类别是'嵌入式 - 微处理器'
嵌入式 - 微处理器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 振荡器类型 | 速度 | 内存大小 | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 位元大小 | 有ADC | DMA 通道 | 数据总线宽度 | 脉宽调制通道 | 数模转换器通道 | 定时器/计数器的数量 | 地址总线宽度 | 核心架构 | 边界扫描 | 低功率模式 | 外部数据总线宽度 | 格式 | 集成缓存 | 内存(字) | 电压 - I/O | 以太网 | 核数/总线宽度 | 图形加速 | 内存控制器 | USB | 附加接口 | 串行I/O数 | 定时器数量 | 协处理器/DSP | 核数量 | 外部中断数量 | 保安功能 | 显示和界面控制器 | 萨塔 | 座位高度(最大) | 长度 | RoHS状态 | 无铅 | |||||
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 | MPC875VR80 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 256-BBGA | YES | 0°C~95°C TA | Tray | 1999 | MPC8xx | e1 | 最后一次购买 | 3 (168 Hours) | 256 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | 30 | MPC875 | S-PBGA-B256 | 1.9V | 1.83.3V | 1.7V | 80MHz | MICROPROCESSOR, RISC | 32 | 32 | YES | YES | 32 | 固定点 | YES | 3.3V | 10Mbps (1), 10/100Mbps (2) | 1 Core 32-Bit | 无 | DRAM | USB 2.0 (1) | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM, Security; SEC | Cryptography | 2.54mm | 23mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
 | MPC8560VT833LB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 784-BBGA, FCBGA | 0°C~105°C TA | Tray | 2002 | MPC85xx | Obsolete | 3 (168 Hours) | MPC8560 | 833MHz | PowerPC e500 | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, SDRAM | I2C, PCI, RapidIO, SPI, TDM, UART | Communications; CPM | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LS1043ASE7MNLB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 621-FBGA, FCBGA | 0°C~105°C | Tray | 2014 | QorIQ® Layerscape | 活跃 | 3 (168 Hours) | 1.2GHz | ARM® Cortex®-A53 | 1GbE (7) or 10GbE (1) & 1GbE (5) | 4 Core 64-Bit | DDR3L, DDR4 | USB 3.0 (3) + PHY | Secure Boot, TrustZone® | SATA 6Gbps (1) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | R7S721031VCFP#AA0 | Renesas Electronics America | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | 208-LQFP | YES | 208 | -40°C~85°C TA | Tray | 2015 | RZ/A1LU | yes | 活跃 | 3 (168 Hours) | 208 | QUAD | 鸥翼 | 1.18V | 0.5mm | 208 | 1.26V | 1.1V | 400MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 13.33MHz | 26 | YES | YES | 32 | 浮点 | YES | 1.2V 3.3V | 10/100Mbps (1), 100Mbps (1) | 1 Core 32-Bit | 有 | SDRAM, SRAM | USB 2.0 (2) | CAN, I2C, IrDA, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | Multimedia; NEON™ MPE | VDC | 1.7mm | 28mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8541ECVTALF | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 783-BBGA, FCBGA | YES | -40°C~105°C TA | Tray | 2002 | MPC85xx | e2 | Obsolete | 3 (168 Hours) | 783 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8541 | R-PBGA-B783 | 1.26V | 1.14V | 667MHz | MICROPROCESSOR, RISC | PowerPC e500 | 166MHz | 32 | 64 | YES | YES | 64 | 浮点 | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, SDRAM | DUART, I2C, PCI | Security; SEC | Cryptography, Random Number Generator | 3.75mm | 29mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
 | MPC745BPX300LE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 255-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2001 | MPC7xx | e0 | Obsolete | 3 (168 Hours) | 255 | 3A991 | 锡铅 | ALSO REQUIRES 2.5V OR 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 245 | 2V | 1.27mm | 30 | MPC745 | S-PBGA-B255 | 2.1V | 1.8V | 300MHz | MICROPROCESSOR, RISC | PowerPC | 100MHz | 32 | 32 | YES | YES | 64 | 浮点 | YES | 2.5V 3.3V | 1 Core 32-Bit | 无 | 2.8mm | 21mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8323VRADDCA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 516-BBGA | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | 活跃 | 3 (168 Hours) | 516 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | S-PBGA-B516 | 1.05V | 0.95V | 266MHz | MICROPROCESSOR, RISC | PowerPC e300c2 | 66.67MHz | 32 | YES | YES | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | Communications; QUICC Engine | 2.55mm | 27mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
