类别是'嵌入式 - 微处理器'
嵌入式 - 微处理器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 表面安装 | 终端数量 | I/O Voltage-Max | InterfaceType / Connectivity | No of I/O Lines | No of Terminals | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 速度 | 内存大小 | uPs/uCs/外围ICs类型 | 核心处理器 | 程序存储器类型 | 电源电流-最大值 | 位元大小 | 数据总线宽度 | 座位高度-最大 | 地址总线宽度 | 边界扫描 | 低功率模式 | 外部数据总线宽度 | 格式 | 集成缓存 | 内存(字) | 外部中断数量 | 总剂量 | 长度 | 宽度 | ||||||||||||||||||||
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![]() | R9A08G045S33GBG#BC0 | Renesas | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | -40°C to +85°C | 3 | 表面贴装 | 82 | 359 | RZ/G3S | 3V to 3.6V | 1024kB | Cortex-A55 x 1 | RAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | R9A08G045S13GBG#BC0 | Renesas | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 100MHz | -40°C to +85°C | 3 | 表面贴装 | CAN | 82 | RZ/G3S | 3V to 3.6V | 1024kB | ARM® Cortex®-A55 | RAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | R9A08G045S11GBG#BC0 | Renesas | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1100MHz | -40°C to +85°C | 3 | 表面贴装 | 3.3V | 361 | G | ARM® Cortex®-A55 | Flash | 64b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XPC7451RX800RE | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FREESCALE SEMICONDUCTOR INC | , | Transferred | 8542.31.00.01 | unknown | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TR80C188-16 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | INTEL CORP | QFN | QCCN, LCC68A,.95SQ | 85 °C | -40 °C | CERAMIC | QCCN | LCC68A,.95SQ | SQUARE | CHIP CARRIER | 5 V | 68 | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | 无铅 | 1.27 mm | compliant | 68 | S-XQCC-N68 | 不合格 | INDUSTRIAL | 16 MHz | MICROPROCESSOR, RISC | 180 mA | 16 | |||||||||||||||||||||||||||||||||||
![]() | PPC405EX-NPC400T | Applied Micro Circuits Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | APPLIED MICRO CIRCUITS CORP | BGA | BGA, BGA388,26X26,40 | 666.66 MHz | 1 | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA388,26X26,40 | SQUARE | 网格排列 | 1.2 V | 1.1 V | 1.15 V | 388 | 无 | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 1 mm | unknown | 388 | S-PBGA-B388 | 不合格 | INDUSTRIAL | 400 MHz | MICROPROCESSOR, RISC | 32 | 2.65 mm | YES | YES | 固定点 | YES | 27 mm | 27 mm | ||||||||||||||||||||||||||
![]() | XC7455ARX1250PF | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Transferred | FREESCALE SEMICONDUCTOR INC | , | 1 | 无 | e0 | 锡铅 | 8542.31.00.01 | 220 | not_compliant | 30 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TSC695F-25MA | Atmel Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | ATMEL CORP | QFP | QFF, QFL256,1.5SQ,20 | 50 MHz | 125 °C | -55 °C | UNSPECIFIED | QFF | QFL256,1.5SQ,20 | SQUARE | FLATPACK | 5.5 V | 4.5 V | 5 V | 256 | 无 | e0 | 无 | 3A991.A.2 | 锡铅 | 8542.31.00.01 | QUAD | FLAT | 0.508 mm | compliant | 256 | S-XQFP-F256 | 不合格 | MILITARY | 25 MHz | MICROPROCESSOR, RISC | 230 mA | 32 | 3.18 mm | 32 | YES | YES | 32 | 浮点 | NO | 300k Rad(Si) V | 37.085 mm | 37.085 mm | ||||||||||||||||||||
![]() | IDT79R3052-40MJ | Integrated Device Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | INTEGRATED DEVICE TECHNOLOGY INC | QFN | QCCJ, LDCC84,1.2SQ | 80 MHz | 1 | 70 °C | PLASTIC/EPOXY | QCCJ | LDCC84,1.2SQ | SQUARE | CHIP CARRIER | 5.25 V | 4.75 V | 5 V | 84 | 无 | e0 | 无 | 3A991.A.2 | Tin/Lead (Sn85Pb15) | 35 DHYRSTONE MIPS; BURST BUS; 5 PIPELINE STAGES | 8542.31.00.01 | QUAD | J BEND | 225 | 1.27 mm | not_compliant | 30 | 84 | S-PQCC-J84 | 不合格 | COMMERCIAL | 40 MHz | MICROPROCESSOR, RISC | 500 mA | 32 | 4.57 mm | 32 | NO | NO | 32 | 固定点 | NO | 0 | 6 | 29.083 mm | 29.083 mm | ||||||||||||||||
![]() | XC7455ARX933LF | Motorola Mobility LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | MOTOROLA INC | BGA | BGA, BGA360,19X19,50 | 133 MHz | CERAMIC, METAL-SEALED COFIRED | BGA | BGA360,19X19,50 | SQUARE | 网格排列 | 1.35 V | 1.25 V | 1.3 V | 483 | Obsolete | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | 483 | S-CBGA-B483 | 不合格 | 933 MHz | MICROPROCESSOR, RISC | 32 | 3.2 mm | 36 | YES | YES | 64 | 浮点 | YES | 29 mm | 29 mm | |||||||||||||||||||||||||||||
![]() | XC7455ARX933LF | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | FREESCALE SEMICONDUCTOR INC | BGA | 29 X 29 MM, 1.27 MM PITCH, CERAMIC, BGA-483 | 133 MHz | CERAMIC, METAL-SEALED COFIRED | BGA | BGA360,19X19,50 | SQUARE | 网格排列 | 1.35 V | 1.25 V | 1.3 V | 483 | Obsolete | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | 483 | S-CBGA-B483 | 不合格 | 933 MHz | MICROPROCESSOR, RISC | 32 | 3.2 mm | 36 | YES | YES | 64 | 浮点 | YES | 29 mm | 29 mm | |||||||||||||||||||||||||||||
