类别是'嵌入式 - 微处理器'
嵌入式 - 微处理器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 底架 | 包装/外壳 | 表面安装 | 引脚数 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 速度 | 内存大小 | uPs/uCs/外围ICs类型 | 核心处理器 | 时钟频率 | 位元大小 | 有ADC | DMA 通道 | 数据总线宽度 | 脉宽调制通道 | 定时器/计数器的数量 | 地址总线宽度 | 核心架构 | 边界扫描 | 低功率模式 | 外部数据总线宽度 | 格式 | 集成缓存 | 内存(字) | 电压 - I/O | UART 通道数 | 以太网 | 核数/总线宽度 | 图形加速 | 内存控制器 | USB | 附加接口 | 协处理器/DSP | 核数量 | 外部中断数量 | 保安功能 | 显示和界面控制器 | 萨塔 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | RoHS状态 | 无铅 | |||
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![]() | MPC8323ECVRADDC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 516-BBGA | YES | -40°C~105°C TA | Tray | 2004 | MPC83xx | Obsolete | 3 (168 Hours) | 516 | 5A002 | 8542.31.00.01 | BOTTOM | BALL | 1V | 1mm | MPC8323 | S-PBGA-B516 | 1.05V | 0.95V | 266MHz | MICROPROCESSOR, RISC | PowerPC e300c2 | 14 | YES | YES | 32 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | Communications; QUICC Engine, Security; SEC 2.2 | Cryptography | 2.55mm | 27mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
![]() | BSC9132NXN7MNMB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 780-BFBGA, FCBGA | YES | -40°C~105°C TA | Tray | 2002 | QorIQ Qonverge BSC | e1 | 活跃 | 3 (168 Hours) | 780 | 3A991.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1V | 0.8mm | 30 | S-PBGA-B780 | 1.05V | 0.97V | 1.333GHz | MICROPROCESSOR, RISC | PowerPC e500 | 32 | 16 | YES | YES | 32 | 固定点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 2 Core 32-Bit | 无 | DDR3, DDR3L | USB 2.0 (1) | AIC, DUART, I2C, MMC/SD, SPI, USIM | Signal Processing; SC3850 - Dual | 2.53mm | 23mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
![]() | MC68SEC000AA20B1 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 64-QFP | YES | 0°C~70°C TA | Tray | 1995 | M680x0 | 不用于新设计 | 3 (168 Hours) | 64 | EAR99 | 8542.31.00.01 | QUAD | 鸥翼 | 5V | 0.8mm | MC68SEC000 | S-PQFP-G64 | 5V | 20MHz | MICROPROCESSOR, RISC | EC000 | 32 | 3.3V 5.0V | 1 Core 32-Bit | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MC68030RC25C | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 128-BPGA | 0°C~70°C TA | Tray | 1997 | M680x0 | Obsolete | 3 (168 Hours) | MC68030 | 25MHz | 68030 | 5.0V | 1 Core 32-Bit | 无 | SCI, SPI | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MCIMX250DJM4AR2 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 400-LFBGA | Tray | i.MX25 | 活跃 | 3 (168 Hours) | 400MHz | ARM926EJ-S | 1 Core 32-Bit | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MC68VZ328AG | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 144-LQFP | 0°C~70°C TA | Tray | M683xx | Obsolete | 3 (168 Hours) | MC68VZ328 | 33MHz | FLX68000 | 3.0V | 1 Core 32-Bit | 无 | DRAM | SPI, UART | LCD, Touch Panel | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | LS1023ASE7QQB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 621-FBGA, FCBGA | 0°C~105°C | Tray | 2014 | QorIQ® Layerscape | 活跃 | 3 (168 Hours) | 1.6GHz | ARM® Cortex®-A53 | 1GbE (7) or 10GbE (1) & 1GbE (5) | 2 Core 64-Bit | DDR3L, DDR4 | USB 3.0 (2) + PHY | Secure Boot, TrustZone® | SATA 6Gbps (1) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | R7S721034VCBG#AC0 | Renesas Electronics America | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | 176-LFBGA | 176 | -40°C~85°C TA | Tray | 2016 | RZ/A1LC | yes | 活跃 | 3 (168 Hours) | 176 | 400MHz | ARM® Cortex®-A9 | 1.2V 3.3V | 10/100Mbps | 1 Core 32-Bit | 有 | SDRAM, SRAM | USB 2.0 (2) | CAN, I2C, IrDA, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | Multimedia; NEON™ MPE | VDC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AM5K2E04XABDA25 