类别是'射频收发器 IC'
射频收发器 IC (5010)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 工作电源电压 | 界面 | 内存大小 | 内存大小 | 数据总线宽度 | 带宽 | 议定书 | 核心架构 | 功率 - 输出 | 无线电频率系列/标准 | 敏感度 | 数据率（最大） | 串行接口 | 接收电流 | 传输电流 | 调制 | 灵敏度(dBm) | 通用输入输出数量 | [医]GPIO | 调制技术 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||||||||||||||||||||
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 | EFR32MG12P431F1024GM68-C | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 68-VFQFN Exposed Pad | -40°C~85°C | Tray | Mighty Gecko | 活跃 | 3 (168 Hours) | TxRx + MCU | 1.8V~3.8V | compliant | 2.4GHz | 1MB Flash 256kB RAM | Bluetooth v4.0, Thread, Zigbee® | 20dBm | 802.15.4, Bluetooth | -102dBm | 38.4kbps | I2C, I2S, IrDA, SPI, UART | 8.4mA~13mA | 20.3mA~134.3mA | 2GFSK, 4GFSK, ASK, DSSS, BPSK, DBPSK, GMSK, O-QPSK, OOK | 46 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | EFR32BG1B232F256GM32-B0 | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 32-VFQFN Exposed Pad | YES | -40°C~85°C | Tray | 2010 | EFR32™ Blue Gecko | Discontinued | 2 (1 Year) | 32 | TxRx + MCU | 8542.39.00.01 | 1.85V~3.8V | QUAD | 无铅 | 1 | 3.3V | 0.5mm | unknown | 2.4GHz | S-XQCC-N32 | I2C, UART, USART | 256kB Flash 32kB RAM | Bluetooth v4.0 | 10.5dBm | Bluetooth | 2Mbps | I2C, UART, USART | 8.7mA | 8.8mA~133mA | 2FSK, 4FSK, DSSS, GFSK, GMSK, MSK, O-QPSK | -99.2 dBm | 16 | 0.9mm | 5mm | 5mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||
 | EZR32WG230F64R69G-B0R | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 64-VFQFN Exposed Pad | -40°C~85°C | Tape & Reel (TR) | 2015 | EZR32WG | 不用于新设计 | 2 (1 Year) | TxRx + MCU | 1.98V~3.8V | 142MHz~1.05GHz | I2C, SPI, UART, USART | 64kB Flash 32kB RAM | EZRadioPro | 20dBm | 802.15.4 | 1Mbps | I2C, SPI, UART, USART | 11.1mA~13.7mA | 18mA~88mA | 4FSK, 4GFSK, FSK, GFSK, GMSK, MSK, OOK | -133 dBm | 41 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EZR32WG230F128R69G-B0 | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 32kB | 表面贴装 | 64-VFQFN Exposed Pad | 64 | 41 | -40°C~85°C | Tray | 2015 | EZR32WG | yes | 不用于新设计 | 2 (1 Year) | TxRx + MCU | 1.98V~3.8V | 260 | 142MHz~1.05GHz | 未说明 | I2C, SPI, UART, USART | 128kB Flash 32kB RAM | EZRadioPro | 20dBm | 802.15.4 | 1Mbps | I2C, SPI, UART, USART | 11.1mA~13.7mA | 18mA~88mA | 4FSK, 4GFSK, FSK, GFSK, GMSK, MSK, OOK | -133 dBm | Unknown | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | BLUENRG-248 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 48-VFQFN Exposed Pad | Industrial grade | -40°C~105°C | Tape & Reel (TR) | BlueNRG | 活跃 | 3 (168 Hours) | TxRx + MCU | 1.7V~3.6V | 未说明 | compliant | 2.4GHz | 未说明 | 256kB Flash 24kB RAM | Bluetooth v5.0 | 10dBm | Bluetooth | -88dBm | 2Mbps | I2C, SPI, UART | 7.7mA~14.5mA | 6.6mA~28.8mA | GFSK | 15 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | TDA5100XT | Infineon Technologies AG | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 500 to 1500 | 870 | 433 to 435|868 to 870 | 2.1V | 3.3V|2.5V | 4V | -25 | 85 | SOP | TSSOP | 表面贴装 | 1 | 5 | 4.4 | 16 | Gull-wing | EAR99 | 卷带 | Obsolete | 16 | ASK/FSK | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LTC5800IWR-IPRB#PBF | Linear Technology/Analog Devices | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 72-VFQFN Exposed Pad | YES | -40°C~85°C | Tray | 2013 | Dust Networks®, SmartMesh IP™ | e4 | 活跃 | 3 (168 Hours) | 72 | 5A002 | TxRx + MCU | Silver (Ag) | 2.1V~3.76V | QUAD | 无铅 | 未说明 | 1 | 3.6V | 0.5mm | 2.4GHz | 未说明 | LTC5800 | 72 | S-PQCC-N72 | 512kB Flash 72kB SRAM | 6LoWPAN | 8dBm | 802.15.4 | -95dBm | 250kbps | JTAG, SPI, UART | 4.5mA | 5.4mA~9.7mA | 8 | 1mm | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
