类别是'嵌入式 - 微处理器'
嵌入式 - 微处理器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 底架 | 包装/外壳 | 表面安装 | 引脚数 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 振荡器类型 | 速度 | 内存大小 | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 位元大小 | 访问时间 | 有ADC | DMA 通道 | 数据总线宽度 | 脉宽调制通道 | 地址总线宽度 | 核心架构 | 边界扫描 | 低功率模式 | 外部数据总线宽度 | 格式 | 集成缓存 | 电压 - I/O | UART 通道数 | 以太网 | 核数/总线宽度 | 图形加速 | 内存控制器 | USB | 附加接口 | 协处理器/DSP | 核数量 | 总线兼容性 | 保安功能 | 最大数据传输率 | 显示和界面控制器 | 通信协议 | 萨塔 | 数据编码/解码方式 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | ||
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 | LS1021ASN7HNB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 525-FBGA, FCBGA | YES | 0°C~105°C | Tray | 2002 | QorIQ® Layerscape | 活跃 | 3 (168 Hours) | 525 | 3A991.A.1 | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 40 | S-PBGA-B525 | 1.03V | 0.97V | 800MHz | 微处理器电路 | ARM® Cortex®-A7 | GbE (3) | 2 Core 32-Bit | DDR3L, DDR4 | USB 3.0 (1) + PHY | Secure Boot, TrustZone® | 2D-ACE | SATA 6Gbps (1) | 2.07mm | 19mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MCIMX6U1AVM08ACR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 624-LFBGA | -40°C~125°C TJ | Tape & Reel (TR) | 2002 | i.MX6DL | 活跃 | 3 (168 Hours) | 800MHz | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC7448VU1267ND | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 360-CBGA, FCCBGA | YES | 0°C~105°C TA | Tray | 1994 | MPC74xx | e2 | 活跃 | 1 (Unlimited) | 360 | 3A991.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | 260 | 1.05V | 1.27mm | 40 | MC7448 | S-CBGA-N360 | 1.1V | 1.31.8/2.5V | 1V | 1.267GHz | MICROPROCESSOR, RISC | PowerPC G4 | 1267MHz | 32 | NO | YES | 固定点 | NO | 1.5V 1.8V 2.5V | 1 Core 32-Bit | 无 | Multimedia; SIMD | 2.8mm | 25mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
 | MPC859TCZP100A | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 357-BBGA | YES | -40°C~100°C TA | Tray | 1999 | MPC8xx | e0 | Obsolete | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 220 | 1.8V | 1.27mm | 30 | MPC859 | S-PBGA-B357 | 1.9V | 1.83.3V | 1.7V | 100MHz | MICROPROCESSOR, RISC | 32 | 32 | YES | YES | 32 | 固定点 | YES | 3.3V | 10Mbps (1), 10/100Mbps (1) | 1 Core 32-Bit | 无 | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||
 | T2081NSN8TTB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 896-BFBGA, FCBGA | YES | 0°C~105°C TA | Tray | QorIQ T2 | 活跃 | 3 (168 Hours) | 780 | 3A991.A.1 | 8542.31.00.01 | BOTTOM | BALL | 250 | 1.025V | 0.8mm | 30 | S-PBGA-B780 | 1.055V | 0.995V | 1.8GHz | MICROPROCESSOR, RISC | PowerPC e6500 | 16 | YES | YES | 64 | 固定点 | YES | 1Gbps (8), 2.5Gbps (4), 10Gbps (4) | 4 Core 64-Bit | DDR3, DDR3L | USB 2.0 + PHY (2) | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | SATA 3Gbps (2) | 2.61mm | 23mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
| MPC859DSLCZP50A | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 357-BBGA | YES | -40°C~100°C TA | Tray | 1999 | MPC8xx | e0 | Obsolete | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 220 | 1.8V | 1.27mm | 30 | MPC859 | S-PBGA-B357 | 1.9V | 1.83.3V | 1.7V | 50MHz | MICROPROCESSOR, RISC | 32 | 32 | YES | YES | 32 | 固定点 | YES | 3.3V | 10Mbps (1), 10/100Mbps (1) | 1 Core 32-Bit | 无 | DRAM | I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||
| LS1021ASE7KQB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 525-FBGA, FCBGA | YES | 0°C~105°C | Tray | 2002 | QorIQ® Layerscape | 活跃 | 3 (168 Hours) | 525 | 5A002.A.1 | 8542.31.00.01 | BOTTOM | BALL | 未说明 | 1V | 0.8mm | 未说明 | S-PBGA-B525 | 1.03V | 0.97V | 1.0GHz | 微处理器电路 | ARM® Cortex®-A7 | GbE (3) | 2 Core 32-Bit | DDR3L, DDR4 | USB 3.0 (1) + PHY | Secure Boot, TrustZone® | 2D-ACE | SATA 6Gbps (1) | 2.07mm | 19mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC68SEC000AE20 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 64-LQFP | YES | 0°C~70°C TA | Tray | 1995 | M680x0 | 不用于新设计 | 4 (72 Hours) | 64 | EAR99 | 8542.31.00.01 | QUAD | 鸥翼 | 5V | 0.5mm | MC68SEC000 | S-PQFP-G64 | 5V | 20MHz | MICROPROCESSOR, RISC | EC000 | 32 | 3.3V 5.0V | 1 Core 32-Bit | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | T4240NSE7QTB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 1932-BBGA, FCBGA | YES | 0°C~105°C TA | Bulk | 2002 | QorIQ T4 | e1 | yes | 活跃 | 3 (168 Hours) | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 250 | 1.025V | 1mm | S-PBGA-B1932 | 1.055V | 0.995V | 1.8GHz | MICROPROCESSOR, RISC | PowerPC e6500 | 133.3MHz | 16 | YES | YES | 64 | 固定点 | YES | 1Gbps (16), 10Gbps (4) | 12 Core 64-Bit | 无 | DDR3, DDR3L | USB 2.0 + PHY (2) | I2C, MMC/SD, PCIe, RapidIO, SPI, UART | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | SATA 3Gbps (2) | 3.33mm | 45mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
