类别是'嵌入式 - 微控制器'
嵌入式 - 微控制器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 最大功率耗散 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 通道数量 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | uPs/uCs/外围ICs类型 | 比特数 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 电源电流-最大值 | 位元大小 | 访问时间 | 有ADC | DMA 通道 | 数据总线宽度 | 脉宽调制通道 | 数模转换器通道 | 定时器/计数器的数量 | 地址总线宽度 | 密度 | 核心架构 | EEPROM 大小 | 片上程序 ROM 宽度 | 处理器系列 | 最高频率 | 边界扫描 | 低功率模式 | 筛选水平 | A/D转换器数量 | 外部数据总线宽度 | 可编程I/O数 | 格式 | 集成缓存 | 内存(字) | UART 通道数 | ADC通道数量 | 定时器数量 | 外部中断数量 | PWM通道数 | I2C通道数 | 片上数据 RAM 宽度 | SPI 通道数 | DMA通道数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||||||
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 | PIC24EP512GU814-E/PL | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 122 | 174762 | 表面贴装 | 表面贴装 | 144-LQFP | 144 | A/D 32x10b/12b | -40°C~125°C TA | Tray | 2012 | Automotive, AEC-Q100, PIC® 24EP | e3 | 活跃 | 1 (Unlimited) | 144 | Matte Tin (Sn) - annealed | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 60MHz | 40 | PIC24EP512GU814 | 144 | 不合格 | 3.3V | 3.6V | CAN, I2C, IrDA, LIN, SPI, UART, USART, USB | Internal | 24K x 16 | 3V~3.6V | MICROCONTROLLER | PIC | Brown-out Detect/Reset, DMA, POR, PWM, WDT | FLASH | 16-Bit | 512KB 170K x 24 | CANbus, I2C, IrDA, LINbus, SPI, UART/USART, USB OTG | 120mA | 16 | YES | YES | 16b | YES | NO | 9 | 14 | 24 | PIC | 1.6mm | 20mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | DSPIC33EP16GS504-I/PT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 35 | 16384 | Automotive grade | 2K x 8 | 表面贴装 | 44-TQFP | YES | 44 | A/D 19x12b; D/A 1x12b | -40°C~85°C TA | Tray | 2015 | dsPIC™ 33EP | e3 | 活跃 | 3 (168 Hours) | 44 | 3A991.A.2 | Matte Tin (Sn) - annealed | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.8mm | 40 | DSPIC33EP16GS504 | 3.6V | 3V | I2C, IrDA, LIN, SPI, UART, USART | Internal | 70 MIPs | 16kB | 3V~3.6V | MICROCONTROLLER | dsPIC | Brown-out Detect/Reset, POR, PWM, WDT | 60MHz | FLASH | 16-Bit | 16KB 16K x 8 | I2C, IrDA, LINbus, SPI, UART/USART | 16 | YES | NO | YES | NO | 128 kb | 8 | TS 16949 | 1.2mm | 10mm | 10mm | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATSAMS70J19A-AN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 44 | 有 | 256K x 8 | Tin | 表面贴装 | 表面贴装 | 64-LQFP | 64 | A/D 5x12b; D/A 1x12b | -40°C~105°C TA | Tray | 2016 | SAM S70 | e3 | yes | 活跃 | 3 (168 Hours) | 64 | QUAD | 鸥翼 | 1.2V | 0.5mm | 300MHz | ATSAMS70J | 1.32V | 1.08V | I2C, IrDA, LIN, SPI, UART, USART, USB | Internal | 512kB | 1.08V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M7 | Brown-out Detect/Reset, DMA, POR, PWM, WDT | FLASH | 32-Bit | 512KB 512K x 8 | I2C, IrDA, LINbus, SPI, UART/USART, USB | 32 | YES | YES | 32b | YES | YES | 4 | ARM | 1.6mm | 10mm | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC9S08QD4CPC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 4 | 通孔 | 8-DIP (0.300, 7.62mm) | NO | A/D 4x10b | -40°C~85°C TA | Tube | 2004 | S08 | e3 | 活跃 | 不适用 | 8 | EAR99 | 哑光锡 | IT ALSO OPERATES AT 3V SUPPLY | DUAL | 未说明 | 5V | 未说明 | MC9S08QD4 | R-PDIP-T8 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 16MHz | 256 x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 4KB 4K x 8 | 8 | YES | NO | YES | NO | 9.779mm | 7.62mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | PIC18LF1330-I/SO | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 16 | 有 | 256 x 8 | 表面贴装 | 表面贴装 | 18-SOIC (0.295, 7.50mm Width) | 18 | A/D 4x10b | -40°C~85°C TA | Tube | 2007 | PIC® 18F | e3 | yes | 活跃 | 1 (Unlimited) | 18 | SMD/SMT | Matte Tin (Sn) | 1W | DUAL | 鸥翼 | 260 | 3V | 40MHz | 40 | PIC18LF1330 | 18 | 5.5V | 2V | I2C, UART, USART | Internal | 8kB | 2V~5.5V | MICROCONTROLLER | PIC | Brown-out Detect/Reset, LVD, POR, PWM, WDT | FLASH | 8-Bit | 8KB 4K x 16 | UART/USART | 8 | YES | NO | 8b | 2 | 64 kb | 128 x 8 | PIC | 4 | 6 | 2.35mm | 11.55mm | 7.5mm | 无 | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | PIC16F18854-I/SS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 25 | Automotive grade | 表面贴装 | 28-SSOP (0.209, 5.30mm Width) | YES | A/D 24x10b; D/A 1x5b | -40°C~85°C TA | Tube | 2004 | PIC® XLP™ 16F | e3 | 活跃 | 1 (Unlimited) | 28 | Matte Tin (Sn) - annealed | ALSO OPEARTES AT 16 MHZ AT 2.3V MINIMUM SUPPLY | 8542.31.00.01 | DUAL | 鸥翼 | 3V | 0.65mm | PIC16F18854 | R-PDSO-G28 | 5.5V | 2.5V | Internal | 32MHz | 512 x 8 | 2.3V~5.5V | MICROCONTROLLER, RISC | PIC | Brown-out Detect/Reset, POR, PWM, WDT | 32MHz | FLASH | 8-Bit | 7KB 4K x 14 | I2C, LINbus, SPI, UART/USART | YES | NO | YES | YES | 256 x 8 | 14 | TS 16949 | 2mm | 10.2mm | 5.3mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC9S08AC128CFGE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 38 | 131072 | 表面贴装 | 44-LQFP | YES | A/D 8x10b | -40°C~85°C TA | Tray | 2006 | S08 | e3 | 活跃 | 3 (168 Hours) | 44 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.8mm | 40 | MC9S08AC128 | S-PQFP-G44 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 8K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 128KB 128K x 8 | I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | NO | 1.6mm | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATSAMD21G18A-AF | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 38 | 有 | 32K x 8 | Tin | 表面贴装 | 表面贴装 | 48-TQFP | 48 | A/D 14x12b; D/A 1x10b | -40°C~125°C TA | Tray | 2014 | Automotive, AEC-Q100, SAM D21G | yes | 活跃 | 3 (168 Hours) | 48 | QUAD | 鸥翼 | 3.3V | 0.5mm | 48MHz | ATSAMD21G18 | 3.3V | I2C, I2S, LIN, SPI, UART, USART, USB | Internal | 256kB | 1.62V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | FLASH | 32-Bit | 256KB 256K x 8 | I2C, LINbus, SPI, UART/USART, USB | 32 | YES | YES | 32b | YES | YES | 6 | ARM | 1.2mm | 7mm | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATUC128L3U-Z3UT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 51 | 有 | 32K x 8 | Gold | 表面贴装 | 表面贴装 | 64-VFQFN Exposed Pad | 64 | A/D 8x12b | -40°C~85°C TA | Tray | AVR®32 UC3 L | yes | 活跃 | 3 (168 Hours) | 64 | QUAD | 无铅 | 1.8V | 0.5mm | 50MHz | ATUC128L | 不合格 | 1.8V | I2C, SPI, UART, USART, USB | Internal | 128kB | 1.62V~3.6V | MICROCONTROLLER, RISC | AVR | Brown-out Detect/Reset, DMA, POR, PWM, WDT | FLASH | 32-Bit | 128KB 128K x 8 | I2C, SPI, UART/USART, USB | 32 | YES | YES | 32b | 8 | 36 | 2 | 1 | 920μm | 9mm | 9mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MK10DX128VFT5 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 33 | 131072 | 