类别是'嵌入式 - 微处理器'
嵌入式 - 微处理器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 制造商包装标识符 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 振荡器类型 | 速度 | 内存大小 | uPs/uCs/外围ICs类型 | 比特数 | 核心处理器 | 周边设备 | 时钟频率 | 位元大小 | 访问时间 | 数据总线宽度 | 定时器/计数器的数量 | 地址总线宽度 | 核心架构 | 最高频率 | 边界扫描 | 低功率模式 | 外部数据总线宽度 | 可编程I/O数 | 格式 | 集成缓存 | 内存(字) | 电压 - I/O | UART 通道数 | ADC通道数量 | 以太网 | 核数/总线宽度 | 图形加速 | 内存控制器 | USB | 附加接口 | 串行I/O数 | 协处理器/DSP | 核数量 | 外部中断数量 | 总线兼容性 | I2C通道数 | 保安功能 | 显示和界面控制器 | SPI 通道数 | DMA通道数 | 萨塔 | 以太网通道数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||||||
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 | AT91SAM9XE512-QU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 96 | 有 | 32kB | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | FLASH, ROM | -40°C~85°C TA | Tray | 1997 | SAM9XE | Obsolete | 3 (168 Hours) | 85°C | -40°C | 180MHz | AT91SAM9XE512 | 3.3V | 2-Wire, EBI/EMI, Ethernet, I2C, I2S, MMC, SPI, UART, USART, USB | 3.6V | 1.65V | Internal | 180MHz | 32kB | ARM926EJ-S | Brown-out Detect/Reset, POR, PWM, WDT | 32b | 6 | ARM | 180MHz | 96 | 1.8V 2.5V 3.3V | 1 | 4 | 10/100Mbps | 1 Core 32-Bit | 无 | SDRAM, SRAM | USB 2.0 (3) | EBI/EMI, I2C, ISI, MMC/SD/SDIO, SPI, SSC, UART/USART | 2 | LCD, Touchscreen | 2 | 1 | 3.6mm | 28mm | 28mm | 无 | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | P2020NSE2MHC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 689-BBGA Exposed Pad | YES | 0°C~125°C TA | Tray | 2002 | QorIQ P2 | 活跃 | 3 (168 Hours) | 689 | BOTTOM | BALL | 1.05V | 1mm | P2020 | S-PBGA-B689 | 1.1V | 1V | 1.2GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 32 | YES | YES | 16 | 浮点 | YES | 10/100/1000Mbps (3) | 2 Core 32-Bit | 无 | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | Security; SEC 3.3 | Cryptography, Random Number Generator | 2.46mm | 31mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | XPC8260VVIHBC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 480-LBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 2004 | MPC82xx | e1 | Obsolete | 3 (168 Hours) | 480 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | 30 | PC8260 | S-PBGA-B480 | 1.9V | 1.7V | 200MHz | MICROPROCESSOR, RISC | PowerPC G2 | 66.66MHz | 32 | 32 | YES | NO | 64 | 浮点 | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | 无 | DRAM, SDRAM | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | 1.65mm | 37.5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MCIMX6Y1CVM05AA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 289-LFBGA | YES | -40°C~105°C TJ | Tray | 2015 | i.MX6 | e1 | Obsolete | 3 (168 Hours) | 289 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 0.8mm | S-PBGA-B289 | 1.5V | 1.275V | 528MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A7 | 528MHz | 16 | YES | 16 | 1.8V 2.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | 无 | LPDDR2, DDR3, DDR3L | USB 2.0 OTG + PHY (2) | CAN, I2C, SPI, UART | 1 | Multimedia; NEON™ MPE | ETHERNET, I2C, PCI, SPI, UART, USB | A-HAB, ARM TZ, CSU, SJC, SNVS | Electrophoretic, LCD | 1.32mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MPC8255AVVMHBB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 480-LBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 1997 | MPC82xx | e1 | Obsolete | 3 (168 Hours) | 480 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.27mm | 40 | PC8255 | S-PBGA-B480 | 2.2V | 1.9V | 266MHz | MICROPROCESSOR, RISC | PowerPC G2 | 66.66MHz | 32 | 32 | YES | NO | 64 | 浮点 | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | 无 | DRAM, SDRAM | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | 1.65mm | 37.5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC860DECZQ50D4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 357-BBGA | YES | -40°C~95°C TA | Tray | 1995 | MPC8xx | e0 | 不用于新设计 | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | 固定点 | YES | 3.3V | 10Mbps (2) | 1 Core 32-Bit | 无 | DRAM | I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AM1806BZCEA3 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Copper, Silver, Tin | 表面贴装 | 361-LFBGA | 361 | -40°C~105°C TJ | Tray | Sitara™ | e1 | Obsolete | 3 (168 Hours) | 361 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 375MHz | AM1806 | 361 | 1.2V | 1.32V | I2C, SPI, UART, USB | 1.32V | 1.14V | 8kB | MICROPROCESSOR, RISC | ARM926EJ-S | 32 | 32b | 23 | ARM | YES | YES | 固定点 | YES | 1.8V 3.3V | 3 | 1 Core 32-Bit | 无 | LPDDR, DDR2 | USB 2.0 + PHY (1) | I2C, McASP, McBSP, SPI, MMC/SD, UART | System Control; CP15 | LCD | 1.4mm | 16mm | ROHS3 Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8347CVVAJFB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 672-LBGA | YES | -40°C~105°C TA | Tray | 2002 | MPC83xx | e1 | 活跃 | 3 (168 Hours) | 672 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8347 | S-PBGA-B672 | 1.26V | 1.2V | 1.14V | 533MHz | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | 32 | YES | YES | 32 | 浮点 | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | 1.69mm | 35mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATSAMA5D43A-CUR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 19 Weeks | 152 | 128kB | Copper, Silver, Tin | 表面贴装 | 289-LFBGA | 289 | L2 Cache, ROM, SRAM | -40°C~85°C TA | Tape & Reel (TR) | 2014 | SAMA5D4 | yes | Obsolete | 3 (168 Hours) | 528MHz | ATSAMA5D43 | 1.8V | 2-Wire, EBI/EMI, Ethernet, I2C, MMC, SD, SPI, UART, USART, USB | 1.98V | 1.62V | Internal | 128kB | ARM® Cortex®-A5 | DMA, LCD, POR, PWM, WDT | 32b | 3 | ARM | 1.2V 1.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | 有 | LPDDR, LPDDR2, DDR2 | USB 2.0 (3) | EBI, I2C, MMC/SD/SDIO, SPI, SSC, UART, USART | Multimedia; NEON™ SIMD | 1 | AES, SHA, TDES, TRNG | LCD, Touchscreen | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png) | N80C188XL12 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | PLCC | 68 | Bulk | 1996 | e0 | Discontinued | 68 | SMD/SMT | Tin/Lead (Sn/Pb) | 70°C | 0°C | DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS | QUAD | J BEND | 5V | 1.27mm | 12MHz | 68 | 不合格 | 5V | 5V | COMMERCIAL | 5V | 5.5V | 4.5V | MICROPROCESSOR | 8 | 16 | 12 μs | 20 | NO | YES | 8 | 固定点 | NO | 0 | 5 | 2 | 24.2316mm | 24.2316mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | T1042NXN7PQB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 780-FBGA, FCBGA | YES | -40°C~105°C TA | Tray | 2006 | QorIQ T1 | 活跃 | 3 (168 Hours) | 780 | 3A991.A.1 | 8542.31.00.01 | BOTTOM | BALL | 250 | 1V | 0.8mm | S-PBGA-B780 | 1.03V | 0.97V | 1.4GHz | MICROPROCESSOR, RISC | PowerPC e5500 | 133.3MHz | 32 | 16 | YES | YES | 64 | 固定点 | YES | 1Gbps (5) | 4 Core 64-Bit | 无 | DDR3L, DDR4 | USB 2.0 + PHY (2) | I2C, MMC/SD, PCIe, SPI, UART | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | SATA 3Gbps (2) | 2.07mm | 23mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MPC885VR66 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 357-BBGA | YES | 0°C~95°C TA | Tray | 1999 | MPC8xx | e1 | 最后一次购买 | 3 (168 Hours) | 357 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.8V | 1.27mm | 40 | MPC885 | S-PBGA-B357 | 1.9V | 1.83.3V | 1.7V | 66MHz | MICROPROCESSOR, RISC | 32 | 32 | YES | YES | 32 | 固定点 | YES | 3.3V | 10Mbps (3), 10/100Mbps (2) | 1 