类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | 额定电流 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 电源电流 | 操作模式 | 最大电源电流 | 时钟频率 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 无卤素 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 最高频率 | 筛选水平 | 访问时间（最大） | 并行/串行 | 同步/异步 | 字长 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 环境温度范围高 | 通用闪存接口 | I2C控制字节 | 反向引脚排列 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | AT28C256-15JU-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 32-LCC (J-Lead) | YES | Non-Volatile | -40°C~85°C TC | Tape & Reel (TR) | 1997 | e3 | 活跃 | 3 (168 Hours) | 32 | Matte Tin (Sn) - annealed | 4.5V~5.5V | QUAD | 245 | 1 | 5V | 1.27mm | 40 | R-PQCC-J32 | 5.5V | 4.5V | 256Kb 32K x 8 | ASYNCHRONOUS | 150ns | EEPROM | Parallel | 32KX8 | 8 | 10ms | 262144 bit | 5V | 10ms | 3.556mm | 13.97mm | 11.43mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST39VF6402B-70-4C-B1KE | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 48-TFBGA | 48 | Non-Volatile | 0°C~70°C TA | Tray | 2000 | SST39 MPF™ | e1 | yes | 活跃 | 3 (168 Hours) | 48 | 3A991.B.1.A | Tin/Silver/Copper (Sn/Ag/Cu) | TOP BOOT BLOCK | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 260 | 1 | 3V | 0.8mm | 40 | SST39VF6402B | 48 | 3.3V | 3.6V | 2.7V | 64Mb 4M x 16 | 18mA | 70ns | FLASH | Parallel | 16b | 4MX16 | 16 | 10μs | 22b | 64 Mb | 0.00002A | Asynchronous | 16b | 2.7V | YES | YES | YES | 2K | 2K | TOP | YES | 1.2mm | 10mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||
| AT28HC64BF-12JU-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 32-LCC (J-Lead) | YES | Non-Volatile | -40°C~85°C TC | Tape & Reel (TR) | 2017 | 活跃 | 3 (168 Hours) | 32 | 4.5V~5.5V | DUAL | 1 | 5V | 1.27mm | R-PDSO-G32 | 5.5V | 4.5V | 64Kb 8K x 8 | ASYNCHRONOUS | 120ns | EEPROM | Parallel | 8KX8 | 8 | 10ms | 65536 bit | 5V | 10ms | 3.556mm | 13.97mm | 11.43mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24AA04H-I/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Automotive grade | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2008 | e3 | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.7V~5.5V | DUAL | 260 | 1 | 0.65mm | 40 | 24AA04H | 8 | 5V | 1.7V | I2C, Serial | 4Kb 256 x 8 x 2 | 3mA | 400kHz | 900ns | EEPROM | I2C | OPEN-DRAIN | 8 | 5ms | 4 kb | 0.000001A | ISO/TS-16949 | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | YES | 16words | 1010XXMR | NO | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
 | W25Q80DVSNIG | Winbond Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tube | 2010 | SpiFlash® | e3 | 活跃 | 3 (168 Hours) | 8 | Tin (Sn) | 2.7V~3.6V | DUAL | 未说明 | 1 | 3V | 1.27mm | 未说明 | R-PDSO-G8 | 不合格 | 3.6V | 3/3.3V | 2.7V | 8Mb 1M x 8 | SYNCHRONOUS | 104MHz | FLASH | SPI | 8MX1 | 1 | 3ms | 0.000005A | 8388608 bit | SERIAL | 3V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 85°C | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CAT24C01WI-GT3 | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | LAST SHIPMENTS (Last Updated: 2 days ago) | Gold | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2009 | e4 | yes | Obsolete | 1 (Unlimited) | 8 | EAR99 | 1.7V~5.5V | DUAL | 260 | 1 | 3.3V | 1.27mm | 40 | CAT24C01 | 8 | 5V | 1.7V | 2-Wire, I2C, Serial | 1Kb 128 x 8 | 2mA | 400kHz | 900ns | EEPROM | I2C | 1KX1 | 无卤素 | 1 | 5ms | 1 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE | 1010DDDR | 1.75mm | 4.9mm | 3.9mm | 无 | 无SVHC | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||
 | AT25010B-XHL-B | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 1997 | e4 | yes | 活跃 | 3 (168 Hours) | 8 | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 40 | AT25010 | 5.5V | 2/5V | SPI, Serial | 1Kb 128 x 8 | 10mA | 20MHz | 80 ns | EEPROM | SPI | 8 | 5ms | 1 kb | 5e-7A | SPI | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE/SOFTWARE | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M24C08-FMN6TP | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.7V~5.5V | DUAL | 1 | 1.8V | 1.27mm | M24C08 | 5.5V | 1.7V | 2-Wire, I2C, Serial | 8Kb 1K x 8 | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 8 kb | I2C | 5ms | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S25FL128SAGMFI003 