表面贴装 | 48-VFQFN Exposed Pad | YES | A/D 16x16b | -40°C~105°C TA | Tray | 2002 | Kinetis K10 | 活跃 | 3 (168 Hours) | 48 | 3A991.A.2 | 8542.31.00.01 | QUAD | 无铅 | 260 | 3.3V | 0.5mm | 40 | MK10DX128 | S-XQCC-N48 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 50MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, IrDA, SPI, UART/USART | 32 | YES | YES | YES | YES | 2K x 8 | CORTEX-M4 | 1mm | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | PIC16LF877-04I/PQ | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 2 Weeks | 33 | 8192 | 有 | 368 x 8 | 表面贴装 | 44-QFP | YES | 44 | A/D 8x10b | -40°C~85°C TA | Tray | PIC® 16F | e3 | yes | 活跃 | 3 (168 Hours) | 44 | EAR99 | Matte Tin (Sn) | 1W | QUAD | 鸥翼 | 260 | 5V | 0.8mm | 4MHz | 40 | PIC16LF877 | 44 | 5.5V | 2.5/5V | 2V | I2C, SPI, UART, USART | External | 14kB | 2V~5.5V | MICROCONTROLLER, RISC | PIC | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 8-Bit | 14KB 8K x 14 | I2C, SPI, UART/USART | 2mA | 8 | 4 μs | YES | NO | 8b | YES | NO | 3 | 256 x 8 | 14 | PIC | 10mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | PIC16F883-E/SP | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | FLASH | 24 | 有 | 256 x 8 | 通孔 | 通孔 | 28-DIP (0.300, 7.62mm) | 28 | 28-SPDIP | A/D 11x10b | -40°C~125°C TA | Tube | 2001 | PIC® 16F | 活跃 | 1 (Unlimited) | 125°C | -40°C | 800mW | 20MHz | PIC16F883 | I2C, SPI, UART, USART | 5.5V | 2V | Internal | 20MHz | 7kB | 2V~5.5V | PIC | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 8-Bit | 7KB 4K x 14 | I2C, SPI, UART/USART | 20 μs | 8b | 3 | PIC | 256 x 8 | 20MHz | 24 | 1 | 11 | 1 | 1 | 3.81mm | 35.56mm | 7.493mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | EFM32GG380F1024G-E-QFP100R | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 83 | 表面贴装 | 100-LQFP | A/D 8x12b; D/A 2x12b | -40°C~85°C TA | Cut Tape (CT) | 2013 | 大壁虎 | 活跃 | 3 (168 Hours) | 8542.31.00.01 | Internal | 48MHz | 128K x 8 | 1.98V~3.8V | ARM® Cortex®-M3 | Brown-out Detect/Reset, DMA, POR, PWM, WDT | FLASH | 32-Bit | 1MB 1M x 8 | EBI/EMI, I2C, IrDA, SmartCard, SPI, UART/USART, USB | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | STM32F303VDH6 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 84 | 393216 | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 100-UFBGA | YES | A/D 39x12b; D/A 2x12b | -40°C~85°C TA | Tray | STM32F3 | 活跃 | 3 (168 Hours) | 100 | BOTTOM | BALL | 未说明 | 3.3V | 0.5mm | 未说明 | STM32F303 | S-PBGA-B100 | 不合格 | 3.6V | 2.5/3.3V | 2V | Internal | 72MHz | 80K x 8 | 2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 384KB 384K x 8 | CANbus, I2C, IrDA, LINbus, SPI, UART/USART, USB | 76.9mA | 32 | YES | YES | YES | 8 | 8 | CORTEX-M4F | 16 | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | TM4C1290NCZADI3R | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 140 | 有 | 256K x 8 | ACTIVE (Last Updated: 2 days ago) | 表面贴装 | 212-VFBGA | YES | 212 | A/D 24x12b | -40°C~85°C TA | Tape & Reel (TR) | Tiva™ C | e1 | yes | 活跃 | 3 (168 Hours) | 212 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.018W | BOTTOM | BALL | 1.2V | 0.5mm | 120MHz | M4C1290 | 1.32V | 1.14V | CAN, EBI/EMI, Ethernet, I2C, IrDA, SPI, UART, USART, USB | Internal | 1MB | 2.97V~3.63V | MICROCONTROLLER, RISC | 12 | ARM® Cortex®-M4F | Brown-out Detect/Reset, DMA, Motion Control PWM, POR, PWM, WDT | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, QEI, SPI, SSI, UART/USART, USB OTG | 100.1mA | 32 | YES | YES | 32b | YES | NO | ARM | 6K x 8 | CORTEX-M4F | YES | YES | 24 | 140 | FLOATING-POINT | NO | 256 | 8 | 8 | 1mm | 10mm | 10mm | 650μm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||
