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厂商

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子类别

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电压 - 供电

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端子间距

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引脚数量

JESD-30代码

资历状况

电源电压-最大值(Vsup)

电源

温度等级

电源电压-最小值(Vsup)

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内存接口

建筑学

组织结构

座位高度-最大

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写入周期时间 - 字符、页面

待机电流-最大值

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耐力

数据保持时间

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行业规模

页面尺寸

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组织的记忆

长度

宽度

W25Q128BVFAG W25Q128BVFAG

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

表面贴装

3A991.b.1.a

Unknown

NOR

128M

Symmetrical

24

8

16M

Synchronous

8.5

40/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

3|3.3

3.6

18

12

-40

105

汽车

100000

表面贴装

2.31

7.49

10.31

16

SOIC

Tube

W25Q128

Obsolete

Non-Volatile

0.300 INCH, GREEN, SOIC-16

小概要

128000000

PLASTIC/EPOXY

SOP16,.4

-40 °C

105 °C

W25Q128BVFAG

104 MHz

3 V

SOP

RECTANGULAR

Winbond Electronics Corp

Obsolete

WINBOND ELECTRONICS CORP

5.69

SOIC

16-SOIC (0.295, 7.50mm Width)

YES

16-SOIC

16

Winbond Electronics

Compliant

-40°C ~ 105°C (TA)

SpiFlash®

Obsolete

3A991.B.1.A

NOR型号

8542.32.00.51

闪存

FLASH - NOR

2.7V ~ 3.6V

DUAL

鸥翼

1

1.27 mm

compliant

16

R-PDSO-G16

不合格

3.6 V

3/3.3 V

INDUSTRIAL

2.7 V

128Mbit

SYNCHRONOUS

104 MHz

0.025 mA

7 ns

FLASH

SPI - Quad I/O

Sectored

128MX1

2.64 mm

1

50µs, 3ms

0.000015 A

134217728 bit

SERIAL

FLASH

2.7 V

SPI

100000 Write/Erase Cycles

20

HARDWARE/SOFTWARE

4Kbyte x 4096

256byte

16M x 8

10.31 mm

7.49 mm

W25Q128BVFJG/REEL W25Q128BVFJG/REEL

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

3A991.b.1.a

NOR

128M

Symmetrical

24

8

16M

Synchronous

8.5

40/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

3|3.3

3.6

18

12

-40

105

Industrial

100000

表面贴装

2.31

7.49

10.31

16

SOP

SOIC

Gull-wing

Compliant

Obsolete

16

Sectored

4Kbyte x 4096

256byte

W29N04GZSIBA/REEL W29N04GZSIBA/REEL

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

3A991.b.1.a

Unknown

NAND

4G

30

8

512M

0.01/Block

0.7/Page

Parallel

1.7

1.8

1.95

20

20

-40

85

Industrial

100000

Compliant

活跃

2Kbyte

W29GL128CL9B/REEL W29GL128CL9B/REEL

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

3A991.b.1.a

NOR

128M

Symmetrical

Bottom|Top

23

1

128M

Asynchronous

100

256/Chip

35

224000/Chip

35

Parallel

2.7

3|3.3

3.6

2.7 to 3.6

55

25

30

-40

85

Industrial

表面贴装

0.6(Min)

11

13

48

BGA

LFBGA

Ball

Compliant

Obsolete

48

Sectored

128Kbyte x 128

256byte

W25M02GVTCIG/TRAY W25M02GVTCIG/TRAY

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

3A991.b.1.a

SLC NAND

2G

Symmetrical

32

8

256M

Synchronous

7

0.01/Block

0.7/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

3|3.3

3.6

2.7 to 3.6

35

35

-40

85

Industrial

100000

表面贴装

0.85(Max)

