类别是'嵌入式 - 微控制器'
嵌入式 - 微控制器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 最大功率耗散 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 螺纹距离 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 界面 | 内存大小 | 振荡器类型 | 电源电流 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | uPs/uCs/外围ICs类型 | 比特数 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 电源电流-最大值 | 位元大小 | 访问时间 | 有ADC | DMA 通道 | 数据总线宽度 | 脉宽调制通道 | 数模转换器通道 | 定时器/计数器的数量 | 地址总线宽度 | 密度 | 核心架构 | EEPROM 大小 | 片上程序 ROM 宽度 | 处理器系列 | 边界扫描 | 低功率模式 | 筛选水平 | A/D转换器数量 | 可编程I/O数 | 格式 | 集成缓存 | 内存(字) | UART 通道数 | ADC通道数量 | 串行I/O数 | 定时器数量 | PWM通道数 | I2C通道数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||||||
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 | MSP430FR2532IRGET | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 15 | 8704 | 1K x 8 | ACTIVE (Last Updated: 6 days ago) | 表面贴装 | 24-VFQFN Exposed Pad | YES | 24 | A/D 8x10b | -40°C~85°C TA | Tape & Reel (TR) | MSP430™ FRAM | e4 | yes | 活跃 | 2 (1 Year) | 24 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | QUAD | 无铅 | 2V | 0.5mm | 16MHz | 3.6V | 1.8V | I2C, IrDA, SCI, SPI, UART, USART | Internal | 8.5kB | 1.8V~3.6V | MICROCONTROLLER, RISC | MSP430 | Brown-out Detect/Reset, POR, PWM, WDT | FRAM | 16-Bit | 8.5KB 8.5K x 8 | I2C, IrDA, SCI, SPI, UART/USART | 16 | YES | NO | YES | NO | 2 | 1mm | 4mm | 4mm | 880μm | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | PIC18F8527-I/PT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 70 | 有 | 3.8K x 8 | 表面贴装 | 表面贴装 | 80-TQFP | 80 | A/D 16x10b | -40°C~85°C TA | Tray | 2016 | PIC® 18F | e3 | yes | 活跃 | 3 (168 Hours) | 80 | SMD/SMT | Matte Tin (Sn) | 1W | QUAD | 鸥翼 | 260 | 5V | 40MHz | 40 | PIC18F8527 | 80 | 500μm | 5V | EBI/EMI, I2C, SPI, UART, USART | Internal | 48kB | 4.2V~5.5V | MICROCONTROLLER | 8 | PIC | Brown-out Detect/Reset, HLVD, POR, PWM, WDT | FLASH | 8-Bit | 48KB 24K x 16 | EBI/EMI, I2C, SPI, UART/USART | 8 | 40 μs | YES | NO | 8b | 5 | 384 kb | 1K x 8 | PIC | 1 | 16 | 12 | 2 | 1.05mm | 12mm | 12mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||
 | PIC16F1788-I/ML | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | A/D 11x12b; D/A 1x8b, 3x5b | 2K x 8 | 表面贴装 | 28-VQFN Exposed Pad | YES | 28 | 24 | -40°C~85°C TA | Tube | 2011 | PIC® XLP™ 16F | e3 | 活跃 | 1 (Unlimited) | 28 | Matte Tin (Sn) - annealed | QUAD | 无铅 | 260 | 3V | 0.65mm | 32MHz | 40 | PIC16F1788 | 不合格 | 5.5V | 2.5/5V | 2.5V | I2C, SPI, USART | Internal | 2.1mA | 28kB | 2.3V~5.5V | MICROCONTROLLER, RISC | PIC | Brown-out Detect/Reset, POR, PSMC, PWM, WDT | FLASH | 8-Bit | 28KB 16K x 14 | I2C, LINbus, SPI, UART/USART | 8 | YES | NO | 8b | YES | 3 | 8b | 256 x 8 | PIC | 25 | 11 | 1 | 950μm | 6mm | 6mm | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||
 | DSPIC30F5011T-30I/PT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 52 | 有 | 4K x 8 | 表面贴装 | 表面贴装 | 64-TQFP | 64 | A/D 16x12b | -40°C~85°C TA | Tape & Reel (TR) | 2004 | dsPIC™ 30F | e3 | yes | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | QUAD | 鸥翼 | 260 | 3.3V | 30MHz | 40 | DSPIC30F5011 | 64 | 5.5V | CAN, I2C, SPI, UART, USART | Internal | 96kB | 2.5V~5.5V | MICROCONTROLLER, RISC | dsPIC | AC'97, Brown-out Detect/Reset, I2S, LVD, POR, PWM, WDT | FLASH | 16-Bit | 66KB 22K x 24 | CANbus, I2C, SPI, UART/USART | 16 | YES | NO | 16b | YES | NO | 5 | 1K x 8 | 24 | FIXED-POINT | 2048 | 1.2mm | 10mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||