Core 32-Bit | 无 | DRAM | USB 2.0 (1) | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM, Security; SEC | Cryptography | 2.52mm | 25mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AM3352BZCEA60R | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 64kB | ACTIVE (Last Updated: 1 day ago) | Copper, Silver, Tin | 298-LFBGA | YES | 298 | ROM | -40°C~105°C TJ | Tape & Reel (TR) | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 298 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.1V | 600MHz | AM3352 | 1.1V | 1.144V | CAN, Ethernet, I2C, SPI, UART, USB | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 32b | 10 | ARM | YES | YES | 固定点 | YES | 1.8V 3.3V | 6 | 10/100/1000Mbps (2) | 1 Core 32-Bit | 有 | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | Cryptography, Random Number Generator | LCD, Touchscreen | 1.3mm | 13mm | 13mm | 890μm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8313CVRAGDC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | -40°C | 516-BBGA Exposed Pad | YES | 105°C | Tray | 2002 | e2 | 活跃 | 3 (168 Hours) | 516 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8313 | S-PBGA-B516 | 1.05V | INDUSTRIAL | 0.95V | 400 MHz | MICROPROCESSOR, RISC | 15 | YES | YES | 32 | 浮点 | YES | 2.55mm | 27mm | 27mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MPC860DTZQ80D4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 357-BBGA | YES | 0°C~95°C TA | Tray | 1995 | MPC8xx | e0 | 不用于新设计 | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 80MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | 固定点 | YES | 3.3V | 10Mbps (2), 10/100Mbps (1) | 1 Core 32-Bit | 无 | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8315CVRAFDA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 620-BBGA Exposed Pad | YES | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | 活跃 | 3 (168 Hours) | 620 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8315 | S-PBGA-B620 | 1.05V | 11.8/2.53.3V | 0.95V | 333MHz | MICROPROCESSOR | PowerPC e300c3 | 66.67MHz | 32 | 32 | YES | YES | 32 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, PCI, SPI, TDM | SATA 3Gbps (2) | 2.46mm | 29mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| P2020NSN2KHC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 689-BBGA Exposed Pad | YES | 0°C~125°C TA | Tray | 2002 | QorIQ P2 | e2 | 活跃 | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 1mm | 40 | P2020 | S-PBGA-B689 | 1.1V | 1.05V | 1V | 1.2GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 32 | YES | YES | 固定点 | YES | 10/100/1000Mbps (3) | 2 Core 32-Bit | 无 | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | 2.46mm | 31mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AMIC120BZDNA30 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | ACTIVE (Last Updated: 6 days ago) | 491-LFBGA | YES | 491 | AMIC120BZDNA30 | 0 | -40°C~105°C | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 491 | 5A992C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1.1V | 0.65mm | AMIC120 | 1.144V | 1.056V | 300MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 32 | YES | YES | 固定点 | YES | 524288 | 1.8V 3.3V | 1 Core 32-Bit | 无 | DDR3, LPDDR2 | USB 2.0 (2) | AC'97, CAN, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART | 4 | Multimedia; NEON™ SIMD | AES, SHA, RNG, DES, DES | LCD | 64 | 1.3mm | 17mm | 17mm | 900μm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT91SAM9263B-CU-999 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 160 | 有 | 96kB | Copper, Silver, Tin | 表面贴装 | 324-TFBGA | 324 | 324-TFBGA (15x15) | L1 Cache, ROM, SRAM | -40°C~85°C TA | Tray | 1997 | AT91SAM | 活跃 | 3 (168 Hours) | 85°C | -40°C | 200MHz | AT91SAM9263 | 1.2V | 2-Wire, CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART, USART, USB | Internal | 200MHz | 128kB | ARM926EJ-S | DMA, LCD, POR, PWM, WDT | 32b | 3 | ARM | 200MHz | 160 | 1.8V 2.0V 2.5V 2.7V 3.0V 3.3V | 10/100Mbps | 1 Core 32-Bit | 有 | SDRAM, SRAM | USB 2.0 (2) | AC97, CAN, EBI/EMI, I2C, ISI, MMC/SD/SDIO, SPI, SSC, UART/USART | 1 | LCD | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8548EVJAVHD | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 783-BBGA, FCBGA | 0°C~105°C TA | Tray | 2002 | MPC85xx | 活跃 | 3 (168 Hours) | MPC8548 | 1.5GHz | PowerPC e500 | 1.8V 2.5V 3.3V | 10/100/1000Mbps (4) | 1 Core 32-Bit | 无 | DDR, DDR2, SDRAM | DUART, I2C, PCI, RapidIO | Signal Processing; SPE, Security; SEC | Cryptography, Random Number Generator | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ATSAMA5D41A-CU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 19 Weeks | 152 | 128kB | Copper, Silver, Tin | 表面贴装 | 289-LFBGA | 289 | L2 Cache, ROM, SRAM | -40°C~85°C TA | Tray | 2014 | SAMA5D4 | yes | Obsolete | 3 (168 Hours) | 528MHz | ATSAMA5D41 | 1.8V | 2-Wire, EBI/EMI, Ethernet, I2C, MMC, SD, SPI, UART, USART, USB | 1.98V | 1.62V | Internal | 128kB | ARM® Cortex®-A5 | DMA, LCD, POR, PWM, WDT | 32b | 3 | ARM | 1.2V 1.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | 有 | LPDDR, LPDDR2, DDR2 | USB 2.0 (3) | EBI, I2C, MMC/SD/SDIO, SPI, SSC, UART, USART | Multimedia; NEON™ SIMD | 1 | AES, SHA, TDES, TRNG | LCD, Touchscreen | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MPC8314CVRADDA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 620-BBGA Exposed Pad | YES | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | 活跃 | 3 (168 Hours) | 620 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8314 | S-PBGA-B620 | 1.05V | 13.3V | 0.95V | 266MHz | MICROPROCESSOR | PowerPC e300c3 | 66.67MHz | 32 | YES | YES | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI, TDM | 2.46mm | 29mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MPC8280ZUQLDA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 480-LBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 1994 | MPC82xx | e0 | 活跃 | 4 (72 Hours) | 480 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1.27mm | 40 | MPC8280 | S-PBGA-B480 | 1.6V | 1.53.3V | 1.45V | 333MHz | MICROPROCESSOR, RISC | PowerPC G2_LE | 32 | 32 | YES | YES | 64 | 浮点 | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | 无 | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | 1.65mm | 37.5mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6G3DVM05AB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 289-LFBGA | YES | 0°C~95°C TJ | Tray | 2002 | i.MX6UL | 活跃 | 3 (168 Hours) | 289 | 5A992 | 8542.31.00.01 | BOTTOM | BALL | 0.8mm | S-PBGA-B289 | 1.3V | 1.15V | 528MHz | MICROPROCESSOR | ARM® Cortex®-A7 | 26 | YES | YES | 16 | 固定点 | YES | 1.2V 1.35V 1.5V 1.8V 2.5V 2.8V 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | 无 | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | LCD, LVDS | 1.32mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MPC855TZQ80D4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 357-BBGA | YES | 0°C~95°C TA | Tray | 1997 | MPC8xx | e0 | 不用于新设计 | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC855 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 80MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | 固定点 | YES | 3.3V | 10Mbps (1), 10/100Mbps (1) | 1 Core 32-Bit | 无 | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant |