类别是'嵌入式 - 微控制器'
嵌入式 - 微控制器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 最大功率耗散 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 界面 | 内存大小 | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | uPs/uCs/外围ICs类型 | 比特数 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 电源电流-最大值 | 位元大小 | 访问时间 | 有ADC | DMA 通道 | 数据总线宽度 | 脉宽调制通道 | 无卤素 | 数模转换器通道 | 定时器/计数器的数量 | 地址总线宽度 | 密度 | 核心架构 | EEPROM 大小 | 片上程序 ROM 宽度 | 处理器系列 | 边界扫描 | 低功率模式 | 筛选水平 | A/D转换器数量 | 外部数据总线宽度 | 可编程I/O数 | 格式 | 集成缓存 | 内存(字) | UART 通道数 | 串行I/O数 | 定时器数量 | 只读存储器可编程性 | 外部中断数量 | 总线兼容性 | I2C通道数 | 片上数据 RAM 宽度 | 时间-最小值 | SPI 通道数 | DMA通道数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||||||
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 | CY8C21223-24LGXIT | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 12 | 4096 | 256 x 8 | 表面贴装 | 16-UFQFN | YES | 16 | A/D 8x8b | -40°C~85°C TA | Tape & Reel (TR) | 2004 | PSOC®1 CY8C21xxx | e4 | yes | Obsolete | 3 (168 Hours) | 16 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.31.00.01 | QUAD | 260 | 2.7V | 0.5mm | 24MHz | 30 | CY8C21223 | 16 | 5.25V | 2.5/5V | 2.4V | I2C, SPI, UART, USART | Internal | 4kB | 2.4V~5.25V | M8C | POR, PWM, WDT | FLASH | 8-Bit | 4KB 4K x 8 | I2C, SPI, UART/USART | 8 | 8b | M8C | NO | 256 | I2C; USB | 0.6mm | 3mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | XC226796F80LACKXUMA1 | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 26 Weeks | 75 | 有 | 82K x 8 | 表面贴装 | 表面贴装 | 100-LQFP Exposed Pad | 100 | A/D 16x8/10b | -40°C~125°C TA | Tape & Reel (TR) | 2001 | XC22xx | e3 | 不用于新设计 | 3 (168 Hours) | 100 | 3A991.A.2 | Tin (Sn) | 1W | QUAD | 鸥翼 | 未说明 | 1.5V | 80MHz | 未说明 | SA*XC2267 | 1.6V | 1.4V | CAN, EBI/EMI, I2C, I2S, LIN, SPI, UART, USART | Internal | 768kB | 3V~5.5V | MICROCONTROLLER | C166SV2 | DMA, I2S, POR, PWM, WDT | FLASH | 16/32-Bit | 768KB 768K x 8 | CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI | 32 | YES | NO | YES | 无卤素 | NO | 5 | 24 | 16 | 1.6mm | 14mm | 14mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | PIC16C622A-20I/SS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 13 | 有 | 128 x 8 | 表面贴装 | 表面贴装 | 20-SSOP (0.209, 5.30mm Width) | 20 | EPROM, OTP | -40°C~85°C TA | Tube | 1997 | PIC® 16C | e3 | yes | 活跃 | 1 (Unlimited) | 20 | Matte Tin (Sn) | 1W | DUAL | 鸥翼 | 260 | 5V | 0.65mm | 20MHz | 40 | PIC16C622A | 20 | 5.5V | 3.3/5V | External | 3.5kB | 2.5V~5.5V | MICROCONTROLLER, RISC | PIC | Brown-out Detect/Reset, POR, WDT | OTP | 8-Bit | 3.5KB 2K x 14 | 7mA | 8 | 20 μs | NO | NO | 8b | NO | NO | 1 | PIC | 1.83mm | 7.34mm | 5.38mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATSAM4E16EB-CN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 117 | 128K x 8 | 表面贴装 | 144-LFBGA | YES | 144 | A/D 16x12b; D/A 2x12b | -40°C~105°C TA | Bulk | 2015 | SAM4E | e1 | yes | 活跃 | 3 (168 Hours) | 144 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1.2V | 0.8mm | 120MHz | ATSAM4E | 1.32V | 1.08V | CAN, EBI/EMI, Ethernet, IrDA, SD, SPI, UART, USART, USB | Internal | 1MB | 1.62V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | Brown-out Detect/Reset, DMA, POR, PWM, WDT | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, IrDA, SD, SPI, UART/USART, USB | 32 | YES | YES | YES | YES | 24 | ARM | 32 | CORTEX-M4F | YES | 8 | 32768 | 3 | 32 | 4 | 