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我的订单 我的询价 0755-82520436 3307104213

图片

产品型号

品牌

数据表

有效性

单价(CNY)

询价

认证

工厂交货时间

生命周期状态

触点镀层

底架

包装/外壳

表面安装

引脚数

质量

操作温度

包装

已出版

系列

JESD-609代码

无铅代码

零件状态

湿度敏感性等级(MSL)

终止次数

ECCN 代码

端子表面处理

附加功能

HTS代码

端子位置

终端形式

峰值回流焊温度(摄氏度)

电源电压

端子间距

频率

时间@峰值回流温度-最大值(s)

基本部件号

引脚数量

JESD-30代码

资历状况

工作电源电压

电源电压-最大值(Vsup)

电源

电源电压-最小值(Vsup)

电压

界面

最大电源电压

最小电源电压

内存大小

振荡器类型

速度

内存大小

uPs/uCs/外围ICs类型

核心处理器

周边设备

时钟频率

位元大小

有ADC

DMA 通道

数据总线宽度

脉宽调制通道

数模转换器通道

定时器/计数器的数量

地址总线宽度

核心架构

边界扫描

低功率模式

外部数据总线宽度

格式

集成缓存

电压 - I/O

UART 通道数

以太网

核数/总线宽度

图形加速

内存控制器

USB

附加接口

协处理器/DSP

只读存储器可编程性

核数量

桶式移位器

内部总线架构

保安功能

显示和界面控制器

萨塔

高度

座位高度(最大)

长度

宽度

器件厚度

辐射硬化

RoHS状态

无铅

MPC875VR66 MPC875VR66

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

12 Weeks

256-BBGA

YES

0°C~95°C TA

Tray

1999

MPC8xx

e1

最后一次购买

3 (168 Hours)

256

5A002.A.1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.31.00.01

BOTTOM

BALL

245

1.8V

1.27mm

30

MPC875

S-PBGA-B256

1.9V

1.83.3V

1.7V

66MHz

MICROPROCESSOR, RISC

32

32

YES

YES

32

固定点

YES

3.3V

10Mbps (1), 10/100Mbps (2)

1 Core 32-Bit

DRAM

USB 2.0 (1)

HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART

Communications; CPM, Security; SEC

Cryptography

2.54mm

23mm

ROHS3 Compliant

MPC8347VVAJFB MPC8347VVAJFB

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

12 Weeks

672-LBGA

YES

0°C~105°C TA

Tray

2002

MPC83xx

e2

活跃

3 (168 Hours)

672

3A991.A.2

TIN COPPER/TIN SILVER

8542.31.00.01

BOTTOM

BALL

260

1.2V

1mm

40

MPC8347

S-PBGA-B672

1.26V

1.2V

1.14V

533MHz

MICROPROCESSOR

PowerPC e300

66MHz

32

32

YES

YES

32

浮点

YES

2.5V 3.3V

10/100/1000Mbps (2)

1 Core 32-Bit

DDR

USB 2.0 + PHY (2)

DUART, I2C, PCI, SPI

1.69mm

35mm

ROHS3 Compliant

MPC8280VVQLDA MPC8280VVQLDA

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

18 Weeks

480-LBGA Exposed Pad

YES

0°C~105°C TA

Tray

1994

MPC82xx

e1

活跃

4 (72 Hours)

480

3A991.A.2

Tin/Silver/Copper (Sn/Ag/Cu)

8542.31.00.01

BOTTOM

BALL

260

1.5V

1.27mm

40

MPC8280

S-PBGA-B480

1.6V

1.53.3V

1.45V

333MHz

MICROPROCESSOR, RISC

PowerPC G2_LE

32

32

YES

YES

64

浮点

YES

3.3V

10/100Mbps (3)

1 Core 32-Bit

DRAM, SDRAM

USB 2.0 (1)

I2C, SCC, SMC, SPI, UART, USART

Communications; RISC CPM

1.65mm

37.5mm

ROHS3 Compliant

MPC8306SCVMADDCA MPC8306SCVMADDCA

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

10 Weeks

369-LFBGA

YES

-40°C~105°C TA

Tray

2002

MPC83xx

e2

活跃

3 (168 Hours)

369

3A991.A.2

TIN COPPER/TIN SILVER

8542.31.00.01

BOTTOM

BALL

260

1V

0.8mm

40

MPC8306

S-PBGA-B369

1.05V

11.83.3V

0.95V

266MHz

MICROPROCESSOR, RISC

PowerPC e300c3

66.67MHz

32

YES

YES

浮点

YES

1.8V 3.3V

10/100Mbps (3)