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | Tin | 表面贴装 | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | 16 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2013 | FL-S | e3 | 活跃 | 3 (168 Hours) | 16 | IT ALSO CONFIGURED AS 256M X 1 | 8542.32.00.51 | 2.7V~3.6V | DUAL | 1 | 3V | 1.27mm | 3.6V | 3/3.3V | 2.7V | SPI, Serial | 128Mb 16M x 8 | 75mA | 133MHz | 8 ns | FLASH | SPI - Quad I/O | 8b | 32MX4 | 4 | 1b | 128 Mb | 0.0001A | Synchronous | 1b | 3V | SPI | 100000 Write/Erase Cycles | 500ms | 20 | HARDWARE/SOFTWARE | 2 | BOTTOM | 2.65mm | 10.3mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||
 | BR24T08FJ-WE2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | Copper, Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2013 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | Matte Tin (Sn) | 1.6V~5.5V | DUAL | 225 | 1 | 2.5V | 1.27mm | 未说明 | BR24T08 | 不合格 | 5.5V | 1.6V | 2-Wire, I2C, Serial | 8Kb 1K x 8 | SYNCHRONOUS | 400kHz | 900 ns | EEPROM | I2C | 8 | 5ms | 8 kb | 0.000002A | I2C | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE | 1010DMMR | 1.65mm | 4.9mm | 3.9mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
| CAT24C16WI-G | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | Industrial grade | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2008 | e4 | yes | 活跃 | 1 (Unlimited) | 8 | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.7V~5.5V | DUAL | 未说明 | 1 | 3.3V | 1.27mm | 未说明 | CAT24C16 | 8 | 不合格 | 5.5V | 1.7V | 16Kb 2K x 8 | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 16KX1 | 1 | 5ms | 0.000001A | SERIAL | I2C | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE | 1010MMMR | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | 93LC66T/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 29 Weeks | Tin | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | 0°C~70°C TA | Tape & Reel (TR) | 2004 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 100K ERASE/WRITE CYCLES MIN; DATA RETENTION > 40 YEARS | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 93LC66 | 8 | 6V | 3/5V | 2V | 2-Wire, Serial | 4Kb 512 x 8 256 x 16 | 3mA | 2MHz | 6 ms | EEPROM | SPI | 3-STATE | 8 | 10ms | 4 kb | 0.00003A | MICROWIRE | 10000000 Write/Erase Cycles | 10ms | 200 | SOFTWARE | 16 | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||
| 11AA080-I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | 8-SOIC | Non-Volatile | -40°C~85°C TA | Tube | 2008 | 活跃 | 1 (Unlimited) | 85°C | -40°C | 1.8V~5.5V | 100kHz | 11AA080 | Serial | 5.5V | 1.8V | 8Kb 1K x 8 | 5mA | 100kHz | 5 ms | EEPROM | 单线 | 5ms | 8 kb | 100kHz | 1.25mm | 4.9mm | 3.9mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 93AA46AT-I/MS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2003 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 40 | 93AA46A | 8 | 5.5V | 2/5V | Serial | 1Kb 128 x 8 | 2mA | 2MHz | 250 ns | EEPROM | SPI | 8 | 6ms | 1 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 6ms | 200 | SOFTWARE | 1.1mm | 3mm | 3mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
| 25C040T-I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2006 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | DATA RETENTION > 200 YEARS; 1M ENDURANCE CYCLES | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 25C040 | 8 | 5V | 5V | SPI, Serial | 4Kb 512 x 8 | 5mA | 3MHz | 150 ns | EEPROM | SPI | 8 | 5ms | 4 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1.75mm | 4.9mm | 3.91mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT24C32E-SSHM-B | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | Non-Volatile | -40°C~85°C TC | Tube | 1997 | e4 | yes | 活跃 | 3 (168 Hours) | 8 | Nickel/Palladium/Gold (Ni/Pd/Au) | ALSO OPERATES AT MIN 1.7 V AT 100 KHZ AND 400 KHZ | 1.7V~3.6V | DUAL | 260 | 1 | 3V | 1.27mm | 40 | AT24C32E | R-PDSO-G8 | 3.6V | 2.5V | 2-Wire, I2C, Serial | 32Kb 4K x 8 | SYNCHRONOUS | 1MHz | 450ns | EEPROM | I2C | 4KX8 | 8 | 5ms | 32768 bit | I2C | 5ms | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24LC64X-I/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2002 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 40 | 24LC64 | 8 | 5.5V | 2/5V | 