1.4mm | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | MSP430F5419AIZQWT | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 87 | 有 | 16K x 8 | ACTIVE (Last Updated: 5 days ago) | 表面贴装 | 表面贴装 | 113-VFBGA | 113 | A/D 16x12b | -40°C~85°C TA | Tape & Reel (TR) | MSP430F5xx | e1 | yes | 活跃 | 3 (168 Hours) | 113 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3V | 0.5mm | 25MHz | MSP430 | 113 | 2.2V | I2C, IrDA, LIN, SCI, SPI, UART, USART | Internal | 128kB | 1.8V~3.6V | MICROCONTROLLER, RISC | CPUXV2 | Brown-out Detect/Reset, DMA, POR, PWM, WDT | FLASH | 16-Bit | 128KB 128K x 8 | I2C, IrDA, LINbus, SCI, SPI, UART/USART | 16 | YES | YES | 16b | YES | NO | 3 | YES | YES | 16 | FIXED-POINT | NO | 16 | 3 | 4 | 8 | 1mm | 7mm | 7mm | 740μm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||
 | PIC24FJ128GA106-E/PT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 53 | 131072 | 有 | 16K x 8 | 表面贴装 | 表面贴装 | 64-TQFP | 64 | A/D 16x10b | -40°C~125°C TA | Tray | 2009 | PIC® 24F | e3 | 活跃 | 3 (168 Hours) | 64 | Matte Tin (Sn) - annealed | QUAD | 鸥翼 | 32MHz | PIC24FJ128GA106 | 64 | I2C, SPI, UART, USART | Internal | 128kB | 2V~3.6V | MICROCONTROLLER | PIC | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 16-Bit | 128KB 43K x 24 | I2C, PMP, SPI, UART/USART | 24mA | 16 | YES | NO | 16b | YES | 5 | 24 | PIC | 10mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATSAM4S4CB-AN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 79 | 表面贴装 | 100-LQFP | YES | A/D 16x12b; D/A 2x12b | -40°C~105°C TA | Tray | 2017 | SAM4S | e3 | yes | 活跃 | 3 (168 Hours) | 100 | Matte Tin (Sn) - annealed | QUAD | 鸥翼 | 1.2V | 0.5mm | ATSAM4S4 | S-PQFP-G100 | 1.32V | 1.08V | Internal | 120MHz | 64K x 8 | 1.62V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 256KB 256K x 8 | EBI/EMI, I2C, IrDA, Memory Card, SPI, SSC, UART/USART, USB | 32 | YES | YES | YES | YES | 24 | 8 | 1.6mm | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | PIC16F648AT-I/SO | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 4096 | 有 | 256 x 8 | 表面贴装 | 表面贴装 | 18-SOIC (0.295, 7.50mm Width) | 18 | 16 | -40°C~85°C TA | Tape & Reel (TR) | 1997 | PIC® 16F | e3 | yes | 活跃 | 1 (Unlimited) | 18 | EAR99 | Matte Tin (Sn) | 800mW | DUAL | 鸥翼 | 260 | 5V | 1.27mm | 20MHz | 40 | PIC16F648A | 18 | 5.5V | 4.5V | SCI, UART, USART | Internal | 7kB | 3V~5.5V | MICROCONTROLLER, RISC | PIC | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 8-Bit | 7KB 4K x 14 | UART/USART | 8 | 20 μs | NO | NO | 8b | YES | NO | 3 | 256 x 8 | 14 | PIC | 2.65mm | 11.55mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||
 | ATMEGA128L-8MN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 53 | 有 | 4K x 8 | Tin | 表面贴装 | 表面贴装 | 64-VFQFN Exposed Pad | 64 | A/D 8x10b | -40°C~105°C TA | Tray | 1997 | AVR® ATmega | yes | 活跃 | 3 (168 Hours) | 64 | QUAD | 无铅 | 4V | 0.5mm | 8MHz | ATMEGA128 | 不合格 | 5.5V | 3/5V | 3V | EBI/EMI, I2C, SPI, UART, USART | Internal | 128kB | 2.7V~5.5V | MICROCONTROLLER, RISC | AVR | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 8-Bit | 128KB 64K x 16 | EBI/EMI, I2C, SPI, UART/USART | 8 | YES | NO | 8b | YES | NO | 4 | 16 | 4K x 8 | 1mm | 9mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MK20DN32VLH5 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 40 | 表面贴装 | 