6

8

24

BGA

TFBGA

Ball

Compliant

Tray

Obsolete

24

Sectored

W29GL064CT7A/REEL W29GL064CT7A/REEL

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

3A991.b.1.a

NOR

64M

Symmetrical

Top

22

8/16

8M/4M

Asynchronous

70

128/Chip

35

112000/Chip

35

Parallel

2.7

3|3.3

3.6

2.7 to 3.6

55

25

30

-40

85

Industrial

表面贴装

0.79

6

8

48

BGA

TFBGA

Ball

Compliant

Obsolete

48

Sectored

64Kbyte x 128

8Words/16byte

W25Q128FVEIF/REEL W25Q128FVEIF/REEL

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

3A991.b.1.a

NOR

128M

Symmetrical

24

8

16M

Synchronous

7

200/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

104

3.3|3

3.6

2.7 to 3.6

20

25

-40

85

Industrial

100000

表面贴装

0.73

8

6

8

SON

WSON EP

No Lead

Compliant

Obsolete

8

Sectored

4Kbyte x 4096

256byte

W29N02GWBIBA/REEL W29N02GWBIBA/REEL

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

3A991.b.1.a

Unknown

SLC NAND

2G

29

8

256M

Asynchronous

30

0.01/Block

0.7

Parallel

1.7

1.8

1.95

1.7 to 1.95

20

-40

85

Industrial

表面贴装

0.6(Max)

9

11

63

VFBGA

Compliant

活跃

63

Sectored

W29N04GWBIBA/TRAY W29N04GWBIBA/TRAY

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

3A991.b.1.a

Unknown

NAND

4G

29

16

256M

Asynchronous

0.01/Block

0.7/Page

Parallel

1.7

1.8

1.95

20

20

-40

85

Industrial

100000

表面贴装

0.6(Max)

9

11

63

BGA

VFBGA

Ball

Compliant

Tray

活跃

63

2Kbyte

W25N01GVZEIT TUBE W25N01GVZEIT TUBE

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

3A991.b.1.a

SLC NAND

1G

Symmetrical

32

8

128M

Synchronous

7

0.01/Block

0.7/Page

Serial (SPI, Dual SPI, Quad SPI)

104

2.7

3|3.3

3.6

2.7 to 3.6

35

35

-40

85

Industrial

100000

表面贴装

0.73

8

6

8

WSON EP

Compliant

Tray

活跃

8

Sectored

128Kbyte x 1024

2Kbyte

W25M512JVBIQ/TUBE W25M512JVBIQ/TUBE

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

3A991.b.1.a

NOR

512M

Symmetrical

Bottom|Top

32

8

64M

Synchronous

7

400/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

104

2.7

3|3.3

3.6

2.7 to 3.6

30

25

-40

85

Industrial

100000

表面贴装

0.85

6

8

24

BGA

TFBGA

Ball

Compliant

活跃

24

Sectored

4Kbyte x 16384

256byte

W25Q128BVEJG /REEL W25Q128BVEJG /REEL

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

3A991.b.1.a

NOR

128M

Symmetrical

24

8

16M

Synchronous

8.5

40/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

3.3|3

3.6

18

12

-40

105

Industrial

100000

表面贴装

0.73

6

8

8

SON

WSON EP

No Lead

Compliant

Obsolete

8

Sectored

4Kbyte x 4096

256byte

W29N01HZBINF/TRAY W29N01HZBINF/TRAY

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

3A991.b.1.a

SLC NAND

1G

Symmetrical

28

8

128M

Asynchronous

0.01/Block

0.7/Page

Parallel

1.7

1.8

1.95

25

25

-40

85

Industrial

100000

表面贴装

0.6(Max)

9

11

63

VFBGA

Compliant

63

Sectored

128Kbyte x 1024

2Kbyte

W29N04GVSJAF/TRAY W29N04GVSJAF/TRAY

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

3A991.b.1.a

Unknown

SLC NAND

4G

30

8

512M

Asynchronous

25

0.01/Block

0.7/Page

Parallel

2.7

3|3.3

3.6

2.7 to 3.6

35

35

-40

105

工业级

表面贴装

1

18.4

12

48

TSOP

Compliant

活跃

48

Sectored

2Kbyte

W29N02GVSIAF TRAY W29N02GVSIAF TRAY

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

Unknown

Compliant

活跃

W29N01HVDINF/TRAY W29N01HVDINF/TRAY

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

3A991.b.1.a

SLC NAND

1G

Symmetrical

28

8

128M

Asynchronous

0.01/Block

0.7/Page

Parallel

2.7

3.3

3.6

2.7 to 3.6

35

35

-40

85

Industrial

表面贴装

0.6(Max)

