类别是'嵌入式 - 微处理器'
嵌入式 - 微处理器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 包装/外壳 | 表面安装 | 引脚数 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 速度 | 内存大小 | uPs/uCs/外围ICs类型 | 核心处理器 | 时钟频率 | 位元大小 | 有ADC | DMA 通道 | 数据总线宽度 | 脉宽调制通道 | 数模转换器通道 | 定时器/计数器的数量 | 地址总线宽度 | 核心架构 | 边界扫描 | 低功率模式 | 外部数据总线宽度 | 格式 | 集成缓存 | 内存(字) | 电压 - I/O | UART 通道数 | 以太网 | 核数/总线宽度 | 图形加速 | 内存控制器 | USB | 附加接口 | 串行I/O数 | 定时器数量 | 协处理器/DSP | 只读存储器可编程性 | 核数量 | 总线兼容性 | 桶式移位器 | 内部总线架构 | 保安功能 | 显示和界面控制器 | 萨塔 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||
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 | MCIMX233CJM4C | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 169-LFBGA | Industrial grade | -40°C~85°C TA | Tray | 2004 | i.MX23 | 活跃 | 3 (168 Hours) | MCIMX233 | 454MHz | ARM926EJ-S | 2.0V 2.5V 2.7V 3.0V 3.3V | 1 Core 32-Bit | 无 | DRAM | USB 2.0 + PHY (1) | I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | Data; DCP | Cryptography, Hardware ID | LCD, Touchscreen | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MCIMX257CJN4A | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 347-LFBGA | YES | 6 | -40°C~85°C TA | Tray | 2005 | i.MX25 | e1 | 活跃 | 3 (168 Hours) | 347 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.45V | 0.5mm | 40 | MCIMX257 | S-PBGA-B347 | 1.52V | 1.2/1.51.8/3.3V | 1.38V | 400MHz | MICROPROCESSOR | ARM926EJ-S | 24MHz | 32 | 26 | YES | YES | 16 | 固定点 | YES | 128000 | 2.0V 2.5V 2.7V 3.0V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | 无 | LPDDR, DDR, DDR2 | USB 2.0 + PHY (2) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | I2C; USB | Keypad, LCD, Touchscreen | 1.52mm | 12mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
 | MCIMX6DP6AVT1AB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 624-FBGA, FCBGA | YES | -40°C~125°C TJ | Tray | 2002 | i.MX6DP | 活跃 | 3 (168 Hours) | 624 | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | S-PBGA-B624 | 1.5V | 1.35V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | 有 | LPDDR2, DDR3L, DDR3 | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | SATA 3Gbps (1) | 2.16mm | 21mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AM1808BZWTD4 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Copper, Silver, Tin | 表面贴装 | 361-LFBGA | 361 | -40°C~90°C TJ | Tray | Sitara™ | e1 | no | Obsolete | 3 (168 Hours) | 361 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.3V | 0.8mm | 456MHz | AM1808 | 361 | 1.35V | I2C, SPI, UART, USB | 1.35V | 950mV | 8kB | MICROPROCESSOR, RISC | ARM926EJ-S | 32 | 32b | 23 | ARM | YES | YES | 固定点 | YES | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | 无 | LPDDR, DDR2 | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | I2C, McASP, McBSP, SPI, MMC/SD, UART | System Control; CP15 | 1 | LCD | SATA 3Gbps (1) | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||
 | MPC8569ECVJAQLJB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 783-BBGA, FCBGA | YES | -40°C~105°C TA | Tray | 2002 | MPC85xx | e1 | 最后一次购买 | 3 (168 Hours) | 783 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 30 | S-PBGA-B783 | 1.03V | 12.5/3.3V | 0.97V | 1.067GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 133MHz | 32 | 16 | YES | YES | 64 | 浮点 | YES | 1.0V 1.5V 1.8V 2.5V 3.3V | 10/100Mbps (8), 1Gbps (4) | 1 Core 32-Bit | 无 | DDR2, DDR3, SDRAM | USB 2.0 (1) | DUART, HSSI, I2C, MMC/SD, PCI, RapidIO, SPI, TDM, UART | Communications; QUICC Engine, Security; SEC | Cryptography, Random Number Generator | 3.94mm | 29mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