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | ACTIVE (Last Updated: 3 days ago) | 表面贴装 | 1089-BFBGA, FCBGA | 1089 | -40°C~100°C TC | Tray | Sitara™ | e1 | yes | 活跃 | 4 (72 Hours) | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1V | 0.8mm | 1.25GHz | AM5K2E04 | 1.05V | 0.95V | Ethernet, I2C, SPI, UART, USB | 2MB | MICROPROCESSOR, RISC | ARM® Cortex®-A15 | 72b | ARM | YES | YES | 浮点 | YES | 1.35V 1.5V 1.8V 3.3V | 2 | 1GBE (8), 10GBE (2) | 4 Core 32-Bit | 无 | DDR3, SRAM | USB 3.0 (2) | EBI/EMI, I2C, PCIe, SPI, TSIP, UART, USIM | Network | 4 | 3.55mm | 27mm | 27mm | 2.98mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||
![]() | LS1012AXE7EKA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 24 Weeks | 211-VFLGA | -40°C~105°C | Tray | 2016 | QorIQ® Layerscape | 活跃 | 3 (168 Hours) | 600MHz | ARM® Cortex®-A53 | GbE (2) | 1 Core 64-Bit | DDR3L | USB 2.0 (1), USB 3.0 + PHY | Secure Boot, TrustZone® | SATA 6Gbps (1) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPC8271CZQTIEA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 516-BBGA | YES | 57 | -40°C~105°C TA | Tray | 1994 | MPC82xx | e0 | 最后一次购买 | 3 (168 Hours) | 516 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.5V | 1mm | 30 | MPC8271 | S-PBGA-B516 | 1.575V | 1.53.3V | 1.425V | 400MHz | MICROCONTROLLER, RISC | PowerPC G2_LE | 66.7MHz | 32 | NO | YES | NO | 30 | 64 | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | 无 | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | 27mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||
![]() | MPC755CVT400LE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 360-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2001 | MPC7xx | e2 | Obsolete | 3 (168 Hours) | 360 | 3A991 | TIN COPPER/TIN SILVER | ALSO REQUIRES 2.5V OR 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 2V | 1.27mm | 40 | MPC755 | S-PBGA-B360 | 2.1V | 1.9V | 400MHz | MICROPROCESSOR, RISC | PowerPC | 100MHz | 32 | 32 | YES | YES | 64 | 浮点 | YES | 2.5V 3.3V | 1 Core 32-Bit | 无 | 2.77mm | 25mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
![]() | EN80C188XL12 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | PLCC | 68 | 12MHz | Bulk | 85°C | -40°C | 12MHz | 5V | 5V | 5.5V | 4.5V | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MC9328MX1DVM20 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 256-MAPBGA | -30°C~70°C TA | Tray | 1994 | i.MX1 | 不用于新设计 | 3 (168 Hours) | MC9328MX1 | 200MHz | ARM920T | 1.8V 3.0V | 1 Core 32-Bit | 无 | SDRAM | USB 1.x (1) | I2C, I2S, SPI, SSI, MMC/SD, UART | LCD, Touch Panel | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Z84C0006PEG | Zilog | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 通孔 | 40-DIP (0.620, 15.75mm) | 40 | ROMless | -40°C~100°C TA | Tube | 2002 | Z80 | e3 | yes | 活跃 | 1 (Unlimited) | 40 | 3A001.A.2.C | 哑光锡 | 刷新计数器 | 8542.31.00.01 | DUAL | 5V | 2.54mm | 6MHz | Z84C00 | 40 | 5V | 5V | 6.17 MHz | 64kB | MICROPROCESSOR | 8 | 8b | 16 | NO | YES | 固定点 | NO | 0 | 5.0V | 1 Core 8-Bit | 无 | 2 | 4.75mm | 52.325mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||
![]() | T2080NSE8MQB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 896-BFBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2002 | QorIQ T2 | 活跃 | 3 (168 Hours) | 896 | BOTTOM | BALL | S-PBGA-B896 | 1.2GHz | MICROPROCESSOR, RISC | PowerPC e6500 | 64 | NO | NO | 固定点 | YES | 1Gbps (8), 2.5Gbps (4), 10Gbps (4) | 4 Core 64-Bit | DDR3, DDR3L | USB 2.0 + PHY (2) | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | SATA 3Gbps (2) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | LS1088AXN7Q1A | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 