 32 | YES | NO | 8b | YES | 8 | AVR | 1K x 8 | PIC | 16 | 2 | 950μm | 9mm | 9mm | 无 | ROHS3 Compliant |