类别是'射频收发器模块'
射频收发器模块 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 质量 | 制造商包装标识符 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 端子表面处理 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 电源电压 | 端子间距 | 深度 | 额定电流 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 通道数量 | 界面 | 内存大小 | 最大电源电流 | uPs/uCs/外围ICs类型 | 数据率 | 使用的 IC/零件 | 带宽 | 议定书 | 最高频率 | 筛选水平 | 通信IC类型 | 功率 - 输出 | 无线电频率系列/标准 | 天线类型 | 消费者集成电路类型 | 敏感度 | ADC通道数量 | 串行接口 | 接收电流 | 传输电流 | 调制 | 灵敏度(dBm) | 通用输入输出数量 | 环境温度范围高 | 固件版本 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |
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![]() | BM20SPKA1NBC-0001AA | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 表面贴装 | 40-SMD Module | -20°C~70°C | Tray | 2015 | yes | 活跃 | 3 (168 Hours) | 40 | 3V~4.2V | UNSPECIFIED | 无铅 | 1 | 3.7V | 2.4GHz | BM20 | R-XXMA-N40 | 4.2V | 5.25mA | Bluetooth v4.1 | 电信电路 | 4dBm | Bluetooth | Integrated, Trace | UART | -91 dBm | 2.5mm | 29mm | 15mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||
![]() | MRF24WG0MAT-I/RM | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 36-SMD Module | 36 | -40°C~85°C | Tape & Reel (TR) | 2012 | 活跃 | 3 (168 Hours) | 36 | 8542.39.00.01 | 2.8V~3.6V | 3.3V | 21mm | 2.4GHz | MRF24WG0M | 3.6V | 3.3V | 11 | 54Mbps | 802.11b/g | 18dBm | WiFi | Integrated, Trace | SPI | 156mA | 226mA~237mA | DSSS, OFDM | -95 dBm | 310C | 31mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
![]() | XB3-C-A2-UT-001 | Digi | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3 Weeks | 通孔 | 20-SMD Module | NO | XB3-C-A2-UT-001 | -40°C~85°C | Tray | XBee® 3 Cellular | 活跃 | 1 (Unlimited) | 20 | POWER REQUIREMENTS AVAILABLE AT 3.3VDC INPUT POWER | 2.8V~5.5V | UNSPECIFIED | 1 | R-XXMA-T20 | SPI, UART, USB | 2 Mbps | SARA-R410M | 83.5MHz | 4G LTE CAT-M1 (AT&T/Verizon) | 2.4835GHz | MODEM | 23dBm | Bluetooth, Cellular | Antenna Not Included, U.FL | -105dBm | 4 | SPI, UART, USB | 235mA~860mA | 13 | 5.4356mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||
![]() | RN1723-I/RM100 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 表面贴装 | 表面贴装 | 49-SMD Module | Automotive grade | -40°C~85°C | Tray | 2016 | yes | 活跃 | 1 (Unlimited) | 49 | QUAD | 无铅 | 1 | 3.3V | 2.4GHz | RN1723 | R-XQMA-N49 | 3.3V | SPI, UART | 2MB ROM 128kB RAM | 54Mbps | 802.11b/g | TS 16949 | 电信电路 | 12dBm | WiFi | 不包括天线 | -83dBm | SPI, UART | 40mA | 120mA~190mA | CCK, DBPSK, DQPSK, DSSS, OFDM | -83 dBm | 1.0.0 | 3.1mm | 18mm | 27mm | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||
![]() | ATWINC1500-MR210UB | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | Module | 40 | -40°C~85°C | Tray | 2015 | yes | 活跃 | 3 (168 Hours) | 3V~4.2V | 2.4GHz | ATWINC1500 | 3.6V | 1 | I2C, SPI, UART | 4MB Flash 128kB RAM | 72.2Mbps | 802.11b/g/n | 19.5dBm | WiFi | Antenna Not Included, U.FL | I2C, SPI, UART | 52.5mA~70.1mA | 132mA~294mA | 16-QAM, 64-QAM, BPSK, CCK, DBPSK, DQPSK, OFDM, QPSK | -98 dBm | 19.4.4 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||