2.5V | I2C, Serial | 64Kb 8K x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 5ms | 64 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 1.05mm | 4.5mm | 3.1mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | S29GL512S11TFI020 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | Tin | 表面贴装 | 表面贴装 | 56-TFSOP (0.724, 18.40mm Width) | 56 | Non-Volatile | -40°C~85°C TA | Tray | 2011 | GL-S | 活跃 | 3 (168 Hours) | 56 | 3A991.B.1.A | 8542.32.00.51 | 2.7V~3.6V | DUAL | 1 | 3V | 0.5mm | 3.6V | 3/3.3V | 2.7V | 512Mb 32M x 16 | 60mA | 110ns | FLASH | Parallel | 16b | 64MX8 | 60ns | 25b | 512 Mb | 0.0001A | Asynchronous | 16b | 2.7V | YES | YES | YES | 512 | 64K | 32B | YES | YES | 1.05mm | 18.5mm | 14.1mm | 无 | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
| IS25LQ040B-JNLE | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~105°C TA | Bulk | e3 | 活跃 | 3 (168 Hours) | 8 | Tin (Sn) | 2.3V~3.6V | DUAL | 未说明 | 1 | 3V | 1.27mm | 未说明 | 3.3V | 3.6V | 2.3V | SPI | 4Mb 512K x 8 | SYNCHRONOUS | 104MHz | 8 ns | FLASH | SPI - Quad I/O | 4MX1 | 1 | 800μs | 24b | 4 Mb | SERIAL | 3V | 256B | 1.75mm | 4.9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | FM25W256-G | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | 540.001716mg | Non-Volatile | -40°C~85°C TA | Tube | 2008 | F-RAM™ | e3 | 活跃 | 3 (168 Hours) | 8 | EAR99 | 2.7V~5.5V | DUAL | 260 | 1 | 3.3V | 1.27mm | 6A | 30 | FM25W256 | 8 | 不合格 | 3.3V | 5.5V | 3/5V | 2.7V | 256Kb 32K x 8 | 2mA | SYNCHRONOUS | 20MHz | 20 ns | FRAM | SPI | 8b | 256 kb | 0.00003A | 8b | 85°C | 1.727mm | 4.98mm | 3.987mm | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | S25FL128SAGNFI001 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 8-WDFN Exposed Pad | YES | 8 | 10.886217mg | Non-Volatile | -40°C~85°C TA | Tube | 2013 | FL-S | e3 | 活跃 | 3 (168 Hours) | 8 | 3A991.B.1.A | Matte Tin (Sn) | IT ALSO CONFIGURED AS 256M X 1 | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 1.27mm | 30 | 3.6V | 3/3.3V | 2.7V | SPI, Serial | 128Mb 16M x 8 | 75mA | 35mA | 133MHz | 8 ns | FLASH | SPI - Quad I/O | 8b | 32MX4 | 4 | 1b | 128 Mb | 0.0001A | Synchronous | 1b | 3V | SPI | 100000 Write/Erase Cycles | 500ms | 20 | HARDWARE/SOFTWARE | 2 | BOTTOM | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||
 | SST39LF400A-55-4C-EKE | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | YES | 48 | Non-Volatile | 0°C~70°C TA | Tray | 2000 | SST39 MPF™ | e3 | yes | 活跃 | 3 (168 Hours) | 48 | 3A991.B.1.A | Matte Tin (Sn) - annealed | 8542.32.00.51 | 3V~3.6V | DUAL | 260 | 1 | 3.3V | 0.5mm | 40 | SST39LF400A | 48 | 3.3V | 3.6V | 3V | 4Mb 256K x 16 | 30mA | 55ns | FLASH | Parallel | 16b | 256KX16 | 16 | 20μs | 18b | 4 Mb | 0.00002A | Asynchronous | 16b | 3V | YES | YES | YES | 128 | 2K | YES | 1.2mm | 18.4mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||
 | PC48F4400P0VB0EE | Micron Technology Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Copper, Silver, Tin | 表面贴装 | 64-LBGA | YES | 64 | Non-Volatile | -40°C~85°C TC | Tray | 2010 | Axcell™ | e1 | yes | Obsolete | 3 (168 Hours) | 64 | 3A991.B.1.A | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.32.00.51 | 1.7V~2V | BOTTOM | 260 | 1 | 1.8V | 1mm | 30 | 48F4400P0 | 64 | 1.8V | 1.81.8/3.3V | 1.7V | Parallel, Serial | 512Mb 32M x 16 | 31mA | 52MHz | FLASH | Parallel | 32MX16 | 16 | 100ns | 25b | 512 Mb | 0.00042A | 100 ns | Asynchronous | 16b | NO | NO | 8 510 | BOTTOM/TOP | 1.2mm | 13mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
| SST39WF1601-70-4C-B3KE | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 48-TFBGA | YES | 48 | Non-Volatile | 0°C~70°C TA | Tray | 2000 | SST39 MPF™ | e1 | yes | 活跃 | 3 (168 Hours) | 48 | 3A991.B.1.A | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM BOOT-BLOCK | 8542.32.00.51 | 1.65V~1.95V | BOTTOM | 260 | 1 | 1.8V | 0.8mm | 40 | SST39WF1601 | 48 | 1.8V | 1.95V | 1.65V | 16Mb 1M x 16 | 10mA | 70ns | FLASH | Parallel | 16b | 1MX16 | 16 | 40μs | 20b | 16 Mb | 0.00004A | Asynchronous | 16b | YES | YES | YES | 512 | 2K | BOTTOM | YES | 1.2mm | 8mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||
.png) | AT28C64B-15SUSL383 | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 |