类别是'嵌入式 - 微处理器'
嵌入式 - 微处理器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 速度 | 内存大小 | uPs/uCs/外围ICs类型 | 核心处理器 | 时钟频率 | 位元大小 | 访问时间 | 数据总线宽度 | 无卤素 | 定时器/计数器的数量 | 地址总线宽度 | 核心架构 | 边界扫描 | 低功率模式 | 外部数据总线宽度 | 格式 | 集成缓存 | 电压 - I/O | UART 通道数 | 以太网 | 核数/总线宽度 | 图形加速 | 内存控制器 | USB | 附加接口 | 协处理器/DSP | 核数量 | 保安功能 | 显示和界面控制器 | 萨塔 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||
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.png) | T1014NXE7PQA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 780-FBGA | YES | -40°C~105°C TA | 2014 | QorIQ T1 | e1 | 活跃 | 3 (168 Hours) | 780 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 1V | 0.8mm | S-PBGA-B780 | 1.03V | 0.97V | 1.4GHz | MICROPROCESSOR, RISC | PowerPC e5500 | 133.33MHz | 64 | 16 | YES | YES | 64 | YES | GbE (8) | 1 Core 64-Bit | 无 | DDR3L, DDR4 | USB 2.0 + PHY (2) | I2C, MMC/SD, PCIe, SPI, UART | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | SATA 3Gbps (2) | 2.07mm | 23mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
 | P5021NSN72QC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 1295-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2012 | QorIQ P5 | e1 | 活跃 | 3 (168 Hours) | 3A991.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.2V | 1mm | 30 | S-PBGA-B1295 | 1.23V | 1.17V | 2.2GHz | MICROPROCESSOR, RISC | PowerPC e5500 | 16 | YES | YES | 64 | 固定点 | YES | 1.0V 1.2V | 1Gbps (10), 10Gbps (2) | 2 Core 64-Bit | 无 | DDR3, DDR3L | USB 2.0 + PHY (2) | I2C, MMC/SD, PCIe, SPI, UART | SATA 3Gbps (2) | 3.53mm | 37.5mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
 | T1022NSE7MQPB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 780-FBGA, FCBGA | 780-FCPBGA (23x23) | 0°C~105°C TA | 2014 | QorIQ T1 | 活跃 | 3 (168 Hours) | 1.2GHz | PowerPC e5500 | 1Gbps (5) | 2 Core 64-Bit | 无 | DDR3L, DDR4 | USB 2.0 + PHY (2) | I2C, MMC/SD, PCIe, SPI, UART | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | SATA 3Gbps (2) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT79RC64V475-200DP | Renesas Electronics America Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 208-BFQFP Exposed Pad | 0°C~85°C TC | Tray | Obsolete | 3 (168 Hours) | IDT79RC64V475 | 200MHz | MIPS-I | 3.3V | 1 Core 64-Bit | 无 | SDRAM | System Control; CP0 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| T2081NSN8PTB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 896-BFBGA, FCBGA | YES | 0°C~105°C TA | 2002 | QorIQ T2 | 活跃 | 3 (168 Hours) | 780 | 3A991.A.1 | 8542.31.00.01 | BOTTOM | BALL | 250 | 1.025V | 0.8mm | 30 | S-PBGA-B780 | 1.055V | 0.995V | 1.533GHz | MICROPROCESSOR, RISC | PowerPC e6500 | 16 | YES | YES | 64 | 固定点 | YES | 1Gbps (8), 2.5Gbps (4), 10Gbps (4) | 4 Core 64-Bit | DDR3, DDR3L | USB 2.0 + PHY (2) | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | SATA 3Gbps (2) | 2.61mm | 23mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
| P4080PSE1MZA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1295-BBGA, FCBGA | 0°C~105°C TA | Tray | QorIQ P4 | Obsolete | 3 (168 Hours) | P4080 | 1.5GHz | PowerPC e500mc | 1.8V 2.5V 3.3V | 1Gbps (8), 10Gbps (2) | 8 Core 32-Bit | 无 | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, RapidIO, SPI | Security; SEC 4.0 | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AM1808EZWT4 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 128kB | ACTIVE (Last Updated: 1 week ago) | Copper, Silver, Tin | 表面贴装 | 361-LFBGA | 361 | 789.392471mg | L1 Cache, RAM, ROM | 0°C~90°C TJ | Tray | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 361 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.3V | 0.8mm | 456MHz | AM1808 | 1.3V | Ethernet, I2C, SPI, UART, USB | 1.35V | 1.25V | 16kB | MICROPROCESSOR, RISC | ARM926EJ-S | 32 | 32b | ARM | YES | YES | 固定点 | YES | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | 无 | LPDDR, DDR2 | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | I2C, McASP, McBSP, SPI, MMC/SD, UART | System Control; CP15 | 1 | LCD | SATA 3Gbps (1) | 1.4mm | 16mm | 16mm | 900μm | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||
