类别是'嵌入式 - 微处理器'
嵌入式 - 微处理器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 底架 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 振荡器类型 | 速度 | 内存大小 | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 电源电流-最大值 | 位元大小 | 访问时间 | 有ADC | DMA 通道 | 脉宽调制通道 | 数模转换器通道 | 地址总线宽度 | 核心架构 | 边界扫描 | 低功率模式 | 筛选水平 | 外部数据总线宽度 | 格式 | 集成缓存 | 内存(字) | 电压 - I/O | UART 通道数 | 以太网 | 核数/总线宽度 | 图形加速 | 内存控制器 | USB | 附加接口 | 协处理器/DSP | 外部中断数量 | 总线兼容性 | 桶式移位器 | 内部总线架构 | 保安功能 | 显示和界面控制器 | DMA通道数 | 萨塔 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | RoHS状态 | 无铅 | ||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | MPC8349VVAGDB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 672-LBGA | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | 活跃 | 3 (168 Hours) | 672 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8349 | S-PBGA-B672 | 1.26V | 1.21.8/2.52.5/3.3V | 1.14V | 400MHz | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | 32 | YES | YES | 32 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | 1.69mm | 35mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8544CVJAQGA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 783-BBGA, FCBGA | -40°C~105°C TA | Tray | 2002 | MPC85xx | yes | 活跃 | 3 (168 Hours) | 260 | 40 | MPC8544 | 1.0GHz | MICROPROCESSOR, RISC | PowerPC e500 | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, DDR2, SDRAM | DUART, I2C, PCI | Signal Processing; SPE | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AM5716AABCXEQ1 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | ACTIVE (Last Updated: 1 week ago) | 760-BFBGA, FCBGA | YES | 760 | Automotive grade | -40°C~125°C TJ | Automotive, AEC-Q100 | e1 | yes | 活跃 | 3 (168 Hours) | 760 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1.15V | 0.8mm | AM5716 | 1.2V | 1.11V | 1.5GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A15 | 38.4MHz | YES | YES | 固定点 | NO | 1.8V 3.3V | 10 | 10/100/1000Mbps (1) | 1 Core 32-Bit | 有 | DDR3, SRAM | USB 2.0 (1), USB 3.0 (1) | CAN, EBI/EMI, HDQ/1-Wire®, I²C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART | Multimedia; GPU, IPU, VFP | SATA 3Gbps (1) | 2.96mm | 23mm | 23mm | 2.39mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Z84C1516FSG | Zilog | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 16 | 有 | 表面贴装 | 100-QFP | 100 | 1.758804g | ROMless | 0°C~70°C TA | Tray | 2002 | Z80 | e3 | yes | 活跃 | 3 (168 Hours) | 100 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.65mm | 16MHz | 40 | Z84C15 | 100 | 5.5V | 5V | 5V | Serial | MICROCONTROLLER | 8 | NO | NO | NO | NO | 16 | 8 | 5.0V | 1 Core 8-Bit | 无 | 3.1mm | 20mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||
 | MCIMX356AVM5B | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | Automotive grade | 400-LFBGA | YES | 3 | -40°C~85°C TA | Tray | 2008 | i.MX35 | e1 | 活跃 | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | MCIMX356 | S-PBGA-B400 | 不合格 | 1.47V | 1.33V | 532MHz | ARM1136JF-S | YES | AEC-Q100 | 1.8V 2.0V 2.5V 2.7V 3.0V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | 有 | LPDDR, DDR2 | USB 2.0 + PHY (2) | 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART | Multimedia; GPU, IPU, VFP | CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; SPI; UART; USB | Secure Fusebox, Secure JTAG | Keypad, KPP, LCD | 1.6mm | 17mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ADSP-2184NKST-320 | Analog Devices, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | LQFP | 100 | Bulk | e0 | 3 (168 Hours) | 100 | 3A991.A.2 | 锡铅 | 70°C | 0°C | 8542.31.00.01 | QUAD | 鸥翼 | 240 | 1.8V | 0.5mm | not_compliant | 80MHz | 30 | 100 | 不合格 | 1.81.8/3.3V | COMMERCIAL | 3.6V | 1.71V | 20kB | DIGITAL SIGNAL PROCESSOR, OTHER | 16 | 14 | NO | YES | 24 | 固定点 | 4096 | YES | MULTIPLE | 1.6mm | 14mm | 14mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC8640DTVJ1250HE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 1023-BCBGA, FCCBGA | YES | -40°C~105°C TA | Tray | 2001 | MPC86xx | e2 | 活跃 | 3 (168 Hours) | 3A991.