| PIC16F723A-I/SP | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 25 | 4096 | 有 | 192 x 8 | 通孔 | 28-DIP (0.300, 7.62mm) | NO | 28 | A/D 11x8b | -40°C~85°C TA | Tube | 2010 | PIC® XLP™ 16F | e3 | yes | 活跃 | 1 (Unlimited) | 28 | Matte Tin (Sn) - annealed | 800mW | DUAL | 3.3V | 20MHz | PIC16F723A | 28 | 5.5V | I2C, SPI, UART, USART | Internal | 7kB | 1.8V~5.5V | MICROCONTROLLER, RISC | 8 | PIC | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 8-Bit | 7KB 4K x 14 | I2C, SPI, UART/USART | 8 | YES | NO | 8b | 3 | PIC | 1 | 24 | 11 | 2 | 3.81mm | 35.56mm | 7.493mm | 无 | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MKV46F256VLH16 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 48 | 表面贴装 | 64-LQFP | A/D 29x12b; D/A 1x12b | -40°C~105°C TA | Tray | 2002 | Kinetis KV | 活跃 | 3 (168 Hours) | 3A991.A.2 | 8542.31.00.01 | 未说明 | 未说明 | Internal | 168MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, LVD, POR, PWM, WDT | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, I2C, SPI, UART/USART | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PIC16C65B-20I/PQ | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 33 | 4096 | 有 | 192 x 8 | 表面贴装 | 表面贴装 | 44-QFP | 44 | EPROM | -40°C~85°C TA | Tray | 1997 | PIC® 16C | e3 | yes | 活跃 | 3 (168 Hours) | 44 | Matte Tin (Sn) | 1W | QUAD | 鸥翼 | 260 | 5V | 0.8mm | 20MHz | 40 | PIC16C65B | 44 | 5V | 5V | I2C, SPI, UART, USART | External | 7kB | 4V~5.5V | MICROCONTROLLER, RISC | PIC | Brown-out Detect/Reset, POR, PWM, WDT | OTP | 8-Bit | 7KB 4K x 14 | I2C, SPI, UART/USART | 20mA | 8 | 20 μs | NO | NO | 8b | YES | NO | 3 | 14 | PIC | 10mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | PIC16F687-E/ML | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 18 | 有 | 128 x 8 | 表面贴装 | 表面贴装 | 20-VFQFN Exposed Pad | 20 | A/D 12x10b | -40°C~125°C TA | Tube | 2006 | PIC® 16F | e3 | yes | 活跃 | 1 (Unlimited) | 20 | EAR99 | Matte Tin (Sn) - annealed | 800mW | QUAD | 260 | 5V | 0.5mm | 20MHz | 40 | PIC16F687 | 20 | 5V | I2C, SPI, SSP, UART, USART | Internal | 3.5kB | 2V~5.5V | MICROCONTROLLER, RISC | PIC | Brown-out Detect/Reset, POR, WDT | FLASH | 8-Bit | 3.5KB 2K x 14 | I2C, SPI, UART/USART | 8 | 20 μs | YES | NO | 8b | YES | NO | 2 | 256 x 8 | 14 | PIC | 17 | 1mm | 4mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | MK20DN512ZVMD10 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 100 | 表面贴装 | 144-LBGA | YES | A/D 42x16b; D/A 2x12b | -40°C~105°C TA | Tray | 2011 | Kinetis K20 | e1 | 不用于新设计 | 3 (168 Hours) | 144 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MK20DN512 | S-PBGA-B144 | 不合格 | 3.6V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 1.7mm | 13mm | 13mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | PIC24FJ256GB610-I/BG | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 