 | BCM20735KMLG | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 60-VFQFN Exposed Pad | 60-QFN (7x7) | -30°C~85°C | Tray | Obsolete | 3 (168 Hours) | TxRx + MCU | 3.3V | 2.4GHz | Bluetooth v4.2 | 10dBm | Bluetooth | -94.5dBm | 2Mbps | I2C, I2S, SPI, UART | 8mA | 18mA | GFSK | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | HMC310MS8GETR | Analog Devices Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | OBSOLETE (Last Updated: 2 weeks ago) | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) Exposed Pad | 8 | -40°C~85°C | Tape & Reel (TR) | no | Obsolete | 1 (Unlimited) | 仅TxRx | 3V | 2.4GHz | HMC310 | 8 | 10dBm | Bluetooth | 12mA | 24mA | ROHS3 Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | EFR32FG12P431F1024GM48-CR | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 48-VFQFN Exposed Pad | Tape & Reel (TR) | 柔性壁虎 | 活跃 | 2 (1 Year) | TxRx + MCU | 1MB Flash 256kB RAM | 20dBm | -121dBm | I2C, I2S, SPI, UART | 31 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | BCM20735KFBG | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3 Weeks | 表面贴装 | 111-VFBGA | YES | -30°C~85°C | Tray | 2016 | yes | 活跃 | 3 (168 Hours) | 111 | TxRx + MCU | 8542.39.00.01 | 3.3V | BOTTOM | BALL | 1 | 1.2V | 0.8mm | unknown | 2.4GHz | Bluetooth v4.2 | 10dBm | Bluetooth | -94.5dBm | 2Mbps | I2C, I2S, SPI, UART | 8mA | 18mA | GFSK | 111 | 0.97mm | 9mm | 9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
 | BCM20732A1KML2G | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | -30°C~85°C | Tray | Obsolete | 3 (168 Hours) | 32 | TxRx + MCU | 8542.39.00.01 | 1.4V~3.6V | QUAD | 无铅 | 1 | 1.2V | 0.5mm | unknown | 2.4GHz | S-XQCC-N32 | Bluetooth v4.0 | Bluetooth | I2C, SPI, UART | 14 | 1mm | 5mm | 5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CC2420Z-RTB1 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 48-VFQFN Exposed Pad | YES | 48 | -40°C~85°C | Tube | e4 | no | Discontinued | 3 (168 Hours) | 48 | 仅TxRx | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.39.00.01 | 2.1V~3.6V | QUAD | 260 | 1 | 1.8V | 0.5mm | 2.4GHz | CC2420 | 48 | 3.3V | 2.4835 GHz | Zigbee® | 0dBm | 802.15.4 | 250kbps | SPI | 18.8mA | 8.5mA~17.4mA | DSSS, O-QPSK | -95 dBm | 0.9mm | 7mm | 无 | 无SVHC | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||
| EFR32MG12P432F1024GM48-BR | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 48-VFQFN Exposed Pad | -40°C~85°C | Tape & Reel (TR) | Mighty Gecko | yes | Discontinued | 2 (1 Year) | TxRx + MCU | 1.8V~3.8V | compliant | 2.4GHz | 1024kB Flash 256kB RAM | Bluetooth v4.0, Thread, Zigbee® | 19dBm | 802.15.4, Bluetooth | -102dBm | 2Mbps | I2C, I2S, SPI, UART | 8mA~10.8mA | 8.2mA~126.7mA | 2-FSK, 4-FSK, DSSS, GMSK, O-QPSK | 31 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATR2406-PNQW | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad | 32-QFN (5x5) | Commercial grade | -10°C~60°C | Cut Tape (CT) | 2011 | Obsolete | 1 (Unlimited) | 仅TxRx | 60°C | -10°C | 2.9V~3.6V | 2.4GHz | SPI | 4dBm | General ISM > 1GHZ | -93dBm | 1.125Mbps | SPI | 57mA | 42mA | GFSK | -93 dBm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ATMEGA1281R212-AU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8kB | 64-TQFP | 64-TQFP (14x14) | FLASH | -40°C~85°C | Tray | 活跃 | 3 (168 Hours) | TxRx + MCU | 85°C | -40°C | 1.8V~3.6V | 769MHz~935MHz | ATMEGA1281 | I2C, SPI | 128kB Flash 4kB EEPROM 8kB RAM | 8b | 