类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 最大功率耗散 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 端口的数量 | 电源电流 | 内存大小 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 逻辑功能 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 无卤素 | 座位高度-最大 | 内存宽度 | 定时器/计数器的数量 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 核心架构 | 最高频率 | 筛选水平 | 访问时间（最大） | 并行/串行 | I/O类型 | 可编程I/O数 | 同步/异步 | 字长 | 内存IC类型 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 输出启用 | 扇区/尺寸数 | 行业规模 | 时间格式 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 通用闪存接口 | I2C控制字节 | 反向引脚排列 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||||||||||||||||||||||||
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 | 93LC56/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 28 Weeks | 通孔 | 8-DIP (0.300, 7.62mm) | NO | 8 | Non-Volatile | 0°C~70°C TA | Tube | e3 | yes | 活跃 | 不适用 | 8 | EAR99 | Matte Tin (Sn) | 100K ERASE/WRITE CYCLES MIN; DATA RETENTION > 40 YEARS | 2.5V~5.5V | DUAL | 1 | 5V | 2.54mm | 93LC56 | 8 | 2.5V | 6V | 3/5V | 2V | Serial | 3mA | 2Kb 256 x 8 128 x 16 | 2MHz | 2 μs | EEPROM | SPI | 3-STATE | 8 | 10ms | 2 kb | 0.00003A | MICROWIRE | 10000000 Write/Erase Cycles | 10ms | 200 | SOFTWARE | 16 | 4.064mm | 9.9695mm | 7.62mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M29W160EB70ZA6E | Micron Technology Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 48-TFBGA | YES | 48 | Non-Volatile | -40°C~85°C TA | Tray | 1998 | e1 | yes | Obsolete | 3 (168 Hours) | 48 | SMD/SMT | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 底部启动区块 | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 260 | 1 | 3V | 0.8mm | 30 | M29W160 | 48 | 3/3.3V | 2.7V | 10mA | 16Mb 2M x 8 1M x 16 | FLASH | Parallel | 1MX16 | 16 | 70ns | 16 Mb | 0.0001A | 70 ns | Asynchronous | 8 | YES | YES | YES | 12131 | 16K8K32K64K | YES | BOTTOM | YES | 1.2mm | 8mm | 6mm | 无 | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png) | 24AA08T-I/OTG | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | EEPROM | ROHS COMPLIANT, PLASTIC, SOT-23, 5 PIN | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | 1 | 1000 | PLASTIC/EPOXY | TSOP5/6,.11,37 | -40 °C | 40 | 85 °C | 有 | 24AA08T-I/OTG | 0.1 MHz | 1024 words | 2.5 V | LSSOP | RECTANGULAR | Microchip Technology Inc | 活跃 | MICROCHIP TECHNOLOGY INC | 5.2 | SOT-23 | 表面贴装 | YES | 5 | 5 | Compliant | Tape & Reel (TR) | e3 | 有 | EAR99 | Matte Tin (Sn) | 85 °C | -40 °C | 8542.32.00.51 | EEPROMs | CMOS | DUAL | 鸥翼 | 260 | 1 | 0.95 mm | compliant | 400 kHz | 5 | R-PDSO-G5 | 不合格 | 5.5 V | 2/5 V | INDUSTRIAL | 1.7 V | 2-Wire, I2C, Serial | 5.5 V | 1.8 V | 3 mA | 1 kB | SYNCHRONOUS | 0.003 mA | 900 ns | 1KX8 | 1.45 mm | 8 | 8 kb | 0.000001 A | 8192 bit | 400 kHz | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 1010XMMR | 2.95 mm | 1.55 mm | 无 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CAT24C208WI-GT3 | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 45 Weeks | Industrial grade | ACTIVE (Last Updated: 4 hours ago) | Gold | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2006 | e4 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 3V | 1.27mm | 30 | CAT24C208 | 8 | 不合格 | 5V | 2-Wire, I2C, Serial | 2 | 3mA | 8Kb 256 x 8 x 4 | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 无卤素 | 5ms | 8 kb | 0.00005A | I2C | 5ms | 100 | 1.5mm | 5mm | 4mm | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | IS42S16160J-6BLI | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Industrial