类别是'嵌入式 - 微控制器'
嵌入式 - 微控制器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 最大功率耗散 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 螺纹距离 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 行间距 | 通道数量 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | uPs/uCs/外围ICs类型 | 比特数 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 电源电流-最大值 | 位元大小 | 访问时间 | 有ADC | DMA 通道 | 数据总线宽度 | 脉宽调制通道 | 数模转换器通道 | 定时器/计数器的数量 | 决议案 | 地址总线宽度 | 采样率 | 密度 | 核心架构 | EEPROM 大小 | 片上程序 ROM 宽度 | 处理器系列 | 最高频率 | 边界扫描 | 低功率模式 | 筛选水平 | A/D转换器数量 | 外部数据总线宽度 | 可编程I/O数 | 格式 | 集成缓存 | 内存(字) | UART 通道数 | ADC通道数量 | 串行I/O数 | 定时器数量 | 外部中断数量 | PWM通道数 | I2C通道数 | 桶式移位器 | 内部总线架构 | SPI 通道数 | DMA通道数 | USB 通道数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | ATSAM3N00AA-MU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | FLASH, ROM | 34 | 有 | 4K x 8 | 表面贴装 | 表面贴装 | 48-VFQFN Exposed Pad | 48 | A/D 8x10b | -40°C~85°C TA | Tray | 1997 | SAM3N | e3 | yes | 活跃 | 3 (168 Hours) | 48 | Matte Tin (Sn) | QUAD | 无铅 | 1.8V | 0.5mm | 48MHz | ATSAM3N | 不合格 | 1.8V | I2C, IrDA, SPI, UART, USART | Internal | 16kB | 1.62V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M3 | Brown-out Detect/Reset, DMA, POR, PWM, WDT | FLASH | 32-Bit | 16KB 16K x 8 | I2C, IrDA, SPI, UART/USART | 32 | YES | YES | 32b | 6 | ARM | CORTEX-M3 | 8 | 4 | 2 | 1 | 850μm | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | PIC16C74A-20I/PQ | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 33 | 4096 | 有 | 192 x 8 | 表面贴装 | 44-QFP | YES | 44 | A/D 8x8b | -40°C~85°C TA | Tray | 1997 | PIC® 16C | e3 | yes | 活跃 | 3 (168 Hours) | 44 | EAR99 | Matte Tin (Sn) | 1W | QUAD | 鸥翼 | 260 | 5V | 0.8mm | 20MHz | 40 | PIC16C74A | 44 | 5V | 5V | I2C, SPI, UART, USART | External | 7kB | 4V~6V | MICROCONTROLLER, RISC | PIC | Brown-out Detect/Reset, POR, PWM, WDT | OTP | 8-Bit | 7KB 4K x 14 | I2C, SPI, UART/USART | 8 | 20 μs | YES | NO | 8b | YES | NO | 3 | 14 | PIC | 10mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | PIC16F883T-I/SO | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 24 | 4096 | 有 | 256 x 8 | 表面贴装 | 表面贴装 | 28-SOIC (0.295, 7.50mm Width) | 28 | A/D 11x10b | -40°C~85°C TA | Tape & Reel (TR) | 2007 | PIC® 16F | e3 | yes | 活跃 | 1 (Unlimited) | 28 | EAR99 | Matte Tin (Sn) - annealed | ITS ALSO OPERATES MINIMUM 2V AT 8 MHZ | 800mW | DUAL | 鸥翼 | 260 | 5V | 1.27mm | 20MHz | 40 | PIC16F883 | 28 | 5.5V | 2.5/5V | 4.5V | I2C, SPI, UART, USART | Internal | 7kB | 2V~5.5V | MICROCONTROLLER, RISC | PIC | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 8-Bit | 7KB 4K x 14 | I2C, SPI, UART/USART | 4.8mA | 8 | 20 μs | YES | NO | 8b | YES | NO | 3 | 256 x 8 | 14 | PIC | 2.65mm | 17.9mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | PIC16HV616-E/SL | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | FLASH | 11 | 有 | 128 x 8 | 表面贴装 | 表面贴装 | 14-SOIC (0.154, 3.90mm Width) | 14 | 