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.05V | 1mm | 30 | S-CBGA-B1023 | 1.1V | 1V | 1.25GHz | MICROPROCESSOR | PowerPC e600 | 32 | 16 | YES | YES | 64 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (4) | 2 Core 32-Bit | 无 | DDR, DDR2 | DUART, HSSI, I2C, RapidIO | 2.77mm | 33mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SB80C188EC13 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 100-BFQFP | 100 | 0°C~70°C TA | Tray | 1996 | i186 | e0 | Obsolete | 不适用 | 100 | Tin/Lead (Sn/Pb) | QUAD | 鸥翼 | 5V | 0.5mm | 13MHz | 100 | 5V | 5V | 5V | 5.5V | 4.5V | MICROPROCESSOR | 80C186 | 70mA | 16 | 13 μs | 20 | NO | YES | 8 | 固定点 | NO | 5.0V | 1 Core 16-Bit | 无 | DRAM | Serial Communications Unit (SCU) | 1.66mm | 14mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC68SEC000AA20 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 64-QFP | YES | 0°C~70°C TA | Tray | 1995 | M680x0 | 不用于新设计 | 3 (168 Hours) | 64 | EAR99 | 8542.31.00.01 | QUAD | 鸥翼 | 5V | 0.8mm | MC68SEC000 | S-PQFP-G64 | 5V | 20MHz | MICROPROCESSOR, RISC | EC000 | 32 | 3.3V 5.0V | 1 Core 32-Bit | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MCIMX6G1AVM05AB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 289-LFBGA | YES | Automotive grade | -40°C~125°C TJ | Tray | 2002 | i.MX6UL | 活跃 | 3 (168 Hours) | 289 | 5A992 | 8542.31.00.01 | BOTTOM | BALL | 0.8mm | S-PBGA-B289 | 1.3V | 1.15V | 528MHz | MICROPROCESSOR | ARM® Cortex®-A7 | 26 | YES | YES | 16 | 固定点 | YES | 1.2V 1.35V 1.5V 1.8V 2.5V 2.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | 无 | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | LVDS | 1.32mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC866PCZP100A | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 357-BBGA | YES | -40°C~100°C TA | Tray | 1999 | MPC8xx | e0 | Obsolete | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.31.00.01 | BOTTOM | BALL | 220 | 1.8V | 1.27mm | 30 | MPC866 | S-PBGA-B357 | 1.9V | 1.83.3V | 1.7V | 100MHz | MICROPROCESSOR, RISC | 32 | 32 | YES | YES | 32 | 固定点 | YES | 3.3V | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | 无 | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8568VTAUJJ | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1023-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2016 | MPC85xx | e2 | Obsolete | 3 (168 Hours) | 5A992 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.1V | 1mm | 40 | MPC8568 | S-PBGA-B1023 | 1.155V | 1.11.8/2.52.5/3.3V | 1.045V | 1.333GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 32 | 16 | YES | YES | 64 | 固定点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, DDR2, SDRAM | DUART, HSSI, I2C, PCI, RapidIO, UART | Communications; QUICC Engine | 2.75mm | 33mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8377EVRANGA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 689-BBGA Exposed Pad | YES | 0°C~125°C TA | Tray | 2002 | MPC83xx | e2 | 活跃 | 3 (168 Hours) | 689 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8377 | S-PBGA-B689 | 1.05V | 1.051.8/2.52.5/3.3V | 0.95V | 800MHz | MICROPROCESSOR | PowerPC e300c4s | 66.66MHz | 32 | 32 | YES | YES | 32 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | Security; SEC 3.0 | Cryptography, Random Number Generator | SATA 3Gbps (2) | 2.46mm | 31mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
| MPC8377CVRANG | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 689-BBGA Exposed Pad | -40°C~125°C TA | Tray | 2012 | MPC83xx | Obsolete | 3 (168 Hours) | MPC8377 | 800MHz | PowerPC e300c4s | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | SATA 3Gbps (2) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | R80C188XL20 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | PLCC | 68 | Bulk | 1996 | Discontinued | 68 | 3A991.A.2 | 70°C | 0°C | DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS | 8542.31.00.01 | QUAD | 无铅 | 5V | 1.27mm | 20MHz | 68 | 不合格 | 5V | 5V | COMMERCIAL | 5V | 5.5V | 4.5V | MICROPROCESSOR | 90mA | 16 | 20 μs | 20 | NO | YES | 8 | 固定点 | NO | 0 | 5 | 2 | 24.13mm | 24.13mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | P1014NSE5HHA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 425-FBGA | YES | 0°C~105°C TA | Tray | 2010 | QorIQ P1 | e2 | Obsolete | 3 (168 Hours) | 425 | 5A002.A | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 40 | P1014 | S-PBGA-B425 | 1.05V | 0.95V | 800MHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 32 | YES | YES | 浮点 | YES | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR3, DDR3L | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, SPI | Security; SEC 4.4 | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | SATA 3Gbps (2) | 1.9mm | 19mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| MPC860DPZQ80D4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 357-BBGA | YES | 0°C~95°C TA | Tray | 1995 | MPC8xx | e0 | 不用于新设计 | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 80MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | 固定点 | YES | 3.3V | 10Mbps (2), 10/100Mbps (1) | 1 Core 32-Bit | 无 | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC7447AVU1420LB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 360-BCBGA, FCCBGA | YES | 0°C~105°C TA | Tray | 1994 | MPC74xx | e2 | 不用于新设计 | 1 (Unlimited) | 360 | 3A991.A.1 | TIN COPPER/TIN SILVER | ALSO REQUIRES 1.8V OR 2.5V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.3V | 1.27mm | 40 | MC7447 | S-CBGA-B360 | 1.35V | 1.25V | 1.42GHz | MICROPROCESSOR, RISC | PowerPC G4 | 167MHz | 32 | 36 | YES | YES | 64 | 浮点 | YES | 1.8V 2.5V | 1 Core 32-Bit | 无 | Multimedia; SIMD | 2.8mm | 25mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC850SRCVR66BU | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 256-BBGA | -40°C~95°C TA | Tray | 2004 | MPC8xx | Obsolete | 3 (168 Hours) | MPC850 | 66MHz | 3.3V | 10Mbps (1) | 1 Core 32-Bit | 无 | DRAM | USB 1.x (1) | HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART | Communications; CPM | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| P1021NSN2HFB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 689-BBGA Exposed Pad | YES | 0°C~125°C TA | Tray | 2002 | QorIQ P1 | e2 | 活跃 | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | P1021 | S-PBGA-B689 | 1.05V | 0.95V | 800MHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 32 | YES | YES | 固定点 | YES | 10/100/1000Mbps (3) | 2 Core 32-Bit | 无 | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | Communications; QUICC Engine | 2.46mm | 31mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | FC80960HD80SL2LZ | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 208-QFP | 0°C~85°C TC | Tray | 2002 | i960 | e0 | Obsolete | 5 (48 Hours) | 208 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | 鸥翼 | 3.3V | 0.5mm | 80MHz | 208 | S-PQFP-G208 | 3.33.3/5V | 3.3V | 2kB | MICROPROCESSOR, RISC | 32 | 80 μs | 32 | YES | YES | 32 | 固定点 | YES | 1 Core 32-Bit | 无 | DRAM | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LS2084AXE7TTB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 1292-BFBGA, FCBGA | -40°C~105°C | QorIQ® Layerscape | 活跃 | 3 (168 Hours) | 1.8GHz | ARM® Cortex®-A72 | 10GbE (8) or 1GbE (16) & 2.5GbE (1) | 8 Core 64-Bit | DDR4 | USB 3.0 (2) + PHY | Secure Boot, TrustZone® | SATA (2) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8540VT833LB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 784-BBGA, FCBGA | 783-FCPBGA (29x29) | 0°C~105°C TA | Tray | 2002 | MPC85xx | Obsolete | 3 (168 Hours) | MPC8540 | 833MHz | PowerPC e500 | 2.5V 3.3V | 10/100Mbps (1), 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, SDRAM | DUART, I2C, PCI, RapidIO | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATSAMA5D21A-CUR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 72 | 196-TFBGA, CSBGA | YES | 外部程序存储器 | -40°C~85°C TA | Tape & Reel (TR) | 2016 | SAMA5D2 | yes | 活跃 | 3 (168 Hours) | 196 | BOTTOM | BALL | 1.2V | 0.75mm | 500MHz | ATSAMA5D21 | S-PBGA-B196 | 1.32V | 1.1V | EBI/EMI, Ethernet, I2C, IrDA, LIN, MMC, SD, SDIO, SPI, UART, USART, USB | Internal | MICROPROCESSOR, RISC | ARM® Cortex®-A5 | DMA, LCD, POR, PWM, WDT | 26 | ARM | YES | YES | 32 | 浮点 | YES | 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | 有 | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | USB 2.0 + HSIC | I2C, SMC, SPI, UART, USART, QSPI | Multimedia; NEON™ MPE | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keyboard, LCD, Touchscreen | 1.2mm | 11mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | LS1020ASE7KQB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 525-FBGA, FCBGA | YES | 0°C~105°C | Tray | 2002 | QorIQ® Layerscape | 活跃 | 3 (168 Hours) | 525 | 5A002.A.1 | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 40 | S-PBGA-B525 | 1.03V | 0.97V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A7 | 133.3MHz | 32 | 16 | YES | YES | 32 | 浮点 | YES | GbE (3) | 2 Core 32-Bit | DDR3L, DDR4 | USB 2.0 (1), USB 3.0 + PHY | Multimedia; NEON™ SIMD | Secure Boot, TrustZone® | SATA 3Gbps (1) | 2.07mm | 19mm | ROHS3 Compliant |