类别是'射频收发器 IC'
射频收发器 IC (5010)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 安装类型 | 包装/外壳 | 供应商器件包装 | 厂商 | 操作温度 | 系列 | 类型 | 子类别 | 技术 | 电压 - 供电 | 频率 | 工作频率 | 界面 | 内存大小 | 程序存储器类型 | 程序内存大小 | 输出功率 | 数据总线宽度 | 产品类别 | 工作温度范围 | 议定书 | 核心架构 | 功率 - 输出 | 无线电频率系列/标准 | 敏感度 | 数据率(最大) | ADC通道数量 | 串行接口 | 接收电流 | 传输电流 | 定时器数量 | 调制 | [医]GPIO | 产品类别 | 设备核心 | 高度 | 长度 | 宽度 | |||||||||||||||||||||||
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![]() | EFR32FG23A020F512GM48-C | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Silicon Laboratories | Silicon Labs | Details | SMD/SMT | RF System on a Chip - SoC | QFN-48 | 有 | Wireless & RF Integrated Circuits | Si | RF System on a Chip - SoC | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | DA14697-00000HR2 | Renesas | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | DA14697 | 活跃 | MSL 3 - 168 hours | - | 100-VFBGA | 100-VFBGA (5x5) | Renesas Design Germany GmbH | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | - | SmartBond™ | TxRx + MCU | 2.4V ~ 4.75V | 2.4GHz | I2C, QSPI, SPI, UART, USB | - | 512Byte | 32bit | Bluetooth v5.2 | 6dBm | Bluetooth | -97dBm | - | GPIO, I²C, I²S, SPI, UART | - | - | - | 20 | ARM Cortex-M33F | |||||||||||||||||||||||||||||||||
![]() | EFR32MG24B020F1536IM48-B | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | EFR32MG24B020 | 活跃 | 78 MHz | 2 Mbps | + 125 C | 3.8 V | - 40 C | 1.71 V | SMD/SMT | I2C | RAM | 256 kB | 48-VFQFN Exposed Pad | 48-QFN (6x6) | Silicon Labs | Tray | -40°C ~ 125°C (TA) | Mighty Gecko | TxRx + MCU | Wireless & RF Integrated Circuits | Si | 1.71V ~ 3.8V | 2.4GHz | 1536kB Flash, 256kB RAM | Flash | 1536 kB | 20 dBm | 32 bit | Bluetooth v5.3 | 19.5dBm | Bluetooth | -94.8dBm | 2Mbps | ADC, GPIO, I²C, I²S, SPI, IrDA, UART | 4.4mA ~ 5.1mA | 5mA ~ 156.8mA | 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK | 32 | RF System on a Chip - SoC | ||||||||||||||||||||||
![]() | EFR32MG24A010F1024IM48-B | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | EFR32MG24A010 | 活跃 | 78 MHz | 2 Mbps | + 125 C | 3.8 V | - 40 C | 1.71 V | SMD/SMT | I2C | RAM | 128 kB | 48-VFQFN Exposed Pad | 48-QFN (6x6) | Silicon Labs | Tray | -40°C ~ 125°C (TA) | Mighty Gecko | TxRx + MCU | Wireless & RF Integrated Circuits | Si | 1.71V ~ 3.8V | 2.4GHz | 1024kB Flash, 128kB RAM | Flash | 1 MB | 10 dBm | 32 bit | Bluetooth v5.3 | 10dBm | Bluetooth | -94.8dBm | 2Mbps | ADC, GPIO, I²C, I²S, SPI, IrDA, UART | 4.4mA ~ 5.1mA | 5mA ~ 19.1mA | 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK | 32 | RF System on a Chip - SoC | ||||||||||||||||||||||
![]() | EFR32MG24A020F1024IM40-B | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | EFR32MG24A020 | 活跃 | 78 MHz | 2 Mbps | + 125 C | 3.8 V | - 40 C | 1.71 V | SMD/SMT | I2C | RAM | 128 kB | 40-VFQFN Exposed Pad | 40-QFN (5x5) | Silicon Labs | Tray | -40°C ~ 125°C (TA) | Mighty Gecko | TxRx + MCU | Wireless & RF Integrated Circuits | Si | 1.71V ~ 3.8V | 2.4GHz | 1024kB Flash, 128kB RAM | Flash | 1 MB | 20 dBm | 32 bit | Bluetooth v5.3 | 19.5dBm | Bluetooth | -94.8dBm | 2Mbps | ADC, GPIO, I²C, I²S, SPI, IrDA, UART | 4.4mA ~ 5.1mA | 5mA ~ 156.8mA | 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK | 26 | RF System on a Chip - SoC | ||||||||||||||||||||||