1 Core 32-Bit

DDR2

USB 2.0 (1)

DUART, I2C, SPI, TDM

Communications; QUICC Engine

1.61mm

19mm

ROHS3 Compliant

MPC8313EVRAFF MPC8313EVRAFF

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

516-BBGA Exposed Pad

YES

0°C~105°C TA

Tray

2004

MPC83xx

e2

Obsolete

1 (Unlimited)

516

5A002.A.1

TIN COPPER/TIN SILVER

8542.31.00.01

BOTTOM

BALL

260

1V

1mm

40

MPC8313

S-PBGA-B516

1.05V

11.8/2.53.3V

0.95V

333MHz

MICROPROCESSOR

PowerPC e300c3

66.67MHz

32

32

YES

YES

32

浮点

YES

1.8V 2.5V 3.3V

10/100/1000Mbps (2)

1 Core 32-Bit

DDR, DDR2

USB 2.0 + PHY (1)

DUART, HSSI, I2C, PCI, SPI

Security; SEC 2.2

Cryptography

2.55mm

27mm

ROHS3 Compliant

AM1707DZKB3 AM1707DZKB3

NA 数据表

N/A

-

最小起订量: 1

倍率: 1

6 Weeks

ACTIVE (Last Updated: 1 week ago)

Copper, Silver, Tin

表面贴装

256-BGA

256

2.784008g

L1 Cache, RAM, ROM

0°C~90°C TJ

Tray

Sitara™

e1

yes

活跃

3 (168 Hours)

256

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

BALL

260

1.2V

375MHz

AM1707

1.2V

Ethernet, I2C, SPI, UART, USB

1.32V

1.14V

128kB

MICROPROCESSOR, RISC

ARM926EJ-S

32

32b

ARM

YES

YES

固定点

YES

1.8V 3.3V

3

10/100Mbps (1)

1 Core 32-Bit

SDRAM

USB 1.1 + PHY (1), USB 2.0 + PHY (1)

I2C, McASP, SPI, MMC/SD, UART

System Control; CP15

1

LCD

2.05mm

17mm

17mm

1.36mm

ROHS3 Compliant

无铅

LS1088AXE7Q1A LS1088AXE7Q1A

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

18 Weeks

780-BFBGA, FCBGA

-40°C~105°C

QorIQ® Layerscape

活跃

3 (168 Hours)

8542.39.00.01

250

30

1.6GHz

ARM® Cortex®-A53

10GbE (2), 1GbE (8)

8 Core 64-Bit

DDR4

USB 3.0 (2) + PHY

Secure Boot, TrustZone®

SATA 6Gbps (1)

ROHS3 Compliant

MC9328MXLVP20 MC9328MXLVP20

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

26 Weeks

225-LFBGA

YES

0°C~70°C TA

Tray

1994

i.MXL

e1

不用于新设计

3 (168 Hours)

225

3A991.A.2

Tin/Silver/Copper (Sn/Ag/Cu)

8542.31.00.01

BOTTOM

BALL

260

1.9V

0.8mm

40

MC9328MXL

S-PBGA-B225

2V

1.8V

200MHz

MICROPROCESSOR, RISC

ARM920T

16MHz

32

25

YES

YES

32

固定点

YES

1.8V 3.0V

1 Core 32-Bit

SDRAM

USB 1.x (1)

I2C, I2S, SPI, SSI, MMC/SD, UART

LCD

1.6mm

13mm

ROHS3 Compliant

MPC8272CZQMIBA MPC8272CZQMIBA

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

12 Weeks

516-BBGA

YES

57

-40°C~105°C TA

Tray

1994

MPC82xx

e0

最后一次购买

3 (168 Hours)

516

5A002.A.1

Tin/Lead (Sn/Pb)

8542.31.00.01

BOTTOM

BALL

245

1.5V

1mm

30

MPC8272

S-PBGA-B516

1.575V

1.53.3V

1.425V

266MHz

MICROCONTROLLER, RISC

PowerPC G2_LE

66.7MHz

32

NO

YES

NO

30

64

3.3V

10/100Mbps (2)

1 Core 32-Bit

DRAM, SDRAM

USB 2.0 (1)

I2C, SCC, SMC, SPI, UART, USART

Communications; RISC CPM, Security; SEC

Cryptography, Random Number Generator

27mm

Non-RoHS Compliant

AT91SAM9260B-CU-999 AT91SAM9260B-CU-999

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

12 Weeks

96

8kB

Copper, Silver, Tin

表面贴装

217-LFBGA

217

FLASH, ROM

-40°C~85°C TA

Tape & Reel (TR)

