类别是'嵌入式 - 微处理器'
嵌入式 - 微处理器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 底架 | 包装/外壳 | 表面安装 | 引脚数 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 速度 | 内存大小 | uPs/uCs/外围ICs类型 | 核心处理器 | 时钟频率 | 电源电流-最大值 | 位元大小 | 访问时间 | 数据总线宽度 | 定时器/计数器的数量 | 地址总线宽度 | 最高频率 | 边界扫描 | 低功率模式 | 外部数据总线宽度 | 格式 | 集成缓存 | 内存(字) | 电压 - I/O | 以太网 | 核数/总线宽度 | 图形加速 | 内存控制器 | USB | 附加接口 | 协处理器/DSP | 核数量 | 外部中断数量 | 保安功能 | 显示和界面控制器 | DMA通道数 | 萨塔 | SPI,SPI | 设备核心 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |||||||||||||||||||
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![]() | MCIMX6Q4AVT08ADR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 624-FBGA, FCBGA | -40°C~125°C TJ | Tape & Reel (TR) | 2002 | i.MX6Q | 活跃 | 3 (168 Hours) | 852MHz | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 4 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MCIMX6D4AVT10ADR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 624-FBGA, FCBGA | -40°C~125°C TJ | Tape & Reel (TR) | 2002 | i.MX6D | 活跃 | 3 (168 Hours) | 1.0GHz | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPC8545EVJATGD | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 783-BBGA, FCBGA | 0°C~105°C TA | Tray | 2011 | MPC85xx | 活跃 | 3 (168 Hours) | 1.2GHz | PowerPC e500 | 1.8V 2.5V 3.3V | 10/100/1000Mbps (4) | 1 Core 32-Bit | 无 | DDR, DDR2, SDRAM | DUART, I2C, PCI, RapidIO | Signal Processing; SPE, Security; SEC | Cryptography, Random Number Generator | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPC850CVR50BU | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 256-BBGA | YES | -40°C~95°C TA | Tray | 2004 | MPC8xx | e1 | Obsolete | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1.27mm | 40 | MPC850 | S-PBGA-B256 | 3.6V | 3.3V | 3V | 50MHz | MICROPROCESSOR, RISC | 32 | 26 | YES | YES | 32 | 固定点 | YES | 3.3V | 10Mbps (1) | 1 Core 32-Bit | 无 | DRAM | USB 1.x (1) | HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART | Communications; CPM | 2.54mm | 23mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | P1010PSE5FFA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 425-FBGA | 0°C~105°C TA | Bulk | 2011 | QorIQ P1 | Obsolete | 3 (168 Hours) | P1010 | 1.0GHz | PowerPC e500v2 | 10/100/1000Mbps (3) | 1 Core 32-Bit | 无 | DDR3, DDR3L | USB 2.0 + PHY (1) | CAN, DUART, I2C, MMC/SD, SPI | Security; SEC 4.4 | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | SATA 3Gbps (2) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MC7448HX1250ND | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 360-BCBGA, FCCBGA | YES | 0°C~105°C TA | Tray | 1994 | MPC74xx | e0 | 活跃 | 1 (Unlimited) | 360 | 3A991.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.1V | 1.27mm | 40 | MC7448 | S-CBGA-B360 | 1.15V | 1.31.8/2.5V | 1.05V | 1.25GHz | MICROPROCESSOR, RISC | PowerPC G4 | 1250MHz | 32 | NO | YES | 固定点 | NO | 1.5V 1.8V 2.5V | 1 Core 32-Bit | 无 | Multimedia; SIMD | 2.8mm | 25mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | P2041NSN1NNB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 780-BBGA, FCBGA | 0°C~105°C TA | Tray | 2012 | QorIQ P2 | Obsolete | 3 (168 Hours) | P2041 | 1.3GHz | PowerPC e500mc | 1.0V 1.35V 1.5V 1.8V 2.5V 3.3V | 10/100/1000Mbps (5), 10Gbps (1) | 4 Core 32-Bit | 无 | DDR3, DDR3L | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, RapidIO, SPI | SATA 3Gbps (2) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | LS1043AXE8MQB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 780-FBGA, FCBGA | -40°C~105°C | Tray | 2014 | QorIQ® Layerscape | 活跃 | 3 (168 Hours) | 1.2GHz | ARM® Cortex®-A53 | 1GbE (7) or 10GbE (1) & 1GbE (5) | 4 Core 64-Bit | DDR3L, DDR4 | USB 3.0 (3) + PHY | Secure Boot, TrustZone® | SATA 6Gbps (1) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | T4240NSE7PQB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 1932-BBGA, FCBGA | YES | 0°C~105°C TA | Bulk | 2002 | QorIQ T4 | yes | 活跃 | 3 (168 Hours) | BOTTOM | BALL | 250 | 1.025V | 1mm | S-PBGA-B1932 | 1.055V | 0.995V | 1.8GHz | MICROPROCESSOR, RISC | PowerPC e6500 | 133.3MHz | 16 | YES | YES | 64 | 固定点 | YES | 1Gbps (16), 10Gbps (4) | 12 Core 64-Bit | 无 | DDR3, DDR3L | USB 2.0 + PHY (2) | I2C, MMC/SD, PCIe, RapidIO, SPI, UART | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | SATA 3Gbps (2) | 3.33mm | 45mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | T4081NSE7PQB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 1932-BBGA, FCBGA | YES | 0°C~105°C | 2002 | QorIQ T4 | 活跃 | 3 (168 Hours) | 3A001.A.3 | 8542.31.00.01 | BOTTOM | BALL | 250 | 1mm | S-PBGA-B1932 | 1.5GHz | MICROPROCESSOR, RISC | PowerPC e6500 | 133.3MHz | 16 | YES | YES | 64 | 固定点 | YES | 1.8V 2.5V | 1Gbps (13), 10Gbps (2) | 4 Core 64-Bit | 无 | DDR3, DDR3L | USB 2.0 + PHY (2) | I2C, MMC/SD, PCIe, RapidIO, SPI, UART | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | SATA 3Gbps (2) | 3.33mm | 45mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | N80C186XL25 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | LCC | 70°C | Bulk | e0 | 68 | 3A001.A.3 | Tin/Lead (Sn/Pb) | DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; NUMERIC COPROCESSOR INTERFACE | 8542.31.00.01 | QUAD | J BEND | 5V | 1.27mm | 25MHz | 68 | S-PQCC-J68 | 不合格 | 5V | COMMERCIAL | 5V | MICROPROCESSOR | 100mA | 16 | 20 | NO | YES | 16 | 固定点 | NO | 0 | 5 | 2 | 4.83mm | 24.2316mm | 24.2316mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | LE80535VC600512.SL8FN | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 479 | 600MHz | 600MHz | 1.004V | 32b | 1 | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | R80C186XL25 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | PLCC | 68 | 25MHz | Bulk | 68 | 3A001.A.3 | 70°C | 0°C | DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; NUMERIC COPROCESSOR INTERFACE | 8542.31.00.01 | QUAD | 5V | 1.27mm | 25MHz | 68 | 5V | 5V | COMMERCIAL | 5V | 5.5V | 4.5V | MICROPROCESSOR | 100mA | 16 | 20 | NO | YES | 16 | 固定点 | NO | 0 | 5 | 2 | 24.13mm | 24.13mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MCIMX6U4AVM08AB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 624-LFBGA | YES | -40°C~125°C TJ | Tray | 2002 | i.MX6DL | e1 | 不用于新设计 | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.35V | 0.8mm | 40 | MCIMX6 | S-PBGA-B624 | 1.5V | 1.275V | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 24MHz | 64 | 16 | YES | YES | 64 | 固定点 | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.6mm | 21mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPC823VR75B2T | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 256-BBGA | 0°C~95°C TA | Tray | 1997 | MPC8xx | Obsolete | 3 (168 Hours) | MPC823 | 75MHz | PowerPC | 3.3V | 10Mbps (1) | 1 Core 32-Bit | 无 | DRAM | USB 1.x (1) | I2C, SMC, SCC, SPI, UART | Communications; RISC CPM | LCD, Video | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | P1011NSN2FFB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 689-BBGA Exposed Pad | YES | 0°C~125°C TA | Tray | 2002 | QorIQ P1 | e2 | 活跃 | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | P1011 | S-PBGA-B689 | 1.05V | 0.95V | 800MHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 32 | YES | YES | 浮点 | YES | 10/100/1000Mbps (3) | 1 Core 32-Bit | 无 | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | 2.46mm | 31mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SCP2207VMU | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 236-LFBGA | YES | -40°C~105°C TA | Tray | 2009 | 活跃 | 3 (168 Hours) | 236 | 5A002.A.1 | 8542.31.00.01 | BOTTOM | BALL | 1V | 0.5mm | SCP2207 | S-PBGA-B236 | 1.1V | 0.9V | 347.5 MHz | MICROPROCESSOR, RISC | ARM926EJ-S | 30MHz | 32 | 13 | YES | YES | 32 | 固定点 | YES | 1.8V 2.5V 3.3V | 1 Core 32-Bit | 无 | DDR, SDRAM | USB 2.0 OTG (1) | AC’97, I2C, I2S, SPI, UART | Cryptography | LCD | 1.34mm | 9mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MC68040FE25A | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 184-BCQFP | 0°C~70°C TA | Tray | 1995 | M680x0 | Obsolete | 1 (Unlimited) | MC68040 | 25MHz | 68040 | 5.0V | 1 Core 32-Bit | 无 | SCI, SPI | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MCIMX6Q4AVT10ACR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 624-FBGA, FCBGA | -40°C~125°C TJ | Tape & Reel (TR) | 2002 | i.MX6Q | e1 | 不用于新设计 | 3 (168 Hours) | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | 260 | 40 | MCIMX6 | 1.0GHz | MICROPROCESSOR | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 4 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPC860ENZQ80D4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 357-BBGA | YES | 0°C~95°C TA | Tray | 1995 | MPC8xx | e0 | 不用于新设计 | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 80MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | 固定点 | YES | 3.3V | 10Mbps (4) | 1 Core 32-Bit | 无 | DRAM | I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | ATSAMA5D28B-CU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 289-LFBGA | YES | -40°C~105°C TA | Tray | SAMA5D2 | Obsolete | 3 (168 Hours) | 289 | 5A992.C | 8542.31.00.01 | BOTTOM | BALL | 1.2V | 0.8mm | ATSAMA5D28 | S-PBGA-B289 | 1.32V | 1.1V | 500MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A5 | 50MHz | 26 | YES | YES | 32 | 浮点 | YES | 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | 有 | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | USB 2.0 + HSIC | I2C, SMC, SPI, UART, USART, QSPI | Multimedia; NEON™ MPE | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keyboard, LCD, Touchscreen | 1.4mm | 14mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPC8379CVRALG | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 689-BBGA Exposed Pad | YES | -40°C~125°C TA | Tray | 2012 | MPC83xx | e2 | Obsolete | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8379 | S-PBGA-B689 | 1.05V | 11.8/2.52.5/3.3V | 0.95V | 667MHz | MICROPROCESSOR | PowerPC e300c4s | 32 | 15 | YES | YES | 64 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | SATA 3Gbps (4) | 2.46mm | 31mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | DF8064101050503S R0W1 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | RISC | 2 | 64 | 1860 | 0 | 0 | 无 | 0 | 0 | BGA | FCBGA | 表面贴装 | 559 | Ball | Compliant | DDR3 | 表面贴装 | 559 | Atom™ Processor N2800 | Tray | Obsolete | 1.86 GHz | 559 | 4 GB | 64 b | 1.86 GHz | 0 | 0 | 2 | 0 | Atom | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | BCM5892PC0KFB266G | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 22 Weeks | 2016 | 活跃 | 1 (Unlimited) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Z8018010VSC | Zilog | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 68-LCC (J-Lead) | 68 | 0°C~70°C TA | Tube | 2006 | Z180 | e0 | Obsolete | 3 (168 Hours) | 68 | Tin/Lead (Sn/Pb) | QUAD | J BEND | 240 | 5V | 10MHz | 20 | 68 | 5V | 5V | 5V | SCI, UART | 64kB | MICROPROCESSOR | Z80180 | 8 | 10 μs | 8b | 2 | 5.0V | 1 Core 8-Bit | 无 | DRAM | ASCI, CSIO, UART | 4.57mm | Non-RoHS Compliant | 含铅 |