6LoWPAN, Zigbee® | AVR | 10dBm | 802.15.4, General ISM < 1GHz | -110dBm | 1Mbps | SPI | 8.7mA~9.2mA | 13mA~25mA | DSSS, BPSK, O-QPSK | -110 dBm | 54 | 54 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| EFR32FG1V132F128GM48-B0 | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 48-VFQFN Exposed Pad | YES | -40°C~85°C | Tray | 2016 | 柔性壁虎 | yes | Discontinued | 2 (1 Year) | 48 | TxRx + MCU | 8542.39.00.01 | 1.85V~3.8V | QUAD | 无铅 | 1 | 3.3V | 0.5mm | 2.4GHz | S-XQCC-N48 | I2C, UART, USART | 128kB Flash 16kB RAM | 16.5dBm | General ISM > 1GHZ | 2Mbps | I2C, UART, USART | 8.7mA | 8.8mA~133mA | 2FSK, 4FSK, DSSS, GFSK, GMSK, MSK, O-QPSK | -99.2 dBm | 31 | 0.9mm | 7mm | 7mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | OL2385AHN/001A0Y | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 48-VFQFN Exposed Pad | -40°C~85°C | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | TxRx + MCU | 1.9V~5.5V | 260 | 未说明 | 48 | 14dBm | -124dBm | SPI, UART | 29mA | ASK, FSK | 12 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EFR32BG1B132F256IM32-C0 | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 32-VFQFN Exposed Pad | -40°C~85°C | Tray | 蓝壁虎 | 活跃 | 2 (1 Year) | TxRx + MCU | 1.8V~3.8V | compliant | 2.4GHz | 256kB Flash 32kB RAM | Bluetooth v4.0 | 3dBm | Bluetooth | 2Mbps | I2C, I2S, SPI, UART | 8.2mA~126.7mA | 16 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EFR32FG1P132F256GM32-B0R | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 32-VFQFN Exposed Pad | YES | -40°C~85°C | Tape & Reel (TR) | 2016 | 柔性壁虎 | yes | Discontinued | 2 (1 Year) | 32 | TxRx + MCU | 8542.39.00.01 | 1.85V~3.8V | QUAD | 无铅 | 1 | 3.3V | 0.5mm | unknown | 2.4GHz | S-XQCC-N32 | I2C, UART, USART | 256kB Flash 32kB RAM | 19.5dBm | General ISM > 1GHZ | 2Mbps | I2C, UART, USART | 8.7mA | 8.8mA~133mA | 2FSK, 4FSK, DSSS, GFSK, GMSK, MSK, O-QPSK | -99.2 dBm | 16 | 0.9mm | 5mm | 5mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||
 | CYW20702B0KWFBG | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 50-WFBGA | YES | -30°C~85°C | Tray | 活跃 | 3 (168 Hours) | 50 | TxRx + MCU | 2.3V~5.5V | BOTTOM | BALL | 1 | 1.22V | 0.5mm | 2.4GHz | R-PBGA-B50 | Bluetooth v4.0 +EDR | 10dBm | Bluetooth | -92dBm | 3Mbps | I2C, I2S, SPI, UART, USB | 32mA | 65mA | 4DQPSK, 8DPSK, GFSK | 7 | 0.8mm | 4.5mm | 4mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| EFR32BG1P333F256IM48-C0 | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 48-VFQFN Exposed Pad | -40°C~85°C | Tray | 蓝壁虎 | 活跃 | 2 (1 Year) | TxRx + MCU | 1.8V~3.8V | compliant | 2.4GHz | 256kB Flash 32kB RAM | Bluetooth v4.0 | 20dBm | Bluetooth | 2Mbps | I2C, I2S, SPI, UART | 8.2mA~126.7mA | 28 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| BCM43455HKUBG | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | 活跃 | 1 (Unlimited) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CYW20732ST | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 48-SMD Module | -30°C~85°C | Tape & Reel (TR) | 活跃 | 3 (168 Hours) | TxRx + MCU | 1.4V~3.6V | 2.4GHz | Bluetooth v4.0 | Bluetooth | I2C, SPI, UART | 14 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | TC35679FSG-002 | Toshiba Semiconductor and Storage | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 60-VFQFN Exposed Pad | YES | -40°C~85°C | Tape & Reel (TR) | yes | 活跃 | 40 | TxRx + MCU | 1.8V~3.6V | QUAD | 无铅 | 未说明 | 1 | 1.1V | 0.4mm | 2.4GHz | 未说明 | S-PQCC-N40 | Bluetooth v4.2 | 0dBm | Bluetooth | -93dBm | I2C, SPI, UART | 3.3mA | 0.9mm | 5mm | 5mm | 符合RoHS标准 |