 | STM32L071C8T6 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | A/D 13x12b | 表面贴装 | 48-LQFP | YES | 37 | -40°C~85°C TA | Tray | STM32L0 | 活跃 | 3 (168 Hours) | 48 | QUAD | 鸥翼 | 未说明 | 3V | 0.5mm | 未说明 | STM32L071 | S-PQFP-G48 | 3.6V | 1.8V | Internal | 32MHz | 20K x 8 | 1.65V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, IrDA, SPI, UART/USART | 32 | YES | YES | YES | NO | 3K x 8 | 8 | 1.6mm | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | STM32F031K6U7 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | A/D 13x12b | 有 | 4K x 8 | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 表面贴装 | 32-UFQFN Exposed Pad | 27 | -40°C~105°C TA | Tray | STM32F0 | 活跃 | 3 (168 Hours) | 32 | 3A991.A.2 | 8542.31.00.01 | 526mW | QUAD | 鸥翼 | 3.3V | 0.8mm | 48MHz | STM32F03 | S-PQFP-G32 | 2V | I2C, I2S, IrDA, LIN, SPI, UART, USART | Internal | 32kB | 2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0 | DMA, I2S, POR, PWM, WDT | FLASH | 32-Bit | 32KB 32K x 8 | I2C, IrDA, LINbus, SPI, UART/USART | 32 | YES | YES | 32b | YES | NO | 6 | ARM | 7mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | TMS320F28377SPTPT | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 97 | Automotive grade | 82K x 16 | ACTIVE (Last Updated: 3 days ago) | 表面贴装 | 176-LQFP Exposed Pad | YES | 176 | A/D 20x12b, 20x16b; D/A 3x12b | -40°C~105°C TJ | Tray | C2000™ C28x Delfino™ | e4 | yes | 活跃 | 3 (168 Hours) | 176 | 3A991A2 | Nickel/Palladium/Gold (Ni/Pd/Au) | QUAD | 鸥翼 | 260 | 1.2V | 0.5mm | 200MHz | 未说明 | 320F28377 | 1.26V | CAN, EBI/EMI, I2C, SCI, SPI, UART, USART, USB | Internal | 1MB | 1.14V~3.47V | MICROCONTROLLER, RISC | C28x | DMA, POR, PWM, WDT | FLASH | 32-Bit Single-Core | 1MB 512K x 16 | CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB | 32 | YES | YES | YES | YES | 8 Mb | TMS320 | YES | YES | AEC-Q100 | FLOATING-POINT | NO | 164 | 4 | 5 | 3 | 1.6mm | 24mm | 24mm | 1.4mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||
 | DSPIC30F2023-20E/PT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 35 | 有 | 512 x 8 | 表面贴装 | 表面贴装 | 44-TQFP | 44 | A/D 12x10b | -40°C~125°C TA | Tray | 2004 | dsPIC™ 30F | e3 | yes | 活跃 | 3 (168 Hours) | 44 | Matte Tin (Sn) - annealed | QUAD | 鸥翼 | 0.8mm | 20MHz | DSPIC30F2023 | 44 | I2C, IrDA, LIN, SPI, UART, USART | Internal | 12kB | 3V~5.5V | dsPIC | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 16-Bit | 12KB 4K x 24 | I2C, IrDA, LINbus, SPI, UART/USART | 16 | 16b | 3 | FIXED-POINT | 256 | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | PIC32MX470F512L-120/PT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 81 | 536576 | Automotive grade | 128K x 8 | 表面贴装 | 100-TQFP | YES | A/D 28x10b | 0°C~70°C TA | Tray | 2013 | PIC® 32MX | e3 | 活跃 | 3 (168 Hours) | 100 | Matte Tin (Sn) - annealed | AEC-Q100 REVH (GRADE 2 -40 CEL TO +105 CEL) PLANNED | QUAD | 鸥翼 | 3.3V | 0.4mm | 120MHz | PIC32MX470F512L | S-PQFP-G100 | 不合格 | 3.6V | 2.5/3.3V | 2.3V | I2C, IrDA, LIN, SPI, UART, USART, USB | Internal | 512kB | 2.3V~3.6V | MICROCONTROLLER, RISC | MIPS32® M4K™ | Brown-out Detect/Reset, DMA, POR, PWM, WDT | FLASH | 32-Bit | 512KB 512K x 8 | I2C, IrDA, LINbus, PMP, SPI, UART/USART, USB OTG | 84mA | 32 | YES | YES | YES | NO | 8 | PIC | TS 16949 | 1.2mm | 12mm | 12mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