![]() | NRF24AP2-1CHC32-R7 | Nordic | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 450-0106C | LSR | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | QT62104 | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | onsemi | Bulk | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 450-0118C | LSR | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 450-0118R | LSR | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EFR32FG25A221F1920IM56-BR | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | EFR32FG25 | 活跃 | 97.5 MHz | 2.4 Mbps | + 125 C | 3.8 V | - 40 C | 1.71 V | SMD/SMT | 186 mA | I2C | 6.28 mA | RAM | 512 kB | 56-VFQFN Exposed Pad | 56-QFN (7x7) | Silicon Labs | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | -40°C ~ 125°C | 柔性壁虎 | 仅TxRx | Wireless & RF Integrated Circuits | Si | 1.71V ~ 3.8V | - | 1.92MB Flash, 512kB RAM | Flash | 1920 kB | 16 dBm | 32 bit | - 40 C to + 125 C | Zigbee® | 16dBm | 802.15.4 | -126.3dBm | 2.4Mbps | GPIO, I²C, IrDA, PWM, SPI, USB | 6.28mA | 58.6mA ~ 186mA | FSK, OFDM, O-QPSK | 37 | RF System on a Chip - SoC | 0.85 mm | 7 mm | 7 mm | ||||||||||||||||
![]() | KW45Z41083AFPBT | NXP | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | KW45B41Z53AFTBT | NXP | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TLSR8271F512ET48 | LINKSEMI | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 32 I/O | 2 Mbps | + 85 C | 3.6 V | - 40 C | 1.8 V | SMD/SMT | 4.9 mA | I2C, I2S, SPI, UART, USB | 4.6 mA | SRAM | 32 kB | QFN-48 | 32 MHz | TLSR827X | BLE | Wireless & RF Integrated Circuits | Si | 2.4 GHz | Flash | 512 kB | 10 dBm | 32 bit | - 93 dBm | 10 Channel | 3 x 32 bit | RF System on a Chip - SoC | |||||||||||||||||||||||||||||||||||
![]() | TLSR8251F512ET32 | LINKSEMI | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 17 I/O | 2 Mbps | + 85 C | 3.6 V | - 40 C | 1.8 V | SMD/SMT | 4.8 mA | I2C, I2S, SPI, UART, USB | 5.3 mA | SRAM | 64 kB | QFN-32 | 32 kHz | TLSR825X | BLE 5.0 | Wireless & RF Integrated Circuits | Si | 2.4 GHz | Flash | 512 kB | 10 dBm | 32 bit | - 93 dBm | 10 Channel | 3 x 32 bit | RF System on a Chip - SoC | |||||||||||||||||||||||||||||||||||
![]() | TLSR8278F1KET48 | LINKSEMI | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 32 I/O | 2 Mbps | + 85 C | 3.6 V | - 40 C | 1.8 V | SMD/SMT | 4.9 mA | I2C, I2S, SPI, UART, USB | 4.6 mA | SRAM | 64 kB | TQFN-48 | 32 MHz | TLSR827X | BLE 5.1, multi-antenna AoA/AoD, BLE Mesh, 802.15.4, Zigbee 3.0, RF4CE, HomeKit, Dual-Mode, 2.4G Proprietary | Wireless & RF Integrated Circuits | Si | 2.4 GHz | Flash | 1 MB | 10 dBm | 32 bit | - 93 dBm | 10 Channel | 3 x 32 bit | RF System on a Chip - SoC | |||||||||||||||||||||||||||||||||||
![]() | NRF7001-QFAA-R7 | Nordic | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Wireless & RF Integrated Circuits | Si | RF System on a Chip - SoC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | DA14531-01000FX2 | Renesas | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1 Mbps | + 85 C | 3.6 V | - 40 C | 1.8 V | SMD/SMT | 3.5 mA | 2.2 mA | RAM | 48 kB | FCGQFN-24 | 16 MHz | Bluetooth 5.1 | Wireless & RF Integrated Circuits | Si | 2.4 GHz | OTP | 32 kB | 2.5 dBm | - 94 dBm | RF System on a Chip - SoC | |||||||||||||||||||||||||||||||||||||||||
![]() | CYW4319GKUBGT | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Obsolete | 138-UFBGA, WLBGA | 138-WLBGA (5.74x4.53) | Infineon Technologies | Tape & Reel (TR) | -30°C ~ 85°C | - | TxRx + MCU | 3.3V | 2.4GHz, 5GHz | 802.11a/b/g/n | 20dBm | WiFi | -94dBm | 54Mbps | SPI, UART, USB | 16QAM, 64QAM, BPSK, CCK, DSSS, QPSK | 8 | |||||||||||||||||||||||||||||||||||||||||||
![]() | DA16200-00000F22 | Renesas | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | - | DA16200 | 活跃 | MSL 3 - 168 hours | 160 MHz | DA16200 | 54 Mbps | + 85 C | 3.6 V | - 40 C | 2.1 V | SMD/SMT | 280 mA | GPIO, I2C, I2S, JTAG, SDIO, SPI, UART | 38.5 mA | SRAM | 512 kB | - | - | Renesas Design Germany GmbH | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | - | - | - | Wireless & RF Integrated Circuits | Si | - | - | 2.4 GHz | - | OTP | 8 kB, 256 kB | 20 dBm | 32 bit | - | ARM Cortex-M4F | - | - | - | - | 4 Channel | - | - | - | - | RF System on a Chip - SoC | 0.4 mm | 3.8 mm | 3.8 mm | |||||||||||||
![]() | RF430F5144S1RKVRQ1 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | RF430 | 活跃 | 德州仪器 | Bulk | * | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | DA14705-00000HZ2 | Renesas | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | DA14705 | 活跃 | 160 MHz | 2 Mbps | + 85 C | 4.75 V | - 40 C | 2.9 V | SMD/SMT | 3 mA | 1.85 mA | 1.5 MB | 142-VFBGA | 142-VFBGA (6.2x6) | Renesas Design Germany GmbH | Tape & Reel (TR) | -40°C ~ 85°C (TA) | - | TxRx + MCU | Wireless & RF Integrated Circuits | Si | 2.9V ~ 4.75V | 2.4GHz | 2.4 GHz | 4kB OTP, 32kB ROM, 1.5MB SRAM | OTP | 4 kB | 6 dBm | Bluetooth v5.2 | 6dBm | Bluetooth | -97dBm | 2Mbps | GPIO, I²C, I²S, PCM, PDM, SPI, UART, USB | 1.85mA | 1.1mA ~ 5.2mA | - | 79 | RF System on a Chip - SoC | ||||||||||||||||||||||
![]() | QT7810C | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | QT7810 | Obsolete | 225-VFBGA, FCBGA | 225-FCBGA (10x10) | onsemi | Bulk | - | - | 仅TxRx | - | 20MHz ~ 5GHz | - | 802.11a/-c/ax | - | General ISM > 1GHz, WiFi | - | - | - | - | - | - | ||||||||||||||||||||||||||||||||||||||||
![]() | DA14691-00000HQ2 | Renesas | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | DA14691 | 活跃 | MSL 3 - 168 hours | - | 96 MHz | 44 I/O | 1 Mbps | + 85 C | 4.75 V | - 40 C | 2.4 V | SMD/SMT | 3 mA | I2C, I2S, SPI, UART, USB | 1.8 mA | SRAM | 384 kB | 86-VFBGA | 86-VFBGA (6x6) | Renesas Design Germany GmbH | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | - | SmartBond™ | TxRx + MCU | Wireless & RF Integrated Circuits | Si | 2.4V ~ 4.75V | 2.4GHz | 2.4 GHz | I2C, QSPI, SPI, UART, USB | - | OTP | 384Byte | 6 dBm | 32bit | Bluetooth v5.2 | 6dBm | Bluetooth | -97dBm | - | 16 Channel | GPIO, I²C, I²S, SPI, UART | - | - | 4 Timer | - | 20 | RF System on a Chip - SoC | ARM Cortex-M33F | 0.9 mm | 6 mm | 6 mm | |||||||||
![]() | EFR32MG24B220F1536IM48-BR | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | EFR32MG24B220 | 活跃 | 78 MHz | 2 Mbps | + 125 C | 3.8 V | - 40 C | 1.71 V | SMD/SMT | I2C | RAM | 256 kB | 48-VFQFN Exposed Pad | 48-QFN (6x6) | Silicon Labs | Tape & Reel (TR) | -40°C ~ 125°C (TA) | Mighty Gecko | TxRx + MCU | Wireless & RF Integrated Circuits | Si | 1.71V ~ 3.8V | 2.4GHz | 1536kB Flash, 256kB RAM | Flash | 1536 kB | 20 dBm | 32 bit | Bluetooth v5.3 | 19.5dBm | Bluetooth | -94.8dBm | 2Mbps | ADC, GPIO, I²C, I²S, SPI, IrDA, UART | 4.4mA ~ 5.1mA | 5mA ~ 156.8mA | 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK | 32 | RF System on a Chip - SoC |