| LS1043ASE7QQA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 99 Weeks | 621-FBGA, FCBGA | 0°C~105°C TA | Tray | QorIQ® Layerscape | Obsolete | 3 (168 Hours) | 1.6GHz | ARM® Cortex®-A53 | 1GbE (7) or 10GbE (1) & 1GbE (5) | 4 Core 64-Bit | 无 | DDR3L, DDR4 | USB 3.0 + PHY (3) | eMMC/SD/SDIO, I2C, SPI, UART | ARM TZ, Boot Security | SATA 6Gbps (1) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC7448VU1400ND | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 360-CBGA, FCCBGA | YES | 0°C~105°C TA | Tray | 1994 | MPC74xx | e2 | 活跃 | 1 (Unlimited) | 360 | 3A991.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | 260 | 1.15V | 1.27mm | 40 | MC7448 | S-CBGA-N360 | 1.2V | 1.31.8/2.5V | 1.1V | 1.4GHz | MICROPROCESSOR, RISC | PowerPC G4 | 1400MHz | 32 | NO | YES | 固定点 | NO | 1.5V 1.8V 2.5V | 1 Core 32-Bit | 无 | Multimedia; SIMD | 2.8mm | 25mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8567EVTAQGG | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1023-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2016 | MPC85xx | e2 | Obsolete | 3 (168 Hours) | 5A002.A | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.1V | 1mm | 40 | MPC8567 | S-PBGA-B1023 | 1.155V | 1.11.8/2.52.5/3.3V | 1.045V | 1.0GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 32 | 16 | YES | YES | 64 | 固定点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, DDR2, SDRAM | DUART, HSSI, I2C, PCI, RapidIO, UART | Communications; QUICC Engine, Security; SEC | Cryptography, Random Number Generator | 2.75mm | 33mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
 | MC8641DHX1333JE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 1023-BCBGA, FCCBGA | YES | 0°C~105°C TA | Tray | 2002 | MPC86xx | e0 | Obsolete | 3 (168 Hours) | 3A991.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.05V | 1mm | 30 | MC8641 | S-CBGA-B1023 | 1.1V | 1.11.8/2.52.5/3.3V | 1V | 1.333GHz | MICROPROCESSOR | PowerPC e600 | 1333MHz | 32 | 32 | YES | YES | 32 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (4) | 2 Core 32-Bit | 无 | DDR, DDR2 | DUART, HSSI, I2C, RapidIO | 2.97mm | 33mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||
 | Z8401510FEG | Zilog | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 16 | 0 | 有 | 表面贴装 | 100-QFP | 100 | ROMless | -40°C~100°C TA | Tray | 2002 | Z80 | e3 | yes | 活跃 | 3 (168 Hours) | 100 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 5V | 10MHz | 40 | Z84015 | 100 | 5V | 5V | MICROCONTROLLER | 8 | NO | NO | NO | NO | 16 | NO | YES | 8 | 固定点 | NO | 0 | 5.0V | 1 Core 8-Bit | 无 | 2 | 1 | 2 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||
 | MCIMX257DJM4AR2 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 400-LFBGA | YES | -20°C~70°C TA | Tape & Reel (TR) | 2008 | i.MX25 | e1 | 活跃 | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.45V | 0.8mm | 40 | S-PBGA-B400 | 1.52V | 1.2/1.51.8/3.3V | 1.38V | 400MHz | MICROPROCESSOR | ARM926EJ-S | 24MHz | 32 | 26 | YES | YES | 16 | 固定点 | YES | 2.0V 2.5V 2.7V 3.0V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | 无 | LPDDR, DDR, DDR2 | USB 2.0 + PHY (2) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | Keypad, LCD, Touchscreen | 1.6mm | 17mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
 | BSC9131NSE1KHKB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 26 Weeks | 520-FBGA, FCBGA | YES | 0°C~105°C TA | Bulk | 2002 | QorIQ Qonverge BSC | e1 | Obsolete | 3 (168 Hours) | 520 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1V | 0.8mm | 30 | S-PBGA-B520 | 1.05V | 0.97V | 800MHz | MICROPROCESSOR, RISC | PowerPC e500 | 32 | 16 | YES | YES | 32 | 固定点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR3, DDR3L | USB 2.0 (1) | AIC, DUART, I2C, MMC/SD, SPI, USIM | Signal Processing; SC3850, Security; SEC 4.4 | Boot Security, Cryptography, Random Number Generator | 1.97mm | 21mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
 | MCIMX6Q5EYM12AC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 624-LFBGA, FCBGA | YES | Commercial grade | -20°C~105°C TJ | Tray | 1997 | i.MX6Q | e1 | 不用于新设计 | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | S-PBGA-B624 | 1.2GHz | MICROPROCESSOR | ARM® Cortex®-A9 | 24MHz | 64 | 26 | YES | YES | 64 | 固定点 | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 4 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | 1.6mm | 21mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
.png) | MCIMX6Q7CZK08AD | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 569-LFBGA | YES | -40°C~105°C TA | Tray | 2002 | i.MX6Q | e1 | 活跃 | 3 (168 Hours) | 569 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.4V | 0.4mm | 40 | S-PBGA-B569 | 1.5V | 1.275V | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 26 | YES | YES | 32 | 固定点 | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 4 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | 1.25mm | 12mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