64-LQFP | YES | A/D 13x16b | -40°C~105°C TA | Tray | 2012 | Kinetis K20 | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MK20DN32 | S-PQFP-G64 | 3.6V | 1.71V | Internal | 50MHz | 8K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, IrDA, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 1.6mm | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATSAML22J17A-AUT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 50 | 32768 | 有 | Automotive grade | 16K x 8 | Tin | 表面贴装 | 表面贴装 | 64-TQFP Exposed Pad | 64 | A/D 16x12b | -40°C~85°C TA | Tape & Reel (TR) | 2016 | SAM L22J | yes | 活跃 | 3 (168 Hours) | 64 | QUAD | 鸥翼 | 3.3V | 32MHz | ATSAML22J | 3.3V | 3.63V | I2C, SPI, UART, USART, USB | Internal | 128kB | 1.62V~3.63V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT | FLASH | 32-Bit | 128KB 128K x 8 | I2C, SPI, UART/USART, USB | 32 | YES | YES | 32b | NO | 5 | ARM | 32 | YES | ISO/TS-16949 | YES | 4096 | 16 | 32 | 1.2mm | 10mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | PIC16LF18313-I/RF | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 6 | 2048 | 256 x 8 | 表面贴装 | 8-UDFN Exposed Pad | YES | A/D 5x10b; D/A 1x5b | -40°C~85°C TA | Tube | 2016 | PIC® XLP™ 16F | 活跃 | 3 (168 Hours) | 8 | 8542.31.00.01 | DUAL | 无铅 | 260 | 3V | 32MHz | 30 | PIC16LF18313 | S-PDSO-N8 | 2.5V | I2C, LIN, SPI, UART, USART | Internal | 3.5kB | 1.8V~3.6V | MICROCONTROLLER, RISC | PIC | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 8-Bit | 3.5KB 2K x 14 | I2C, LINbus, SPI, UART/USART | 8 | YES | NO | YES | YES | 256 x 8 | 14 | NO | YES | FIXED-POINT | NO | 256 | 1 | 3 | 1 | 8 | 0.55mm | 3mm | 3mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
| MK22DX256VLH5 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 40 | 262144 | 表面贴装 | 64-LQFP | YES | A/D 18x16b; D/A 1x12b | -40°C~105°C TA | Tray | 2012 | Kinetis K20 | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | 哑光锡 | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MK22DX256 | S-PQFP-G64 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 50MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 256KB 256K x 8 | I2C, IrDA, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 4K x 8 | CORTEX-M4 | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATSAMDA1E16B-ABT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 22 Weeks | 26 | 16384 | 表面贴装 | 32-TQFP | YES | A/D 10x12b; D/A 1x10b | -40°C~105°C TA | Tape & Reel (TR) | SAM DA1 | e3 | 活跃 | 3 (168 Hours) | 32 | Matte Tin (Sn) - annealed | 8542.31.00.01 | QUAD | 鸥翼 | 3.3V | 0.8mm | ATSAMDA1 | S-PQFP-G32 | 3.63V | 2.7V | Internal | 48MHz | 8K x 8 | 2.7V~3.63V | MICROCONTROLLER | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, SCI, SPI, UART/USART, USB | 5.95mA | 32 | YES | YES | YES | YES | 32 | CORTEX-M0 | NO | YES | FIXED-POINT | YES | 8192 | 3 | 16 | 8 | SECONDS | 12 | 1.2mm | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
