类别是'嵌入式 - 微处理器'
嵌入式 - 微处理器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 底架 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 振荡器类型 | 速度 | 内存大小 | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 位元大小 | 有ADC | DMA 通道 | 数据总线宽度 | 脉宽调制通道 | 数模转换器通道 | 定时器/计数器的数量 | 地址总线宽度 | 核心架构 | 边界扫描 | 低功率模式 | 外部数据总线宽度 | 格式 | 集成缓存 | 内存(字) | 电压 - I/O | UART 通道数 | 以太网 | 核数/总线宽度 | 图形加速 | 内存控制器 | USB | 附加接口 | 定时器数量 | 协处理器/DSP | 只读存储器可编程性 | 核数量 | 桶式移位器 | 内部总线架构 | 保安功能 | 显示和界面控制器 | 萨塔 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | RoHS状态 | 无铅 | ||
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 | MCIMX6X3CVN08AB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 400-LFBGA | YES | -40°C~105°C TA | Tray | 2002 | i.MX6SX | e1 | 活跃 | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | S-PBGA-B400 | 1.5V | 1.275V | 200MHz, 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9, ARM® Cortex®-M4 | 15 | YES | YES | 32 | 浮点 | YES | 1.8V 2.5V 2.8V 3.15V | 10/100/1000Mbps (2) | 2 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | 1.53mm | 17mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
 | MPC860TZQ80D4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 357-BBGA | YES | 0°C~95°C TA | Tray | 1995 | MPC8xx | e0 | 不用于新设计 | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 80MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | 固定点 | YES | 3.3V | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | 无 | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||
 | MPC8313CVRAFFB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | -40°C~105°C TA | Tray | 2006 | MPC83xx | Obsolete | 3 (168 Hours) | MPC8313 | 333MHz | PowerPC e300c3 | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | P3041NSE7PNC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 1295-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2002 | QorIQ P3 | e1 | 活跃 | 3 (168 Hours) | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 30 | P3041 | S-PBGA-B1295 | 1.04V | 0.96V | 1.5GHz | MICROPROCESSOR, RISC | PowerPC e500mc | 133MHz | YES | YES | 固定点 | YES | 1.5V 1.8V 2.5V 3.3V | 10/100/1000Mbps (5), 10Gbps (1) | 4 Core 32-Bit | 无 | DDR3, DDR3L | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, RapidIO, SPI | Security; SEC 4.2 | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | SATA 3Gbps (2) | 3.53mm | 37.5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
 | AT91SAM9XE256B-CU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | FLASH | 217-LFBGA | YES | 217 | 96 | -40°C~85°C TA | Tray | 1997 | SAM9XE | yes | 活跃 | 3 (168 Hours) | 217 | BOTTOM | BALL | 1.8V | 0.8mm | 180MHz | AT91SAM9XE256 | 1.95V | 1.65V | EBI/EMI, Ethernet, I2C, SPI, UART, USART, USB | Internal | 256kB | MICROCONTROLLER, RISC | ARM926EJ-S | Brown-out Detect/Reset, POR, PWM, WDT | 32 | YES | YES | YES | NO | ARM | 1.8V 2.5V 3.3V | 10/100Mbps | 1 Core 32-Bit | 无 | SDRAM, SRAM | USB 2.0 (3) | EBI/EMI, I2C, ISI, MMC/SD/SDIO, SPI, SSC, UART/USART | LCD, Touchscreen | 1.4mm | 15mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
 | MPC8544VJANGA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 783-BBGA, FCBGA | 0°C~105°C TA | Tray | 2002 | MPC85xx | yes | 活跃 | 3 (168 Hours) | 260 | 40 | MPC8544 | 800MHz | MICROPROCESSOR, RISC | PowerPC e500 | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, DDR2, SDRAM | DUART, I2C, PCI | Signal Processing; SPE | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | P1012NSN2HFB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 689-BBGA Exposed Pad | 0°C~125°C TA | Tray | 2002 | QorIQ P1 | 活跃 | 3 (168 Hours) | P1012 | 800MHz | PowerPC e500v2 | 10/100/1000Mbps (3) | 1 Core 32-Bit | 无 | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | Communications; QUICC Engine | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | OMAP3530ECBB | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 64kB | ACTIVE (Last Updated: 6 days ago) | 表面贴装 | 515-VFBGA, FCBGA | 515 | L2 Cache, ROM, SRAM | 0°C~90°C TJ | Tray | OMAP-35xx | e1 | yes | 活跃 | 3 (168 Hours) | 515 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 0.4mm | 600MHz | OMAP3530 | 515 | 1.35V | I2C, SPI, UART, USB | 1.35V | 985mV | 112kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32b | ARM | 1.8V 3.0V | 3 | 1 Core 32-Bit | 有 | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Signal Processing; C64x+, Multimedia; NEON™ SIMD | 1 | LCD | 900μm | 12mm | 12mm | 610μm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||