| T4240NXN7PQB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 1932-BBGA, FCBGA | YES | -40°C~105°C TA | Bulk | 2002 | QorIQ T4 | yes | 活跃 | 3 (168 Hours) | BOTTOM | BALL | 1.025V | 1mm | S-PBGA-B1932 | 1.055V | 0.995V | 1.8GHz | MICROPROCESSOR, RISC | PowerPC e6500 | 133.3MHz | 16 | YES | YES | 64 | 固定点 | YES | 1Gbps (16), 10Gbps (4) | 12 Core 64-Bit | 无 | DDR3, DDR3L | USB 2.0 + PHY (2) | I2C, MMC/SD, PCIe, RapidIO, SPI, UART | SATA 3Gbps (2) | 3.33mm | 45mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
.png) | MCIMX514AJM6CR2 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 529-LFBGA | YES | -40°C~125°C TJ | Tape & Reel (TR) | i.MX51 | e1 | 活跃 | 3 (168 Hours) | 529 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 40 | S-PBGA-B529 | 不合格 | 1.1V | 1.2V | 0.95V | 600MHz | 微处理器电路 | ARM® Cortex®-A8 | 1.2V 1.875V 2.775V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | 有 | LPDDR, DDR2 | USB 2.0 (3), USB 2.0 + PHY (1) | 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keypad, LCD | 1.6mm | 19mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
 | GCIXP1240AC | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | BGA | 432 | Bulk | 2004 | Discontinued | 1 (Unlimited) | 432 | 3A001.A.3 | 70°C | 0°C | 8542.31.00.01 | BOTTOM | BALL | 225 | 2V | 1.27mm | 232MHz | 432 | 3.3V | COMMERCIAL | 3.3V | MICROPROCESSOR, RISC | 32 | 232 μs | 32 | YES | NO | 32 | 固定点 | YES | 1.67mm | 40mm | 40mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | R7S721000VLFP#AA0 | Renesas Electronics America | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | 115 | 256-LQFP | YES | 256 | ROMless | -40°C~85°C TA | Tray | 2018 | RZ/A1H | yes | 活跃 | 3 (168 Hours) | 256 | QUAD | 鸥翼 | 1.18V | 0.4mm | 400MHz | 256 | 1.26V | 1.1V | CAN, EBI/EMI, I2C, LIN, MMC, SCI, SD, SPI, UART, USART, USB | External | MICROCONTROLLER, RISC | ARM® Cortex®-A9 | DMA, POR, PWM, WDT | 32 | YES | YES | YES | 26 | ARM | 32 | 1.2V 3.3V | 10/100Mbps (1), 100Mbps (1) | 1 Core 32-Bit | 有 | SDRAM, SRAM | USB 2.0 (2) | CAN, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI | Multimedia; NEON™ MPE | DVD, VDC | 28mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
| MC68360VR25L | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 357-BBGA | YES | 0°C~70°C TA | Tray | 1995 | M683xx | e1 | 最后一次购买 | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 5V | 1.27mm | 40 | MC68360 | S-PBGA-B357 | 5.25V | 4.75V | 25MHz | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | CPU32+ | 25MHz | 32 | YES | YES | 32 | 5.0V | 10Mbps (1) | 1 Core 32-Bit | 无 | DRAM | SCC, SMC, SPI | Communications; CPM | MC68040; MC68030 | 1.25 MBps | BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP | NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL | 1.86mm | 25mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
 | MPC8533EVTALF | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 783-BBGA, FCBGA | YES | 0°C~90°C TA | Tray | 2006 | MPC85xx | Obsolete | 3 (168 Hours) | 783 | 3A001.A.3 | 8542.31.00.01 | BOTTOM | BALL | 1V | 1mm | MPC8533 | S-PBGA-B783 | 1.05V | 0.95V | 667MHz | MICROPROCESSOR | PowerPC e500v2 | 133MHz | 32 | 16 | YES | YES | 64 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, DDR2 | DUART, HSSI, I2C, PCI | Security; SEC | Cryptography, Random Number Generator | 2.8mm | 29mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
 | AM1707CZKB3 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8kB | 表面贴装 | 256-BGA | 256 | 0°C~90°C TJ | Tray | Sitara™ | e1 | no | Obsolete | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.2V | 1mm | 375MHz | AM1707 | 1.2V | 1.32V | I2C, SPI, UART | 16kB | ARM926EJ-S | 32 | 32b | 13 | RISC | YES | YES | 固定点 | YES | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | 无 | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | I2C, McASP, SPI, MMC/SD, UART | System Control; CP15 | LCD | 2.05mm | 17mm | ROHS3 Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||