 | ATTINY20-CCU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 12 | 有 | 128 x 8 | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 15-UFBGA | 15 | A/D 8x10b | -40°C~85°C TA | Tray | 1997 | AVR® ATtiny | e3 | yes | 活跃 | 3 (168 Hours) | 15 | 哑光锡 | BOTTOM | BALL | 5V | 0.65mm | 12MHz | ATTINY20 | 不合格 | 3.3V | 5.5V | I2C, SPI | Internal | 2kB | 1.8V~5.5V | MICROCONTROLLER, RISC | AVR | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 8-Bit | 2KB 1K x 16 | I2C, SPI | 8 | YES | NO | 8b | YES | NO | 2 | 0.6mm | 3mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MSP430F2121TPW | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 16 | 256 | 有 | 256 x 8 | ACTIVE (Last Updated: 6 days ago) | 表面贴装 | 20-TSSOP (0.173, 4.40mm Width) | YES | 20 | 76.997305mg | Slope A/D | -40°C~105°C TA | Tube | MSP430F2xx | e4 | yes | 活跃 | 1 (Unlimited) | 20 | SMD/SMT | Nickel/Palladium/Gold (Ni/Pd/Au) | DUAL | 鸥翼 | 260 | 3.3V | 16MHz | 20 | 3.6V | 2/3.3V | 3.3V | UART | Internal | 4kB | 1.8V~3.6V | MICROCONTROLLER, RISC | MSP430 | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 16-Bit | 4KB 4K x 8 + 256B | 16 | NO | NO | 16b | YES | NO | 1 | 32 kb | YES | YES | 16 | FIXED-POINT | NO | 0 | 1.2mm | 6.5mm | 4.4mm | 1mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||
 | STM32F051R8T7TR | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 55 | A/D 19x12b; D/A 1x12b | 8K x 8 | 表面贴装 | 64-LQFP | YES | 64 | 有 | -40°C~105°C TA | Tape & Reel (TR) | STM32F0 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | 444mW | QUAD | 鸥翼 | 未说明 | 2.4V | 0.5mm | 48MHz | 未说明 | STM32F05 | 不合格 | 3.6V | 2.5/3.3V | 2V | I2C, I2S, IrDA, LIN, SPI, UART, USART | Internal | 64kB | 2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0 | DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT | FLASH | 32-Bit | 64KB 64K x 8 | I2C, IrDA, LINbus, SPI, UART/USART | 24.4mA | 32 | YES | YES | 32b | YES | YES | 8 | ARM | 8 | CORTEX-M0 | 1.6mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| MSP430G2102IPW20R | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 有 | 128 | 128 x 8 | ACTIVE (Last Updated: 2 days ago) | 表面贴装 | 20-TSSOP (0.173, 4.40mm Width) | YES | 20 | 16 | -40°C~85°C TA | Tape & Reel (TR) | MSP430G2xx | e4 | yes | 活跃 | 1 (Unlimited) | 20 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | DUAL | 鸥翼 | 260 | 2.2V | 16MHz | 20 | 3.6V | 2/3.3V | I2C, SPI | Internal | 1kB | 1.8V~3.6V | MICROCONTROLLER, RISC | MSP430 | Brown-out Detect/Reset, DMA, POR, PWM, WDT | FLASH | 16-Bit | 1KB 1K x 8 | I2C, SPI, USI | 16 | NO | YES | 16b | YES | NO | 1 | YES | YES | 16 | FIXED-POINT | NO | 0 | 1.2mm | 6.5mm | 4.4mm | 1mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | TM4C129DNCPDTI3R | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 90 | 有 | 256K x 8 | ACTIVE (Last Updated: 1 week ago) | Gold | 表面贴装 | 表面贴装 | 128-TQFP | 128 | A/D 20x12b | -40°C~85°C TA | Tape & Reel (TR) | Tiva™ C | e4 | yes | 活跃 | 3 (168 Hours) | 128 | 904mW | QUAD | 鸥翼 | 260 | 1.2V | 0.4mm | 120MHz | 未说明 | M4C129 | 1.32V | 1.14V | CAN, EBI/EMI, Ethernet, I2C, IrDA, SPI, UART, USART, USB | Internal | 1MB | 2.97V~3.63V | MICROCONTROLLER, RISC | 12 | ARM® Cortex®-M4F | Brown-out Detect/Reset, DMA, Motion Control PWM, POR, PWM, WDT | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, QEI, SPI, SSI, UART/USART, USB OTG | 102.3mA | 32 | YES | YES | 32b | YES | NO | 8 | ARM | 6K x 8 | CORTEX-M4F | YES | NO | 20 | 98 | FIXED-POINT | YES | 256 | 5 | 32 | 1.2mm | 14mm | 14mm | 1mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||
