类别是'USB 闪存驱动器'
USB 闪存驱动器 (1677)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 包装 | 零件状态 | 引脚数量 | 建筑学 | 行业规模 | 页面尺寸 | 引导模块 | |||||||||||||||||||||||||||||||||||||||||||
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 | W29N01HVSINF-T | Winbond Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3A991.b.1.a | 无 | 无 | SLC NAND | 1G | Symmetrical | 28 | 8 | 128M | 有 | Asynchronous | 0.01/Block | 0.7/Page | Parallel | 40 | 2.7 | 3.3|3 | 3.6 | 2.7 to 3.6 | 35 | 35 | -40 | 85 | Industrial | 无 | 有 | 有 | 100000 | 表面贴装 | 1 | 18.4 | 12 | 48 | SOP | TSOP-I | Gull-wing | Compliant | 活跃 | 48 | Sectored | 128Kbyte x 1024 | 2Kbyte | 无 | ||||||||
| W25Q128FWSIQ-T | Winbond Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3A991.b.1.a | 无 | 无 | NOR | 128M | Symmetrical | 24 | 8 | 16M | 有 | Synchronous | 6 | 200/Chip | 5/Page | Serial (SPI, Dual SPI, Quad SPI) | 1.65 | 1.8 | 1.95 | 1.65 to 1.95 | 20 | 25 | -40 | 85 | Industrial | 有 | 无 | 无 | 100000 | 表面贴装 | 1.8 | 5.28 | 5.28 | 8 | SOP | SOIC | Gull-wing | Compliant | Tube | Obsolete | 8 | Sectored | 4Kbyte x 4096 | 256byte | 无 | |||||||
| W25Q16DVSNAG-T | Winbond Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | EAR99 | 有 | Unknown | NOR | 16M | Symmetrical | 24 | 8 | 2M | 有 | Synchronous | 8 | 10/Chip | 4/Page | Serial (SPI, Dual SPI, Quad SPI) | 2.7 | 3|3.3 | 3.6 | 2.7 to 3.6 | 30 | 25 | -40 | 105 | 汽车 | 有 | 无 | 无 | 表面贴装 | 1.5(Max) | 4(Max) | 5(Max) | 8 | SOIC N | Compliant | Obsolete | 8 | Sectored | 4Kbyte x 512 | 256byte | 无 | |||||||||||
| W25Q16DVSNAG-S | Winbond Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | EAR99 | 有 | Unknown | NOR | 16M | Symmetrical | 24 | 8 | 2M | 有 | Synchronous | 8 | 10/Chip | 4/Page | Serial (SPI, Dual SPI, Quad SPI) | 2.7 | 3|3.3 | 3.6 | 2.7 to 3.6 | 30 | 25 | -40 | 105 | 汽车 | 有 | 无 | 无 | 表面贴装 | 1.5(Max) | 4(Max) | 5(Max) | 8 | SOIC N | Compliant | Obsolete | 8 | Sectored | 4Kbyte x 512 | 256byte | 无 | |||||||||||
| W25Q256JWPIQT | Winbond Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3A991.b.1.a | 无 | 无 | NOR | 256M | Symmetrical | 32 | 8 | 32M | 有 | Synchronous | 6 | 400/Chip | 5/Page | Serial (SPI, Dual SPI, Quad SPI) | 1.7 | 1.8 | 1.95 | 1.7 to 1.95 | 20 | 20 | -40 | 85 | Industrial | 有 | 无 | 无 | 表面贴装 | 0.73 | 6 | 5 | 8 | WSON EP | Compliant | Tape and Reel|Tray|Tube | 活跃 | 8 | Sectored | 4Kbyte x 8192 | 256byte | 无 | ||||||||||
| W25Q64FWSTIM-T | Winbond Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3A991.b.1.a | 无 | 无 | NOR | 64M | Symmetrical | Top|Bottom | 24 | 8 | 8M | 有 | Synchronous | 6 | 100/Chip | 5/Page | Serial (SPI, Dual SPI, Quad SPI) | 1.65 | 1.8 | 1.95 | 1.65 to 1.95 | 20 | 25 | -40 | 85 | Industrial | 有 | 无 | 无 | 100000 | 表面贴装 | 0.8 | 5.28 | 5.28 | 8 | VSOP | Compliant | Obsolete | 8 | Sectored | 4Kbyte x 2048 | 256byte | 有 | |||||||||
| KLM8G1GETF-B041T06 | Samsung Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 无 | 无 | 64G | Synchronous | Serial e-MMC | 1.7|2.7 | 1.8|3.3 | 1.95|3.6 | Compliant | 活跃 | Sectored | ||||||||||||||||||||||||||||||||||||||||
