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我的订单 我的询价 0755-82520436 3307104213

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数据表

有效性

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询价

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安装类型

包装

系列

零件状态

引脚数量

内存大小

建筑学

行业规模

页面尺寸

引导模块

高度

长度

宽度

W25X40CLSVIG/REEL W25X40CLSVIG/REEL

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

EAR99

NOR

4M

Symmetrical

Bottom|Top

24

8

512K

Synchronous

8

4/Chip

0.8/Page

Serial (SPI, Dual SPI)

2.3

104

2.5|3|3.3

3.6

2.3 to 3.6

14

15

-40

85

Industrial

100000

表面贴装

0.8

3.9

4.9

8

SOP

SOIC

Gull-wing

Compliant

活跃

8

Sectored

4Kbyte x 128

256byte

K9WAG08U1A-PCB0T00 K9WAG08U1A-PCB0T00

Samsung Semiconductor 数据表

N/A

-

最小起订量: 1

倍率: 1

3A991.b.1.a

SLC NAND

16G

Symmetrical

8

8

2G

Asynchronous

25000

0.002/Block

25(Min)

1/Chip

Parallel

2.7

3.3

3.6

35

35

0

70

Commercial

表面贴装

1

18.4

12.4(Max)

48

SOP

TSOP-I

Gull-wing

Compliant

卷带

Obsolete

48

Sectored

512byte x 4194304

2Kbyte

K9F8G08U0M-PIB0000 K9F8G08U0M-PIB0000

Samsung Semiconductor 数据表

N/A

-

最小起订量: 1

倍率: 1

8G

Symmetrical

Asynchronous

Parallel

2.7

3.3

3.6

Compliant

Obsolete

Sectored

K9F1G08U0C-PCB0T00 K9F1G08U0C-PCB0T00

Samsung Semiconductor 数据表

N/A

-

最小起订量: 1

倍率: 1

3A991.b.1.a

NAND

1G

Symmetrical

28

8

128M

Asynchronous

0.01/Block

0.7

Parallel

2.7

3.3

3.6

30

30

30

-10

125

Compliant

Obsolete

Sectored

128Kbyte x 1024

2Kbyte

KLM2G1HE3F-B001002 KLM2G1HE3F-B001002

Samsung Semiconductor 数据表

N/A

-

最小起订量: 1

倍率: 1

Unknown

Unknown

Non-Compliant

供应商未确认

Obsolete

W25Q32FVSFIG/TUBE W25Q32FVSFIG/TUBE

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

3A991.b.1.a

NOR

32M

Symmetrical

24

8

4M

Synchronous

7

50/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

3.3|3

3.6

2.7 to 3.6

20

25

-40

85

Industrial

100000

表面贴装

2.31

7.49

10.31

16

SOP

SOIC

Gull-wing

Compliant

Obsolete

16

Sectored

4Kbyte x 1024

256byte

NAND01GW3B2AZA6E NAND01GW3B2AZA6E

Micron Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

3A991.b.1.a

NAND

1G

Symmetrical

28

8

128M

Asynchronous

25000

0.003/Block

50(Min)

0.7/Page

Parallel

2.7

3.3|3

3.6

30

30

-40

85

Industrial

100000

表面贴装

0.7(Max)