 | AT91SAM7SE512B-CU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | 88 | 有 | 32K x 8 | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 144-LFBGA | 144 | A/D 8x10b | -40°C~85°C TA | Tray | 1997 | SAM7SE | e2 | yes | 活跃 | 3 (168 Hours) | 144 | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) | BOTTOM | BALL | 260 | 1.8V | 0.8mm | 55MHz | 40 | AT91SAM7SE512 | 不合格 | 1.95V | 1.6V | EBI/EMI, I2C, SPI, UART, USART, USB | Internal | 512kB | 1.65V~1.95V | MICROCONTROLLER, RISC | ARM7® | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 16/32-Bit | 512KB 512K x 8 | EBI/EMI, I2C, SPI, SSC, UART/USART, USB | 32 | YES | YES | 32b | YES | YES | 3 | 23 | ARM | 1.4mm | 10mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
 | MKV31F256VLL12 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 70 | 49152 | 262144 | 表面贴装 | 100-LQFP | YES | A/D 2x16b; D/A 1x12b | -40°C~105°C TA | Tray | 2002 | Kinetis KV | e3 | 活跃 | 3 (168 Hours) | 100 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | S-PQFP-G100 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 120MHz | 48K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, PWM, WDT | 50MHz | FLASH | 32-Bit | 256KB 256K x 8 | I2C, SPI, UART/USART | 32 | YES | YES | YES | YES | CORTEX-M4F | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
| MCF52223CAF66 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 56 | 262144 | 表面贴装 | 100-LQFP | YES | A/D 8x12b | -40°C~85°C TA | Tray | 2001 | MCF5222x | e3 | 活跃 | 3 (168 Hours) | 100 | 3A991.A.2 | 哑光锡 | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MCF52223 | S-PQFP-G100 | 不合格 | 3.6V | 3/3.3V | 3V | Internal | 66MHz | 32K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | Coldfire V2 | DMA, LVD, POR, PWM, WDT | 80MHz | FLASH | 32-Bit | 256KB 256K x 8 | I2C, SPI, UART/USART, USB OTG | 32 | YES | YES | YES | NO | 1.7mm | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
| MK40DN512VLL10 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 64 | 524288 | 表面贴装 | 100-LQFP | YES | A/D 34x16b; D/A 1x12b | -40°C~105°C TA | Tray | 2012 | Kinetis K40 | e3 | 活跃 | 3 (168 Hours) | 100 | 3A991.A.2 | 哑光锡 | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MK40DN512 | S-PQFP-G100 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | CORTEX-M4 | 1.7mm | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
| PIC16F1827-E/ML | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 16 | 4096 | 有 | 384 x 8 | 表面贴装 | 28-VQFN Exposed Pad | YES | 28 | A/D 12x10b | -40°C~125°C TA | Tube | 2008 | PIC® XLP™ mTouch™ 16F | e3 | yes | 活跃 | 1 (Unlimited) | 28 | EAR99 | Matte Tin (Sn) - annealed | 800mW | QUAD | 260 | 3V | 32MHz | 40 | PIC16F1827 | 28 | 2.3V | I2C, SPI, UART, USART | Internal | 7kB | 1.8V~5.5V | MICROCONTROLLER, RISC | PIC | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 8-Bit | 7KB 4K x 14 | I2C, SPI, UART/USART | 8mA | 8 | YES | NO | 8b | YES | YES | 5 | 256 x 8 | 14 | PIC | 15 | 1mm | 6mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||
 | MC9S08AC60CFUE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 54 | 63280 | 表面贴装 | 64-QFP | YES | A/D 16x10b | -40°C~85°C TA | Tray | 2000 | S08 | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | QUAD | 鸥翼 | 260 | 5V | 0.8mm | 40 | MC9S08AC60 | S-PQFP-G64 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 60KB 60K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | NO | 2.45mm | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| PIC18F24K20-E/ML | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 24 | 8192 | 有 | 768 x 8 | 表面贴装 | 表面贴装 | 28-VQFN Exposed Pad | 28 | A/D 11x10b | -40°C~125°C TA | Tube | PIC® XLP™ 18K | e3 | yes | 活跃 | 1 (Unlimited) | 28 | 3A001.A.3 | Matte Tin (Sn) - annealed | ALSO OPERATES AT 1.8V MINIMUM SUPPLY FOR 20 MHZ | 1W | QUAD | 260 | 3V | 64MHz | 40 | PIC18F24K20 | 28 | 2/3.3V | 2.7V | I2C, SPI, UART, USART | Internal | 16kB | 1.8V~3.6V | MICROCONTROLLER | PIC | Brown-out Detect/Reset, HLVD, POR, PWM, WDT | FLASH | 8-Bit | 16KB 8K x 16 | I2C, SPI, UART/USART | 8 | YES | NO | 8b | NO | 4 | 256 x 8 | 16 | PIC | 25 | 5 | 1mm | 6mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||
 | MC9S08LL36CLH | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 37 | 36864 | 表面贴装 | 64-LQFP | YES | A/D 8x12b | -40°C~85°C TA | Tray | 2003 | S08 | e3 | 活跃 | 3 (168 Hours) | 64 | EAR99 | 哑光锡 | OPERATES AT 1.8 V MINIMUM SUPPLY AT 20 MHZ | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3V | 0.5mm | 40 | MC9S08LL36 | S-PQFP-G64 | 不合格 | 3.6V | 2/3.3V | 2.1V | Internal | 40MHz | 4K x 8 | 1.8V~3.6V | MICROCONTROLLER | LCD, LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 36KB 36K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | NO | 1.6mm | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATMEGA8535L-8MUR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | FLASH, OTP | 32 | 4096 | 有 | 512 x 8 | Tin | 表面贴装 | 表面贴装 | 44-VFQFN Exposed Pad | 44 | A/D 8x10b | -40°C~85°C TA | Tape & Reel (TR) | 2005 | AVR® ATmega | e3 | yes | 活跃 | 3 (168 Hours) | 44 | QUAD | 260 | 3V | 0.5mm | 8MHz | 40 | ATMEGA8535 | 5.5V | 2.7V | I2C, SPI, UART, USART | Internal | 7kB | 2.7V~5.5V | MICROCONTROLLER, RISC | AVR | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 8-Bit | 8KB 4K x 16 | I2C, SPI, UART/USART | 8 | YES | NO | 8b | YES | NO | 3 | 512 x 8 | 1mm | 7mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
| ATSAMD20J18A-ANT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 52 | 有 | 32K x 8 | Tin | 表面贴装 | 64-TQFP Exposed Pad | YES | 64 | A/D 20x12b; D/A 1x10b | -40°C~105°C TA | Tape & Reel (TR) | 2015 | SAM D20J | e3 | yes | 活跃 | 3 (168 Hours) | 64 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 48MHz | 30 | ATSAMD20J18 | 3.63V | 1.62V | I2C, SPI, UART, USART | Internal | 256kB | 1.62V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, POR, WDT | FLASH | 32-Bit | 256KB 256K x 8 | I2C, SPI, UART/USART | 32 | YES | NO | 32b | YES | YES | 8 | 2 Mb | ARM | 52 | 1.2mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
 | PIC16F1933-E/SO | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 25 | 4096 | 有 | 256 x 8 | 表面贴装 | 表面贴装 | 28-SOIC (0.295, 7.50mm Width) | 28 | A/D 11x10b | -40°C~125°C TA | Tube | 2010 | PIC® XLP™ 16F | e3 | yes | 活跃 | 1 (Unlimited) | 28 | 3A991.A.2 | Matte Tin (Sn) - annealed | ALSO OPERATES AT 1.8V MINIMUM SUPPLY FOR 16 MHZ | 800mW | DUAL | 鸥翼 | 260 | 3V | 1.27mm | 32MHz | 40 | PIC16F1933 | 28 | 2.3V | I2C, LIN, SPI, UART, USART | Internal | 7kB | 1.8V~5.5V | MICROCONTROLLER, RISC | PIC | Brown-out Detect/Reset, LCD, POR, PWM, WDT | FLASH | 8-Bit | 7KB 4K x 14 | I2C, LINbus, SPI, UART/USART | 3mA | 8 | YES | NO | 8b | YES | YES | 5 | 256 x 8 | 14 | PIC | 17.9mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||