![]() | WT12-A-AI4 | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | Module | 31 | -40°C~85°C | Tape & Reel (TR) | 2014 | 活跃 | 3 (168 Hours) | 31 | 8542.39.00.01 | 3.1V~3.6V | UNSPECIFIED | 1 | 3.3V | 1.5mm | 2.4GHz | 3.4V | SPI, UART, USB | 8MB Flash | 60mA | 3Mbps | BlueCore4 | Bluetooth v2.1 + EDR, Class 2 | 电信电路 | 3dBm | Bluetooth | Integrated, Chip | PIO, SPI, UART, USB | 70mA | DQPSK, GFSK | -86 dBm | 2.6mm | 25.6mm | 14mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||
![]() | BM62SPKS1MC2-0001AA | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 25 Weeks | 表面贴装 | Module | YES | Automotive grade | -20°C~70°C | Bulk | 2017 | yes | 活跃 | 3 (168 Hours) | 40 | 3.8V | UNSPECIFIED | 无铅 | 未说明 | 1 | 2.4GHz | 未说明 | BM62 | R-XXMA-N40 | 4.2V | 3.2V | 3Mbps | Bluetooth v5.0 | TS 16949 | 2dBm | Bluetooth | Integrated, Trace | 消费电路 | -90dBm | I2S, UART | 15mA | 8DPSK, DQPSK, GFSK | DSPK1.1 | 2.56mm | 29mm | 15mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||
![]() | BM23SPKA1NB9-0001AA | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 43-SMD Module | -20°C~70°C | Tray | 2015 | yes | Obsolete | 3 (168 Hours) | 43 | 3V~4.2V | UNSPECIFIED | 无铅 | 1 | 3.7V | 1.2mm | 2.4GHz | BM23 | R-XXMA-N43 | UART | Bluetooth v4.1 | 电信电路 | 4dBm | Bluetooth | Integrated, Trace | I2S, UART | -91 dBm | 1.9mm | 29mm | 15mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
![]() | BM71BLES1FC2-0B02AA | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | Module | YES | BM71BLES1FC2-0B02AA | Industrial grade | -40°C~85°C | Tray | 2017 | yes | 活跃 | 1 (Unlimited) | 16 | 1.9V~3.6V | UNSPECIFIED | 无铅 | 260 | 1 | 3V | 1.2mm | 2.4GHz | 30 | BM71 | R-XXMA-N16 | I2C, SPI, UART | 8.6 kbps | Bluetooth v5.0 | 电信电路 | 2dBm | Bluetooth | Integrated, Chip | -90dBm | 5 | UART | 10mA~13mA | 13mA | 9 | 85°C | 1.06 | 2.1mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||
![]() | RN4870-V/RM118 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 33-SMD Module | NO | -20°C~70°C | Tray | 2017 | 活跃 | 1 (Unlimited) | 33 | 8542.39.00.01 | 1.9V~3.6V | UNSPECIFIED | 无铅 | 1 | 3.3V | 1.1mm | 2.4GHz | RN4870 | R-XXMA-N33 | 10 Mbps | Bluetooth v5.0 | 电信电路 | 0dBm | Bluetooth | Integrated, Chip | -90dBm | UART | 13mA | GFSK | 1.1.8 | 2.4mm | 22mm | 12mm | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||
![]() | SPBTLE-RF0TR | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NRND (Last Updated: 6 months ago) | 表面贴装 | Module | SPBTLE-RF0TR | -40°C~85°C | Tape & Reel (TR) | BlueNRG | 不用于新设计 | 3 (168 Hours) | 1.7V~3.6V | 未说明 | 2.4GHz | 未说明 | SPBTLE | Bluetooth v4.1 | 电信电路 | 4dBm | Bluetooth | Integrated, Chip | -88dBm | SPI | 14.5mA | 20.5mA | 1 | 2.2mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | LBCA2HNZYZ-711 | Murata Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 24 Weeks | 表面贴装 | 表面贴装 | Module | -40°C~85°C | Tape & Reel (TR) | 活跃 | 3 (168 Hours) | 37 | 8542.39.00.01 | 2.35V~3.3V | UNSPECIFIED | 1 | 2.5V | 2.4GHz | R-XXMA-N37 | 3.3V | I2C, SPI, UART | 1 Mbps | DA14580 | Bluetooth v4.1 | 电信电路 | -1dBm | Bluetooth | Integrated, Chip | I2C, SPI, UART | 5.1mA | 4.8mA | -93 dBm | 1mm | 7.4mm | 7mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||