2004

AT91SAM

yes

活跃

3 (168 Hours)

217

BOTTOM

BALL

1.8V

0.8mm

80MHz

AT91SAM9260

3.3V

2-Wire, CAN, EBI/EMI, Ethernet, I2C, I2S, MMC, SPI, UART, USART, USB

3.6V

1.65V

Internal

210 MHz

32kB

MICROCONTROLLER, RISC

ARM926EJ-S

Brown-out Detect/Reset, DMA, POR, PWM, WDT

32

YES

YES

32b

YES

NO

6

26

ARM

1.8V 2.5V 3.3V

10/100Mbps

1 Core 32-Bit

SDRAM, SRAM

USB 2.0 (2)

EBI/EMI, I2C, ISI, MMC/SD/SDIO, SPI, SSC, UART/USART

1.4mm

15mm

ROHS3 Compliant

MPC8560CVT667JC MPC8560CVT667JC

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

783-BBGA, FCBGA

YES

-40°C~105°C TA

Tray

2002

MPC85xx

e2

Obsolete

3 (168 Hours)

783

3A991.A.2

TIN COPPER/TIN SILVER

8542.31.00.01

BOTTOM

BALL

260

1.2V

1mm

40

MPC8560

S-PBGA-B783

1.26V

1.14V

667MHz

MICROPROCESSOR, RISC

PowerPC e500

166MHz

32

64

YES

YES

64

固定点

YES

2.5V 3.3V

10/100/1000Mbps (2)

1 Core 32-Bit

DDR, SDRAM

I2C, PCI, RapidIO, SPI, TDM, UART

Communications; CPM

3.85mm

29mm

ROHS3 Compliant

SPEAR310-2 SPEAR310-2

STMicroelectronics 数据表

N/A

-

最小起订量: 1

倍率: 1

8kB

表面贴装

289-LFBGA

289

102

-40°C~85°C TC

Tray

SPEAr®

e1

活跃

3 (168 Hours)

289

5A002.A.4

Tin/Silver/Copper (Sn/Ag/Cu)

8542.31.00.01

BOTTOM

BALL

260

1.2V

0.8mm

333MHz

30

SPEAR310

289

1.2V

1.21.83.3V

3.6V

I2C, Serial, UART, USB

2.5V

1.14V

32kB

MICROPROCESSOR, RISC

ARM926EJ-S

32

16b

6

ARM

YES

YES

固定点

YES

3.3V

10/100Mbps (5)

1 Core 32-Bit

LPDDR, DDR2

USB 2.0 + PHY (3)

HDLC, I2C, I2S, IrDA, Microwire, MMC/SDIO, SPI, TDM/E1, UART

Security; C3

Cryptography

1.7mm

15mm

ROHS3 Compliant

无铅

OMAP3515DCUS OMAP3515DCUS

NA 数据表

N/A

-

最小起订量: 1

倍率: 1

表面贴装

423-LFBGA, FCBGA

423

L2 Cache, ROM, SRAM

0°C~90°C TJ

Tray

OMAP-35xx

no

Obsolete

4 (72 Hours)

423

BOTTOM

BALL

1.8V

0.65mm

600MHz

OMAP3515

423

1.35V

I2C, MMC, SDIO, UART, USB

1.89V

1.71V

64kB

DIGITAL SIGNAL PROCESSOR, OTHER

ARM® Cortex®-A8

32b

12

ARM

YES

YES

浮点

1.8V 3.0V

3

1 Core 32-Bit

LPDDR

USB 1.x (3), USB 2.0 (1)

HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART

Multimedia; NEON™ SIMD

NO

MULTIPLE

LCD

1.4mm

16mm

ROHS3 Compliant

含铅

MCIMX6G2CVK05AA MCIMX6G2CVK05AA

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

10 Weeks

272-LFBGA

YES

-40°C~105°C TJ

Tray

2012

i.MX6UL

Obsolete

3 (168 Hours)

272

5A992

8542.31.00.01

BOTTOM

BALL

0.5mm

S-PBGA-B272

1.3V

1.15V

528MHz

MICROPROCESSOR

ARM® Cortex®-A7

16

YES

YES

16

固定点

YES

1.2V 1.35V 1.5V 1.8V 2.5V 2.8V 3.3V

10/100Mbps (2)

1 Core 32-Bit

LPDDR2, DDR3, DDR3L

USB 2.0 + PHY (2)

CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART

Multimedia; NEON™ SIMD

ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS

LCD, LVDS

1.23mm

9mm

ROHS3 Compliant

MPC860ENCVR50D4 MPC860ENCVR50D4

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

357-BBGA

YES

-40°C~95°C TA

Tray

1995

MPC8xx

e1

不用于新设计

3 (168 Hours)

357

3A991.A.2

锡银铜

8542.31.00.01

BOTTOM

BALL

245

3.3V

1.27mm

30

MPC860

S-PBGA-B357

3.465V

3.3V

3.135V

50MHz

MICROPROCESSOR, RISC

50MHz

32

32

YES

YES

32

固定点

YES

3.3V

10Mbps (4)

1 Core 32-Bit

DRAM

I2C, IrDA, PCMCIA, SPI, TDM, UART/USART

Communications; CPM

2.52mm

25mm

ROHS3 Compliant

AM3356BZCZA30 AM3356BZCZA30

NA 数据表

N/A

-

最小起订量: 1

倍率: 1

6 Weeks

ACTIVE (Last Updated: 2 weeks ago)

Copper, Silver, Tin

324-LFBGA

YES

324

1.713814g

L2 Cache, RAM, ROM

-40°C~105°C TJ

Tray

Sitara™

e1

yes

活跃

3 (168 Hours)

324

5A992.C

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

BALL

260

1.1V

0.8mm

300MHz

未说明

AM3356

不合格

1.1V

1.144V

CAN, Ethernet, I2C, SPI, UART, USB

64kB

MICROPROCESSOR, RISC

ARM® Cortex®-A8

32

32b

ARM

YES

YES

固定点

YES

1.8V 3.3V

6

10/100/1000Mbps (2)

1 Core 32-Bit

LPDDR, DDR2, DDR3, DDR3L

USB 2.0 + PHY (2)

CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART

Multimedia; NEON™ SIMD

1

Cryptography, Random Number Generator

LCD, Touchscreen

1.4mm

15mm

15mm

900μm

ROHS3 Compliant

无铅

MC9328MXLVP15 MC9328MXLVP15

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

225-LFBGA

YES

0°C~70°C TA

Tray

1994

i.MXL

e1

不用于新设计

3 (168 Hours)

225

3A991.A.2

Tin/Silver/Copper (Sn/Ag/Cu)

8542.31.00.01

BOTTOM

BALL

260

1.8V

0.8mm

40

MC9328MXL

S-PBGA-B225

1.9V

1.7V

150MHz

MICROPROCESSOR, RISC

ARM920T

16MHz

32

25

YES

YES

32

固定点

YES

1.8V 3.0V

1 Core 32-Bit

SDRAM

USB 1.x (1)

I2C, I2S, SPI, SSI, MMC/SD, UART

LCD

1.6mm

13mm

ROHS3 Compliant

MPC8260ACZUMIBB MPC8260ACZUMIBB

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

12 Weeks

480-LBGA Exposed Pad

YES

-40°C~105°C TA

Tray

1994

MPC82xx

e0

Obsolete

3 (168 Hours)

480

3A991.A.2

Tin/Lead (Sn/Pb)

8542.31.00.01

BOTTOM

BALL

220

2V

1.27mm

30

PC8260

S-PBGA-B480

2.2V

1.9V

266MHz

MICROPROCESSOR, RISC

PowerPC G2

66.66MHz

32

32

YES

NO

64

浮点

YES

3.3V

10/100Mbps (3)

1 Core 32-Bit

DRAM, SDRAM

I2C, SCC, SMC, SPI, UART, USART

Communications; RISC CPM

1.65mm

37.5mm

Non-RoHS Compliant

P2010NXN2KFC P2010NXN2KFC

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

12 Weeks

689-BBGA Exposed Pad

YES

-40°C~125°C TA

Tray

2002

QorIQ P2

e2

活跃

3 (168 Hours)

689

3A991.A.2

TIN COPPER/TIN SILVER

8542.31.00.01

BOTTOM

BALL

260

1.05V

1mm

40

P2010

S-PBGA-B689

1.1V

1V

1.2GHz

MICROPROCESSOR, RISC

PowerPC e500v2

100MHz

16

YES

YES

64

浮点

YES

10/100/1000Mbps (3)

1 Core 32-Bit

DDR2, DDR3

USB 2.0 + PHY (2)

DUART, I2C, MMC/SD, SPI

2.46mm

31mm

ROHS3 Compliant

MC7448HX1000ND MC7448HX1000ND

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

12 Weeks

360-BCBGA, FCCBGA

YES

0°C~105°C TA

Tray

1994

MPC74xx

e0

活跃

1 (Unlimited)