![]() | SCIMX6D5EYM10CD | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | NXP SEMICONDUCTORS | HBGA, | 24 MHz | PLASTIC/EPOXY | HBGA | SQUARE | GRID ARRAY, HEAT SINK/SLUG | 1.5 V | 1.35 V | 624 | 活跃 | 8542.31.00.01 | BOTTOM | BALL | 0.8 mm | unknown | S-PBGA-B624 | 1000 MHz | MICROPROCESSOR | 64 | 1.6 mm | 16 | YES | YES | 64 | 固定点 | YES | 21 mm | 21 mm | |||||||||||||||||||||||||||||||||||
![]() | MC68322FT25 | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | FREESCALE SEMICONDUCTOR INC | QFP | QFP, | 50 MHz | 70 °C | PLASTIC/EPOXY | QFP | SQUARE | FLATPACK | 5.5 V | 4.5 V | 5 V | 160 | Obsolete | EAR99 | 8542.31.00.01 | QUAD | 鸥翼 | 0.65 mm | unknown | 160 | S-PQFP-G160 | 不合格 | COMMERCIAL | 25 MHz | MICROPROCESSOR, RISC | 16 | 3.85 mm | 26 | NO | NO | 16 | 固定点 | NO | 28 mm | 28 mm | ||||||||||||||||||||||||||||
![]() | MC68322FT25 | Motorola Mobility LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | MOTOROLA INC | QFP | QFP, QFP160,1.2SQ | 50 MHz | 70 °C | PLASTIC/EPOXY | QFP | QFP160,1.2SQ | SQUARE | FLATPACK | 5.5 V | 4.5 V | 5 V | 160 | 无 | e0 | 3A991.A.2 | 锡铅 | 8542.31.00.01 | QUAD | 鸥翼 | 0.65 mm | unknown | 160 | S-PQFP-G160 | 不合格 | COMMERCIAL | 25 MHz | MICROPROCESSOR, RISC | 32 | 3.85 mm | 25 | NO | NO | 16 | 固定点 | NO | 28 mm | 28 mm | ||||||||||||||||||||||||
![]() | XC7455CRX933LF | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | FREESCALE SEMICONDUCTOR INC | BGA | BGA, | 133 MHz | CERAMIC, METAL-SEALED COFIRED | BGA | SQUARE | 网格排列 | 1.35 V | 1.25 V | 1.3 V | 483 | Obsolete | 3A991 | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | 483 | S-CBGA-B483 | 不合格 | 933 MHz | MICROPROCESSOR, RISC | 32 | 3.2 mm | 36 | YES | YES | 64 | 浮点 | YES | 29 mm | 29 mm | ||||||||||||||||||||||||||||||
![]() | SAA2500 | Philips Semiconductors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | 飞利浦半导体 | QFP, QFP44(UNSPEC) | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP44(UNSPEC) | FLATPACK | 5 V | 44 | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | 鸥翼 | unknown | 不合格 | INDUSTRIAL | 消费电路 | |||||||||||||||||||||||||||||||||||||||||||
![]() | XPC823VF66B2 | Motorola Semiconductor Products | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | MOTOROLA INC | BGA, BGA256,16X16,40 | 70 °C | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | 网格排列 | 3.6 V | 3 V | 3.3 V | 256 | Obsolete | 8542.31.00.01 | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B256 | 不合格 | COMMERCIAL | 66 MHz | MICROPROCESSOR, RISC | 32 | 1.75 mm | 32 | YES | YES | 32 | 固定点 | YES | 17 mm | 17 mm | |||||||||||||||||||||||||||||||
![]() | XPC823VF66B2 | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | MOTOROLA SEMICONDUCTOR PRODUCTS | BGA, BGA256,16X16,40 | 70 °C | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | 网格排列 | 3.3 V | 256 | Obsolete | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B256 | 不合格 | 3.3 V | COMMERCIAL | 66 MHz | MICROPROCESSOR, RISC | 32 | ||||||||||||||||||||||||||||||||||||||||||
![]() | TR80C188XL10 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | INTEL CORP | , | 活跃 | 8542.31.00.01 | compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 88DE3118A0-BVD2C000-T191 | Marvell Technology Group Ltd | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GC801MD18-32S | TE Connectivity | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | G1620 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | INTEL CORP | 活跃 | 8542.31.00.01 | compliant | MICROPROCESSOR | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPC8245LZU266B | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | MOTOROLA SEMICONDUCTOR PRODUCTS | BGA, BGA352,26X26,50 | PLASTIC/EPOXY | BGA | BGA352,26X26,50 | SQUARE | 网格排列 | 352 | Obsolete | BOTTOM | BALL | 1.27 mm | unknown | S-PBGA-B352 | 不合格 | 2,3.3 V | 266 MHz | MICROPROCESSOR, RISC | 32 | |||||||||||||||||||||||||||||||||||||||||||||
![]() | SPAKLC302PU16B | Motorola Semiconductor Products | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | IDT75K62134 | Integrated Device Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | INTEGRATED DEVICE TECHNOLOGY INC | 无 | 8542.31.00.01 | unknown |