类别是'嵌入式 - 微处理器'
嵌入式 - 微处理器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 底架 | 包装/外壳 | 表面安装 | 引脚数 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 电压 | 界面 | 内存大小 | 电源电流 | 速度 | 内存大小 | uPs/uCs/外围ICs类型 | 核心处理器 | 时钟频率 | 位元大小 | 数据总线宽度 | 定时器/计数器的数量 | 地址总线宽度 | 边界扫描 | 低功率模式 | 外部数据总线宽度 | 格式 | 集成缓存 | 内存(字) | 电压 - I/O | 以太网 | 核数/总线宽度 | 图形加速 | 内存控制器 | USB | 附加接口 | 协处理器/DSP | 总线兼容性 | 桶式移位器 | 内部总线架构 | 保安功能 | 显示和界面控制器 | DMA通道数 | 萨塔 | 座位高度(最大) | 长度 | RoHS状态 | 无铅 | |||
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 | MCIMX6G1AVM07AB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 289-LFBGA | YES | -40°C~125°C TJ | Tray | 2002 | i.MX6UL | 活跃 | 3 (168 Hours) | 289 | 5A992 | 8542.31.00.01 | BOTTOM | BALL | 0.8mm | S-PBGA-B289 | 1.3V | 1.25V | 696MHz | MICROPROCESSOR | ARM® Cortex®-A7 | 26 | YES | YES | 16 | 固定点 | YES | 1.2V 1.35V 1.5V 1.8V 2.5V 2.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | 无 | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | LVDS | 1.32mm | 14mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||
 | MC68302AG16C | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 144-LQFP | 0°C~70°C TA | Tray | 1995 | M683xx | 不用于新设计 | 3 (168 Hours) | MC68302 | 16MHz | M68000 | 5.0V | 1 Core 8/16-Bit | 无 | DRAM | GCI, IDL, ISDN, NMSI, PCM, SCPI | Communications; RISC CPM | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8313ECVRADDC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 516-BBGA Exposed Pad | YES | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | 活跃 | 3 (168 Hours) | 516 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8313 | S-PBGA-B516 | 1.05V | 11.8/2.53.3V | 0.95V | 267MHz | MICROPROCESSOR, RISC | PowerPC e300c3 | 32 | 15 | YES | YES | 32 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI | Security; SEC 2.2 | Cryptography | 2.55mm | 27mm | ROHS3 Compliant | |||||||||||||||||||||||||||||
 | MCIMX6G2DVK05AA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 272-LFBGA | YES | 0°C~95°C TJ | Tray | 2015 | i.MX6UL | Obsolete | 3 (168 Hours) | 272 | 5A992 | 8542.31.00.01 | BOTTOM | BALL | 0.5mm | S-PBGA-B272 | 1.5V | 1.275V | 528MHz | MICROPROCESSOR | ARM® Cortex®-A7 | 16 | YES | YES | 16 | 固定点 | YES | 1.2V 1.35V 1.5V 1.8V 2.5V 2.8V 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | 无 | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | LCD, LVDS | 1.23mm | 9mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||
 | MC68LC302AF16VCT | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 100-LQFP | 0°C~70°C TA | Tray | 1995 | M683xx | e3 | 不用于新设计 | 3 (168 Hours) | 3A991.A.2 | Tin (Sn) | 8542.31.00.01 | 260 | 40 | MC68LC302 | 16MHz | MICROCONTROLLER, RISC | M68000 | 3.3V | 1 Core 8/16-Bit | 无 | DRAM | GCI, IDL, ISDN, NMSI, PCM, SCPI | Communications; RISC CPM | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| MPC8313CVRAFF | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 516-BBGA Exposed Pad | YES | -40°C~105°C TA | Tray | 2008 | MPC83xx | e2 | Obsolete | 3 (168 Hours) | 516 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8313 | S-PBGA-B516 | 1.5V | 0.95V | 333MHz | MICROPROCESSOR | PowerPC e300c3 | 66.67MHz | 32 | 32 | YES | YES | 32 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI | 2.55mm | 27mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||
 | MPC8548EVTAUJB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 783-BBGA, FCBGA | 0°C~105°C TA | Tray | 2007 | MPC85xx | Obsolete | 3 (168 Hours) | MPC8548 | 1.333GHz | PowerPC e500 | 1.8V 2.5V 3.3V | 10/100/1000Mbps (4) | 1 Core 32-Bit | 无 | DDR, DDR2, SDRAM | DUART, I2C, PCI, RapidIO | Signal Processing; SPE, Security; SEC | Cryptography, Random Number Generator | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MCIMX6Q4AVT08AC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 624-FBGA, FCBGA | YES | Automotive grade | -40°C~125°C TJ | Tray | 2002 | i.MX6Q | e1 | 不用于新设计 | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.4V | 0.8mm | 40 | MCIMX6 | S-PBGA-B624 | 1.5V | 1.225V | 852MHz | MICROPROCESSOR | ARM® Cortex®-A9 | 16 | YES | YES | 64 | 固定点 | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 4 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | 2.16mm | 21mm | ROHS3 Compliant | |||||||||||||||||||||||||||||
 | MPC8377VRAJF | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 689-BBGA Exposed Pad | YES | 0°C~125°C TA | Tray | 2006 | MPC83xx | e2 | Obsolete | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8377 | S-PBGA-B689 | 1.05V | 11.8/2.52.5/3.3V | 0.95V | 533MHz | MICROPROCESSOR | PowerPC e300c4s | 32 | 15 | YES | YES | 64 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | SATA 3Gbps (2) | 2.46mm | 31mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||