 | MSP430F148IPMR | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 48 | 有 | 2K x 8 | ACTIVE (Last Updated: 3 days ago) | 表面贴装 | 64-LQFP | YES | 64 | 342.689036mg | A/D 8x12b | -40°C~85°C TA | Tape & Reel (TR) | MSP430x1xx | e4 | yes | 活跃 | 3 (168 Hours) | 64 | Nickel/Palladium/Gold (Ni/Pd/Au) | QUAD | 鸥翼 | 260 | 3V | 0.5mm | 8MHz | 64 | 3.6V | SPI, UART, USART | Internal | 48kB | 1.8V~3.6V | MICROCONTROLLER, RISC | 12 | MSP430 | POR, PWM, WDT | FLASH | 16-Bit | 48KB 48K x 8 + 256B | SPI, UART/USART | 16 | YES | NO | 16b | YES | NO | YES | YES | 8 | 48 | FIXED-POINT | NO | 2 | 2 | 2 | 2 | 1.6mm | 10mm | 10mm | 1.4mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||
 | STM32F302RBT7 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 52 | 131072 | 32K x 8 | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 64-LQFP | YES | 64 | A/D 16x12b; D/A 1x12b | -40°C~105°C TA | Tray | STM32F3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | QUAD | 鸥翼 | 未说明 | 3.3V | 0.5mm | 72MHz | 未说明 | STM32F302 | 不合格 | 3.6V | 2.5/3.3V | 2V | CAN, I2C, IrDA, LIN, SPI, UART, USART, USB | Internal | 128kB | 2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, POR, PWM, WDT | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, I2C, IrDA, LINbus, SPI, UART/USART, USB | 32 | YES | YES | YES | YES | ARM | CORTEX-M4F | 1.6mm | 10mm | 10mm | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||
 | STM32F042F4P6TR | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 16 | 有 | 6K x 8 | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 20-TSSOP (0.173, 4.40mm Width) | YES | 20 | A/D 12x12b | -40°C~85°C TA | Tape & Reel (TR) | STM32F0 | 活跃 | 1 (Unlimited) | 20 | 3A991.A.2 | 263mW | DUAL | 鸥翼 | 3.3V | 48MHz | STM32F04 | 2V | CAN, HDMI, I2C, I2S, IrDA, LIN, SPI, UART, USART, USB | Internal | 16kB | 1.65V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0 | DMA, I2S, POR, PWM, WDT | FLASH | 32-Bit | 16KB 16K x 8 | CANbus, HDMI-CEC, I2C, IrDA, LINbus, SPI, UART/USART, USB | 32 | YES | YES | 32b | YES | NO | 6 | ARM | 8 | 1.2mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | PIC16F676-E/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 12 | 有 | 64 x 8 | 表面贴装 | 表面贴装 | 14-TSSOP (0.173, 4.40mm Width) | 14 | A/D 8x10b | -40°C~125°C TA | Tube | 2003 | PIC® 16F | e3 | yes | 活跃 | 1 (Unlimited) | 14 | EAR99 | Matte Tin (Sn) | 800mW | DUAL | 鸥翼 | 260 | 5V | 0.65mm | 20MHz | 40 | PIC16F676 | 14 | 5.5V | 5V | 4.5V | RS-232, USB | Internal | 1.8kB | 2V~5.5V | MICROCONTROLLER, RISC | PIC | Brown-out Detect/Reset, POR, WDT | FLASH | 8-Bit | 1.75KB 1K x 14 | 8 | 20 μs | YES | NO | 8b | NO | NO | 2 | 128 x 8 | 14 | PIC | 5mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||
 | S912XET256J2VALR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 91 | 16384 | 262144 | 表面贴装 | 112-LQFP | YES | A/D 16x12b | -40°C~105°C TA | Tape & Reel (TR) | 1996 | HCS12X | e3 | 活跃 | 3 (168 Hours) | 112 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 1.8V | 0.65mm | 40 | S-PQFP-G112 | 不合格 | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 16K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 16 | YES | YES | YES | 4K x 8 | CPU12 | 20mm | 20mm | ROHS3 Compliant |