| MPC855TVR80D4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 357-BBGA | YES | 0°C~95°C TA | Tray | 1997 | MPC8xx | e1 | 不用于新设计 | 3 (168 Hours) | 357 | 3A991.A.2 | 锡银铜 | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC855 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 80MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | 固定点 | YES | 3.3V | 10Mbps (1), 10/100Mbps (1) | 1 Core 32-Bit | 无 | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
 | OMAP3515ECUSA | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 1 week ago) | 表面贴装 | 423-LFBGA, FCBGA | 423 | L2 Cache, ROM, SRAM | -40°C~105°C TJ | Tray | OMAP-35xx | e1 | 活跃 | 4 (72 Hours) | 423 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.8V | 0.65mm | 600MHz | OMAP3515 | 423 | 1.35V | I2C, SPI, UART, USB | 1.89V | 1.71V | DIGITAL SIGNAL PROCESSOR, OTHER | ARM® Cortex®-A8 | 32b | ARM | YES | YES | 浮点 | YES | 64000 | 1.8V 3.0V | 3 | 1 Core 32-Bit | 有 | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | 15 | Multimedia; NEON™ SIMD | MROM | 1 | NO | SINGLE | LCD | 1.4mm | 16mm | 16mm | 960μm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||
 | AM3874CCYE80 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 6 days ago) | 684-BFBGA, FCBGA | YES | 684 | 0°C~90°C TJ | Tray | Sitara™ | e1 | yes | 活跃 | 4 (72 Hours) | 684 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 250 | 1.35V | 0.8mm | 800MHz | 未说明 | AM3874 | 684 | 不合格 | 0.95/1.35V | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 32b | ARM | YES | YES | 浮点 | YES | 1.8V 3.3V | 6 | 10/100/1000Mbps (1) | 1 Core 32-Bit | 有 | DDR2, DDR3 | USB 2.0 (2) | CAN, I2C, McASP, McBSP, SPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | HDMI, HDVPSS | SATA 3Gbps (1) | 3.06mm | 23mm | 23mm | 2.5mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||
 | MPC870CVR133 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 256-BBGA | YES | -40°C~100°C TA | Tray | 1999 | MPC8xx | e1 | 最后一次购买 | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | 30 | MPC870 | S-PBGA-B256 | 1.9V | 1.83.3V | 1.7V | 133MHz | MICROPROCESSOR, RISC | 32 | 32 | YES | YES | 32 | 固定点 | YES | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | 无 | DRAM | USB 2.0 (1) | I2C, PCMCIA, SPI, TDM, UART | Communications; CPM | 2.54mm | 23mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
| P2010NXN2HFC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 689-BBGA Exposed Pad | YES | -40°C~125°C TA | Tray | 2002 | QorIQ P2 | e2 | 活跃 | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 1mm | 40 | P2010 | S-PBGA-B689 | 1.1V | 1V | 1.2GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 32 | YES | YES | 16 | 浮点 | YES | 10/100/1000Mbps (3) | 1 Core 32-Bit | 无 | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | 2.46mm | 31mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8321EVRAFDC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 516-BBGA | YES | 0°C~105°C TA | Tray | 2004 | MPC83xx | e2 | Obsolete | 3 (168 Hours) | 516 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8321 | S-PBGA-B516 | 1.05V | 0.95V | 333MHz | MICROPROCESSOR, RISC | PowerPC e300c2 | 66.67MHz | 32 | YES | YES | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | Communications; QUICC Engine, Security; SEC 2.2 | Cryptography | 2.55mm | 27mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
 | MPC8347VVAGDB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 620-BBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | 活跃 | 3 (168 Hours) | 672 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8347 | S-PBGA-B672 | 1.26V | 1.2V | 1.14V | 400MHz | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | 32 | YES | YES | 32 | 浮点 | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | 1.69mm | 35mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
| MPC850DECVR66BU | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 256-BBGA | YES | -40°C~95°C TA | Tray | 1997 | MPC8xx | e1 | Obsolete | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1.27mm | 40 | MPC850 | S-PBGA-B256 | 3.6V | 3.3V | 3V | 66MHz | MICROPROCESSOR, RISC | 32 | 26 | YES | YES | 32 | 固定点 | YES | 3.3V | 10Mbps (1) | 1 Core 32-Bit | 无 | DRAM | USB 1.x (1) | HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART | Communications; CPM | 2.54mm | 23mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
 | MPC8306SCVMAFDCA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 369-LFBGA | YES | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | 活跃 | 3 (168 Hours) | 369 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 40 | MPC8306 | S-PBGA-B369 | 1.05V | 11.83.3V | 0.95V | 333MHz | MICROPROCESSOR, RISC | PowerPC e300c3 | 66.67MHz | 32 | YES | YES | 浮点 | YES | 1.8V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | 无 | DDR2 | USB 2.0 (1) | DUART, I2C, SPI, TDM | Communications; QUICC Engine | 1.61mm | 19mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
 | SPEAR600-2 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8kB | 表面贴装 | 420-FBGA | 420 | 24 | -40°C~85°C TC | Tray | SPEAr® | e2 | 活跃 | 3 (168 Hours) | 420 | 3A991.A.2 | Tin/Silver (Sn/Ag) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 333MHz | SPEAR600 | 420 | 3.3V | 3.6V | Ethernet, I2C, IrDA, SPI, UART, USB | 30 MHz | 16kB | MICROCONTROLLER, RISC | ARM926EJ-S | 32 | YES | YES | 32b | NO | NO | 10 | ARM | 10/100/1000Mbps (1) | 2 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 + PHY (3) | I2C, I2S, IrDA, Microwire, SPI, UART | FLASH | LCD, Touchscreen | 2.06mm | 23mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||
| MC68EN360VR33L | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 357-BBGA | YES | 46 | 0°C~70°C TA | Tray | 1995 | M683xx | e1 | 最后一次购买 | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 5V | 1.27mm | 40 | MC68EN360 | S-PBGA-B357 | 5.25V | 4.75V | 33MHz | MICROCONTROLLER, RISC | CPU32+ | 6MHz | 32 | NO | YES | NO | 32 | 32 | 5.0V | 10Mbps (1) | 1 Core 32-Bit | 无 | DRAM | SCC, SMC, SPI | Communications; CPM | 1.86mm | 25mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
| MPC860PVR80D4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 357-BBGA | YES | 0°C~95°C TA | Tray | 1995 | MPC8xx | e1 | 不用于新设计 | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 80MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | 固定点 | YES | 3.3V | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | 无 | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
 | MPC8260AZUPIBB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 480-LBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 1994 | MPC82xx | e0 | Obsolete | 3 (168 Hours) | 480 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 220 | 2V | 1.27mm | 30 | PC8260 | S-PBGA-B480 | 2.2V | 1.9V | 300MHz | MICROPROCESSOR, RISC | PowerPC G2 | 66.66MHz | 32 | 32 | YES | NO | 64 | 浮点 | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | 无 | DRAM, SDRAM | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | 1.65mm | 37.5mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||
| MPC860SRCVR66D4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 357-BBGA | YES | -40°C~95°C TA | Tray | 1995 | MPC8xx | e1 | 不用于新设计 | 3 (168 Hours) | 357 | 3A991.A.2 | 锡银铜 | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.135V | 66MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | 固定点 | YES | 3.3V | 10Mbps (4) | 1 Core 32-Bit | 无 | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
 | MPC8308VMAGD | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 473-LFBGA | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Obsolete | 3 (168 Hours) | 473 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 40 | MPC8308 | S-PBGA-B473 | 400MHz | MICROPROCESSOR, RISC | PowerPC e300c3 | 1.8V 2.5V 3.3V | 10/100/1000Mbps (3) | 1 Core 32-Bit | 无 | DDR2 | USB 2.0 (1) | DUART, HSSI, I2C, MMC/SD/SDIO, SPI | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC9328MXLCVM15 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 256-LFBGA | -40°C~85°C TA | Tray | 1994 | i.MXL | 不用于新设计 | 3 (168 Hours) | MC9328MXL | 150MHz | ARM920T | 1.8V 3.0V | 1 Core 32-Bit | 无 | SDRAM | USB 1.x (1) | I2C, I2S, SPI, SSI, MMC/SD, UART | LCD | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC9328MXLDVP15 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 26 Weeks | 225-LFBGA | 225-MAPBGA (13x13) | -30°C~70°C TA | Tray | 1994 | i.MXL | 不用于新设计 | 3 (168 Hours) | MC9328MXL | 150MHz | ARM920T | 1.8V 3.0V | 1 Core 32-Bit | 无 | SDRAM | USB 1.x (1) | I2C, I2S, SPI, SSI, MMC/SD, UART | LCD | ROHS3 Compliant |