9.5

12

63

BGA

VFBGA

Ball

Compliant

Tray

Obsolete

63

Sectored

128Kbyte x 1024

2Kbyte

W25Q16DVSSIG/TUBE W25Q16DVSSIG/TUBE

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

EAR99

NOR

16M

Symmetrical

24

8

2M

Synchronous

7

10/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

3|3.3

3.6

25

25

-40

85

Industrial

100000

表面贴装

1.8

5.28

5.28

8

SOP

SOIC W

Gull-wing

Compliant

Obsolete

8

Sectored

4Kbyte x 512

256byte

W25Q32FVTCIG/TRAY W25Q32FVTCIG/TRAY

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

3A991.b.1.a

NOR

32M

Symmetrical

24

8

4M

Synchronous

7

50/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

3|3.3

3.6

2.7 to 3.6

20

25

-40

85

Industrial

100000

表面贴装

0.85

6

8

24

BGA

TFBGA

Ball

Compliant

Obsolete

24

Sectored

4Kbyte x 1024

256byte

W25Q64FVSFIG/TRAY W25Q64FVSFIG/TRAY

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

3A991.b.1.a

NOR

64M

Symmetrical

Bottom|Top

24

8

8M

Synchronous

7

100/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

104

3|3.3

3.6

2.7 to 3.6

20

25

-40

85

Industrial

100000

表面贴装

2.31

7.49

10.31

16

SOP

SOIC W

Gull-wing

Compliant

Tube

Obsolete

16

Sectored

4Kbyte x 2048

256byte

W25Q16JVZPIQ TUBE W25Q16JVZPIQ TUBE

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

EAR99

NOR

16M

Symmetrical

24

8

2M

Synchronous

6

25/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

3|3.3

3.6

2.7 to 3.6

25

25

-40

85

Industrial

100000

表面贴装

0.73

6

5

8

WSON EP

Non-Compliant

Compliant

Tube

活跃

8

Sectored

4Kbyte x 512

256byte

W25X20CLSNIG/TUBE W25X20CLSNIG/TUBE

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

表面贴装

EAR99

8542.32.00.71

NOR

2M

Symmetrical

Bottom|Top

24

8

256K

Synchronous

8

2/Chip

0.8/Page

Serial (SPI, Dual SPI)

2.3

2.5|3|3.3

3.6

2.3 to 3.6

14

12

-40

85

Industrial

表面贴装

1.5(Max)

4(Max)

5(Max)

8

SOP

SOIC

Gull-wing

5 x 4 x 1.5mm

2.3 V

SOIC

+85 °C

-40 °C

3.6 V

Compliant

W25X

活跃

8

2Mbit

Sectored

4Kbyte x 64

256byte

1.5mm

5mm

4mm

W25X40CLSNIG TRAY W25X40CLSNIG TRAY

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

EAR99

8542.32.00.71

NOR

4M

Symmetrical

Bottom|Top

24

8

512K

Synchronous

8

4/Chip

0.8/Page

Serial (SPI, Dual SPI)

104

2.3

2.5|3|3.3

3.6

2.3 to 3.6

14

15

-40

85

Industrial

100000

表面贴装

1.5(Max)

4(Max)

5(Max)

8

SOP

SOIC

Gull-wing

Compliant

Tube

活跃

8

Sectored

4Kbyte x 128

256byte

W25Q64CVSSIG/TRAY W25Q64CVSSIG/TRAY

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

3A991.b.1.a

NOR

64M

Symmetrical

24

8

8M

Synchronous

8.5

30/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

3|3.3

3.6

2.7 to 3.6

18

25

-40

85

Industrial

100000

表面贴装

1.5(Max)

4(Max)

5(Max)

8

SOP

SOIC W

Gull-wing

Compliant

Obsolete

8

Sectored

4Kbyte x 2048

256byte

W25Q16DVSSIG/REEL W25Q16DVSSIG/REEL

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

EAR99

NOR

16M

Symmetrical

24

8

2M

Synchronous

7

10/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

3.3|3

3.6

25

25

-40

85

Industrial

100000

Compliant

Obsolete

Sectored

4Kbyte x 512

256byte

W25X40CLSNIG TUBE W25X40CLSNIG TUBE

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

表面贴装

EAR99

8542.32.00.71

NOR

4M

Symmetrical

Bottom|Top

24

8

512K

Synchronous

8

4/Chip

0.8/Page

Serial (SPI, Dual SPI)

104

2.3

2.5|3|3.3

3.6

2.3 to 3.6

14

15

-40

85

Industrial

100000

表面贴装

1.5(Max)

4(Max)

5(Max)