360

3A991.A.1

Tin/Lead (Sn/Pb)

8542.31.00.01

BOTTOM

BALL

260

1V

1.27mm

40

MC7448

S-CBGA-B360

1.05V

1.31.8/2.5V

0.95V

1.0GHz

MICROPROCESSOR, RISC

PowerPC G4

1000MHz

32

NO

YES

固定点

NO

1.5V 1.8V 2.5V

1 Core 32-Bit

Multimedia; SIMD

2.8mm

25mm

Non-RoHS Compliant

T2080NXE8TTB T2080NXE8TTB

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

18 Weeks

896-BFBGA, FCBGA

YES

0°C~105°C TA

Tray

2002

QorIQ T2

活跃

3 (168 Hours)

896

5A002.A.1

8542.31.00.01

BOTTOM

BALL

250

0.8mm

未说明

S-PBGA-B896

1.8GHz

MICROPROCESSOR, RISC

PowerPC e6500

64

NO

NO

固定点

YES

1Gbps (8), 2.5Gbps (4), 10Gbps (4)

4 Core 64-Bit

DDR3, DDR3L

USB 2.0 + PHY (2)

Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage

SATA 3Gbps (2)

2.61mm

25mm

ROHS3 Compliant

MPC8280CZUQLDA MPC8280CZUQLDA

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

18 Weeks

480-LBGA Exposed Pad

YES

-40°C~105°C TA

Tray

1994

MPC82xx

e0

活跃

4 (72 Hours)

480

3A991.A.2

Tin/Lead (Sn/Pb)

8542.31.00.01

BOTTOM

BALL

260

1.5V

1.27mm

40

MPC8280

S-PBGA-B480

1.6V

1.53.3V

1.45V

333MHz

MICROPROCESSOR, RISC

PowerPC G2_LE

32

32

YES

YES

64

浮点

YES

3.3V

10/100Mbps (3)

1 Core 32-Bit

DRAM, SDRAM

USB 2.0 (1)

I2C, SCC, SMC, SPI, UART, USART

Communications; RISC CPM

1.65mm

37.5mm

Non-RoHS Compliant

MVF60NS151CMK40 MVF60NS151CMK40

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

15 Weeks

0

364-LFBGA

YES

131

-40°C~85°C TA

Tray

2002

Vybrid, VF6xx

e1

活跃

3 (168 Hours)

364

5A002.A.1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.31.00.01

BOTTOM

BALL

260

1.23V

0.8mm

40

MVF60NS151

S-PBGA-B364

不合格

1.26V

3.3V

1.16V

400MHz, 167MHz

MICROCONTROLLER, RISC

ARM® Cortex®-A5 + Cortex®-M4

16

YES

YES

NO

YES

16

16

3.3V

10/100Mbps (2)

2 Core 32-Bit

LPDDR2, DDR3, DRAM

USB 2.0 OTG + PHY (1)

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART

Multimedia; NEON™ MPE

FLASH

ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG

DCU, GPU, LCD, VideoADC, VIU

17mm

ROHS3 Compliant

MC7447AVU867NB MC7447AVU867NB

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

360-BCBGA, FCCBGA

YES

0°C~105°C TA

Tray

1994

MPC74xx

e2

不用于新设计

1 (Unlimited)

360

3A991.A.1

TIN COPPER/TIN SILVER

ALSO REQUIRES 1.8V OR 2.5V SUPPLY

8542.31.00.01

BOTTOM

BALL

260

1.3V

1.27mm

40

MC7447

S-CBGA-B360

1.35V

1.25V

867MHz

MICROPROCESSOR, RISC

PowerPC G4

167MHz

32

36

YES

YES

64

浮点

YES

1.8V 2.5V

1 Core 32-Bit

Multimedia; SIMD

2.8mm

25mm

ROHS3 Compliant

MC8641DVJ1333JE MC8641DVJ1333JE

NXP USA Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

12 Weeks

1023-BCBGA, FCCBGA

YES

0°C~105°C TA

Tray

2001

MPC86xx

e2

活跃

3 (168 Hours)

3A991.A.1

TIN COPPER/TIN SILVER

8542.31.00.01

BOTTOM

BALL

245

1.05V

1mm

30

S-CBGA-B1023

1.1V

1V

1.333GHz

MICROPROCESSOR, RISC

PowerPC e600

32

16

YES

YES

64

浮点

YES

1.8V 2.5V 3.3V

10/100/1000Mbps (4)

2 Core 32-Bit

DDR, DDR2

DUART, HSSI, I2C, RapidIO

2.77mm

33mm

ROHS3 Compliant