 | MC68EN360CAI25L | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 240-BFQFP | YES | -40°C~85°C TA | Tray | 1995 | M683xx | e3 | 不用于新设计 | 3 (168 Hours) | 240 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 40 | MC68EN360 | S-PQFP-G240 | 25MHz | risc微控制器 | CPU32+ | 5.0V | 10Mbps (1) | 1 Core 32-Bit | 无 | DRAM | SCC, SMC, SPI | Communications; CPM | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8314VRADDA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 620-BBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | 活跃 | 3 (168 Hours) | 620 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8314 | S-PBGA-B620 | 1.05V | 13.3V | 0.95V | 266MHz | MICROPROCESSOR | PowerPC e300c3 | 66.67MHz | 32 | YES | YES | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI, TDM | 2.46mm | 29mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8377VRALGA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 689-BBGA Exposed Pad | YES | 0°C~125°C TA | Tray | 2002 | MPC83xx | e2 | 活跃 | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8377 | S-PBGA-B689 | 1.05V | 11.8/2.52.5/3.3V | 0.95V | 667MHz | MICROPROCESSOR | PowerPC e300c4s | 32 | 15 | YES | YES | 64 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | SATA 3Gbps (2) | 2.46mm | 31mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
 | FS32V234CON1VUB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 22 Weeks | 621-FBGA, FCBGA | YES | -40°C~105°C TA | 2015 | 活跃 | 3 (168 Hours) | 621 | 5A992 | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.65mm | 40 | S-PBGA-B621 | 1.05V | 0.95V | 1GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A53, ARM® Cortex®-M4 | 64 | YES | YES | 浮点 | YES | 1V 1.8V 3.3V | 1Gbps | 4 Core 64-Bit/1 Core 32-Bit | 有 | DDR3, DDR3L, LPDDR2 | I2C, SPI, PCI, UART | Multimedia; NEON™ MPE | AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG | APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU | 2.44mm | 17mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AM3354BZCEA60 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | ACTIVE (Last Updated: 2 weeks ago) | Copper, Silver, Tin | 298-LFBGA | YES | 298 | Cache, RAM, ROM | -40°C~105°C TJ | Tube | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 298 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.1V | 600MHz | 未说明 | AM3354 | 不合格 | 1.1V | 1.144V | CAN, Ethernet, I2C, SPI, UART, USB | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 32b | ARM | YES | YES | 固定点 | YES | 1.8V 3.3V | 6 | 10/100/1000Mbps (2) | 1 Core 32-Bit | 有 | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | Cryptography, Random Number Generator | LCD, Touchscreen | 1.3mm | 13mm | 13mm | 890μm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||
 | MCIMX6S1AVM08AC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 624-LFBGA | YES | -40°C~125°C TJ | Tray | 2002 | i.MX6S | e1 | 活跃 | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.35V | 0.8mm | 40 | S-PBGA-B624 | 1.5V | 1.275V | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 24MHz | 64 | 16 | YES | YES | 32 | 固定点 | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.6mm | 21mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
| P1020NSE2DFB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 689-BBGA Exposed Pad | YES | 0°C~125°C TA | Tray | 2002 | QorIQ P1 | 活跃 | 3 (168 Hours) | 689 | 8542.31.00.01 | BOTTOM | BALL | 1V | 1mm | P1020 | S-PBGA-B689 | 1V | 800MHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 32 | 2.5V 3.3V | 10/100/1000Mbps (3) | 2 Core 32-Bit | 无 | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | Security; SEC 3.3 | Cryptography, Random Number Generator | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6L7DVN10AB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Commercial grade | 432-TFBGA | YES | 162 | 0°C~95°C TJ | Tray | 2002 | i.MX6SL | e1 | 活跃 | 3 (168 Hours) | 576 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.5mm | 40 | MCIMX6 | S-PBGA-B | 不合格 | 1.5V | 1.375V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 32 | 16 | YES | YES | 32 | 固定点 | YES | 32000 | 1.2V 1.8V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | CAN; ETHERNET; IRDA; I2C; I2S; SPI; UART; USB | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.1mm | 13mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