| W25Q32JWBYIQ/REEL | Winbond Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3A991.b.1.a | 无 | 无 | NOR | 32M | Symmetrical | 24 | 8 | 4M | 有 | Synchronous | 6 | 50/Chip | 5/Page | Serial (SPI, Dual SPI, Quad SPI) | 1.7 | 133 | 1.8 | 1.95 | 1.7 to 1.95 | 20 | 20 | -40 | 85 | Industrial | 有 | 无 | 无 | 100000 | 表面贴装 | 0.33 | 12 | WLCSP | Compliant | Tube | 活跃 | 12 | Sectored | 4Kbyte x 1024 | 256byte | 无 | ||||||||||
| W25Q16JVSSJQ/REEL | Winbond Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | EAR99 | 无 | 无 | NOR | 16M | Symmetrical | 24 | 8 | 2M | 有 | Synchronous | 6 | 25/Chip | 3/Page | Serial (SPI, Dual SPI, Quad SPI) | 2.7 | 3|3.3 | 3.6 | 2.7 to 3.6 | 25 | 25 | -40 | 105 | 工业级 | 有 | 无 | 无 | 表面贴装 | 1.8 | 5.28 | 5.28 | 8 | SOIC | Compliant | Tube | 活跃 | 8 | Sectored | 4Kbyte x 512 | 256byte | 无 | ||||||||||
| M25P10-VMN6 | Micron Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | EAR99 | 无 | 无 | NOR | 1M | Symmetrical | 1 | 8 | 128K | 有 | Synchronous | 20 | 4/Chip | 5/Page | Serial-SPI | 2.7 | 3|3.3 | 3.6 | 15 | 15 | -40 | 85 | Industrial | 无 | 无 | 无 | 表面贴装 | 1.25(Min) | 3.9 | 4.9 | 8 | SOP | SOIC N | Gull-wing | Compliant | Tray | Obsolete | 8 | Sectored | 32Kbyte x 4 | 无 | ||||||||||
| W25Q256FVEIF/TRAY | Winbond Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3A991.b.1.a | NOR | 256M | Symmetrical | 32 | 8 | 32M | 有 | Synchronous | 7 | 400/Chip | 3/Page | Serial (SPI, Dual SPI, Quad SPI) | 2.7 | 3|3.3 | 3.6 | 2.7 to 3.6 | 20 | 25 | -40 | 85 | Industrial | 有 | 无 | 无 | 100000 | Compliant | Obsolete | Sectored | 4Kbyte x 8192 | 256byte | 无 | |||||||||||||||||||
| W25Q80DVSVIG/REEL | Winbond Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | EAR99 | 无 | 无 | NOR | 8M | Symmetrical | 24 | 8 | 1M | 有 | Synchronous | 6 | 6/Chip | 3/Page | Serial (SPI, Dual SPI, Quad SPI) | 104 | 2.7 | 3|3.3 | 3.6 | 2.7 to 3.6 | 25 | 25 | -40 | 85 | Industrial | 有 | 无 | 无 | 100000 | 表面贴装 | 0.8 | 3.9 | 4.9 | 8 | SOP | VSOP | Compliant | 活跃 | 8 | Sectored | 4Kbyte x 256 | 256byte | 有 | ||||||||
| W25N01GVTBIR/REEL | Winbond Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Unknown | Unknown | Compliant | 活跃 | |||||||||||||||||||||||||||||||||||||||||||||||
| W25Q128JWSIQ-T | Winbond Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3A991.b.1.a | 无 | 无 | NOR | 128M | Symmetrical | 24 | 8 | 16M | 有 | Synchronous | Serial (SPI, Dual SPI, Quad SPI) | 104 | 1.65 | 1.8 | 1.95 | 20 | -40 | 85 | Industrial | 无 | 无 | 无 | 表面贴装 | 8 | SO | Compliant | 卷带 | 活跃 | 8 | Sectored | 4Kbyte x 4096 | 无 | ||||||||||||||||||
| W25N01GWTBIG/TRAY | Winbond Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3A991.b.1.a | 无 | 无 | NAND | 1G | Symmetrical | 32 | 8 | 128M | 有 | Synchronous | 8 | 0.01/Block | 0.7/Page | Serial (SPI, Dual SPI, Quad SPI) | 1.7 | 1.8 | 1.95 | 1.7 to 1.95 | 35 | 35 | -40 | 85 | Industrial | 有 | 有 | 无 | 100000 | 表面贴装 | 0.85 | 6 | 8 | 24 | TFBGA | Compliant | Tray | 活跃 | 24 | Sectored | 128Kbyte x 1024 | 2Kbyte | 无 | |||||||||
| W29N04GZBIBF/TRAY | Winbond Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3A991.b.1.a | 无 | 无 | SLC NAND | 4G | Symmetrical | 30 | 8 | 512M | 有 | Synchronous | 0.01/Block | 0.7/Page | Serial | 1.7 | 1.8 | 1.95 | 1.7 to 1.95 | 20 | 20 | -40 | 85 | Industrial | 无 | 有 | 有 | 100000 | 表面贴装 | 0.6(Max) | 9 | 11 | 63 | VFBGA | Compliant | 活跃 | 63 | 2Kbyte | 无 | |||||||||||||
| K9K8G08U0F-SIB00CV | Samsung Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 无 | 无 | 8G | Symmetrical | Asynchronous | Parallel | 2.7 | 3.3 | 3.6 | Compliant | Preliminary | Sectored | |||||||||||||||||||||||||||||||||||||||
| W29N08GZBIBA/TRAY | Winbond Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3A991.b.1.a | 有 | Unknown | SLC NAND | 8G | Symmetrical | 31 | 8 | 1G | 有 | Asynchronous | 0.01/Block | 0.7/Page | Parallel | 1.7 | 1.8 | 1.95 | 1.7 to 1.95 | 20 | 20 | -40 | 85 | Industrial | 无 | 有 | 有 | 100000 | 表面贴装 | 0.6(Max) | 9 | 11 | 63 | VFBGA | Compliant | 活跃 | 63 | 2Kbyte | 无 | |||||||||||||
| W29N04GVSIAA TRAY | Winbond Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3A991.b.1.a | 有 | Unknown | SLC NAND | 4G | Symmetrical | 30 | 8 | 512M | 有 | Asynchronous | 0.01/Block | 0.7/Page | Parallel | 2.7 | 3.3 | 3.6 | 2.7 to 3.6 | 35 | 35 | -40 | 85 | Industrial | 无 | 有 | 有 | 100000 | 表面贴装 | 1 | 18.4 | 12 | 48 | TSOP | Compliant | 活跃 | 48 | Sectored | 128Kbyte x 4096 | 2Kbyte | 无 | |||||||||||
| W25Q80DVSNBG-TR | Winbond Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | EAR99 | 8542.32.00.51 | 有 | Unknown | NOR | 8M | Symmetrical | 24 | 8 | 1M | 有 | Synchronous | 6 | 6/Chip | 3/Page | Serial (SPI, Dual SPI, Quad SPI) | 104 | 2.7 | 3.3|3 | 3.6 | 2.7 to 3.6 | 25 | 25 | 有 | 无 | 无 | 100000 | 表面贴装 | 1.45 | 3.9 | 4.85 | 8 | SOP | SOIC N | Gull-wing | Compliant | Obsolete | 8 | Sectored | 4Kbyte x 256 | 256byte | 有 | |||||||||
| W29GL128CL9B/TUBE | Winbond Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3A991.b.1.a | 无 | 无 | NOR | 128M | Symmetrical | Bottom|Top | 23 | 1 | 128M | 有 | Asynchronous | 100 | 256/Chip | 35 | 224000/Chip | 35 | Parallel | 2.7 | 3|3.3 | 3.6 | 2.7 to 3.6 | 55 | 25 | 30 | -40 | 85 | Industrial | 有 | 无 | 有 | 表面贴装 | 0.6(Min) | 11 | 13 | 48 | BGA | LFBGA | Ball | Compliant | Obsolete | 48 | Sectored | 128Kbyte x 128 | 256byte | 有 | |||||
| W25Q128JVBIQ TRAY | Winbond Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3A991.b.1.a | 无 | 无 | NOR | 128M | Symmetrical | 24 | 8 | 16M | 有 | Synchronous | 6 | 200/Chip | 3/Page | Serial (SPI, Dual SPI, Quad SPI) | 2.7 | 133 | 3|3.3 | 3.6 | 2.7 to 3.6 | 25 | 25 | -40 | 85 | Industrial | 有 | 无 | 无 | 100000 | 表面贴装 | 0.85 | 6 | 8 | 24 | BGA | TFBGA | Ball | Compliant | Tray | 活跃 | 24 | Sectored | 4Kbyte x 4096 | 256byte | 无 | ||||||
| KLM8G1GESD-B03Q017 | Samsung Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3A991.b.1.a | 无 | 无 | 64G | 有 | Synchronous | Serial e-MMC | 1.8|3.3 | -40 | 105 | 无 | 无 | 无 | 表面贴装 | 0.8 | 11.5 | 13 | 153 | FBGA | 供应商未确认 | Obsolete | 153 | 无 | ||||||||||||||||||||||||||||
| W25Q64FVSSIG TRAY | Winbond Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3A991.b.1.a | 无 | 无 | NOR | 64M | Symmetrical | Bottom|Top | 24 | 8 | 8M | 有 | Synchronous | 7 | 100/Chip | 3/Page | Serial (SPI, Dual SPI, Quad SPI) | 104 | 2.7 | 3|3.3 | 3.6 | 2.7 to 3.6 | 20 | 25 | -40 | 85 | Industrial | 有 | 无 | 无 | 100000 | 表面贴装 | 1.8 | 5.28 | 5.28 | 8 | SOP | SOIC | Gull-wing | Compliant | Obsolete | 8 | Sectored | 4Kbyte x 2048 | 256byte | 有 | ||||||
| K9WAG08U1E-SCB0000 | Samsung Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Unknown | Unknown | Compliant | Obsolete |