grade | 表面贴装 | 54-TFBGA | YES | Volatile | -40°C~85°C TA | Tray | e1 | 活跃 | 3 (168 Hours) | 54 | Tin/Silver/Copper (Sn/Ag/Cu) | PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH | 3V~3.6V | BOTTOM | 未说明 | 1 | 3.3V | 0.8mm | 未说明 | S-PBGA-B54 | 3.6V | 3V | 1 | 256Mb 16M x 16 | SYNCHRONOUS | 166MHz | 5.4ns | DRAM | Parallel | 16MX16 | 16 | 268435456 bit | 1.2mm | 8mm | 8mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY62147EV30LL-45BVXIT | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 48-VFBGA | 48 | Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2001 | MoBL® | e1 | yes | 活跃 | 3 (168 Hours) | 48 | Tin/Silver/Copper (Sn/Ag/Cu) | 2.2V~3.6V | BOTTOM | 260 | 1 | 3V | 0.75mm | 45GHz | 30 | CY62147 | 3V | 3.6V | 2.2V | 1 | 20mA | 4Mb 256K x 16 | SRAM | Parallel | 3-STATE | 16 | 45ns | 18b | 4 Mb | 0.000007A | 45 ns | COMMON | Asynchronous | 16b | 8mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AT24C08C-PUM | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 1997 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | 哑光锡 | 1.7V~5.5V | DUAL | 1 | 5V | 2.54mm | AT24C08 | 5.5V | 1.7V | 2-Wire, I2C, Serial | 3mA | 8Kb 1K x 8 | 1MHz | 550ns | EEPROM | I2C | 5ms | 8 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE | 1010DMMR | 4.953mm | 10.16mm | 8.255mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY14B108L-ZS20XI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | Gold | 表面贴装 | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | 44 | Non-Volatile | -40°C~85°C TA | Tray | 2007 | e4 | 活跃 | 3 (168 Hours) | 44 | 3A991.B.2.B | 8542.32.00.41 | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 0.8mm | 30 | CY14B108 | 44 | 3V | 3.6V | 2.7V | 75mA | 8Mb 1M x 8 | Clock | NVSRAM | Parallel | 8b | 1MX8 | 8 | 20ns | 8 Mb | 0.01A | 20 ns | 8b | HH:MM:SS | 1.194mm | 18.415mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S29GL01GS10TFI010 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | Tin | 表面贴装 | 表面贴装 | 56-TFSOP (0.724, 18.40mm Width) | 56 | Non-Volatile | -40°C~85°C TA | Tray | 2012 | GL-S | 活跃 | 3 (168 Hours) | 56 | 8542.32.00.51 | 2.7V~3.6V | DUAL | 1 | 3V | 0.5mm | 3.6V | 3/3.3V | 2.7V | 60mA | 1Gb 64M x 16 | 100ns | FLASH | Parallel | 16b | 128MX8 | 60ns | 26b | 1 Gb | 0.0001A | Asynchronous | 16b | 3V | YES | YES | YES | 1K | 64K | 32B | YES | BOTTOM/TOP | YES | 1.05mm | 18.5mm | 14.1mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 25C320-I/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 有 | 25B | 通孔 | 8-DIP (0.300, 7.62mm) | NO | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2005 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 800mW | 4.5V~5.5V | DUAL | 1 | 5V | 2.54mm | 25C320 | 8 | 5V | 5V | SPI, Serial | 5mA | 32Kb 4K x 8 | 3MHz | 150 ns | EEPROM | SPI | 8b | 1 | 5ms | 32 kb | 0.000005A | PIC | 12 | SPI | 5ms | 200 | HARDWARE/SOFTWARE | 4.953mm | 10.16mm | 7.112mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT28C010-15JU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 22 Weeks | Tin | 表面贴装 | 表面贴装 | 32-LCC (J-Lead) | 32 | Non-Volatile | -40°C~85°C TC | Tube | 1997 | e3 | yes | 活跃 | 2 (1 Year) | 32 | 4.5V~5.5V | QUAD | 245 | 1 | 5V | 1.27mm | 150GHz | 40 | AT28C010 | 5V | 5V | Parallel, SPI | 40mA | 1Mb 128K x 8 | 150ns | EEPROM | Parallel | 128KX8 | 8 | 10ms | 1 Mb | 0.0002A | 5V | 10000 Write/Erase Cycles | 10ms | YES | YES | 128words | 3.556mm | 13.97mm | 