N/A

-

卡边缘

100

无线通信模块

0.222931 oz

Mini PCIe

Socket Mount

Tray

EM06

活跃

Module

Quectel

Details

-30 to 70 °C

Reel

-

LTE-A Cat 6 M.2 Module

3.135V ~ 4.4V

-

1.71, 3.6 V

-

300Mbps

-

BeiDou, Galileo, GLONASS, GPS, GNSS, HSPA+, LTE, UMTS, WCDMA

700/800/850/900/1700/1800/1900/2600 MHz

扩展工业

-

Cellular, Navigation

不包括天线

-

I²C, PCM, USB

22.1mA

22.1mA

-

N/A

-

表面贴装

UART, USB, PCM, I2C, Netlight, SPI

3.3 V

- 35 C

+ 75 C

SMD/SMT

IoT

1

无线通信模块

0.146740 oz

SPI/USB

RF and Wireless Tools

4.3 V

Box

EG91

活跃

Module

Quectel

Details

-35°C ~ 75°C

-

TEA Board

3.3V ~ 4.3V

-

3.8 V

-

42Mbps

-

BeiDou, Galileo, GLONASS, GPS, GNSS, LTE, UMTS, WCDMA

-

Cellular, Navigation

不包括天线

-

I²C, PCM, SPI, UART, USB

29mA

29mA

-

N/A

-

卡边缘

I2C, USB

3.1 V

- 35 C

+ 75 C

250

无线通信模块

0.360853 oz

4.4 V

Tray

EP06

活跃

Module

Quectel

Details

-35°C ~ 75°C

切割胶带

-

PCIe模块

3.1V ~ 4.4V

-

3.3 V

-

300Mbps

-

BeiDou, Galileo, GLONASS, GPS, GNSS, HSPA+, LTE, WCDMA

-

Cellular, Navigation

不包括天线

-

I²C, PCM, USB

32.12mA

32.12mA

-

N/A

-

卡边缘

I2C, PCM, UART, USB

30 mA

30 mA

- 40 C

+ 80 C

SMA

100

3 V

无线通信模块

0.368613 oz

3.6 V

Tray

EC21

活跃

32 mm x 29 mm x 2.4 mm

Module

Quectel

Details

-35°C ~ 75°C

切割胶带

-

LTE模块

3V ~ 3.6V

700 MHz to 2700 MHz

-

33 dBm

10Mbps

-

BeiDou, Galileo, GLONASS, GPS, GNSS, LTE

-

Cellular, Navigation

不包括天线

-

I²C, PCM, UART, USB

30mA

30mA

-

N/A

-

卡边缘

I2C, UART, USB

3 V

- 35 C

+ 75 C

100

无线通信模块

0.368613 oz

3.6 V

Tape & Reel (TR)

EC25

Obsolete

Module

Quectel

Details

-35°C ~ 75°C

Tray

EC25

Mini PCIe

3V ~ 3.6V

698 MHz to 960 MHz, 1561 MHz to 1571 MHz, 1602 MHz to 1606 MHz, 1700 MHz to 2700 MHz

3.3 V

-

150Mbps

-

BeiDou, EDGE, Galileo, GLONASS, GPS, GNSS, GSM, LTE, WCDMA

-

Cellular, Navigation

不包括天线

-

I²C, PCM, UART, USB

-

-

-

N/A

-

100

无线通信模块

0.163318 oz

Details

Tray

N/A

-

3.3 V

- 20 C

+ 70 C

802.11ac/a/b/g/n

802.11 a/b/g/n/ac, Bluetooth 4.2

1

3.3 V

SMA

26.65 mm x 29.85 mm x 3.25 mm

USB

2.4 GHz, 5.5 GHz

N/A

-

表面贴装

GPIO, I2C, I2S, SPI, UART, USB

- 102 dBm

1.7 V

- 40 C

+ 105 C

Integrated

有

SMD/SMT

500

4.6 mA

4.8 mA to 14.8 mA

3.6 V

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

NINA-B416

活跃

55-SMD Module

u-blox

Bluetooth Low Energy (BLE)

-40°C ~ 105°C

MouseReel

NINA-B41

1.7V ~ 3.6V

2.4 GHz

1.7 V to 3.6 V

512 kB, 128 kB

10 dBm

2 Mb/s

nRF52833

Bluetooth 5.1

10dBm

802.15.4, Bluetooth

Integrated, Trace

- 102 dBm

ADC, GPIO, I²C, I²S, PWM, SPI, UART, USB

4.6mA

4.8mA ~ 14.8mA

-

蓝牙模块

N/A

-

M2M

Screw

Commercial grade

无

Commercial

30(mm)

2.4(mm)

N/A

-

0 V

- 40 C

+ 85 C

RP-SMA

1

1.653 lbs

48 V

M12

300 m

2.4 GHz to 2.4835 GHz

3.6 V

8 dBm

250 kb/s

- 93 dBm

Wireless Sensor Networks

N/A

-

3.3 V

- 40 C

+ 85 C

802.11 b/g/n

802.11 b/g/n, Bluetooth

500

3.3 V

GPIO, SPI, UART

2.4 GHz

3.3 V

18 dBm

N/A

-

表面贴装

60 m, 1.2 km

2.1 V

135 mA

17 mA

- 40 C

+ 85 C

Chip

I2C, SPI, UART

有

90

Tray

XBRR-24

活跃

3.6 V

19 mm x 13 mm x 2 mm

34-SMD Module

Digi

Details

-40°C ~ 85°C

Tray

XBRR

1.71V ~ 3.8V

2.4 GHz

1MB Flash, 96kB RAM

8 dBm

250 kb/s, 1 Mb/s

EFR32MG

Zigbee®

8dBm

802.15.4, Bluetooth

Integrated, Chip

- 103 dBm

I²C, SPI, UART

14mA

32mA

DSSS

N/A

-

通孔

15 m, 90 m, 300 mm, 3.2 km

1.72 V

30 mA

14.5 mA

- 40 C

+ 85 C

PCB

Bluetooth, I2C, SPI, UART

有

25

Tray

XBRR-24

活跃

3.8 V

27.61 mm x 24.38 mm

20-DIP Module

Digi

Details

-40°C ~ 85°C

Tray

XBRR

1.71V ~ 3.8V

2.4 GHz

1MB Flash, 96kB RAM

19 dBm

250 kb/s, 1 Mb/s

EFR32MG

Zigbee®

19dBm

802.15.4, Bluetooth

Integrated, Trace

- 103 dBm

I²C, SPI, UART

14.5mA

195mA

DSSS

N/A

-

表面贴装

15 m, 90 m, 300 mm, 3.2 km

1.72 V

30 mA

14.5 mA

- 40 C

+ 85 C

PCB

Bluetooth, I2C, SPI, UART

有

36

Tray

XBRR-24

活跃

3.8 V

34 mm x 22 mm x 3.05 mm

34-SMD Module

Digi

Details

-40°C ~ 85°C

Tray

XBRR

1.71V ~ 3.8V

2.4 GHz

1MB Flash, 96kB RAM

19 dBm

250 kb/s, 1 Mb/s

EFR32MG

Zigbee®

8dBm

802.15.4, Bluetooth

Integrated, Trace

- 103 dBm

I²C, SPI, UART

14mA

193mA

DSSS

N/A

-

表面贴装

15 m, 90 m, 300 mm, 3.2 km

1.72 V

30 mA

14.5 mA

- 40 C

+ 85 C

Pad

Bluetooth, I2C, SPI, UART

有

90

Tray

XBRR-24

活跃

3.8 V

19 mm x 13 mm x 2 mm

34-SMD Module

Digi

Details

-40°C ~ 85°C

Tray

XBRR

1.71V ~ 3.8V

2.4 GHz

1MB RAM

19 dBm

250 kb/s, 1 Mb/s

EFR32MG

Bluetooth v4.2, Bluetooth v5.0, Zigbee®

19dBm

802.15.4, Bluetooth

不包括天线

- 103 dBm

I²C, SPI, UART

14mA

193mA

DSSS

N/A

-

表面贴装

15 m, 60 m, 300 mm, 1.2 km

1.72 V

30 mA

14.5 mA

- 40 C

+ 85 C

PCB

Bluetooth, I2C, SPI, UART

有

36

Tray

XBRR-24

活跃

3.8 V

34 mm x 22 mm x 3.05 mm

34-SMD Module

Digi

Details

-40°C ~ 85°C

Tray

XBRR

1.71V ~ 3.8V

2.4 GHz

1MB Flash, 96kB RAM

8 dBm

250 kb/s, 1 Mb/s

EFR32MG

Zigbee®

8dBm

802.15.4, Bluetooth

Integrated, Trace

- 103 dBm

I²C, SPI, UART

14mA

32mA

DSSS

N/A

-

通孔

15 m, 60 m, 300 mm, 1.2 km

1.72 V

30 mA

14.5 mA

- 40 C

+ 85 C

SMA

Bluetooth, I2C, SPI, UART

有

25

Tray

XBRR-24

活跃

3.8 V

27.61 mm x 24.38 mm

20-DIP Module

Digi

Details

-40°C ~ 85°C

Tray

XBRR

1.71V ~ 3.8V

2.4 GHz

1MB Flash, 96kB RAM

8 dBm

250 kb/s, 1 Mb/s

EFR32MG

Zigbee®

8dBm

802.15.4, Bluetooth

Antenna Not Included, SMA

- 103 dBm

I²C, SPI, UART

14mA

32mA

DSSS

N/A

-

表面贴装

15 m, 60 m, 300 mm, 1.2 km

1.72 V

30 mA

14.5 mA

- 40 C

+ 85 C

Pad

Bluetooth, I2C, SPI, UART

有

90

Tray

XBRR-24

活跃

3.8 V

19 mm x 13 mm x 2 mm

34-SMD Module

Digi

Details

-40°C ~ 85°C

Tray

XBRR

1.71V ~ 3.8V

2.4 GHz

1MB Flash, 96kB RAM

8 dBm

250 kb/s, 1 Mb/s

EFR32MG

Zigbee®

8dBm

802.15.4, Bluetooth

Antenna Not Included, Castellation

- 103 dBm

I²C, SPI, UART

14.5mA

30mA

DSSS

N/A

-

表面贴装

3.2 km

2.1 V

135 mA

17 mA

- 40 C

+ 85 C

Pad

I2C, SPI, UART

有

90

Tray

XBRR-24

活跃

3.6 V

19 mm x 13 mm x 2 mm

34-SMD Module

Digi

Details

-40°C ~ 85°C

Tray

XBRR

1.71V ~ 3.8V

2.4 GHz

1MB Flash, 96kB RAM

19 dBm

250 kb/s, 1 Mb/s

EFR32MG

Zigbee®

8dBm

802.15.4, Bluetooth

Antenna Not Included, Castellation

- 103 dBm

I²C, SPI, UART

14mA

193mA

DSSS

N/A

-

通孔

15 m, 90 m, 300 mm, 3.2 km

1.72 V

30 mA

14.5 mA

- 40 C

+ 85 C

u.FL

Bluetooth, I2C, SPI, UART

有

25

Tray

XBRR-24

活跃

3.8 V

27.61 mm x 24.38 mm

20-DIP Module

Digi

Details

-40°C ~ 85°C

Tray

XBRR

1.71V ~ 3.8V

2.4 GHz

1MB Flash, 96kB RAM

19 dBm

250 kb/s, 1 Mb/s

EFR32MG

Zigbee®

19dBm

802.15.4, Bluetooth

Integrated, Trace + U.FL

- 103 dBm

I²C, SPI, UART

14.5mA

195mA

DSSS

N/A

-

表面贴装

ADC, GPIO, I2C, I2S, SPM, UART, USB

1.7 V

- 40 C

+ 105 C

NFC

Class 2

有

- 96 dBm

250

0.352740 oz

8dBm

5.5 V

Strip

活跃

Chip

6.3 mm x 8.6 mm x 1.6 mm

59-SMD Module

Laird Connectivity Inc.

Details

-40°C ~ 105°C

切割胶带

BL653

1.7V ~ 5.5V

2.48 GHz

1.7 V to 5.5 V

512kB Flash, 12kB RAM

8 dBm

1 Mb/s

nRF52833

Bluetooth 5.1

8dBm

802.15.4, Bluetooth

Integrated, Chip

-103dBm

ADC, I²C, I²S, NFC, PDM, PWM, GPIO, SPI, UART, USB

-

4.9mA ~ 14.1mA

-

N/A

-

表面贴装

802.11 b/g/n

SPI

1.8 V, 3.3 V

99.4 mA

48.3 mA

- 40 C

+ 105 C

Embedded

有

260

1.8 V, 3.3 V

Tray

WFM200

活跃

6.5 mm x 6.5 mm x 1.3 mm

58-SMD Module

Silicon Labs

Details

-40°C ~ 105°C (TA)

Tray

-

1.62V ~ 3.6V

2.412 GHz to 2.484 GHz

1.8 V, 3.3 V

-

15.1 dBm

72.2 Mb/s

WFM200S

802.11b/g/n

15.1dBm

WiFi

Integrated, Chip

-96.3dBm

SDIO, SPI

42.3mA ~ 48.3mA

45.4mA ~ 99.4mA

DSSS

N/A

-

-

60 m, 1200 m

2.1 V

135 mA

17 mA

- 40 C

+ 85 C

PCB

I2C, SPI, UART

25

3.6 V

Tray

XB3-24

活跃

2.438 cm x 2.761 cm

-

Digi

Details

-

Tray

-

-

2.4 GHz

-

8 dBm

250 kb/s, 1 Mb/s

-

-

-

802.15.4

PCB Trace

- 103 dBm

-

-

-

-

N/A

-

2.7 V

3.6 V

- 40 C

+ 85 C

U.FL

802.11 b/g/n

有

50

I2C, SPI, UART

Tray

2.4 GHz

18.3 dBm

N/A

-

UART

- 90 dBm, - 92 dBm

3.3 V

4.2 V

- 20 C

+ 70 C

88

Class 2

Tray

2.44 GHz

3.3 V to 4.2 V

1.5 dBm

1 Mb/s

Bluetooth 5.0