类别是'嵌入式 - 微处理器'
嵌入式 - 微处理器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 速度 | 内存大小 | uPs/uCs/外围ICs类型 | 核心处理器 | 时钟频率 | 位元大小 | 数据总线宽度 | 定时器/计数器的数量 | 地址总线宽度 | 核心架构 | 边界扫描 | 低功率模式 | 外部数据总线宽度 | 格式 | 集成缓存 | 内存(字) | 电压 - I/O | UART 通道数 | 以太网 | 核数/总线宽度 | 图形加速 | 内存控制器 | USB | 附加接口 | 协处理器/DSP | 总线兼容性 | 保安功能 | 显示和界面控制器 | 萨塔 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | RoHS状态 | 无铅 | ||||
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 | MPC755CRX400LE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 360-BCBGA, FCCBGA | YES | 0°C~105°C TA | Tray | 2001 | MPC7xx | e0 | Obsolete | 1 (Unlimited) | 360 | 3A991 | 锡铅 | ALSO REQUIRES 2.5V OR 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 220 | 2V | 1.27mm | 30 | MPC755 | S-CBGA-B360 | 2.1V | 1.9V | 400MHz | MICROPROCESSOR, RISC | PowerPC | 100MHz | 32 | 32 | YES | YES | 64 | 浮点 | YES | 2.5V 3.3V | 1 Core 32-Bit | 无 | 3.2mm | 25mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||
 | ATSAMA5D26B-CU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 19 Weeks | 289-LFBGA | -40°C~85°C TA | Bulk | 2016 | SAMA5D2 | yes | Obsolete | 3 (168 Hours) | ATSAMA5D26 | 500MHz | ARM® Cortex®-A5 | 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | 有 | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | USB 2.0 + HSIC | I2C, SMC, SPI, UART, USART, QSPI | Multimedia; NEON™ MPE | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keyboard, LCD, Touchscreen | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8321ZQADDC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 516-BBGA | 0°C~105°C TA | Tray | 2004 | MPC83xx | Obsolete | 3 (168 Hours) | MPC8321 | 266MHz | PowerPC e300c2 | 1.8V 2.5V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | Communications; QUICC Engine | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC9328MXLDVM20 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 26 Weeks | 256-LFBGA | -30°C~70°C TA | Tray | 1994 | i.MXL | 不用于新设计 | 3 (168 Hours) | MC9328MXL | 200MHz | ARM920T | 1.8V 3.0V | 1 Core 32-Bit | 无 | SDRAM | USB 1.x (1) | I2C, I2S, SPI, SSI, MMC/SD, UART | LCD | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC885CZP66 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 357-BBGA | YES | -40°C~100°C TA | Tray | 1999 | MPC8xx | e0 | Obsolete | 3 (168 Hours) | 357 | 5A002.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | 30 | MPC885 | S-PBGA-B357 | 1.9V | 1.83.3V | 1.7V | 66MHz | MICROPROCESSOR, RISC | 32 | 32 | YES | YES | 32 | 固定点 | YES | 3.3V | 10Mbps (3), 10/100Mbps (2) | 1 Core 32-Bit | 无 | DRAM | USB 2.0 (1) | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM, Security; SEC | Cryptography | 2.52mm | 25mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||
 | P1010NSE5DFB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 425-FBGA | YES | 0°C~105°C TA | Tray | 2002 | QorIQ P1 | 活跃 | 3 (168 Hours) | 425 | 8542.31.00.01 | 1V | P1010 | 1V | 1.0GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 32 | 10/100/1000Mbps (3) | 1 Core 32-Bit | 无 | DDR3, DDR3L | USB 2.0 + PHY (1) | CAN, DUART, I2C, MMC/SD, SPI | Security; SEC 4.4 | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | SATA 3Gbps (2) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | EE80C186XL12 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | PLCC | 68 | 12MHz | Bulk | 70°C | 0°C | 12MHz | 5V | 5V | 5.5V | 4.5V | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AM3892BCYG120 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Copper, Silver, Tin | 1031-BFBGA, FCBGA | YES | 1031 | 64 | 0°C~95°C TJ | Tray | Sitara™ | e1 | yes | Obsolete | 4 (72 Hours) | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1V | 0.65mm | 1.2GHz | AM3892 | 1V | 1.05V | I2C, SPI, Serial, UART | 1.05V | 950mV | 1200 MHz | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 16b | 7 | 16 | ARM | YES | YES | 浮点 | YES | 1.8V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 有 | DDR2, DDR3 | USB 2.0 + PHY (2) | I2C, McASP, McBSP, SPI, SD/SDIO, UART | Multimedia; NEON™ SIMD | HDMI, HDVPSS | SATA 3Gbps (1) | 3.31mm | 25mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||