 | MPC8572ECVJAULE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 1023-BBGA, FCBGA | YES | -40°C~105°C TA | Box | 1998 | MPC85xx | e2 | 活跃 | 3 (168 Hours) | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.1V | 1mm | 30 | MPC8572 | S-PBGA-B1023 | 1.155V | 1.045V | 1.333GHz | MICROPROCESSOR, RISC | PowerPC e500 | 133MHz | 32 | 16 | YES | YES | 64 | 固定点 | YES | 1.5V 1.8V 2.5V 3.3V | 10/100/1000Mbps (4) | 2 Core 32-Bit | 无 | DDR2, DDR3 | DUART, HSSI, I2C, RapidIO | Signal Processing; SPE, Security; SEC | Cryptography, Random Number Generator | 3.38mm | 33mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||
 | MPC8343EVRAGDB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 620-BBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | 活跃 | 3 (168 Hours) | 620 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8343 | S-PBGA-B620 | 1.26V | 1.22.53.3V | 1.14V | 400MHz | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | 32 | YES | YES | 32 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (3) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | Security; SEC | Cryptography, Random Number Generator | 2.46mm | 29mm | ROHS3 Compliant | ||||||||||||||||||||||||||||
 | MPC745CPX350LE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 255-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2001 | MPC7xx | e0 | Obsolete | 3 (168 Hours) | 255 | 3A991.A.1 | Tin/Lead (Sn/Pb) | ALSO REQUIRES 2.5V OR 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 245 | 2V | 1.27mm | 30 | MPC745 | S-PBGA-B255 | 2.1V | 1.8V | 350MHz | MICROPROCESSOR, RISC | PowerPC | 100MHz | 32 | 32 | YES | YES | 64 | 浮点 | YES | 2.5V 3.3V | 1 Core 32-Bit | 无 | 2.8mm | 21mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
 | LS1012ASN7KKB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 24 Weeks | 211-VFLGA | 0°C~105°C | Tray | 2016 | QorIQ® Layerscape | 活跃 | 3 (168 Hours) | 1.0GHz | ARM® Cortex®-A53 | GbE (2) | 1 Core 64-Bit | DDR3L | USB 2.0 (1), USB 3.0 + PHY | Secure Boot, TrustZone® | SATA 6Gbps (1) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | P1014NSE5HFA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 425-FBGA | YES | 0°C~105°C TA | Tray | 2010 | QorIQ P1 | e2 | Obsolete | 3 (168 Hours) | 425 | 5A002.A | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 40 | P1014 | S-PBGA-B425 | 1.05V | 0.95V | 800MHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 32 | YES | YES | 浮点 | YES | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR3, DDR3L | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, SPI | Security; SEC 4.4 | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | SATA 3Gbps (2) | 1.9mm | 19mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||
 | MPC8321EVRADDCA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 516-BBGA | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | 活跃 | 3 (168 Hours) | 516 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | S-PBGA-B516 | 1.05V | 0.95V | 266MHz | MICROPROCESSOR, RISC | PowerPC e300c2 | 66.67MHz | 32 | YES | YES | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | Communications; QUICC Engine, Security; SEC 2.2 | Cryptography | 2.55mm | 27mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||
 | MIMX8MD6CVAHZAA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 621-FBGA, FCBGA | YES | 16 | -40°C~105°C TJ | Tray | i.MX8MD | 不用于新设计 | 3 (168 Hours) | 621 | BOTTOM | BALL | 260 | 1V | 0.65mm | compliant | 未说明 | S-PBGA-B621 | 1.05V | 0.9V | 1.3GHz | ARM® Cortex®-A53 | 40MHz | YES | 160K | GbE | 2 Core 32-Bit | 有 | DDR3L, DDR4, LPDDR4 | USB 3.0 (2) | EBI/EMI, I2C, PCIe, SPI, UART, uSDHC | ARM® Cortex®-M4 | ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB | ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS | eDP, HDMI, MIPI-CSI, MIPI-DSI | 2.18mm | 17mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||
 | MPC860SRZQ66D4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 357-BBGA | YES | 0°C~95°C TA | Tray | 1995 | MPC8xx | e0 | 不用于新设计 | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 66MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | 固定点 | YES | 3.3V | 10Mbps (4) | 1 Core 32-Bit | 无 | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