8

SOP

SOIC

Gull-wing

5 x 4 x 1.5mm

2.3 V

SOIC

+85 °C

-40 °C

3.6 V

Compliant

Tube

W25X

活跃

8

4Mbit

Sectored

4Kbyte x 128

256byte

1.5mm

5mm

4mm

W25Q128FVSIG/REEL W25Q128FVSIG/REEL

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

3A991.b.1.a

NOR

128M

Symmetrical

24

8

16M

Synchronous

7

200/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

104

3.3|3

3.6

2.7 to 3.6

20

25

-40

85

Industrial

100000

表面贴装

1.8

5.28

5.28

8

SOP

SOIC

Gull-wing

Compliant

Tube

Obsolete

8

Sectored

4Kbyte x 4096

256byte

W25N01GVZEIG/TRAY W25N01GVZEIG/TRAY

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

3A991.b.1.a

SLC NAND

1G

Symmetrical

32

8

128M

Synchronous

7

0.01/Block

0.7/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

104

3|3.3

3.6

2.7 to 3.6

35

35

-40

85

Industrial

100000

表面贴装

0.73

8

6

8

SON

WSON EP

No Lead

Compliant

Tray

活跃

8

Sectored

128Kbyte x 1024

2Kbyte

W25Q64FWSSIQ TRAY W25Q64FWSSIQ TRAY

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

3A991.b.1.a

NOR

64M

Symmetrical

Bottom|Top

24

8

8M

Synchronous

6

100/Chip

5/Page

Serial (SPI, Dual SPI, Quad SPI)

1.65

1.8

1.95

1.65 to 1.95

20

25

-40

85

Industrial

100000

表面贴装

1.8

5.28

5.28

8

SOP

SOIC W

Gull-wing

Compliant

Tube

Obsolete

8

Sectored

4Kbyte x 2048

256byte

W25Q32FVSSIG/REEL W25Q32FVSSIG/REEL

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

3A991.b.1.a

NOR

32M

Symmetrical

24

8

4M

Synchronous

7

50/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

3|3.3

3.6

2.7 to 3.6

20

25

-40

85

Industrial

100000

表面贴装

1.8

5.28

5.28

8

SOP

SOIC

Gull-wing

Compliant

Obsolete

8

Sectored

4Kbyte x 1024

256byte

W25Q64FVZEIG/TUBE W25Q64FVZEIG/TUBE

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

3A991.b.1.a

NOR

64M

Symmetrical

Bottom|Top

24

8

8M

Synchronous

7

100/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

104

2.7

3|3.3

3.6

2.7 to 3.6

20

25

-40

85

Industrial

100000

表面贴装

0.73

8

6

8

SON

WSON EP

No Lead

Compliant

Obsolete

8

Sectored

4Kbyte x 2048

256byte

W25Q16DVZPIG TUBE W25Q16DVZPIG TUBE

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

EAR99

NOR

16M

Symmetrical

24

8

2M

Synchronous

7

10/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

3.3|3

3.6

25

25

-40

85

Industrial

100000

表面贴装

0.73

6

5

8

WSON EP

Compliant

Obsolete

8

Sectored

4Kbyte x 512

256byte

W25Q256FVFIG TUBE W25Q256FVFIG TUBE

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

3A991.b.1.a

NOR

256M

Symmetrical

32

8

32M

Synchronous

7

400/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

3|3.3

3.6

2.7 to 3.6

20

25

-40

85

Industrial

100000

表面贴装

2.31

7.49

10.31

16

SOP

SOIC

Gull-wing

Compliant

Obsolete

16

Sectored

4Kbyte x 8192

256byte

W25Q64FWZPIG TRAY W25Q64FWZPIG TRAY

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

3A991.b.1.a

NOR

64M

Symmetrical

Bottom|Top

24

8

8M

Synchronous

6

100/Chip

5/Page

Serial (SPI, Dual SPI, Quad SPI)

1.65

1.8

1.95

1.65 to 1.95

20

25

-40

85

Industrial

100000

表面贴装

0.73

6

5

8

SON

WSON EP

No Lead

Compliant

Tube

Obsolete

8

Sectored

4Kbyte x 2048

256byte

W25N01GVZEIG TUBE W25N01GVZEIG TUBE

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

表面贴装

表面贴装

0.73

8

6

8

SON

WSON EP

No Lead

Industrial

85

-40

35

35

2.7 to 3.6

3.6

3|3.3

2.7

104

Serial (SPI, Dual SPI, Quad SPI)

0.7/Page

0.01/Block

7

Synchronous

128M

8

32

Symmetrical

1G

SLC NAND

3A991.b.1.a

Compliant

8.1 x 6.1 x 0.75mm

2.7 V

WSON

+85 °C

-40 °C

3.6 V

100000

Tray

W25N

活跃

8

1Gbit

Sectored

128Kbyte x 1024

2Kbyte

0.75mm

6.1mm

8.1mm