 | T1022NSN7PQB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 780-FBGA, FCBGA | YES | 0°C~105°C TA | Bulk | 2014 | QorIQ T1 | 活跃 | 3 (168 Hours) | 780 | 3A991.A.1 | 8542.31.00.01 | BOTTOM | BALL | 250 | 1V | 0.8mm | S-PBGA-B780 | 1.03V | 0.97V | 1.4GHz | MICROPROCESSOR, RISC | PowerPC e5500 | 133.3MHz | 32 | 16 | YES | YES | 64 | 固定点 | YES | 1Gbps (5) | 2 Core 64-Bit | 无 | DDR3L/4 | USB 2.0 + PHY (2) | I2C, MMC/SD, PCIe, SPI, UART | SATA 3Gbps (2) | 2.07mm | 23mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
 | MPC8308CZQAFDA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 473-LFBGA | -40°C~105°C TA | Tray | 2002 | MPC83xx | e0 | 活跃 | 3 (168 Hours) | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | 260 | 40 | MPC8308 | 333MHz | MICROPROCESSOR, RISC | PowerPC e300c3 | 1.8V 2.5V 3.3V | 10/100/1000Mbps (3) | 1 Core 32-Bit | 无 | DDR2 | USB 2.0 (1) | DUART, HSSI, I2C, MMC/SD/SDIO, SPI | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8313EVRAGDC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 516-BBGA Exposed Pad | YES | 105°C | Tray | 2002 | e2 | 活跃 | 3 (168 Hours) | 516 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8313 | S-PBGA-B516 | 不合格 | 1.05V | 11.8/2.53.3V | OTHER | 0.95V | 400 MHz | MICROPROCESSOR, RISC | 32 | 15 | YES | YES | 32 | 浮点 | YES | 2.55mm | 27mm | 27mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
| MPC8321VRAFDC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 516-BBGA | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | Obsolete | 3 (168 Hours) | 516 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8321 | S-PBGA-B516 | 1.05V | 0.95V | 333MHz | MICROPROCESSOR, RISC | PowerPC e300c2 | 66.67MHz | 32 | YES | YES | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | Communications; QUICC Engine | 2.55mm | 27mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
 | LS1024ASN7MLA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 625-BFBGA, FCBGA | YES | 0°C~70°C TA | Tray | 2015 | QorIQ® Layerscape | 活跃 | 3 (168 Hours) | 625 | BOTTOM | BALL | 1.13V | 0.8mm | S-PBGA-B625 | 1.164V | 1.096V | 1.2GHz | 多功能外围设备 | ARM® Cortex®-A9 | 1200MHz | 26 | YES | GbE (3) | 2 Core 32-Bit | DDR3 | USB 2.0 + PHY (1), USB 3.0 + PHY | Secure Boot, TrustZone® | SATA 3Gbps (2) | 2.67mm | 21mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MPC855TCZQ50D4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 357-BBGA | YES | -40°C~95°C TA | Tray | 1997 | MPC8xx | e0 | 不用于新设计 | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC855 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | 固定点 | YES | 3.3V | 10Mbps (1), 10/100Mbps (1) | 1 Core 32-Bit | 无 | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||
 | MPC850DSLZQ50BU | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 256-BBGA | YES | 0°C~95°C TA | Tray | 1997 | MPC8xx | e0 | Obsolete | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1.27mm | 40 | MPC850 | S-PBGA-B256 | 3.6V | 3.3V | 3V | 50MHz | MICROPROCESSOR, RISC | 32 | 26 | YES | YES | 32 | 固定点 | YES | 3.3V | 10Mbps (1) | 1 Core 32-Bit | 无 | DRAM | USB 1.x (1) | HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART | Communications; CPM | 2.54mm | 23mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||
 | P1024NXE5DFB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 561-FBGA | 561-TEPBGA I (23x23) | -40°C~125°C TA | Tray | 2002 | QorIQ P1 | 活跃 | 3 (168 Hours) | P1024 | 667MHz | PowerPC e500v2 | 10/100/1000Mbps (3) | 2 Core 32-Bit | 无 | DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | Security; SEC 3.3 | Cryptography, Random Number Generator | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8536AVJATHA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 783-BBGA, FCBGA | YES | 0°C~90°C TA | Tray | 2002 | MPC85xx | 活跃 | 3 (168 Hours) | 783 | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | S-PBGA-B783 | 1.05V | 0.95V | 1.25GHz | MICROPROCESSOR | PowerPC e500 | 32 | 16 | YES | YES | 64 | 固定点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR2, DDR3 | USB 2.0 (3) | DUART, I2C, MMC/SD, PCI, SPI | SATA 3Gbps (2) | 2.76mm | 29mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