 | P2040NSN7FLC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 780-FCPBGA (23x23) | 0°C~105°C TA | Tray | 2006 | QorIQ P2 | 活跃 | 3 (168 Hours) | P2040 | 667MHz | PowerPC e500mc | 1.0V 1.35V 1.5V 1.8V 2.5V 3.3V | 10/100/1000Mbps (5) | 4 Core 32-Bit | 无 | DDR3, DDR3L | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, RapidIO, SPI | SATA 3Gbps (2) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC8640THX1067NE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 994-BCBGA, FCCBGA | YES | -40°C~105°C TA | Tray | 2002 | MPC86xx | e0 | Obsolete | 3 (168 Hours) | 1023 | 3A991.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 0.95V | 1mm | 30 | MC8640 | S-CBGA-B1023 | 1V | 11.8/2.52.5/3.3V | 0.9V | 1.067GHz | MICROPROCESSOR | PowerPC e600 | 166.66MHz | 32 | 32 | YES | YES | 32 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (4) | 1 Core 32-Bit | 无 | DDR, DDR2 | DUART, HSSI, I2C, RapidIO | 2.97mm | 33mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||
| MPC8323VRAFDCA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 516-BBGA | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | 活跃 | 3 (168 Hours) | 516 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | S-PBGA-B516 | 1.05V | 0.95V | 333MHz | MICROPROCESSOR, RISC | PowerPC e300c2 | 66.67MHz | 32 | YES | YES | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | Communications; QUICC Engine | 2.55mm | 27mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
| MPC8247VRTMFA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 516-BBGA | YES | 57 | 0°C~105°C TA | Tray | 1994 | MPC82xx | e2 | 活跃 | 3 (168 Hours) | 516 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.5V | 1mm | 30 | MPC8247 | S-PBGA-B516 | 1.575V | 1.53.3V | 1.425V | 400MHz | MICROCONTROLLER, RISC | PowerPC G2_LE | 66.7MHz | 32 | NO | YES | NO | 30 | 64 | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | 无 | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | 27mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
 | P1022NSN2LFB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 689-BBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 2002 | QorIQ P1 | e2 | 活跃 | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | P1022 | S-PBGA-B689 | 1.05V | 0.95V | 1.055GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 133MHz | 32 | 16 | YES | YES | 64 | 浮点 | YES | 10/100/1000Mbps (2) | 2 Core 32-Bit | 无 | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, I2S, MMC/SD, SPI | LCD | SATA 3Gbps (2) | 2.46mm | 31mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
| MPC8555CVTAJD | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 783-BBGA, FCBGA | YES | -40°C~105°C TA | Tray | 2002 | MPC85xx | e2 | Obsolete | 3 (168 Hours) | 783 | 5A992 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8555 | S-PBGA-B783 | 1.26V | 1.14V | 533MHz | MICROPROCESSOR, RISC | PowerPC e500 | 166MHz | 32 | 64 | YES | YES | 64 | 浮点 | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, SDRAM | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | Communications; CPM | 3.75mm | 29mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
 | LS1020AXN7HNB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 525-FBGA, FCBGA | YES | -40°C~105°C | Tray | 2002 | QorIQ® Layerscape | 活跃 | 3 (168 Hours) | 525 | 3A991.A.1 | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 40 | S-PBGA-B525 | 1.03V | 0.97V | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A7 | 133.3MHz | 32 | 16 | YES | YES | 32 | 浮点 | YES | GbE (3) | 2 Core 32-Bit | DDR3L, DDR4 | USB 2.0 (1), USB 3.0 + PHY | Multimedia; NEON™ SIMD | Secure Boot, TrustZone® | SATA 3Gbps (1) | 2.07mm | 19mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
 | AT91SAM9CN12B-CFU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 105 | 有 | 32kB | Copper, Silver, Tin | 表面贴装 | 247-LFBGA | 217 | 205.307246mg | L1 Cache, ROM, SRAM | -40°C~85°C TA | Tray | 2004 | SAM9CN | e1 | yes | 活跃 | 3 (168 Hours) | 247 | 锡银铜 | BOTTOM | BALL | 1V | 0.5mm | 400MHz | AT91SAM9CN | 2-Wire, EBI/EMI, I2C, SPI, Serial, UART, USART, USB | 1.1V | 900mV | Internal | 128kB | MICROPROCESSOR, RISC | ARM926EJ-S | DMA, LCD, POR, PWM, WDT | 32 | 32b | 2 | 26 | ARM | YES | YES | 固定点 | YES | 1.8V 3.3V | 1 Core 32-Bit | 无 | LPDDR, LPDDR2, DDR2, SDR, SRAM | USB 2.0 (2) | EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART | 1 | LCD, Touchscreen | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||
 | MPC860PVR50D4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 357-BBGA | YES | 0°C~95°C TA | Tray | 1995 | MPC8xx | e1 | 不用于新设计 | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | 固定点 | YES | 3.3V | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | 无 | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | ROHS3 Compliant |