 | MPC8270VRMIBA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 516-BBGA | YES | 0°C~105°C TA | Tray | 1997 | MPC82xx | e2 | 活跃 | 3 (168 Hours) | 516 | 3A991.A.2 | Tin/Silver (Sn/Ag) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.5V | 1mm | 30 | MPC8270 | S-PBGA-B516 | 1.6V | 1.53.3V | 1.45V | 266MHz | MICROPROCESSOR, RISC | PowerPC G2_LE | 266MHz | 32 | 32 | YES | NO | 64 | 浮点 | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | 无 | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | 2.55mm | 27mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
 | P1013NXE2HFB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 689-BBGA Exposed Pad | YES | -40°C~125°C TA | Tray | 2002 | QorIQ P1 | e2 | 活跃 | 3 (168 Hours) | 689 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | P1013 | S-PBGA-B689 | 1.05V | 0.95V | 1.055GHz | MICROPROCESSOR | PowerPC e500v2 | 133MHz | 32 | YES | YES | 浮点 | YES | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, I2S, MMC/SD, SPI | Security; SEC | Cryptography, Random Number Generator | LCD | SATA 3Gbps (2) | 2.46mm | 31mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
 | T2080NXN8P1B | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 896-BFBGA, FCBGA | YES | 0°C~105°C TA | QorIQ T2 | 活跃 | 3 (168 Hours) | 896 | BOTTOM | BALL | S-PBGA-B896 | 1.533GHz | MICROPROCESSOR, RISC | PowerPC e6500 | 64 | NO | NO | 固定点 | YES | 1Gbps (8), 2.5Gbps (4), 10Gbps (4) | 4 Core 64-Bit | DDR3, DDR3L | USB 2.0 + PHY (2) | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | SATA 3Gbps (2) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC857DSLVR50B | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 357-BBGA | YES | 0°C~105°C TA | Tray | 1997 | MPC8xx | e1 | Obsolete | 3 (168 Hours) | 357 | 5A991 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC857 | S-PBGA-B357 | 3.465V | 3.135V | 50MHz | MICROPROCESSOR, RISC | 32 | 32 | YES | YES | 32 | 固定点 | YES | 3.3V | 10Mbps (1), 10/100Mbps (1) | 1 Core 32-Bit | 无 | DRAM | I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
| PIC16C63-04/SO | Honeywell / Microswitch | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AM1705CPTP3 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8kB | Gold | 表面贴装 | 176-LQFP Exposed Pad | 176 | 0°C~90°C TJ | Tray | Sitara™ | e4 | no | Obsolete | 4 (72 Hours) | 176 | QUAD | 鸥翼 | 260 | 1.2V | 0.5mm | 375MHz | AM1705 | 1.2V | 1.32V | SPI, USB | 1.32V | 1.14V | 16kB | MICROPROCESSOR, RISC | ARM926EJ-S | 32 | 32b | 13 | ARM | YES | YES | 固定点 | YES | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | 无 | SDRAM | USB 2.0 + PHY (1) | I2C, McASP, SPI, MMC/SD, UART | System Control; CP15 | 1.6mm | 24mm | ROHS3 Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||
 | FC80960HA33SL2GV | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 208-QFP | 208 | 0°C~85°C TC | Tray | 2002 | i960 | e0 | Obsolete | 3 (168 Hours) | 208 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | 鸥翼 | 3.3V | 0.5mm | 33MHz | 208 | 3.3V | 3.33.3/5V | 3.3V | 3.45V | 3.15V | 2kB | MICROPROCESSOR, RISC | 32 | 33 μs | 32 | YES | YES | 32 | 固定点 | YES | 1 Core 32-Bit | 无 | DRAM | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
 | SVF532R2K1CMK4R | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 364-LFBGA | -40°C~85°C TA | Tape & Reel (TR) | 2012 | Vybrid, VF5xxR | 活跃 | 3 (168 Hours) | 未说明 | 未说明 | 400MHz, 133MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A5 + Cortex®-M4 | 3.3V | 10/100Mbps (2) | 2 Core 32-Bit | 有 | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG | DCU, GPU, LCD, VideoADC, VIU | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Z8S18020VEC | Zilog | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 68-LCC (J-Lead) | 68 | -40°C~100°C TA | Tube | 2000 | Z180 | e0 | Obsolete | 3 (168 Hours) | 68 | Tin/Lead (Sn/Pb) | QUAD | J BEND | 225 | 5V | 20MHz | 30 | 68 | 5V | 5V | SCI | MICROPROCESSOR | Z8S180 | 8 | 20 μs | 8b | 2 | 20 | NO | YES | 固定点 | NO | 5.0V | 1 Core 8-Bit | 无 | DRAM | ASCI, CSIO, UART | 4.57mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||