 | MPC8572CLVJAULE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 1023-BBGA, FCBGA | -40°C~105°C TA | Tray | 1998 | MPC85xx | yes | 活跃 | 3 (168 Hours) | 245 | 30 | MPC8572 | 1.333GHz | MICROPROCESSOR | PowerPC e500 | 1.5V 1.8V 2.5V 3.3V | 10/100/1000Mbps (4) | 2 Core 32-Bit | 无 | DDR2, DDR3 | DUART, HSSI, I2C, RapidIO | Signal Processing; SPE | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AM3715CBC | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 64kB | NRND (Last Updated: 3 days ago) | 515-VFBGA, FCBGA | YES | 515 | ROM | 0°C~90°C TJ | Tray | Sitara™ | e1 | yes | 不用于新设计 | 3 (168 Hours) | 515 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.1V | 0.5mm | 800MHz | AM3715 | 515 | 1.1V | 1.8V | I2C, SPI, UART, USB | 1.5V | 32kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 32b | ARM | YES | YES | 浮点 | YES | 65536 | 4 | 1 Core 32-Bit | 有 | SDRAM | USB 2.0 (4) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | LCD | 950μm | 14mm | 14mm | 630μm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||
 | MPC8349VVAJDB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 672-LBGA | YES | 105°C | Tray | 2002 | e2 | 活跃 | 3 (168 Hours) | 672 | 3A991.A.2 | TIN COPPER/TIN SILVER | ALSO REQUIRES 2.5V AND 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8349 | S-PBGA-B672 | 不合格 | 1.26V | 1.21.8/2.52.5/3.3V | OTHER | 1.14V | 533 MHz | MICROPROCESSOR | 66MHz | 32 | 32 | YES | YES | 32 | 浮点 | YES | 1.69mm | 35mm | 35mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
 | ATSAMA5D22C-CUR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 196-TFBGA, CSBGA | YES | -40°C~85°C TA | Cut Tape (CT) | 2017 | SAMA5D2 | e2 | 活跃 | 3 (168 Hours) | 196 | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) | 8542.31.00.01 | BOTTOM | BALL | 1.2V | 0.75mm | ATSAMA5D22 | S-PBGA-B196 | 1.32V | 1.1V | 500MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A5 | 24MHz | 26 | YES | YES | 16 | 浮点 | YES | 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | 有 | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | USB 2.0 + HSIC | I2C, SMC, SPI, UART, USART, QSPI | Multimedia; NEON™ MPE | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keyboard, LCD, Touchscreen | 1.2mm | 11mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
 | MC9328MX21CJMR2 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 289-LFBGA | YES | -40°C~85°C TA | Tape & Reel (TR) | 2006 | i.MX21 | e1 | 不用于新设计 | 3 (168 Hours) | 289 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 0.8mm | 40 | MC9328MX21 | S-PBGA-B289 | 1.65V | 1.45V | 266MHz | MICROPROCESSOR | ARM926EJ-S | 32MHz | 32 | 26 | YES | YES | 32 | 固定点 | YES | 1.8V 3.0V | 1 Core 32-Bit | 无 | SDRAM | USB 1.x (2) | 1-Wire, I2C, I2S, SPI, SSI, MMC/SD, UART | Keypad, LCD | 1.6mm | 17mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
.png) | MCIMX6Q6AVT08AE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 624-FBGA, FCBGA | YES | 32 | -40°C~125°C TJ | Tray | 2002 | i.MX6Q | 活跃 | 3 (168 Hours) | 624 | 8542.39.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | S-PBGA-B624 | 1.5V | 1.225V | 852MHz | ARM® Cortex®-A9 | 16 | YES | 64 | 272K | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 4 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | 2.16mm | 21mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
 | MPC8255AZUPIBB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 480-LBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 1997 | MPC82xx | e0 | Obsolete | 3 (168 Hours) | 480 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 220 | 2V | 1.27mm | 30 | PC8255 | S-PBGA-B480 | 2.2V | 1.9V | 300MHz | MICROPROCESSOR, RISC | PowerPC G2 | 66.66MHz | 32 | 32 | YES | NO | 64 | 浮点 | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | 无 | DRAM, SDRAM | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | 1.65mm | 37.5mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||
 | XPC8240LZU200E | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 352-LBGA | 0°C~105°C TA | Tray | 2001 | MPC82xx | Obsolete | 3 (168 Hours) | 8542.31.00.01 | PC8240 | 200MHz | MICROPROCESSOR, RISC | PowerPC 603e | 3.3V | 1 Core 32-Bit | 无 | DRAM, SDRAM | I2C, I2O, PCI, UART | Non-RoHS Compliant |