85 | 262144 | Automotive grade | 32K x 8 | 表面贴装 | 121-TFBGA | YES | A/D 24x10/12b | -40°C~85°C TA | Tray | 2016 | PIC® 24F | e1 | 活跃 | 3 (168 Hours) | 121 | Tin/Silver/Copper (Sn/Ag/Cu) | ITS ALSO AVAILABLE WITH 24-CH 10-BIT | BOTTOM | BALL | 3.3V | 0.8mm | 32MHz | PIC24FJ256GB610 | S-PBGA-B121 | 3.6V | 2V | I2C, IrDA, LIN, SPI, UART, USART, USB | Internal | 256kB | 2V~3.6V | MICROCONTROLLER | PIC | Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT | FLASH | 16-Bit | 256KB 85.5K x 24 | I2C, IrDA, LINbus, PMP, SPI, UART/USART, USB OTG | 16 | YES | YES | YES | NO | 24 | 8 | ISO/TS-16949 | 16 | 1.2mm | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | C8051F126-GQR | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 64 | 有 | 8.25K x 8 | Tin | 表面贴装 | 表面贴装 | 100-TQFP | 100 | A/D 8x8b, 8x10b; D/A 2x12b | -40°C~85°C TA | Tape & Reel (TR) | 2000 | C8051F12x | e3 | yes | 不用于新设计 | 3 (168 Hours) | 100 | 3A001.A.3 | QUAD | 鸥翼 | 未说明 | 3V | 50MHz | 未说明 | C8051F12 | 100 | 不合格 | 3V | 6 | 2-Wire, EBI/EMI, I2C, SMBus, SPI, UART, USART | Internal | 128kB | 2.7V~3.6V | MICROCONTROLLER | 8051 | Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT | FLASH | 8-Bit | 128KB 128K x 8 | EBI/EMI, SMBus (2-Wire/I2C), SPI, UART/USART | 8 | 50 μs | YES | NO | 8b | YES | YES | 5 | 16 | 1.2mm | 14mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATTINY25-20SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | 6 | 有 | 128 x 8 | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | 8 | A/D 4x10b | -40°C~105°C TA | Tube | 1997 | AVR® ATtiny | e3 | yes | 活跃 | 3 (168 Hours) | 8 | DUAL | 鸥翼 | 260 | 5V | 20MHz | 40 | ATTINY25 | 不合格 | 5.5V | 3/5V | 4.5V | SPI | Internal | 2kB | 2.7V~5.5V | MICROCONTROLLER, RISC | AVR | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 8-Bit | 2KB 1K x 16 | USI | 8 | YES | NO | 8b | YES | NO | 2 | 128 x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATSAMD10D13A-SSNT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 18 | 4K x 8 | 表面贴装 | 20-SOIC (0.295, 7.50mm Width) | YES | 20 | A/D 10x12b; D/A 1x10b | -40°C~105°C TA | Tape & Reel (TR) | 2016 | SAM D10D | yes | 活跃 | 3 (168 Hours) | 20 | DUAL | 鸥翼 | 3.3V | 1.27mm | 48MHz | ATSAMD10 | 3.63V | 1.62V | I2C, LIN, SPI, UART, USART | Internal | 8kB | 1.62V~3.63V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, POR, WDT | FLASH | 32-Bit | 8KB 8K x 8 | I2C, LINbus, SPI, UART/USART | 32 | YES | YES | YES | YES | ARM | 32 | CORTEX-M0 | YES | 1024 | 2 | 8 | 32 | 6 | 2.5mm | 12.8mm | 7.5mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | PIC16LF873-04I/SO | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | 22 | 4096 | 有 | 192 x 8 | 表面贴装 | 表面贴装 | 28-SOIC (0.295, 7.50mm Width) | 28 | A/D 5x10b | -40°C~85°C TA | Tube | PIC® 16F | e3 | yes | 活跃 | 1 (Unlimited) | 28 | EAR99 | Matte Tin (Sn) | 1W | DUAL | 鸥翼 | 260 | 5V | 1.27mm | 4MHz | 40 | PIC16LF873 | 28 | 5.5V | 2.5/5V | 2V | I2C, SPI, UART, USART | External | 7kB | 2V~5.5V | MICROCONTROLLER, RISC | PIC | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 8-Bit | 7KB 4K x 14 | I2C, SPI, UART/USART | 2mA | 8 | 4 μs | YES | NO | 8b | YES | NO | 3 | 128 x 8 | 14 | PIC | 2.64mm | 17.87mm | 无 | ROHS3 Compliant | 无铅 |