.png) | MCIMX6D7CVT08AE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 624-FBGA, FCBGA | YES | 14 | -40°C~105°C TA | Tray | 2002 | i.MX6D | 活跃 | 3 (168 Hours) | 624 | 8542.39.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | S-PBGA-B624 | 1.5V | 1.275V | 800MHz | ARM® Cortex®-A9 | 16 | YES | 64 | 272K | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | 2.16mm | 21mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||
 | MPC8250AVVMHBC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 480-LBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 1997 | MPC82xx | e1 | Obsolete | 3 (168 Hours) | 480 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.27mm | 40 | MPC8250 | S-PBGA-B480 | 266MHz | MICROPROCESSOR, RISC | PowerPC G2 | 32 | 32 | YES | NO | 64 | 浮点 | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | 无 | DRAM, SDRAM | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | 1.65mm | 37.5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||
 | MCIMX512CJM6C | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 529-LFBGA | YES | -40°C~95°C TC | Tray | 2008 | i.MX51 | e1 | 活跃 | 3 (168 Hours) | 529 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 40 | MCIMX512 | S-PBGA-B529 | 1.1V | 1.2V | 0.95V | 600MHz | 微处理器电路 | ARM® Cortex®-A8 | 1.2V 1.875V 2.775V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | 无 | LPDDR, DDR2 | USB 2.0 (3), USB 2.0 + PHY (1) | 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keypad, LCD | 1.6mm | 19mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||
| MPC8555ECVTALF | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 783-BBGA, FCBGA | YES | -40°C~105°C TA | Tray | 2002 | MPC85xx | e2 | Obsolete | 3 (168 Hours) | 783 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8555 | S-PBGA-B783 | 1.26V | 1.14V | 667MHz | MICROPROCESSOR, RISC | PowerPC e500 | 166MHz | 32 | 64 | YES | YES | 64 | 浮点 | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, SDRAM | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | Communications; CPM, Security; SEC | Cryptography, Random Number Generator | 3.75mm | 29mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||
 | MCIMX27MJP4A | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 473-LFBGA | YES | -40°C~85°C TA | Tray | 2004 | i.MX27 | e1 | 不用于新设计 | 3 (168 Hours) | 473 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.45V | 0.8mm | 40 | MCIMX27 | S-PBGA-B473 | 不合格 | 1.52V | 1.38V | 400MHz | MICROPROCESSOR | ARM926EJ-S | 26MHz | 32 | 26 | YES | YES | 16 | 固定点 | YES | 2.0V 2.5V 2.7V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | 有 | DDR | USB 2.0 + PHY (3) | 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART | Security; SAHARAH2 | Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory | Keypad, LCD | 1.54mm | 19mm | ROHS3 Compliant | |||||||||||||||||||||||||||
| MPC885ZP133 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 357-BBGA | YES | 0°C~95°C TA | Tray | 1999 | MPC8xx | e0 | Obsolete | 3 (168 Hours) | 357 | 5A002.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | 30 | MPC885 | S-PBGA-B357 | 1.9V | 1.83.3V | 1.7V | 133MHz | MICROPROCESSOR, RISC | 32 | 32 | YES | YES | 32 | 固定点 | YES | 3.3V | 10Mbps (3), 10/100Mbps (2) | 1 Core 32-Bit | 无 | DRAM | USB 2.0 (1) | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM, Security; SEC | Cryptography | 2.52mm | 25mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
 | MC7448HX1267ND | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 360-BCBGA, FCCBGA | YES | 0°C~105°C TA | Tray | 1994 | MPC74xx | e0 | 活跃 | 1 (Unlimited) | 360 | 3A991.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 1.27mm | 40 | MC7448 | S-CBGA-B360 | 1.1V | 1.31.8/2.5V | 1V | 1.267GHz | MICROPROCESSOR, RISC | PowerPC G4 | 1267MHz | 32 | NO | YES | 固定点 | NO | 1.5V 1.8V 2.5V | 1 Core 32-Bit | 无 | Multimedia; SIMD | 2.8mm | 25mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
 | OMAP5912ZZG | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | 250kB | 表面贴装 | 289-TFBGA | 289 | 274.791928mg | FLASH | -40°C~85°C TC | Tray | OMAP-59xx | e1 | 活跃 | 4 (72 Hours) | 289 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.6V | 0.5mm | 192MHz | OMAP5912 | 289 | 3.3V | 1.65V | I2C, MMC, SDIO, UART, USB | 326mA | 24kB | DIGITAL SIGNAL PROCESSOR, MIXED | ARM926EJ-S | 16 | 32b | 6 | 26 | YES | YES | 固定点 | YES | 1.8V 2.75V 3.3V | 1 Core 32-Bit | 无 | LPDDR | USB 1.1 (1), USB 1.x (2) | 1-Wire/HDQ, AC97, I2C, I2S, IrDA, McBSP, MCSI, MICROWIRE, MMC/SD/SDIO, SPI, UART | Signal Processing; C55x, System Control; CP15 | NO | MULTIPLE | Cryptography, Random Number Generator | Keyboard, LCD | 6 | 1.2mm | 12mm | ROHS3 Compliant | 无铅 |