 | MC9S08AC8CFGE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 34 | 8192 | 表面贴装 | 44-LQFP | YES | A/D 8x10b | -40°C~85°C TA | Tray | 2005 | S08 | e3 | 活跃 | 3 (168 Hours) | 44 | 3A991.A.2 | Matte Tin (Sn) | ALSO OPERATES WITH 5V NOMINAL SUPPLY | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.8mm | 40 | MC9S08AC8 | S-PQFP-G44 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 768 x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | NO | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC68HC11E1CFNE2R | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 38 | 表面贴装 | 52-LCC (J-Lead) | YES | A/D 8x8b | -40°C~85°C TA | Tape & Reel (TR) | 1999 | HC11 | e3 | 不用于新设计 | 3 (168 Hours) | 52 | EAR99 | Matte Tin (Sn) | 坐高计算 | 8542.31.00.01 | QUAD | J BEND | 260 | 5V | 1.27mm | 40 | MC68HC11 | S-PQCC-J52 | 5.5V | 4.5V | Internal | 3MHz | 512 x 8 | 4.5V~5.5V | MICROCONTROLLER | POR, WDT | 8MHz | ROMless | 8-Bit | SCI, SPI | 8 | YES | NO | NO | NO | 16 | 512 x 8 | 8 | OTPROM | 5.08mm | 19.125mm | 19.125mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC9S12A256MPVE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 91 | 表面贴装 | 112-LQFP | YES | A/D 8x10b | -40°C~125°C TA | Tray | 2002 | HCS12 | e3 | 活跃 | 3 (168 Hours) | 112 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 2.5V | 0.65mm | 40 | MC9S12A256 | 2.75V | 2.35V | Internal | 25MHz | 12K x 8 | 2.35V~5.25V | MICROCONTROLLER | PWM, WDT | 16MHz | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, I2C, SCI, SPI | 16 | YES | NO | YES | 16 | 4K x 8 | 8 | 20mm | 20mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | PIC18F4515-I/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 36 | 有 | 3.8K x 8 | 通孔 | 通孔 | 40-DIP (0.600, 15.24mm) | 40 | A/D 13x10b | -40°C~85°C TA | Tube | PIC® 18F | e3 | yes | 活跃 | 1 (Unlimited) | 40 | 3A991.A.2 | Matte Tin (Sn) | 1W | DUAL | 5V | 1.27mm | 40MHz | PIC18F4515 | 40 | 5V | 5V | I2C, SPI, UART, USART | Internal | 48kB | 4.2V~5.5V | MICROCONTROLLER | PIC | Brown-out Detect/Reset, HLVD, POR, PWM, WDT | FLASH | 8-Bit | 48KB 24K x 16 | I2C, SPI, UART/USART | 16 | 40 μs | YES | NO | 8b | YES | NO | 4 | 20 | 16 | PIC | 6.35mm | 51.7525mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| PIC17C752-33/PT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 50 | 8192 | 有 | 454 x 8 | 表面贴装 | 64-TQFP | YES | 64 | A/D 12x10b | 0°C~70°C TA | Tray | 1997 | PIC® 17C | e3 | yes | 活跃 | 3 (168 Hours) | 64 | EAR99 | Matte Tin (Sn) | 1W | QUAD | 鸥翼 | 260 | 5V | 0.5mm | 33MHz | 40 | PIC17C752 | 64 | 5V | 6V | 5V | I2C, RS-232, SCI, SPI, UART, USART | External | 16kB | 4.5V~5.5V | MICROCONTROLLER, RISC | PIC | Brown-out Detect/Reset, POR, PWM, WDT | OTP | 8-Bit | 16KB 8K x 16 | I2C, SPI, UART/USART | 8 | 33 μs | YES | NO | 8b | YES | NO | 4 | 16 | 16 | PIC | 1.2mm | 10mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||
 | PIC24FJ128GA705-I/PT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 40 | Automotive grade | 表面贴装 | 48-TQFP | YES | A/D 14x12b | -40°C~85°C TA | Tray | PIC® 24F | yes | 活跃 | 3 (168 Hours) | 44 | QUAD | 鸥翼 | 3.3V | 0.8mm | PIC24FJ128GA705 | S-PQFP-G44 | 3.6V | 2V | Internal | 32MHz | 16K x 8 | 2V~3.6V | MICROCONTROLLER, RISC | PIC | Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT | 48MHz | FLASH | 16-Bit | 128KB 43K x 24 | I2C, IrDA, LINbus, SPI, UART/USART | 16 | YES | YES | YES | NO | 24 | TS 16949 | 1.2mm | 10mm | 10mm | ROHS3 Compliant |