 | P1025NSE5DFB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 561-FBGA | 561-TEPBGA I (23x23) | 0°C~125°C TA | Tray | 2002 | QorIQ P1 | 活跃 | 3 (168 Hours) | P1025 | 667MHz | PowerPC e500v2 | 10/100/1000Mbps (3) | 2 Core 32-Bit | 无 | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | Communications; QUICC Engine, Security; SEC 3.3 | Cryptography, Random Number Generator | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC7447AVU1000LB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 360-BCBGA, FCCBGA | YES | 0°C~105°C TA | Tray | 1994 | MPC74xx | e2 | 不用于新设计 | 1 (Unlimited) | 360 | 3A991.A.1 | TIN COPPER/TIN SILVER | ALSO REQUIRES 1.8V OR 2.5V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.3V | 1.27mm | 40 | MC7447 | S-CBGA-B360 | 1.35V | 1.25V | 1.0GHz | MICROPROCESSOR, RISC | PowerPC G4 | 167MHz | 32 | 36 | YES | YES | 64 | 浮点 | YES | 1.8V 2.5V | 1 Core 32-Bit | 无 | Multimedia; SIMD | 2.8mm | 25mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
| P5020NSE1TNB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 26 Weeks | 1295-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2002 | QorIQ P5 | e1 | Obsolete | 3 (168 Hours) | 5A002.A.1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.1V | 1mm | 30 | P5020 | S-PBGA-B1295 | 1.15V | 1.05V | 2.0GHz | MICROPROCESSOR, RISC | PowerPC e5500 | 166MHz | 16 | YES | YES | 64 | 固定点 | YES | 1Gbps (5), 10Gbps (1) | 2 Core 64-Bit | 无 | DDR3, DDR3L | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | Security; SEC 4.2 | Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection | SATA 3Gbps (2) | 3.53mm | 37.5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
| MPC860DEVR66D4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 26 Weeks | 357-BBGA | YES | 0°C~95°C TA | Tray | 2004 | MPC8xx | e1 | Obsolete | 3 (168 Hours) | 357 | 3A991.A.2 | 锡银铜 | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 66MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | 固定点 | YES | 3.3V | 10Mbps (2) | 1 Core 32-Bit | 无 | DRAM | I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
 | XAM5728BABCXE | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 760-BFBGA, FCBGA | 760 | 0°C~90°C TJ | Bulk | Sitara™ | e1 | Obsolete | 3 (168 Hours) | 760 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 250 | 1.15V | 0.8mm | 1.5GHz | 未说明 | AM5728 | 1.1V | I2C, SPI, UART | 1500 MHz | 2.5MB | MICROPROCESSOR, RISC | ARM® Cortex®-A15 | 32b | 16 | ARM | YES | YES | 浮点 | NO | 1.8V 3.3V | 10 | GbE | 2 Core 32-Bit | 有 | DDR3, SRAM | USB 2.0 (1), USB 3.0 (1) | CAN, EBI/EMI, HDQ/1-Wire®, I²C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART | DSP, BB2D, IPU, IVA, GPU, VPE | 2 | SATA 3Gbps (1) | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||
 | MC94MX21DVKN3R2 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 289-LFBGA | -30°C~70°C TA | Tape & Reel (TR) | 2006 | i.MX21 | Obsolete | 3 (168 Hours) | MC94MX21 | 350MHz | ARM926EJ-S | 1.8V 3.0V | 1 Core 32-Bit | 有 | SDRAM | USB 1.x (2) | 1-Wire, I2C, I2S, IrDA, MMC/SD, UART | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MPC8547EVUAUJ | Freescale Semiconductor, Inc. (NXP Semiconductors) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 783 | 11.227488g | 1.333GHz | e2 | 1 (Unlimited) | 783 | SMD/SMT | 5A002 | Tin/Silver (Sn/Ag) | 105°C | 0°C | BOTTOM | BALL | 260 | 1.1V | 1.333GHz | 40 | 783 | 1.1V | I2C, PCI, SPI, UART | 1.155V | 1.045V | 64MB | MICROPROCESSOR | 32 | 32b | 不含卤素 | 64 | YES | YES | 浮点 | YES | 1 | 3.38mm | 29mm | 无 | 无SVHC | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||
| GCIXP1200EA | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | BGA | 432 | Bulk | 432 | 70°C | 0°C | BOTTOM | BALL | 1.27mm | 166MHz | 不合格 | 3.3V | COMMERCIAL | 166 μs | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| FW80200M600SL677 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | BGA | 241 | Bulk | 2003 | 85°C | -40°C | 600MHz | 1.5V | 5V | 1.575V | 1.425V | 符合RoHS标准 |