![]() | ATWINC1500-MR210UB1954 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 28-SMD Module | YES | Industrial grade | -40°C~85°C | SmartConnect | 活跃 | 3 (168 Hours) | 28 | 2.7V~3.6V | UNSPECIFIED | 无铅 | 3.3V | 2.4GHz | R-XXMA-N28 | 4MB Flash 128kB RAM | 微处理器电路 | 72.2Mbps | ATWINC1500 | 802.11b/g/n | 18.5dBm | WiFi | Integrated, Chip + U.FL | -95dBm | I2C, SPI, UART | 61mA | 265mA | 16-QAM, 64-QAM, BPSK, CCK, DBPSK, DQPSK, OFDM, QPSK | 19.5.4 | 2.113mm | 21.72mm | 14.73mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
![]() | WT11U-A-AI56 | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | Module | -40°C~85°C | Tape & Reel (TR) | yes | 活跃 | 3 (168 Hours) | 8542.39.00.01 | 2.7V~3.6V | 2.4GHz | 3 Mbps | Bluetooth v2.1 + EDR | 16.5dBm | Bluetooth | Integrated, Chip | 消费电路 | -88dBm | SPI, USART, USB | 36mA | 110mA | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | ATWINC1500-MR210PB1954 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 28-SMD Module | YES | Industrial grade | -40°C~85°C | SmartConnect | 活跃 | 3 (168 Hours) | 28 | 2.7V~3.6V | UNSPECIFIED | 无铅 | 3.3V | 2.4GHz | R-XXMA-N28 | 4MB Flash 128kB RAM | 微处理器电路 | 72.2Mbps | ATWINC1500 | 802.11b/g/n | 18.5dBm | WiFi | Integrated, Trace | -95dBm | I2C, SPI, UART | 61mA | 265mA | 16-QAM, 64-QAM, BPSK, CCK, DBPSK, DQPSK, OFDM, QPSK | 19.5.4 | 2.113mm | 21.72mm | 14.73mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
![]() | RN41N-I/RM | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 35-SMD Module | -40°C~85°C | Tray | 2011 | e3 | 活跃 | 3 (168 Hours) | 35 | Matte Tin (Sn) | 8542.39.00.01 | 3V~3.6V | QUAD | 无铅 | 250 | 1 | 3.3V | 2.4GHz | 40 | RN41 | R-XQMA-N35 | UART | 300kbps | Bluetooth v2.1 +EDR, Class 1 | 电信电路 | 16dBm | Bluetooth | 不包括天线 | SPI, UART, USB | 35mA | 65mA | FHSS, GFSK | -80 dBm | 6.15 | 2.2mm | 20.1mm | 13.2mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||
![]() | ATSAMW25H18-MR210PB | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | Module | 51 | Industrial grade | -40°C~85°C | Tray | 2016 | yes | 活跃 | 3 (168 Hours) | 51 | 3V~4.3V | UNSPECIFIED | 无铅 | 1 | 3.3V | 1.2mm | 2.4GHz | ATSAMW25 | SPI, UART | 256kB Flash 32kB SRAM | 72.2Mbps | 802.11b/g/n | 电信电路 | 18.5dBm | WiFi | Integrated, Trace | SPI, UART | DSSS, OFDM | -98 dBm | 19.4.4 | 2.138mm | 33.864mm | 14.908mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||
![]() | BT111-A-HCI | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 41-SMD Module | -30°C~85°C | Cut Tape (CT) | 2013 | 不用于新设计 | 3 (168 Hours) | 21 | 8542.39.00.01 | 1.7V~3.6V | UNSPECIFIED | 无铅 | 1 | 1.1mm | 2.4GHz | R-XXMA-N21 | 3.6V | I2C, SPI, UART, USB | 73mA | 12 Mbps | CSR8510 | Bluetooth v4.0 | 电信电路 | 8dBm | Bluetooth | Integrated, Chip | SPI, UART, USB | -89 dBm | 2.31mm | 13.05mm | 9.3mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||