6.5

8

48

VFBGA

Compliant

活跃

48

Sectored

128Kbyte x 1024

2Kbyte

W25Q10EWSNIG/REEL W25Q10EWSNIG/REEL

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

EAR99

1M

Symmetrical

1

8

Synchronous

6

2/Chip

0.8/Page

Serial (SPI, Dual SPI, Quad SPI)

1.65

1.8

1.95

8

20

-40

85

Industrial

100000

表面贴装

1.45

3.9

4.85

8

SOP

SOIC

Gull-wing

Compliant

Tube

活跃

8

Sectored

4Kbyte x 32

256byte

W25Q128FVAIQ/TUBE W25Q128FVAIQ/TUBE

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

3A991.b.1.a

NOR

128M

Symmetrical

24

8

16M

Synchronous

7

200/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

104

3|3.3

3.6

2.7 to 3.6

20

25

-40

85

Industrial

100000

通孔

3.3

6.35

9.27

8

PDIP

Compliant

Obsolete

8

Sectored

4Kbyte x 4096

256byte

W25Q128FWEIG/TRAY W25Q128FWEIG/TRAY

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

3A991.b.1.a

NOR

128M

Symmetrical

24

8

16M

Synchronous

6

200/Chip

5/Page

Serial (SPI, Dual SPI, Quad SPI)

1.65

1.8

1.95

1.65 to 1.95

20

25

-40

85

Industrial

100000

表面贴装

0.73

8

6

8

SON

WSON EP

No Lead

Compliant

Obsolete

8

Sectored

4Kbyte x 4096

256byte

W29N01HZSINF/TRAY W29N01HZSINF/TRAY

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

3A991.b.1.a

SLC NAND

1G

Symmetrical

28

8

128M

Asynchronous

0.01/Block

0.7/Page

Parallel

1.7

1.8

1.95

1.7 to 1.95

25

25

-40

85

Industrial

100000

表面贴装

1

18.4

12

48

SOP

TSOP-I

Compliant

Tray

48

Sectored

128Kbyte x 1024

2Kbyte

W25Q128FVEIQ/REEL W25Q128FVEIQ/REEL

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

3A991.b.1.a

NOR

128M

Symmetrical

24

8

16M

Synchronous

7

200/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

104

3|3.3

3.6

2.7 to 3.6

20

25

-40

85

Industrial

100000

表面贴装

0.73

8

6

8

SON

WSON EP

No Lead

Compliant

Obsolete

8

Sectored

4Kbyte x 4096

256byte

W25Q128JVPIM/TUBE W25Q128JVPIM/TUBE

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

3A991.b.1.a

NOR

128M

Symmetrical

24

8

16M

Synchronous

6

200/Chip

3/Page

58nm

Serial (SPI, Dual SPI, Quad SPI)

133

2.7

3|3.3

3.6

2.7 to 3.6

25

25

-40

85

Industrial

100000

表面贴装

0.73

6

5

8

SON

WSON EP

No Lead

Compliant

Tube

活跃

8

Sectored

4Kbyte x 4096

256byte

W25Q128BVFSG/REEL W25Q128BVFSG/REEL

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

3A991.b.1.a

NOR

128M

Symmetrical

24

8

16M

Synchronous

8.5

40/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

3.3|3

3.6

18

12

100000

表面贴装

2.31

7.49

10.31

16

SOP

SOIC W

Gull-wing

Compliant

Obsolete

16

Sectored

4Kbyte x 4096

256byte

W25M121AVEIT/TUBE W25M121AVEIT/TUBE

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

EAR99

NOR|NAND

1G NAND+128M NOR

Symmetrical

Synchronous

Serial (SPI, Dual SPI, Quad SPI)

2.7

3.3|3

3.6

-40

85

Industrial

100000

Compliant

活跃

Sectored

256byte

W29GL064CL7B/TRAY W29GL064CL7B/TRAY

Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

3A991.b.1.a

NOR

64M

Symmetrical

22

8/16

8M/4M

Asynchronous

70

128/Chip

35

112000/Chip

35

Parallel

2.7

3|3.3

3.6

2.7 to 3.6

55

25

30

-40

85

Industrial

表面贴装

0.6(Min)

11

13

64

BGA

LFBGA

Ball

Compliant

Obsolete

64

Sectored

64Kbyte x 128

8Words/16byte