 | AM5726BABCXEA | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 1 week ago) | 760-BFBGA, FCBGA | YES | 760 | -40°C~105°C TJ | Tray | Sitara™ | e1 | 活跃 | 3 (168 Hours) | 760 | 5A992C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1.15V | 0.8mm | AM5726 | 1.2V | 1.11V | 1.5GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A15 | 38.4MHz | YES | YES | 浮点 | NO | 1.8V 3.3V | 10 | GbE | 2 Core 32-Bit | 无 | DDR3, SRAM | USB 2.0 (1), USB 3.0 (1) | DSP, IPU, VPE | SATA 3Gbps (1) | 2.96mm | 23mm | 23mm | 2.39mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||
 | P1010NXE5HHB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 425-FBGA | YES | -40°C~105°C TA | Tray | 2002 | QorIQ P1 | 活跃 | 3 (168 Hours) | 425 | 8542.31.00.01 | 1V | P1010 | 1V | 1.0GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 32 | 10/100/1000Mbps (3) | 1 Core 32-Bit | 无 | DDR3, DDR3L | USB 2.0 + PHY (1) | CAN, DUART, I2C, MMC/SD, SPI | Security; SEC 4.4 | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | SATA 3Gbps (2) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| OMAPL138BZWT4 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 40kB | Copper, Silver, Tin | 表面贴装 | 361-LFBGA | 361 | Cache, RAM, ROM | 0°C~90°C TJ | Tray | OMAP-L1x | e1 | yes | Obsolete | 3 (168 Hours) | 361 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1V | 0.8mm | 456MHz | OMAPL138 | 361 | 1.35V | Ethernet, MMC, SATA, SD, UART, USB | 1.35V | 1.25V | 32kB | DIGITAL SIGNAL PROCESSOR, OTHER | ARM926EJ-S | 32b | 4 | ARM | YES | YES | 浮点 | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | 无 | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART | Signal Processing; C674x, System Control; CP15 | NO | MULTIPLE | Boot Security, Cryptography | LCD | SATA 3Gbps (1) | 16mm | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||
 | MCIMX31CVMN4C | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 473-LFBGA | YES | -40°C~85°C TA | Tray | 2004 | i.MX31 | e1 | 活跃 | 3 (168 Hours) | 473 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.4V | 0.8mm | 40 | MCIMX31 | S-PBGA-B473 | 不合格 | 1.47V | 1.53.3V | 1.22V | 400MHz | MICROPROCESSOR | ARM1136JF-S | 75MHz | 32 | 26 | YES | YES | 16 | 浮点 | YES | 1.8V 2.0V 2.5V 2.7V 3.0V | 1 Core 32-Bit | 有 | DDR | USB 2.0 (3) | 1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART | Multimedia; GPU, IPU, MPEG-4, VFP | Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory | Keyboard, Keypad, LCD | 1.54mm | 19mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6U7CVM08AB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 624-LFBGA | YES | -40°C~105°C TA | Tray | 2002 | i.MX6DL | e1 | 不用于新设计 | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | MCIMX6 | S-PBGA-B624 | 1.5V | 1.275V | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 32 | 26 | YES | YES | 32 | 浮点 | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.6mm | 21mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8321ECVRADDCA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 516-BBGA | YES | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | 活跃 | 3 (168 Hours) | 516 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | S-PBGA-B516 | 1.05V | 0.95V | 266MHz | MICROPROCESSOR, RISC | PowerPC e300c2 | 66.67MHz | 32 | YES | YES | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | Communications; QUICC Engine, Security; SEC 2.2 | Cryptography | 2.55mm | 27mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