11.43mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT24C16D-STUM-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 表面贴装 | SOT-23-5 Thin, TSOT-23-5 | YES | Non-Volatile | -40°C~85°C TC | Tape & Reel (TR) | 1997 | e3 | yes | 活跃 | 1 (Unlimited) | 5 | Matte Tin (Sn) - annealed | 1.7V~3.6V | DUAL | 260 | 1 | 1.8V | 0.95mm | 40 | AT24C16D | R-PDSO-G5 | 不合格 | 3.6V | 1.8/3.3V | 1.7V | 2-Wire, I2C, Serial | 16Kb 2K x 8 | SYNCHRONOUS | 1MHz | 450ns | EEPROM | I2C | 2KX8 | 8 | 5ms | 4e-7A | 16384 bit | I2C | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE | 1010MMMR | 1mm | 2.9mm | 1.6mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24LC64FT-I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Gold | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2007 | e3 | yes | 活跃 | 3 (168 Hours) | 8 | EAR99 | Matte Tin (Sn) - annealed | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 24LC64F | 8 | 5V | I2C, Serial | 3mA | 64Kb 8K x 8 | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 64 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT28C256E-15DM/883 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 23 Weeks | Military grade | 通孔 | 通孔 | 28-CDIP (0.600, 15.24mm) | 28 | Non-Volatile | -55°C~125°C TC | Tube | 活跃 | 1 (Unlimited) | 28 | 4.5V~5.5V | DUAL | 1 | 5V | 2.54mm | 150GHz | AT28C256 | 5V | Parallel, SPI | 50mA | 256Kb 32K x 8 | 150ns | EEPROM | Parallel | 32KX8 | 8 | 10ms | 256 kb | MIL-STD-883 Class B | 5V | 64words | 5.72mm | 37.215mm | 15.24mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24LC512-E/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3 Weeks | Tin | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2010 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 1 | 4.5V | 2.54mm | 24LC512 | 8 | 5.5V | 3/5V | 2.5V | I2C, Serial | 5mA | 512Kb 64K x 8 | 400kHz | 900ns | EEPROM | I2C | 5ms | 512 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 195μm | 400μm | 280μm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT24C128C-XHM-B | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2005 | e4 | yes | 活跃 | 1 (Unlimited) | 8 | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.7V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 40 | AT24C128C | 5.5V | 1.7V | 2-Wire, I2C, Serial | 3mA | 128Kb 16K x 8 | 1MHz | 550ns | EEPROM | I2C | 5ms | 128 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE/SOFTWARE | 1010DDDR | 1.05mm | 3.1mm | 4.5mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24LC16B-E/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2005 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1 MILLION ERASE/WRITE CYCLES | 2.5V~5.5V | DUAL | 1 | 5V | 2.54mm | 24LC16B | 8 | 5.5V | 3/5V | 2.5V | I2C, Serial | 3mA | 16Kb 2K x 8 | 400kHz | 900ns | EEPROM | I2C | 5ms | 16 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010MMMR | 195μm | 400μm | 280μm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24AA00T-I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1 Weeks | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2007 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 40 | 24AA00 | 8 | 5.5V | 2/5V | 1.7V | 2-Wire, I2C, Serial | 2mA | 128b 16 x 8 | 400kHz | 3500ns | EEPROM | I2C | 8 | 4ms | 128 b | 0.000001A | I2C | 1000000 Write/Erase Cycles | 4ms | 200 | 1010XXXR | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 25LC020AT-I/MS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2012 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | DATA RETENTION > 200 YEARS; 1,000,000 