14-SOIC | A/D 8x10b | -40°C~125°C TA | Tube | 2009 | PIC® 16F | 活跃 | 1 (Unlimited) | 125°C | -40°C | 800mW | 20MHz | PIC16HV616 | RS-232, USB | 5V | 2V | Internal | 20MHz | 3.5kB | 2V~5V | PIC | Brown-out Detect/Reset, POR, WDT | FLASH | 8-Bit | 3.5KB 2K x 14 | 20 μs | 8b | 3 | PIC | 20MHz | 11 | 8 | 1.5mm | 8.65mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATXMEGA16C4-AU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 34 | 2K x 8 | 表面贴装 | 表面贴装 | 44-TQFP | 44 | A/D 16x12b | -40°C~85°C TA | Tray | 2014 | AVR® XMEGA® C4 | e3 | yes | 活跃 | 3 (168 Hours) | 44 | Matte Tin (Sn) | QUAD | 鸥翼 | 260 | 3.3V | 0.8mm | 32MHz | 40 | ATXMEGA16 | 不合格 | 3.6V | I2C, IrDA, SPI, UART, USART, USB | Internal | 16kB | 1.6V~3.6V | MICROCONTROLLER, RISC | AVR | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 8/16-Bit | 16KB 8K x 16 | I2C, IrDA, SPI, UART/USART, USB | 16 | YES | YES | 8b | 1K x 8 | 16 | 14 | 2 | 4 | 1 | 1.05mm | 10.1mm | 10.1mm | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATSAMD21J16B-MU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 52 | 有 | 8K x 8 | Tin | 表面贴装 | 表面贴装 | 64-VFQFN Exposed Pad | 64 | A/D 20x12b; D/A 1x10b | -40°C~85°C TA | Tray | 2015 | SAM D21J | yes | 活跃 | 3 (168 Hours) | 64 | QUAD | 无铅 | 3.3V | 0.5mm | 48MHz | ATSAMD21J16 | 3.3V | 3.63V | I2C, I2S, LIN, SPI, UART, USART, USB | Internal | 64kB | 1.62V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | FLASH | 32-Bit | 64KB 64K x 8 | I2C, LINbus, SPI, UART/USART, USB | 32 | YES | YES | YES | YES | 8 | ARM | 1mm | 9mm | 9mm | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SPC560B40L5C6E0X | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 26 Weeks | 123 | 有 | 24K x 8 | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 144-LQFP | YES | 144 | A/D 36x10b | -40°C~125°C TA | Tape & Reel (TR) | Automotive, AEC-Q100, SPC56 | e3 | 活跃 | 3 (168 Hours) | 144 | 3A991.A.2 | Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 64MHz | 30 | SPC560B | 144 | 3.6V | 3.3/5V | 3V | CAN, I2C, LIN, SCI, SPI | Internal | 256kB | 3V~5.5V | MICROCONTROLLER | e200z0h | DMA, POR, PWM, WDT | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, I2C, LINbus, SCI, SPI | 140mA | 32 | YES | YES | 32b | YES | NO | 10 | 8 | 1.6mm | 20mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATMEGA32U4RC-MU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | 26 | 有 | 2.5K x 8 | Tin | 表面贴装 | 表面贴装 | 44-VFQFN Exposed Pad | 44 | A/D 12x10b | -40°C~85°C TA | Tray | 2001 | AVR® ATmega | yes | 活跃 | 3 (168 Hours) | 44 | ALSO OPERATES AT 8 MHZ WITH A MINIMUM SUPPLY OF 2.7V | QUAD | 5V | 0.5mm | 16MHz | ATMEGA32U4 | 5.5V | 3/5V | I2C, SPI, UART, USART, USB | Internal | 32kB | 2.7V~5.5V | MICROCONTROLLER, RISC | AVR | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 8-Bit | 32KB 16K x 16 | I2C, SPI, UART/USART, USB | 8 | YES | NO | 8b | YES | NO | 4 | 1K x 8 | 1mm | 7mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | C8051F020-GQ | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 64 | 4.25K x 8 | Tin | 表面贴装 | 表面贴装 | 100-TQFP | 100 | A/D 8x8b, 8x12b; D/A 2x12b | -40°C~85°C TA | Tray | 2000 | C8051F02x | e3 | yes | 不用于新设计 | 3 (168 Hours) | 100 | QUAD | 鸥翼 | 3V | 25MHz | C8051F02 | 100 | 500μm | 3.3V | 3.6V | 3V | 16 mm | 5 | 2-Wire, EBI/EMI, I2C, SMBus, SPI, UART, USART | Internal | 64kB | 2.7V~3.6V | MICROCONTROLLER | 8051 | Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT | FLASH | 8-Bit | 64KB 64K x 8 | EBI/EMI, SMBus (2-Wire/I2C), SPI, UART/USART | 8 | 25 μs | YES | NO | 8b | YES | 512 kb | 2 | 8 | 1 | 1.05mm | 14mm | 14mm | 无 | 无SVHC | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | PIC16F1518T-I/SS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 25 | 有 | 1K x 8 | 表面贴装 | 28-SSOP (0.209, 5.30mm Width) | YES | 28 | A/D 17x10b | -40°C~85°C TA | Tape & Reel (TR) | 2011 | PIC® XLP™ 16F | e3 | 活跃 | 1 (Unlimited) | 28 | EAR99 | Matte Tin (Sn) - annealed | 800mW | DUAL | 鸥翼 | 260 | 0.65mm | 20MHz | 40 | PIC16F1518 | 28 | 5.5V | 2.5/5V | 2.5V | I2C, LIN, SPI, UART, USART | Internal | 28kB | 2.3V~5.5V | MICROCONTROLLER, RISC | PIC | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 8-Bit | 28KB 16K x 14 | I2C, LINbus, SPI, UART/USART | 8 | YES | NO | 8b | YES | NO | 3 | 14 | PIC | 2mm | 10.2mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MSP430FR5847IRHAT | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 33 | 1K x 8 | ACTIVE (Last Updated: 5 days ago) | 表面贴装 | 40-VFQFN Exposed Pad | YES | 40 | A/D 14x12b | -40°C~85°C TA | Tape & Reel (TR) | MSP430™ FRAM | e4 | yes | 活跃 | 3 (168 Hours) | 40 | Nickel/Palladium/Gold (Ni/Pd/Au) | QUAD | 无铅 | 260 | 3V | 0.5mm | 16MHz | 未说明 | MSP430 | 40 | 3.6V | 1.8V | I2C, IrDA, SCI, SPI, UART, USART | Internal | 32kB | 1.8V~3.6V | MICROCONTROLLER, RISC | CPUXV2 | Brown-out Detect/Reset, DMA, POR, PWM, WDT | FRAM | 16-Bit | 32KB 32K x 8 | I2C, IrDA, SCI, SPI, UART/USART | 16 | YES | YES | YES | NO | 0 b | YES | YES | 14 | FIXED-POINT | NO | 1 | 2 | 2 | 15 | 1mm | 6mm | 6mm | 900μm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | PIC16F18345T-I/GZ | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 18 | 8192 | 1K x 8 | 表面贴装 | 20-UFQFN Exposed Pad | YES | A/D 17x10b; D/A 1x5b | -40°C~85°C TA | Tape & Reel (TR) | 2016 | PIC® XLP™ 16F | e3 | 活跃 | 1 (Unlimited) | 20 | Matte Tin (Sn) - annealed | QUAD | 无铅 | 0.5mm | 32MHz | PIC16F18345 | S-PQCC-N20 | 不合格 | 2.5/5V | I2C, LIN, SPI, UART, USART | Internal | 14kB | 2.3V~5.5V | MICROCONTROLLER, RISC | PIC | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 8-Bit | 14KB 8K x 14 | I2C, LINbus, SPI, UART/USART | 2.9mA | 8 | 256 x 8 | PIC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ATXMEGA256A3BU-MHR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 47 | 16K x 8 | 表面贴装 | 表面贴装 | 64-VFQFN Exposed Pad | 64 | A/D 16x12b; D/A 2x12b | -40°C~85°C TA | Tape & Reel (TR) | 2012 | AVR® XMEGA® A3BU | yes | 活跃 | 3 (168 Hours) | 64 | IT ALSO OPERATES IN 12 MHZ AT 1.6V MIN | QUAD | 无铅 | 3V | 0.5mm | 32MHz | ATXMEGA256 | 不合格 | 3.6V | 1.8/3.3V | I2C, IrDA, SPI, UART, USART, USB | Internal | 256kB | 1.6V~3.6V | MICROCONTROLLER, RISC | AVR | Brown-out Detect/Reset, DMA, POR, PWM, WDT | FLASH | 8/16-Bit | 256KB 128K x 16 | I2C, IrDA, SPI, UART/USART, USB | 16 | YES | YES | YES | YES | 7 | 4K x 8 | 1mm | 9mm | 9mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MK22FN1M0VLH12 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 40 | 1048576 | 表面贴装 | 64-LQFP | YES | A/D 22x16b; D/A 1x12b | -40°C~105°C TA | Tray | 2013 | Kinetis K20 | e3 | 不用于新设计 | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MK22FN1M0 | S-PQFP-G64 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 120MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | CORTEX-M4F | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | TMS320F2801PZA-60 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 35 | 6K x 16 | ACTIVE (Last Updated: 5 days ago) | Gold | 表面贴装 | 表面贴装 | 100-LQFP | 100 | 635.596308mg | A/D 16x12b | -40°C~85°C TA | Tray | Automotive, AEC-Q100, C2000™ C28x Fixed-Point | e4 | yes | 活跃 | 2 (1 Year) | 100 | ALSO REQUIRES 3.3V SUPPLY | QUAD | 鸥翼 | 260 | 1.8V | 0.5mm | 60MHz | 320F2801 | 100 | 3.3V | CAN, I2C, SCI, SPI, UART, USART | Internal | 32kB | 1.71V~1.89V | DIGITAL SIGNAL PROCESSOR, OTHER | 32 | C28x | POR, PWM, WDT | FLASH | 32-Bit | 32KB 16K x 16 | CANbus, I2C, SCI, SPI, UART/USART | 230mA | 32 | 32b | 6 | 256 kb | YES | YES | 16 | NO | 1 | 10 | 3 | NO | MULTIPLE | 1.6mm | 14mm | 14mm | 1.4mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | STM32L051T8Y6DTR | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 29 | A/D 10x12b | 8K x 8 | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 36-UFBGA, WLCSP | YES | 36 | 有 | -40°C~85°C TA | Tape & Reel (TR) | STM32L0 | 活跃 | 1 (Unlimited) | 36 | 3A991.A.2 | 318mW | BOTTOM | BALL | 3V | 0.4mm | 32MHz | STM32L051 | 3.6V | I2C, I2S, SPI, UART, USART | Internal | 64kB | 1.65V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, POR, PWM, WDT | FLASH | 32-Bit | 64KB 64K x 8 | I2C, IrDA, SPI, UART/USART | 6.8mA | 32 | YES | YES | 32b | YES | NO | 5 | ARM | 2K x 8 | 8 | CORTEX-M0 | NO | YES | NO | 7 | 2.88mm | 无SVHC | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC9S08JM60CLD | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 33 | 60912 | 表面贴装 | 44-LQFP | YES | A/D 8x12b | -40°C~85°C TA | Tray | 2007 | S08 | e3 | 活跃 | 3 (168 Hours) | 44 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3V | 0.8mm | 40 | MC9S08JM60 | S-PQFP-G44 | 不合格 | 5.5V | 3/5V | 2.7V | External | 48MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 24MHz | FLASH | 8-Bit | 60KB 60K x 8 | I2C, LINbus, SCI, SPI, USB | 8 | YES | YES | YES | NO | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | PIC18F14K22T-I/SS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 17 | 8192 | 有 | 512 x 8 | 表面贴装 | 表面贴装 | 20-SSOP (0.209, 5.30mm Width) | 20 | A/D 12x10b | -40°C~85°C TA | Tape & Reel (TR) | 2009 | PIC® XLP™ 18K | e3 | 活跃 | 1 (Unlimited) | 20 | 3A991.A.2 | Matte Tin (Sn) - annealed | 800mW | DUAL | 鸥翼 | 260 | 3.6V | 0.65mm | 64MHz | 40 | PIC18F14K22 | 20 | 5.5V | 2/5V | 2.7V | I2C, LIN, SPI, UART, USART | Internal | 16kB | 2.3V~5.5V | MICROCONTROLLER, RISC | PIC | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 8-Bit | 16KB 8K x 16 | I2C, LINbus, SPI, UART/USART | 15.6mA | 16 | YES | NO | 8b | YES | YES | 4 | 256 x 8 | 16 | PIC | 18 | 2mm | 7.2mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | PIC18F45K22-E/PT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 35 | 16384 | 有 | 1.5K x 8 | 表面贴装 | 44-TQFP | YES | 44 | A/D 30x10b | -40°C~125°C TA | Tray | 2012 | PIC® XLP™ 18K | e3 | yes | 活跃 | 3 (168 Hours) | 44 | Matte Tin (Sn) - annealed | 1W | QUAD | 鸥翼 | 260 | 5V | 0.8mm | 48MHz | 40 | PIC18F45K22 | 44 | 5.5V | I2C, SPI, UART, USART | Internal | 32kB | 2.3V~5.5V | MICROCONTROLLER, RISC | PIC | Brown-out Detect/Reset, HLVD, POR, PWM, WDT | FLASH | 8-Bit | 32KB 16K x 16 | I2C, SPI, UART/USART | 8 | YES | NO | 8b | YES | 7 | 256 x 8 | PIC | 36 | 30 | 2 | 1.05mm | 10mm | 10mm | 无 | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PIC32MX250F128BT-I/SS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 19 | 有 | 32K x 8 | 表面贴装 | 表面贴装 | 28-SSOP (0.209, 5.30mm Width) | 28 | A/D 9x10b | -40°C~85°C TA | Tape & Reel (TR) | 2012 | PIC® 32MX | e3 | 活跃 | 1 (Unlimited) | 28 | Matte Tin (Sn) - annealed | DUAL | 鸥翼 | 260 | 3.3V | 40MHz | 40 | PIC32MX250F128B | 28 | 3.6V | I2C, I2S, IrDA, LIN, SPI, UART, USART, USB | Internal | 128kB | 2.3V~3.6V | MICROCONTROLLER, RISC | MIPS32® M4K™ | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | FLASH | 32-Bit | 128KB 128K x 8 | I2C, IrDA, LINbus, PMP, SPI, UART/USART, USB OTG | 30mA | 32 | YES | YES | 32b | YES | NO | 5 | PIC | PIC | 2 | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATSAMV71N21B-CBT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 75 | Automotive grade | 表面贴装 | 100-TFBGA | YES | A/D 10x12b; D/A 2x12b | -40°C~105°C TA | Tape & Reel (TR) | Automotive, AEC-Q100, SAM V71 | e1 | 活跃 | 3 (168 Hours) | 100 | 3A001.A.3 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 0.8mm | ATSAMV71N | S-PBGA-B100 | 1.32V | 1.2V | Internal | 300MHz | 384K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M7 | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | 150MHz | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB | 32 | YES | YES | YES | YES | AEC-Q100; TS 16949 | 1.1mm | 9mm | 9mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATSAMS70N21A-AN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 75 | 有 | 384K x 8 | Tin | 表面贴装 | 表面贴装 | 100-LQFP | 100 | A/D 10x12b; D/A 2x12b | -40°C~105°C TA | Tray | 2016 | SAM S70 | e3 | yes | 活跃 | 3 (168 Hours) | 100 | QUAD | 鸥翼 | 260 | 1.2V | 0.5mm | 300MHz | 40 | ATSAMS70N | 1.32V | 1.08V | I2C, IrDA, LIN, MMC, SD, SDIO, SPI, UART, USART, USB | Internal | 2MB | 1.08V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M7 | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | FLASH | 32-Bit | 2MB 2M x 8 | I2C, IrDA, LINbus, MMC/SD/SDIO, SPI, UART/USART, USB | 32 | YES | YES | 32b | YES | YES | 4 | ARM | 1.6mm | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ADUC832BSZ-REEL | Analog Devices Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 34 | 有 | 2.25K x 8 | PRODUCTION (Last Updated: 3 weeks ago) | Tin | 表面贴装 | 表面贴装 | 52-QFP | 52 | A/D 8x12b; D/A 2x12b | -40°C~125°C TA | Tape & Reel (TR) | MicroConverter® ADuC8xx | e3 | no | 活跃 | 3 (168 Hours) | 56 | EAR99 | ALSO OPERATES AT 5V SUPPLY | QUAD | 无铅 | 260 | 3V | 0.5mm | 16MHz | 40 | ADUC832 | 52 | S-PQCC-N56 | 不合格 | 2.7V | EBI/EMI, I2C, SPI, UART, USART | Internal | 62kB | 2.7V~5.5V | MICROCONTROLLER | 8052 | PSM, Temp Sensor, WDT | FLASH | 8-Bit | 62KB 62K x 8 | EBI/EMI, I2C, SPI, UART/USART | 8 | 16 μs | YES | YES | 8b | YES | 3 | 1.5 B | 24 | 247 ksps | 4K x 8 | 8 | 1mm | ROHS3 Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | STM32F215ZET6 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 114 | 有 | 132K x 8 | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 144-LQFP | YES | 144 | A/D 24x12b; D/A 2x12b | -40°C~85°C TA | Tray | STM32F2 | e3 | 活跃 | 3 (168 Hours) | 144 | Matte Tin (Sn) - annealed | 500mW | QUAD | 鸥翼 | 2.7V | 0.5mm | 120MHz | STM32F215 | 144 | 1.8V | CAN, I2C, I2S, SPI, UART, USART, USB | Internal | 512kB | 1.8V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M3 | Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, I2C, IrDA, LINbus, MMC, SPI, UART/USART, USB OTG | 81mA | 32 | YES | YES | 32b | 14 | ARM | 2 | 24 | 6 | 3 | 1.45mm | 20.2mm | 20.2mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | PIC24FJ1024GB606-I/MR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 53 | 1048576 | Automotive grade | 32K x 8 | 表面贴装 | 64-VFQFN Exposed Pad | YES | 64 | A/D 16x10b | -40°C~85°C TA | Tube | 2015 | PIC® 24F | e3 | yes | 活跃 | 1 (Unlimited) | 64 | Matte Tin (Sn) - annealed | ITS ALSO AVAILABLE WITH 16-CH 10-BIT | QUAD | 无铅 | 3.3V | 0.5mm | 32MHz | PIC24FJ1024GB606 | 3.6V | 2V | I2C, IrDA, LIN, SPI, UART, USART, USB | Internal | 1MB | 2V~3.6V | MICROCONTROLLER | PIC | Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT | FLASH | 16-Bit | 1MB 341.5K x 24 | I2C, IrDA, LINbus, PMP, SPI, UART/USART, USB OTG | 16 | YES | YES | YES | NO | 16 | 8 | ISO/TS-16949 | 8 | 0.9mm | 9mm | 9mm | 无SVHC | ROHS3 Compliant | 无铅 |