 | XAM3359AZCZ | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 64kB | 324-LFBGA | 324 | ROM | 0°C~90°C TJ | Tray | Sitara™ | Obsolete | 3 (168 Hours) | AM3359 | CAN, Ethernet, I2C, SPI, UART, USB | 176kB | ARM® Cortex®-A8 | 32b | ARM | 1.8V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 有 | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | Cryptography, Random Number Generator | LCD, Touchscreen | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8378EVRANG | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 689-BBGA Exposed Pad | YES | 0°C~125°C TA | Tray | 2005 | MPC83xx | Obsolete | 3 (168 Hours) | 689 | 8542.31.00.01 | BOTTOM | BALL | 1.05V | 1mm | MPC8378 | S-PBGA-B689 | 1.1V | 1V | 800MHz | MICROPROCESSOR | PowerPC e300c4s | 15 | YES | YES | 64 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | Security; SEC 3.0 | Cryptography, Random Number Generator | 2.46mm | 31mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
 | XAM5718ABCXE | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 760-BFBGA, FCBGA | YES | 0°C~90°C TJ | Bulk | Sitara™ | e1 | Obsolete | 3 (168 Hours) | 760 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 250 | 1.15V | 0.8mm | 1.5GHz | 未说明 | AM5718 | S-PBGA-B760 | MICROPROCESSOR, RISC | ARM® Cortex®-A15 | 16 | ARM | YES | YES | 32 | 浮点 | NO | 1.8V 3.3V | 10 | 10/100/1000Mbps (1) | 1 Core 32-Bit | 有 | DDR3, SRAM | USB 2.0 (1), USB 3.0 (1) | CAN, EBI/EMI, HDQ/1-Wire®, I²C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART | Multimedia; GPU, IPU, VFP | 1 | HDMI | SATA 3Gbps (1) | 2.96mm | 23mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||
 | XPC8260CVVIFBC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 480-LBGA Exposed Pad | YES | -40°C~105°C TA | Tray | 2004 | MPC82xx | e1 | Obsolete | 3 (168 Hours) | 480 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | 30 | PC8260 | S-PBGA-B480 | 1.9V | 1.7V | 200MHz | MICROPROCESSOR, RISC | PowerPC G2 | 66.66MHz | 32 | 32 | YES | NO | 64 | 浮点 | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | 无 | DRAM, SDRAM | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | 1.65mm | 37.5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
 | MPC8358VVADDE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 740-LBGA | 0°C~105°C TA | Tray | 2004 | MPC83xx | Obsolete | 3 (168 Hours) | MPC8358 | 266MHz | PowerPC e300 | 1.8V 2.5V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 1.x (1) | DUART, HDLC, I2C, PCI, SPI, UART | Communications; QUICC Engine | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | STA1085EOA | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | ACTIVE (Last Updated: 7 months ago) | 361-LFBGA | -40°C~85°C TA | Tray | 活跃 | 3 (168 Hours) | STA1085 | 450MHz | ARM® Cortex®-R4 | 3.3V | 1 Core 32-Bit | 有 | SDRAM | USB 2.0 (1) | CAN, I2C, SSP/SPI, UART | ARM® Cortex®-M3 | LCD, Touchscreen | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC7457VG1000LC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 483-BCBGA, FCCBGA | YES | 0°C~105°C TA | Tray | 1994 | MPC74xx | e1 | Obsolete | 1 (Unlimited) | 483 | 3A991.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.3V | 1.27mm | 40 | MC7457 | S-CBGA-B483 | 1.35V | 1.25V | 1.0GHz | MICROPROCESSOR, RISC | PowerPC G4 | 167MHz | 32 | 36 | YES | YES | 64 | 浮点 | YES | 1.5V 1.8V 2.5V | 1 Core 32-Bit | 无 | Multimedia; SIMD | 3.2mm | 29mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
 | SVF532R3K2CMK4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 364-LFBGA | -40°C~85°C TA | Tray | Vybrid, VF5xxR | yes | 活跃 | 3 (168 Hours) | 260 | 40 | 400MHz, 133MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A5 + Cortex®-M4 | 3.3V | 10/100Mbps (2) | 2 Core 32-Bit | 有 | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG | DCU, GPU, LCD, VideoADC, VIU | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EN80C186EB13 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | LCC | 80 | Bulk | 85°C | -40°C | 13MHz | 5V | 5V | 5.5V | 4.5V | 符合RoHS标准 | 无铅 |