780-BFBGA, FCBGA | -40°C~105°C | QorIQ® Layerscape | 活跃 | 3 (168 Hours) | 8542.39.00.01 | 250 | 30 | 1.6GHz | ARM® Cortex®-A53 | 10GbE (2), 1GbE (8) | 8 Core 64-Bit | DDR4 | USB 3.0 (2) + PHY | Secure Boot, TrustZone® | SATA 6Gbps (1) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MCIMX27LVOP4AR2 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 404-LFBGA | YES | -20°C~85°C TA | Tape & Reel (TR) | 2004 | i.MX27 | e1 | 不用于新设计 | 3 (168 Hours) | 404 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.45V | 0.65mm | 40 | MCIMX27 | S-PBGA-B404 | 1.52V | 1.38V | 400MHz | MICROPROCESSOR | ARM926EJ-S | 32MHz | 32 | 26 | YES | YES | 32 | 固定点 | YES | 2.0V 2.5V 2.7V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | 有 | DDR | USB 2.0 + PHY (3) | 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART | Security; SAHARAH2 | Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory | Keypad, LCD | 1.4mm | 17mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||
![]() | SVF331R3K2CKU2 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 176-LQFP Exposed Pad | -40°C~85°C TA | Tray | Vybrid, VF3xxR | yes | 活跃 | 3 (168 Hours) | 260 | 40 | 266MHz, 133MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A5 + Cortex®-M4 | 3.3V | 10/100Mbps (2) | 2 Core 32-Bit | 无 | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG | DCU, GPU, LCD, VideoADC, VIU | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPC8323EZQADDC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 516-BBGA | YES | 0°C~105°C TA | Tray | 2004 | MPC83xx | Obsolete | 3 (168 Hours) | 516 | 5A002 | 8542.31.00.01 | BOTTOM | BALL | 1V | 1mm | MPC8323 | S-PBGA-B516 | 1.05V | 0.95V | 266MHz | MICROPROCESSOR, RISC | PowerPC e300c2 | 14 | YES | YES | 32 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | Communications; QUICC Engine, Security; SEC 2.2 | Cryptography | 2.55mm | 27mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||
![]() | MCIMX6S7CVM08ADR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 624-LFBGA | -40°C~105°C TA | Tape & Reel (TR) | i.MX6S | 活跃 | 3 (168 Hours) | 800MHz | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | LS1043ASN7MQB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 621-FBGA, FCBGA | 0°C~105°C | Tray | 2014 | QorIQ® Layerscape | 活跃 | 3 (168 Hours) | 1.2GHz | ARM® Cortex®-A53 | 1GbE (7) or 10GbE (1) & 1GbE (5) | 4 Core 64-Bit | DDR3L, DDR4 | USB 3.0 (3) + PHY | Secure Boot, TrustZone® | SATA 6Gbps (1) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | LS1043ASN7KNLB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 621-FBGA, FCBGA | 0°C~105°C | Tray | 2014 | QorIQ® Layerscape | 活跃 | 3 (168 Hours) | 1.0GHz | ARM® Cortex®-A53 | 1GbE (7) or 10GbE (1) & 1GbE (5) | 4 Core 64-Bit | DDR3L, DDR4 | USB 3.0 (3) + PHY | Secure Boot, TrustZone® | SATA 6Gbps (1) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Z8S18010VSG | Zilog | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 68-LCC (J-Lead) | 68 | ROMless | 0°C~70°C TA | Tube | 2000 | Z180 | e3 | yes | 活跃 | 3 (168 Hours) | 68 | 哑光锡 | QUAD | J BEND | 260 | 5V | 10MHz | 40 | 68 | 5V | 5V | SCI | MICROPROCESSOR | Z8S180 | 8 | 8b | 2 | 20 | Z8 | NO | YES | 固定点 | NO | 5.0V | 1 Core 8-Bit | 无 | DRAM | ASCI, CSIO, UART | 4.57mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||
![]() | MCIMX6S5EVM10ABR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 624-LFBGA | YES | -20°C~105°C TJ | Tape & Reel (TR) | 2002 | i.MX6S | 不用于新设计 | 3 (168 Hours) | 624 | 8542.31.00.01 | MCIMX6 | 不合格 | 1.05/1.5V | 1.0GHz | GRAPHICS PROCESSOR | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | ROHS3 Compliant |