类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 端口的数量 | 电源电流 | 操作模式 | 时钟频率 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 最高频率 | 访问时间（最大） | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 环境温度范围高 | 通用闪存接口 | I2C控制字节 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | FM28V100-TGTR | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 32-TFSOP (0.465, 11.80mm Width) | 32 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2013 | F-RAM™ | e3 | 活跃 | 3 (168 Hours) | 32 | EAR99 | PURE TIN | 2V~3.6V | DUAL | 260 | 1 | 3V | 0.5mm | 40 | FM28V100 | 32 | 不合格 | 3.3V | 3.6V | 2.7V | 1Mb 128K x 8 | 12mA | SYNCHRONOUS | FRAM | Parallel | 8b | 128KX8 | 8 | 90ns | 1 Mb | 0.00015A | 105 ns | 8b | 1.2mm | 11.8mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | S29GL256P11FFIV20 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 64-LBGA | 64 | Non-Volatile | -40°C~85°C TA | Tray | 2015 | GL-P | e1 | 活跃 | 3 (168 Hours) | 64 | 3A991.B.1.A | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.32.00.51 | 1.65V~3.6V | BOTTOM | 260 | 1 | 3V | 1mm | 40 | 3.6V | 1.8/3.33/3.3V | 2.7V | 256Mb 32M x 8 | 110mA | FLASH | Parallel | 8b | 256MX1 | 1 | 110ns | 256 Mb | 0.000005A | 110 ns | Asynchronous | 3V | 8 | YES | YES | YES | 256 | 128K | 8/16words | YES | YES | 1.4mm | 13mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||
 | AT24MAC402-SSHM-B | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 2 Weeks | Gold | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2011 | e4 | yes | 活跃 | 3 (168 Hours) | 8 | 1.7V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | AT24MAC402 | 5.5V | 1.7V | 2-Wire, I2C, Serial | 2Kb 256 x 8 | SYNCHRONOUS | 1MHz | 550ns | EEPROM | I2C | 8 | 5ms | 2 kb | I2C | 5ms | 1.75mm | 4.925mm | 3.9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | FM24V10-G | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | 540.001716mg | Non-Volatile | -40°C~85°C TA | Tube | 2008 | F-RAM™ | e3 | 活跃 | 3 (168 Hours) | 8 | EAR99 | Tin (Sn) | 2V~3.6V | DUAL | 260 | 1 | 3.3V | 1.27mm | 30 | FM24V10 | 8 | 3.3V | 3.6V | 2V | 1Mb 128K x 8 | 1mA | 3.4MHz | 130ns | FRAM | I2C | 8b | 1 Mb | 0.00015A | 8b | 85°C | 1.727mm | 4.98mm | 3.987mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT25128B-MAHL-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Gold | 表面贴装 | 表面贴装 | 8-UFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 1997 | e4 | yes | 活跃 | 3 (168 Hours) | 8 | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 0.5mm | 40 | AT25128 | 5.5V | 2/5V | SPI, Serial | 128Kb 16K x 8 | 10mA | 20MHz | 80 ns | EEPROM | SPI | 8 | 5ms | 128 kb | 0.000003A | SPI | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE/SOFTWARE | 0.6mm | 3mm | 2mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24LC024H-I/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Tin | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2008 | e3 | 活跃 | 1 (Unlimited) | 8 | 通孔 | EAR99 | 2.5V~5.5V | DUAL | 1 | 4.5V | 2.54mm | 24LC024H | 8 | 5V | 2-Wire, I2C, Serial | 2Kb 256 x 8 | 3mA | 1MHz | 400ns | EEPROM | I2C | 5ms | 2 kb | I2C | 5ms | 4.953mm | 10.16mm | 7.112mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT45DB321D-SU | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | SOIC | 8 | DataFLASH, FLASH, NOR | 1997 | Discontinued | SMD/SMT | 85°C | -40°C | 66MHz | 3.3V | SPI, Serial | 3.6V | 2.7V | 4MB | 15mA | 6 ns | 1b | 32 Mb | Synchronous | 8b | 1.7mm | 5.38mm | 5.41mm | 无 | 无SVHC | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT28C010-12TU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 32-TFSOP (0.724, 18.40mm Width) | 32 | Non-Volatile | -40°C~85°C TC | Tray | 1997 | e3 | yes | 活跃 | 3 (168 Hours) | 32 | Matte Tin (Sn) | 4.5V~5.5V | DUAL | 1 | 5V | 0.5mm | 5MHz | AT28C010 | 5V | 5V | Parallel, SPI | 1Mb 128K x 8 | 40mA | 120ns | EEPROM | Parallel | 128KX8 | 8 | 10ms | 1 Mb | 0.0002A | 5V | 10000 Write/Erase Cycles | 10ms | YES | YES | 128words | 1.2mm | 18.4mm | 8mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||