ERASE/WRITE CYCLES | 2.5V~5.5V | DUAL | 260 | 1 | 2.7V | 0.65mm | 40 | 25LC020A | 8 | 5V | SPI, Serial | 5mA | 2Kb 256 x 8 | 10MHz | 50 ns | EEPROM | SPI | 8 | 5ms | 2 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1.1mm | 3mm | 3mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST26VF016-80-5I-S2AE-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 21 Weeks | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | YES | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2005 | SST26 SQI® | e3 | 活跃 | 3 (168 Hours) | 8 | Matte Tin (Sn) - annealed | 2.7V~3.6V | DUAL | 1.27mm | SST26VF016 | 3.3V | SPI, Serial | 18mA | 16Mb 2M x 8 | 80MHz | 6 ns | FLASH | SPI - Quad I/O | 8b | 8 | 1.5ms | 1b | 16 Mb | 0.000015A | Synchronous | SPI | 100000 Write/Erase Cycles | 100 | SOFTWARE | 256B | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M95128-DWDW4TP/K | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | Automotive grade | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~145°C TA | Cut Tape (CT) | Automotive, AEC-Q100 | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 1 | 0.65mm | M95128 | 5.5V | 2.5V | SPI, Serial | 4mA | 128Kb 16K x 8 | 20MHz | 20 ns | EEPROM | SPI | 8 | 4ms | 128 kb | SPI | 4ms | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CAT93C66YI-GT3 | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | Industrial grade | LIFETIME (Last Updated: 4 days ago) | Gold | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2007 | e4 | yes | Obsolete | 1 (Unlimited) | 8 | EAR99 | 100 YEAR DATA RETENTION | 1.8V~5.5V | DUAL | 1 | 5V | 0.65mm | CAT93C66 | 8 | 5V | Serial | 1mA | 4Kb 512 x 8 256 x 16 | 2MHz | 250 ns | EEPROM | SPI | 256X16 | 16 | 4 kb | 0.00001A | MICROWIRE | 1000000 Write/Erase Cycles | 100 | SOFTWARE | 8 | 1.2mm | 4.4mm | 3mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 23LC1024-I/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 通孔 | 8-DIP (0.300, 7.62mm) | NO | 8 | Volatile | -40°C~85°C TA | Tube | 2004 | e3 | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) - annealed | 2.5V~5.5V | DUAL | 1 | 23LC1024 | 5.5V | 3/5V | SPI | 2 | 10mA | 1Mb 128K x 8 | 20MHz | 25 ns | SRAM | SPI - Quad I/O | 3-STATE | 24b | 1 Mb | SERIAL | COMMON/SEPARATE | Synchronous | 8b | NO | NO | 4.953mm | 10.16mm | 7.112mm | 无 | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S29GL032N90BFI040 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 48-VFBGA | 48 | Non-Volatile | -40°C~85°C TA | Tray | 2008 | GL-N | e1 | 活跃 | 3 (168 Hours) | 48 | 3A991.B.1.A | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 260 | 1 | 3V | 0.8mm | 40 | 3.6V | 3/3.3V | 2.7V | 50mA | 32Mb 4M x 8 2M x 16 | FLASH | Parallel | 16b | 2MX16 | 16 | 90ns | 32 Mb | 0.000005A | 90 ns | Asynchronous | 3V | 8 | YES | YES | YES | 863 | 8K64K | 8/16words | YES | BOTTOM | YES | 1mm | 8.15mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S29GL128P11TFIV10 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 56-TFSOP (0.724, 18.40mm Width) | 56 | Non-Volatile | -40°C~85°C TA | Tray | 2012 | GL-P | e3 | 活跃 | 3 (168 Hours) | 56 | 3A991.B.1.A | Matte Tin (Sn) | 8542.32.00.51 | 1.65V~3.6V | DUAL | 260 | 1 | 3V | 0.5mm | 40 | 3.6V | 1.8/3.33/3.3V | 2.7V | 110mA | 128Mb 16M x 8 | FLASH | Parallel | 8b | 128MX1 | 1 | 110ns | 128 Mb | 0.000005A | 110 ns | Asynchronous | 3V | 8 | YES | YES | YES | 128 | 128K | 8/16words | YES | YES | 1.2mm | 18.4mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 |