 | AM3354BZCZ30 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 1 week ago) | 表面贴装 | 324-LFBGA | 324 | 1.713814g | Cache, RAM, ROM | 0°C~90°C TJ | Tube | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 324 | 5A992C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.1V | 0.8mm | 300MHz | AM3354 | 1.1V | 1.144V | CAN, Ethernet, I2C, SPI, UART, USB | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 32b | ARM | YES | YES | 固定点 | YES | 1.8V 3.3V | 6 | 10/100/1000Mbps (2) | 1 Core 32-Bit | 有 | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | Cryptography, Random Number Generator | LCD, Touchscreen | 1.4mm | 15mm | 15mm | 900μm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||
 | OMAPL137DZKBD4 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 4 days ago) | 256-BGA | YES | 256 | -40°C~90°C TJ | Tray | OMAP-L1x | e1 | yes | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.3V | 456MHz | OMAPL137 | 1.3V | 1.35V | 1.25V | DIGITAL SIGNAL PROCESSOR, OTHER | ARM926EJ-S | ARM | YES | YES | 浮点 | YES | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | 无 | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, MMC/SD, SPI, UART | 3 | Signal Processing; C674x, System Control; CP15 | 1 | NO | SINGLE | LCD | 2.05mm | 17mm | 17mm | 1.36mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||
| MPC8548EVTAUJD | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 783-BBGA, FCBGA | 0°C~105°C TA | Tray | 2009 | MPC85xx | Obsolete | 3 (168 Hours) | MPC8548 | 1.333GHz | PowerPC e500 | 1.8V 2.5V 3.3V | 10/100/1000Mbps (4) | 1 Core 32-Bit | 无 | DDR, DDR2, SDRAM | DUART, I2C, PCI, RapidIO | Signal Processing; SPE, Security; SEC | Cryptography, Random Number Generator | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AM1802BZWTD3 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8kB | Copper, Silver, Tin | 表面贴装 | 361-LFBGA | 361 | 144 | -40°C~90°C TJ | Tray | Sitara™ | e1 | Obsolete | 3 (168 Hours) | 361 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 300MHz | AM1802 | 361 | 1.32V | 1.2V | 950mV | 16kB | MICROCONTROLLER, RISC | ARM926EJ-S | 32 | NO | YES | 32b | NO | NO | 4 | ARM | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | 无 | LPDDR, DDR2 | USB 2.0 + PHY (1) | I2C, McASP, SPI, MMC/SD, UART | System Control; CP15 | FLASH | 1 | LCD | ROHS3 Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||
 | MCIMX6Y0CVM05AA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 52 Weeks | 289-LFBGA | YES | -40°C~105°C TJ | Tray | 2002 | i.MX6 | 活跃 | 3 (168 Hours) | 289 | 5A992 | 8542.31.00.01 | BOTTOM | BALL | 0.8mm | S-PBGA-B289 | 1.5V | 1.275V | 528MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A7 | 528MHz | 16 | YES | 16 | 1.8V 2.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | 无 | LPDDR2, DDR3, DDR3L | USB 2.0 OTG + PHY (1) | I2C, SPI, UART | 1 | Multimedia; NEON™ MPE | ETHERNET, I2C, PCI, SPI, UART, USB | A-HAB, ARM TZ, CSU, SJC, SNVS | Electrophoretic, LCD | 1.32mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC7447AHX1167NB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 360-BCBGA, FCCBGA | YES | 0°C~105°C TA | Tray | 1994 | MPC74xx | e0 | 不用于新设计 | 1 (Unlimited) | 360 | 3A991.A.1 | Tin/Lead (Sn/Pb) | ALSO REQUIRES 1.8V OR 2.5V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.3V | 1.27mm | 40 | MC7447 | S-CBGA-B360 | 1.35V | 1.25V | 1.167GHZ | MICROPROCESSOR, RISC | PowerPC G4 | 167MHz | 32 | 36 | YES | YES | 64 | 浮点 | YES | 1.8V 2.5V | 1 Core 32-Bit | 无 | Multimedia; SIMD | 3.24mm | 25mm | Non-RoHS Compliant |