 | AT28HC256E-12SU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3 Weeks | 表面贴装 | 表面贴装 | 28-SOIC (0.295, 7.50mm Width) | 28 | Non-Volatile | -40°C~85°C TC | Tube | 1997 | e3 | yes | 活跃 | 3 (168 Hours) | 28 | Matte Tin (Sn) - annealed | 4.5V~5.5V | DUAL | 250 | 1 | 5V | 1.27mm | 40 | AT28HC256 | 5V | 5V | 256Kb 32K x 8 | 80mA | 120ns | EEPROM | Parallel | 32KX8 | 8 | 10ms | 256 kb | 0.0003A | 5V | 100000 Write/Erase Cycles | 10ms | YES | YES | NO | 64words | 2.65mm | 17.9mm | 7.5mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
 | 93AA66BT-I/OT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | SOT-23-6 | 6 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2005 | e3 | yes | 活跃 | 1 (Unlimited) | 6 | SMD/SMT | Matte Tin (Sn) | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 0.95mm | 40 | 93AA66B | 6 | 5.5V | 2/5V | 1.8V | Serial | 4Kb 256 x 16 | 2mA | 2MHz | 250 ns | EEPROM | SPI | 6ms | 4 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 200 | SOFTWARE | 1.3mm | 3.1mm | 1.8mm | 无 | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
 | 11LC010-I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2008 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | SMD/SMT | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 11LC010 | 8 | 5V | Serial | 1Kb 128 x 8 | 5mA | 100kHz | 5 ms | EEPROM | 单线 | 8 | 1 kb | 0.000005A | 1-WIRE | 1000000 Write/Erase Cycles | 10ms | 200 | SOFTWARE | 1.75mm | 4.9mm | 3.9mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||
 | 24AA08T-I/MC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-VFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2008 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | 1.7V~5.5V | DUAL | 260 | 1 | 2.5V | 0.5mm | 40 | 24AA08 | 8 | 5.5V | 2/5V | 1.7V | I2C, Serial | 8Kb 256 x 8 x 4 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 8 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010XMMR | 1mm | 3mm | 2mm | 无 | ROHS3 Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||
 | S25FL256SAGNFI000 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | Tin | 表面贴装 | 表面贴装 | 8-WDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tray | 2013 | FL-S | e3 | 活跃 | 3 (168 Hours) | 8 | 3A991.B.1.A | IT ALSO CONFIGURED AS 256M X 1 | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 1.27mm | 30 | 3.6V | 3/3.3V | 2.7V | SPI | 256Mb 32M x 8 | 75mA | 133MHz | 8 ns | FLASH | SPI - Quad I/O | 8b | 64MX4 | 4 | 1b | 256 Mb | 0.0001A | SERIAL | Synchronous | 1b | 3V | SPI | 100000 Write/Erase Cycles | 500ms | 20 | HARDWARE/SOFTWARE | 2 | BOTTOM | 85°C | 800μm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||
 | S29GL256P90TFCR10 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | Tin | 表面贴装 | 表面贴装 | 56-TFSOP (0.724, 18.40mm Width) | 56 | Non-Volatile | 0°C~85°C TA | Tray | 2012 | GL-P | e3 | 活跃 | 3 (168 Hours) | 56 | 3A991.B.1.A | 8542.32.00.51 | 3V~3.6V | DUAL | 260 | 1 | 3.3V | 0.5mm | 40 | 3.3V | 3.6V | 3V | 256Mb 32M x 8 | 110mA | FLASH | Parallel | 8b | 1 | 90ns | 256 Mb | 0.000005A | 90 ns | Asynchronous | 3V | 8 | YES | YES | YES | 256 | 128K | 8/16words | YES | YES | 1.2mm | 18.4mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
| AT24C01D-PUM | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 通孔 | 8-DIP (0.300, 7.62mm) | NO | Non-Volatile | -40°C~85°C TC | Tube | 1997 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | Matte Tin (Sn) - annealed | ALSO COMPATIBLE WITH 2.5 V AT 1 MHZ | 1.7V~3.6V | DUAL | NOT APPLICABLE | 1 | 1.8V | 2.54mm | NOT APPLICABLE | AT24C01 | R-PDIP-T8 | 不合格 | 3.6V | 1.8/3.3V | 1.7V | 2-Wire, I2C, Serial | 1Kb 128 x 8 | SYNCHRONOUS | 1MHz | 4.5μs | EEPROM | I2C | 128X8 | 8 | 5ms | 4e-7A | 1024 bit | I2C | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE | 1010DDDR | 5.334mm | 9.271mm | 7.62mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
| 25C080-E/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2004 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 25C080 | 8 | 5V | 5V | SPI, Serial | 8Kb 1K x 8 | 5mA | 3MHz | 150 ns | EEPROM | SPI | 8 | 5ms | 8 kb | 0.000005A | SPI | 10000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1.75mm | 4.9mm | 3.91mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||
