类别是'USB 闪存驱动器'
USB 闪存驱动器 (1677)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 安装类型 | 表面安装 | 终端数量 | 包装 | 系列 | 零件状态 | 类型 | 附加功能 | 技术 | 端子位置 | 终端形式 | 功能数量 | 端子间距 | Reach合规守则 | 引脚数量 | JESD-30代码 | 电源电压-最大值(Vsup) | 温度等级 | 电源电压-最小值(Vsup) | 内存大小 | 操作模式 | 建筑学 | 组织结构 | 座位高度-最大 | 内存宽度 | 记忆密度 | 并行/串行 | 内存IC类型 | 编程电压 | 行业规模 | 页面尺寸 | 引导模块 | 高度 | 长度 | 宽度 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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 | W25Q32JVZPIQ/TUBE | Winbond Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 3A991.b.1.a | 无 | 无 | NOR | 32M | Symmetrical | Bottom|Top | 24 | 8 | 4M | 有 | Synchronous | 6 | 50/Chip | 3/Page | Serial (SPI, Dual SPI, Quad SPI) | 2.7 | 3|3.3 | 3.6 | 2.7 to 3.6 | 25 | 25 | -40 | 85 | Industrial | 有 | 无 | 无 | 100000 | 表面贴装 | 0.73 | 6 | 5 | 8 | SON | WSON EP | No Lead | 6.1 x 5.1 x 0.75mm | 2.7 V | WSON | +85 °C | -40 °C | 3.6 V | Compliant | Tube | W25Q | 活跃 | 8 | 32Mbit | Sectored | 4Kbyte x 1024 | 256byte | 有 | 0.75mm | 5.1mm | 6.1mm | |||||||||||||||||||||||||||||||||||||||||||||
| W25Q128JVPIM/REEL | Winbond Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3A991.b.1.a | 有 | 无 | 无 | NOR | 128M | Symmetrical | 24 | 8 | 16M | 有 | Synchronous | 6 | 200/Chip | 3/Page | 58nm | Serial (SPI, Dual SPI, Quad SPI) | 2.7 | 133 | 3|3.3 | 3.6 | 2.7 to 3.6 | 25 | 25 | -40 | 85 | Industrial | 有 | 无 | 无 | 100000 | 表面贴装 | 0.73 | 6 | 5 | 8 | SON | WSON EP | No Lead | Compliant | Tube | 活跃 | 8 | Sectored | 4Kbyte x 4096 | 256byte | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25X20CLZPIG/REEL | Winbond Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | EAR99 | 无 | 无 | NOR | 2M | Symmetrical | Bottom|Top | 24 | 8 | 256K | 有 | Synchronous | 8 | 2/Chip | 0.8/Page | Serial (SPI, Dual SPI) | 2.3 | 2.5|3|3.3 | 3.6 | 2.3 to 3.6 | 14 | 12 | -40 | 85 | Industrial | 有 | 无 | 无 | 表面贴装 | 0.73 | 6 | 5 | 8 | SON | WSON EP | No Lead | Compliant | 活跃 | 8 | Sectored | 4Kbyte x 64 | 256byte | 有 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q16JVZPIQ/REEL | Winbond Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | EAR99 | 无 | 无 | NOR | 16M | Symmetrical | 24 | 8 | 2M | 有 | Synchronous | 6 | 25/Chip | 3/Page | Serial (SPI, Dual SPI, Quad SPI) | 2.7 | 3|3.3 | 3.6 | 2.7 to 3.6 | 25 | 25 | -40 | 85 | Industrial | 有 | 无 | 无 | 100000 | 表面贴装 | 0.73 | 6 | 5 | 8 | WSON EP | Compliant | Tube | 活跃 | 8 | Sectored | 4Kbyte x 512 | 256byte | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W29GL032CB7S/TRAY | Winbond Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 无 | 无 | NOR | 32M | Symmetrical | Bottom | 21 | 8/16 | 4M/2M | 有 | Asynchronous | 70 | 64/Chip | 30 | 56000/Chip | 35 | Parallel | 2.7 | 3|3.3 | 3.6 | 2.7 to 3.6 | 55 | 25 | 30 | -40 | 85 | Industrial | 有 | 无 | 有 | 表面贴装 | 1 | 18.4 | 12 | 48 | TSOP | 3A991.b.1.a | 卷带 | Obsolete | 48 | Sectored | 64Kbyte x 64 | 8Words/16byte | 有 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25M512JVFIQ/REEL | Winbond Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3A991.b.1.a | 无 | 无 | NOR | 512M | Symmetrical | 32 | 8 | 64M | 有 | Synchronous | 7 | 2/Block | 3/Page | Serial (SPI, Dual SPI, Quad SPI) | 2.7 | 3|3.3 | 3.6 | 30 | 25 | -40 | 85 | Industrial | 有 | 无 | 无 | 100000 | 表面贴装 | 2.31 | 7.49 | 10.31 | 16 | SOP | SOIC W | Gull-wing | Compliant | 活跃 | 16 | Sectored | 4Kbyte x 16384 | 256byte | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q128JVEIQ/REEL | Winbond Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3A991.b.1.a | 有 | 无 | 无 | NOR | 128M | Symmetrical | 24 | 8 | 16M | 有 | Synchronous | 6 | 200/Chip | 3/Page | 58nm | Serial (SPI, Dual SPI, Quad SPI) | 133 | 2.7 | 3|3.3 | 3.6 | 2.7 to 3.6 | 25 | 25 | -40 | 85 | Industrial | 有 | 无 | 无 | 100000 | 表面贴装 | 0.73 | 6 | 8 | 8 | SON | WSON EP | No Lead | Compliant | Tray|Tube | 活跃 | 8 | Sectored | 4Kbyte x 4096 | 256byte | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q80DVUXIE/REEL | Winbond Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | EAR99 | 无 | 无 | NOR | 8M | Symmetrical | 24 | 8 | 1M | 有 | Synchronous | 6 | 6/Chip | 3/Page | Serial (SPI, Dual SPI, Quad SPI) | 2.7 | 104 | 3|3.3 | 3.6 | 2.7 to 3.6 | 25 | 25 | -40 | 85 | Industrial | 有 | 无 | 无 | 100000 | 表面贴装 | 0.53 | 3 | 2 | 8 | SON | USON EP | Compliant | 活跃 | 8 | Sectored | 4Kbyte x 256 | 256byte | 有 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q128FWSIF/REEL | Winbond Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3A991.b.1.a | 无 | 无 | NOR | 128M | Symmetrical | 24 | 8 | 16M | 有 | Synchronous | 6 | 200/Chip | 5/Page | Serial (SPI, Dual SPI, Quad SPI) | 1.65 | 1.8 | 1.95 | 1.65 to 1.95 | 20 | 25 | -40 | 85 | Industrial | 有 | 无 | 无 | 100000 | 表面贴装 | 1.8 | 5.28 | 5.28 | 8 | SOP | SOIC | Gull-wing | Compliant | Tray | Obsolete | 8 | Sectored | 4Kbyte x 4096 | 256byte | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q80DVSNIG/REEL | Winbond Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | EAR99 | 无 | 无 | NOR | 8M | Symmetrical | 24 | 8 | 1M | 有 | Synchronous | 6 | 6/Chip | 3/Page | Serial (SPI, Dual SPI, Quad SPI) | 104 | 2.7 | 3|3.3 | 3.6 | 2.7 to 3.6 | 25 | 25 | -40 | 85 | Industrial | 有 | 无 | 无 | 100000 | 表面贴装 | 1.45 | 3.9 | 4.85 | 8 | SOP | SOIC N | Gull-wing | Compliant | Tube | 活跃 | 8 | Sectored | 4Kbyte x 256 | 256byte | 有 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25M512JVFIQ/TUBE | Winbond Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3A991.b.1.a | 无 | 无 | NOR | 512M | Symmetrical | 32 | 8 | 64M | 有 | Synchronous | 7 | 2/Block | 3/Page | Serial (SPI, Dual SPI, Quad SPI) | 2.7 | 3|3.3 | 3.6 | 30 | 25 | -40 | 85 | Industrial | 有 | 无 | 无 | 100000 | 表面贴装 | 2.31 | 7.49 | 10.31 | 16 | SOP | SOIC W | Gull-wing | Compliant | 活跃 | 16 | Sectored | 4Kbyte x 16384 | 256byte | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q80DVSNIG TRAY | Winbond Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | EAR99 | 无 | 无 | NOR | 8M | Symmetrical | 24 | 8 | 1M | 有 | Synchronous | 6 | 6/Chip | 3/Page | Serial (SPI, Dual SPI, Quad SPI) | 104 | 2.7 | 3|3.3 | 3.6 | 2.7 to 3.6 | 25 | 25 | -40 | 85 | Industrial | 有 | 无 | 无 | 100000 | 表面贴装 | 1.45 | 3.9 | 4.85 | 8 | SOP | SOIC N | Gull-wing | Compliant | Tube | 活跃 | 8 | Sectored | 4Kbyte x 256 | 256byte | 有 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q64JVZPIM/TUBE | Winbond Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3A991.b.1.a | 有 | 无 | 无 | NOR | 64M | Symmetrical | 24 | 8 | 8M | 有 | Synchronous | 6 | 100/Chip | 3/Page | 58nm | Serial (SPI, Dual SPI, Quad SPI) | 133 | 2.7 | 3|3.3 | 3.6 | 2.7 to 3.6 | 25 | 25 | -40 | 85 | Industrial | 有 | 无 | 无 | 100000 | 表面贴装 | 0.73 | 6 | 5 | 8 | SON | WSON EP | No Lead | Compliant | Tube | 活跃 | 8 | Sectored | 4Kbyte x 2048 | 256byte | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| KLM4G1FETE-B0410 | Samsung Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8542.32.00.71 | 无 | 无 | 供应商未确认 | Unconfirmed | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q16FWBYIG/REEL | Winbond Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | EAR99 | 无 | 无 | NOR | 16M | Symmetrical | 24 | 8 | 2M | 有 | Synchronous | 6 | 25/Chip | 3/Page | Serial (SPI, Dual SPI, Quad SPI) | 1.65 | 1.8 | 1.95 | 1.65 to 1.95 | 25 | 25/Page | -40 | 85 | Industrial | 有 | 无 | 无 | 100000 | 表面贴装 | 0.31 | 8 | WLCSP | Compliant | Tube | Obsolete | 8 | Sectored | 4Kbyte x 512 | 256byte | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q128JVSIQ/REEL | Winbond Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3A991.b.1.a | 8542.32.00.71 | 无 | 无 | NOR | 128M | Symmetrical | 24 | 8 | 16M | 有 | Synchronous | 6 | 200/Chip | 3/Page | 58nm | Serial (SPI, Dual SPI, Quad SPI) | 133 | 2.7 | 3|3.3 | 3.6 | 2.7 to 3.6 | 25 | 25 | -40 | 85 | Industrial | 有 | 无 | 无 | 100000 | 表面贴装 | 1.8 | 5.28 | 5.28 | 8 | SOP | SOIC | Gull-wing | Compliant | Tube | 活跃 | 8 | Sectored | 4Kbyte x 4096 | 256byte | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q64FWSSIG/REEL | Winbond Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3A991.b.1.a | 无 | 无 | NOR | 64M | Symmetrical | Bottom|Top | 24 | 8 | 8M | 有 | Synchronous | 6 | 100/Chip | 5/Page | Serial (SPI, Dual SPI, Quad SPI) | 1.65 | 1.8 | 1.95 | 1.65 to 1.95 | 20 | 25 | -40 | 85 | Industrial | 有 | 无 | 无 | 100000 | 表面贴装 | 1.8 | 5.28 | 5.28 | 8 | SOP | SOIC | Gull-wing | Compliant | Tube | Obsolete | 8 | Sectored | 4Kbyte x 2048 | 256byte | 有 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q16FWSSIQ TUBE | Winbond Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | EAR99 | 无 | 无 | NOR | 16M | Symmetrical | 24 | 8 | 2M | 有 | Synchronous | 6 | 25/Chip | 3/Page | Serial (SPI, Dual SPI, Quad SPI) | 1.65 | 1.8 | 1.95 | 1.65 to 1.95 | 25 | 25/Page | -40 | 85 | Industrial | 有 | 无 | 无 | 100000 | 表面贴装 | 1.8 | 5.28 | 5.28 | 8 | SOP | SOIC | Gull-wing | Compliant | Obsolete | 8 | Sectored | 4Kbyte x 512 | 256byte | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| KLMAG1JETD-B0410 | Samsung Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3A991.b.1.a | 8542.32.00.71 | 无 | 无 | MLC NAND | 128G | 有 | Synchronous | Serial e-MMC | 1.7|2.7 | 1.8|3.3 | 1.95|3.6 | 无 | 无 | 无 | FBGA-153 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 16000000000 | PLASTIC/EPOXY | -25 °C | 85 °C | KLMAG1JETD-B0410 | 200 MHz | 17179869184 words | 1.8 V | VFBGA | RECTANGULAR | 三星半导体 | 活跃 | SAMSUNG SEMICONDUCTOR INC | 5.77 | YES | 153 | 供应商未确认 | Unconfirmed | MLC NAND TYPE | ALSO OPERATES @ 3V SUP NOM | CMOS | BOTTOM | BALL | 1 | 0.5 mm | compliant | R-PBGA-B153 | 1.95 V | OTHER | 1.7 V | SYNCHRONOUS | Sectored | 16GX8 | 0.8 mm | 8 | 137438953472 bit | PARALLEL | FLASH | 1.8 V | 无 | 13 mm | 11.5 mm | |||||||||||||||||||||||||||||||||||||||||||
| W25Q64JVSFIQ/TRAY | Winbond Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3A991.b.1.a | 有 | 无 | 无 | NOR | 64M | Symmetrical | 24 | 8 | 8M | 有 | Synchronous | 6 | 100/Chip | 3/Page | 58nm | Serial (SPI, Dual SPI, Quad SPI) | 133 | 2.7 | 3|3.3 | 3.6 | 2.7 to 3.6 | 25 | 25 | -40 | 85 | Industrial | 有 | 无 | 无 | 100000 | 表面贴装 | 2.31 | 7.49 | 10.31 | 16 | SOP | SOIC W | Gull-wing | Compliant | Tube | 活跃 | 16 | Sectored | 4Kbyte x 2048 | 256byte | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W29N02GZBIBA TRAY | Winbond Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 有 | Unknown | 表面贴装 | 0.6(Max) | 9 | 11 | 63 | VFBGA | Compliant | 活跃 | 63 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W29N02GVSIAA TRAY | Winbond Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3A991.b.1.a | 有 | Unknown | SLC NAND | 2G | Symmetrical | 29 | 8 | 256M | 有 | Asynchronous | 25 | 0.01/Block | 0.7/Page | Parallel | 2.7 | 3|3.3 | 3.6 | 2.7 to 3.6 | 35 | 35 | -40 | 85 | Industrial | 无 | 有 | 有 | 100000 | 表面贴装 | 1 | 18.4 | 12 | 48 | SOP | TSOP-I | Gull-wing | Compliant | 活跃 | 48 | Sectored | 128Kbyte x 2048 | 2Kbyte | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q16DVSNBG TRAY | Winbond Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | EAR99 | NOR | 16M | Symmetrical | 24 | 8 | 2M | 有 | Synchronous | 7 | 10/Chip | 3/Page | Serial (SPI, Dual SPI, Quad SPI) | 2.7 | 3|3.3 | 3.6 | 25 | 25 | 有 | 无 | 无 | 100000 | Compliant | Unconfirmed | Sectored | 4Kbyte x 512 | 256byte | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q256JVEIQ/TUBE | Winbond Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3A991.b.1.a | 无 | 无 | NOR | 256M | Symmetrical | 32 | 8 | 32M | 有 | Synchronous | 6 | 400/Chip | 3/Page | Serial (SPI, Dual SPI, Quad SPI) | 2.7 | 133 | 3 | 3.6 | 2.7 to 3.6 | 25 | 25 | -40 | 85 | Industrial | 有 | 无 | 无 | 100000 | 表面贴装 | 0.73 | 8 | 6 | 8 | SON | WSON EP | Compliant | Tube | 活跃 | 8 | Sectored | 4Kbyte x 8192 | 256byte | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q16CLZPIG/REEL | Winbond Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | EAR99 | NOR | 16M | Symmetrical | 24 | 8 | 2M | 有 | Synchronous | 9 | 10/Chip | 3/Page | Serial (SPI, Dual SPI, Quad SPI) | 80 | 2.3 | 2.5|3|3.3 | 3.6 | 2.3 to 3.6 | 18 | 25 | -40 | 85 | Industrial | 有 | 无 | 无 | Compliant | Obsolete | Sectored | 4Kbyte x 512 | 256byte | 无 |