![]() | MRF24J40MDT-I/RM | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 12-SMD Module | 12 | Industrial grade | -40°C~85°C | Tape & Reel (TR) | 2016 | e3 | 活跃 | 1 (Unlimited) | 12 | 哑光锡 | 8542.39.00.01 | 3V~3.6V | DUAL | 无铅 | 未说明 | 1 | 3.3V | 2.54mm | 22.86mm | 2.4GHz | 未说明 | MRF24J40M | 3.3V | 250kbps | Zigbee® | 电信电路 | 19dBm | 802.15.4 | Integrated, Trace | SPI | 32mA | 140mA | -104 dBm | 3.3528mm | 33.02mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||
![]() | RN41-I/RM | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 表面贴装 | 表面贴装 | 35-SMD Module | 35 | 22.991463mg | -40°C~85°C | Tray | 2010 | e3 | 活跃 | 3 (168 Hours) | 32 | Matte Tin (Sn) | 8542.39.00.01 | 3V~3.6V | UNSPECIFIED | 250 | 1 | 3.3V | 2.4GHz | 40 | RN41 | R-XXMA-N32 | 3.3V | UART, USB | 300kbps | Bluetooth v2.1 +EDR, Class 1 | 电信电路 | 16dBm | Bluetooth | Integrated, Chip | SPI, UART, USB | 35mA | 65mA | FHSS, GFSK | -80 dBm | 2mm | 25.8mm | 13.4mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||
![]() | BGM11S22F256GA-V2R | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | Module | -40°C~85°C | Tape & Reel (TR) | 蓝壁虎 | 活跃 | 3 (168 Hours) | 8542.39.00.01 | 1.85V~3.8V | 2.4GHz | 256kB Flash 32kB RAM | 1Mbps | EFR32BG | Bluetooth v4.2 | 电信电路 | 3dBm | Bluetooth | Integrated, Chip | -90dBm | I2C, SPI, UART | 8.7mA | 8.2mA | GFSK | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | ATBTLC1000-ZR110CA | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 19 Weeks | 表面贴装 | Module | YES | -40°C~85°C | Tray | 2016 | 活跃 | 3 (168 Hours) | 35 | 1.8V~4.3V | UNSPECIFIED | 无铅 | 1 | 3.6V | 2.4GHz | ATBTLC1000 | R-XXMA-N35 | I2C, SPI, UART | 1 Mbps | Bluetooth v4.1 | 电信电路 | 3.5dBm | Bluetooth | Integrated, Chip | -95dBm | 1 | I2C, SPI, UART | 4.2mA | 3mA | 26 | 1.868mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
![]() | RN4871-I/RM128 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 17 Weeks | 表面贴装 | Module | NO | Industrial grade | -40°C~85°C | Tray | 2018 | 活跃 | 3 (168 Hours) | 16 | 1.9V~3.6V | UNSPECIFIED | 无铅 | 1 | 3.3V | 1.2mm | 2.4GHz | RN4871 | R-XXMA-N16 | 10kbps | Bluetooth v5.0 | 电信电路 | 0dBm | Bluetooth | Integrated, Chip | -90dBm | I2C, SPI, UART | 13mA | GFSK | 1.2.8 | 2.1mm | 11.5mm | 9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||
![]() | RN52-I/RM | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 50-SMD Module | YES | 50 | -40°C~85°C | Tray | 2009 | 活跃 | 3 (168 Hours) | 50 | 3V~3.6V | QUAD | 无铅 | 未说明 | 1 | 30mA | 2.4GHz | 未说明 | RN52 | 3.6V | 3V | SPI, UART, USB | 16MB Flash | 3Mbps | Bluetooth v3.0, Class 2 | 4dBm | Bluetooth | Integrated, Trace | 消费电路 | AIO, I2S, SPI, UART, USB | DPSK, DQPSK, GFSK | -85 dBm | 1.1 | 2.7mm | 26mm | 12.75mm | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||
![]() | MRF24WN0MA-I/RM100 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 表面贴装 | 37-SMD Module | 37 | Automotive grade | -40°C~85°C | Tray | 2016 | yes | 活跃 | 1 (Unlimited) | 37 | 3.15V~3.45V | UNSPECIFIED | 无铅 | 1 | 3.3V | 2.4GHz | MRF24WN0M | 3.3V | 13 | 54Mbps | 802.11b/g/n | TS 16949 | 电信电路 | 20.7dBm | WiFi | Integrated, Trace | SPI | 61mA~73mA | 196mA~248mA | BPSK, CCK, DSSS, QAM, QPSK | -94 dBm | 1.0.0 | 2.286mm | 26.67mm | 17.78mm | 无SVHC | ROHS3 Compliant | 无铅 |