 | SST26VF016-80-5I-QAE-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 8-WDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2005 | SST26 SQI® | e3 | 活跃 | 3 (168 Hours) | 8 | Matte Tin (Sn) - annealed | 2.7V~3.6V | DUAL | 1.27mm | SST26VF016 | 3.3V | SPI, Serial | 16Mb 2M x 8 | 18mA | 80MHz | 6 ns | FLASH | SPI - Quad I/O | 8b | 8 | 1.5ms | 1b | 16 Mb | 0.000015A | Synchronous | SPI | 100000 Write/Erase Cycles | 100 | SOFTWARE | 256B | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MB85RS64PNF-G-JNERE1 | Fujitsu Electronics America, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8-SOP | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 活跃 | 3 (168 Hours) | 2.7V~3.6V | 64Kb 8K x 8 | 20MHz | FRAM | SPI | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M24C64-WMN6T | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | e0 | no | Obsolete | 1 (Unlimited) | 8 | EAR99 | 00.1.142 | 2.5V~5.5V | DUAL | 1 | 5V | 1.27mm | M24C64 | 8 | 5.5V | 3/5V | 2.5V | 2-Wire, I2C, Serial | 64Kb 8K x 8 | 1MHz | 450ns | EEPROM | I2C | OPEN-DRAIN | 5ms | 64 kb | 0.000002A | I2C | 1000000 Write/Erase Cycles | 10ms | 40 | HARDWARE | 1010DDDR | 1.25mm | 4.9mm | 3.9mm | 无 | 无SVHC | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C109D-10VXIT | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 32-BSOJ (0.400, 10.16mm Width) | 32 | Volatile | -40°C~85°C TA | Tape & Reel (TR) | 1996 | e4 | yes | 活跃 | 3 (168 Hours) | 32 | Nickel/Palladium/Gold (Ni/Pd/Au) | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 30 | CY7C109 | 5V | 5V | 1Mb 128K x 8 | 1 | 80mA | SRAM | Parallel | 3-STATE | 8 | 10ns | 17b | 1 Mb | 0.003A | 100MHz | COMMON | Asynchronous | 8b | 2V | 3.7592mm | 20.955mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1515KV18-250BZC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 165-LBGA | 165 | Volatile | 0°C~70°C TA | Tray | 2003 | e0 | 活跃 | 3 (168 Hours) | 165 | Tin/Lead (Sn/Pb) | 流水线结构 | 1.7V~1.9V | BOTTOM | 235 | 1 | 1.8V | 1mm | 20 | CY7C1515 | 165 | 1.8V | 1.9V | 1.7V | 72Mb 2M x 36 | 2 | 680mA | 250MHz | 450 ps | SRAM | Parallel | 3-STATE | 36 | 19b | 72 Mb | SEPARATE | Synchronous | 36b | 1.7V | 1.4mm | 15mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||
 | 25LC160B-E/MS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2004 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 40 | 25LC160B | 8 | 5.5V | 3/5V | 2.5V | SPI, Serial | 16Kb 2K x 8 | 6mA | 10MHz | 100 ns | EEPROM | SPI | 8 | 5ms | 16 kb | 0.000005A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1.1mm | 3mm | 3mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||
 | SST39VF3202-70-4C-EKE | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | YES | 48 | Non-Volatile | 0°C~70°C TA | Tray | 2000 | SST39 MPF™ | e3 | yes | 活跃 | 3 (168 Hours) | 48 | SMD/SMT | 3A991.B.1.A | Matte Tin (Sn) - annealed | TOP BOOT BLOCK | 8542.32.00.51 | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 0.5mm | 40 | SST39VF3202 | 48 | 3.3V | 3.6V | 2.7V | 32Mb 2M x 16 | 18mA | 70ns | FLASH | Parallel | 16b | 2MX16 | 16 | 10μs | 21b | 32 Mb | 0.00002A | Asynchronous | 16b | 2.7V | YES | YES | YES | 1K | 2K | TOP | YES | 1.2mm | 18.4mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||
 | CY7C026AV-20AXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 100-LQFP | 100 | Volatile | 0°C~70°C TA | Tray | 2003 | e4 | yes | Obsolete | 3 (168 Hours) | 100 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | FLOW-THROUGH | 3V~3.6V | QUAD | 260 | 1 | 3.3V | 0.5mm | 20GHz | 30 | CY7C026 | 100 | 3.3V | 3.6V | 3V | 256Kb 16K x 16 | 2 | 175mA | SRAM | Parallel | 16KX16 | 3-STATE | 16 | 20ns | 28b | 256 kb | 0.00005A | COMMON | Asynchronous | 16b | 2V | 1.6mm | 14mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||
| 24LC024HT-I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Gold | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2008 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) - annealed | 2.5V~5.5V | DUAL | 260 | 1 | 4.5V | 1.27mm | 40 | 24LC024H | 8 | 5V | I2C, Serial | 2Kb 256 x 8 | 3mA | 1MHz | 400ns | EEPROM | I2C | 8 | 5ms | 2 kb | I2C | 5ms | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant |