类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 电压 | 界面 | 内存大小 | 工作电源电流 | 端口的数量 | 电源电流 | 操作模式 | 时钟频率 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 无卤素 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 访问时间（最大） | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 数据轮询 | 拨动位 | 扇区/尺寸数 | 引导模块 | 刷新周期 | I2C控制字节 | 顺序突发长度 | 交错突发长度 | 反向引脚排列 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||
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 | BR24G01FV-3GTE2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Tin | 表面贴装 | 表面贴装 | 8-LSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2013 | 活跃 | 1 (Unlimited) | 8 | SEATED HT-CALCULATED | 1.6V~5.5V | DUAL | 未说明 | 1 | 0.65mm | 未说明 | BR24G01 | 5.5V | 1.7V | 2-Wire, I2C, Serial | 1Kb 128 x 8 | SYNCHRONOUS | 400kHz | 900 ns | EEPROM | I2C | 8 | 5ms | 1 kb | I2C | 5ms | 1.35mm | 4.4mm | 3mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | N04L63W2AT27I | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | 44 | Volatile | -40°C~85°C TA | Tray | 2008 | Obsolete | 3 (168 Hours) | 44 | 2.3V~3.6V | DUAL | 1 | 3V | 0.8mm | unknown | N04L63W2A | 44 | 不合格 | 3V | 3.6V | 4Mb 256K x 16 | 1 | 16mA | SRAM | Parallel | 3-STATE | 16 | 70ns | 18b | 4 Mb | 70 ns | COMMON | Asynchronous | 16b | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT24CS64-XHM-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Gold | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2005 | e4 | yes | 活跃 | 3 (168 Hours) | 1.7V~5.5V | 260 | 40 | AT24CS64 | 2-Wire, I2C, Serial | 64Kb 8K x 8 | 1MHz | 550ns | EEPROM | I2C | 5ms | 64 kb | I2C | 1000000 Write/Erase Cycles | 100 | HARDWARE | 1010DDDR | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1513KV18-333BZI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 165-LBGA | 165 | Volatile | -40°C~85°C TA | Tray | 2003 | e0 | Obsolete | 3 (168 Hours) | 165 | Tin/Lead (Sn/Pb) | 流水线结构 | 1.7V~1.9V | BOTTOM | 220 | 1 | 1.8V | 1mm | not_compliant | 30 | CY7C1513 | 165 | 不合格 | 1.8V | 1.9V | 1.7V | 72Mb 4M x 18 | 2 | 620mA | 333MHz | 450 ps | SRAM | Parallel | 4MX18 | 3-STATE | 18 | 20b | 72 Mb | SEPARATE | Synchronous | 18b | 1.7V | 1.4mm | 15mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
 | AT24CS01-MAHM-E | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Gold | 表面贴装 | 表面贴装 | 8-UFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2005 | yes | 活跃 | 3 (168 Hours) | 8 | 1.7V~5.5V | DUAL | 未说明 | 1 | 2.5V | 0.5mm | 未说明 | AT24CS01 | 5.5V | 1.7V | 2-Wire, I2C, Serial | 1Kb 128 x 8 | SYNCHRONOUS | 1MHz | 550ns | EEPROM | I2C | 8 | 5ms | 1024 bit | I2C | 5ms | 0.6mm | 3mm | 2mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AT25320B-MAHL-E | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 8-UFDFN Exposed Pad | YES | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 1997 | 活跃 | 3 (168 Hours) | 8 | 8542.32.00.51 | 1.8V~5.5V | DUAL | 未说明 | 1 | 2.5V | 0.5mm | 未说明 | R-PDSO-N8 | 5.5V | 1.8V | 32Kb 4K x 8 | SYNCHRONOUS | 20MHz | EEPROM | SPI | 4KX8 | 8 | 5ms | 32768 bit | SERIAL | SPI | 5ms | 0.6mm | 3mm | 2mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MR0D08BMA45 | Everspin Technologies Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 48-LFBGA | YES | 48 | Non-Volatile | 0°C~70°C TA | Tray | 2000 | 活跃 | 3 (168 Hours) | 48 | EAR99 | 8542.32.00.71 | 3V~3.6V | BOTTOM | 未说明 | 1 | 3.3V | 0.75mm | 未说明 | 48 | 不合格 | 3.6V | 3.3V | 3V | 1Mb 128K x 8 | 55mA | ASYNCHRONOUS | RAM | Parallel | 8b | 128KX8 | 8 | 45ns | 1 Mb | 0.008A | 45 ns | 1.35mm | 8mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | AS4C32M16SB-7TIN | Alliance Memory, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Industrial grade | 表面贴装 | 54-TSOP (0.400, 10.16mm Width) | YES | Volatile | -40°C~85°C TA | Tray | 2012 | yes | 活跃 | 3 (168 Hours) | 54 | AUTO/SELF REFRESH | 3V~3.6V | DUAL | 未说明 | 1 | 3.3V | 0.8mm | 未说明 | R-PDSO-G54 | 3.6V | 3V | 512Mb 32M x 16 | 1 | SYNCHRONOUS | 143MHz | 5.4ns | DRAM | Parallel | 32MX16 | 16 | 14ns | 536870912 bit | 1.2mm | 22.22mm | 10.16mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S29GL512T11FHIV20 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 64-LBGA | YES | Non-Volatile | -40°C~85°C TA | Tray | 2003 | GL-T | e1 | 活跃 | 3 (168 Hours) | 64 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.32.00.51 | 1.65V~3.6V | BOTTOM | 260 | 1 | 3V | 1mm | 30 | R-PBGA-B64 | 3.6V | 2.7V | 512Mb 64M x 8 | ASYNCHRONOUS | 110ns | FLASH | Parallel | 32MX16 | 16 | 60ns | 536870912 bit | 2.7V | 8 | 1.4mm | 13mm | 11mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1512V18-167BZXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 165-LBGA | YES | 165 | Volatile | 0°C~70°C TA | Tray | 2003 | e1 | Obsolete | 5 (48 Hours) | 165 | 3A991.B.2.A | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 8542.32.00.41 | 1.7V~1.9V | BOTTOM | 260 | 1 | 1.8V | 1mm | unknown | 20 | CY7C1512 | 165 | 不合格 | 1.8V | 1.9V | 1.7V | 72Mb 4M x 18 | 167MHz | 500 ps | SRAM | Parallel | 4MX18 | 3-STATE | 18 | 72 Mb | SEPARATE | 1.7V | 1.4mm | 17mm | 15mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||
| CY7C1515JV18-300BZXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 165-LBGA | 165 | Volatile | 0°C~70°C TA | Tray | 2003 | e1 | Obsolete | 3 (168 Hours) | 165 | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 1.7V~1.9V | BOTTOM | 1 | 1.8V | 1mm | unknown | CY7C1515 | 165 | 不合格 | 1.8V | 1.9V | 1.7V | 72Mb 2M x 36 | 2 | 1.14A | 300MHz | 450 ps | SRAM | Parallel | 3-STATE | 36 | 19b | 72 Mb | SEPARATE | Synchronous | 36b | 1.7V | 1.4mm | 17mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | PC48F4400P0VB0EA | Micron Technology Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 64-LBGA | YES | 64 | Non-Volatile | -40°C~85°C TC | Tray | 2012 | Axcell™ | e1 | Obsolete | 3 (168 Hours) | 64 | 3A991.B.1.A | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.32.00.51 | 1.7V~2V | BOTTOM | 260 | 1 | 1mm | 30 | 48F4400P0 | 64 | 1.8V | 1.81.8/3.3V | 1.7V | Parallel, Serial | 512Mb 32M x 16 | 31mA | 52MHz | FLASH | Parallel | 32MX16 | 16 | 100ns | 24b | 512 Mb | 0.00042A | 100 ns | Asynchronous | 16b | 16 | NO | NO | 8 510 | BOTTOM/TOP | 1.2mm | 13mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
 | CY62256L-70SNXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 28-SOIC (0.295, 7.50mm Width) | 28 | Volatile | -40°C~85°C TA | Tube | 2005 | MoBL® | e4 | Obsolete | 1 (Unlimited) | 28 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 4.5V~5.5V | DUAL | 260 | 1 | 5V | unknown | 70GHz | 20 | CY62256 | 28 | 不合格 | 5V | 5V | 256Kb 32K x 8 | 1 | 50mA | SRAM | Parallel | 32KX8 | 3-STATE | 8 | 70ns | 15b | 256 kb | 70 ns | COMMON | Asynchronous | 8b | 2V | 2.794mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||
 | IS42VM16160K-75BLI | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 54-TFBGA | YES | 54 | Volatile | -40°C~85°C TA | Tray | 活跃 | 3 (168 Hours) | 54 | PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH | 1.7V~1.95V | BOTTOM | 1 | 1.8V | 0.8mm | 不合格 | 1.95V | 1.8V | 1.7V | 256Mb 16M x 16 | 1 | SYNCHRONOUS | 133MHz | 6ns | DRAM | Parallel | 16b | 16MX16 | 3-STATE | 16 | 0.00001A | COMMON | 8192 | 1248FP | 1248 | 1.2mm | 8mm | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 93LC66BT-E/MNY | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-WFDFN Exposed Pad | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 1998 | e4 | 活跃 | 1 (Unlimited) | 8 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 0.5mm | 40 | 93LC66B | 8 | 5.5V | 2.5V | Serial | 4Kb 256 x 16 | 2mA | SYNCHRONOUS | 2MHz | 250 ns | EEPROM | SPI | 256X16 | 16 | 6ms | 4 kb | MICROWIRE | 6ms | 3mm | 2mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
| 93LC76CT-E/MNY | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-WFDFN Exposed Pad | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2012 | e4 | 活跃 | 1 (Unlimited) | 8 | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.5V~5.5V | DUAL | 0.5mm | 93LC76C | 不合格 | 3/5V | Serial | 8Kb 1K x 8 512 x 16 | 3mA | 3MHz | 100 ns | EEPROM | SPI | 512X16 | 16 | 5ms | 8 kb | 0.000003A | MICROWIRE | 1000000 Write/Erase Cycles | 200 | HARDWARE/SOFTWARE | 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | IS43TR16128C-15HBLI | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 96-TFBGA | YES | Volatile | -40°C~95°C TC | Tray | e1 | 活跃 | 3 (168 Hours) | 96 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH | 1.425V~1.575V | BOTTOM | 260 | 1 | 1.5V | 0.8mm | 10 | R-PBGA-B96 | 1.575V | 1.425V | 2Gb 128M x 16 | 1 | SYNCHRONOUS | 667MHz | 20ns | DRAM | Parallel | 128MX16 | 16 | 15ns | 2147483648 bit | 1.2mm | 13mm | 9mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M95040-DFMN6TP | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | ACTIVE (Last Updated: 6 months ago) | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.7V~5.5V | DUAL | 1 | 1.8V | 1.27mm | M95040 | 5.5V | 1.7V | SPI, Serial | 4Kb 512 x 8 | 20MHz | 80 ns | EEPROM | SPI | 8 | 5ms | 4 kb | SPI | 5ms | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LE25S81AFDTWG | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | ACTIVE (Last Updated: 4 days ago) | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | Non-Volatile | -40°C~90°C TA | Tape & Reel (TR) | 2009 | e3 | yes | 活跃 | 3 (168 Hours) | 8 | Tin (Sn) | 1.65V~1.95V | DUAL | 1 | 1.8V | 1.27mm | R-PDSO-G8 | 1.95V | 1.65V | 8Mb 1M x 8 | SYNCHRONOUS | 70MHz | FLASH | SPI | 1MX8 | 8 | 500μs | 8388608 bit | SERIAL | 1.8V | 0.85mm | 4.9mm | 3.9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CAT25080HU2I-GT3 | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | Industrial grade | Gold | 表面贴装 | 表面贴装 | 8-UFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2008 | e4 | yes | Obsolete | 1 (Unlimited) | 8 | EAR99 | 100 YEAR DATA RETENTION | 1.8V~5.5V | DUAL | 未说明 | 1 | 5V | 0.5mm | 未说明 | CAT25080 | 8 | 不合格 | 5V | SPI, Serial | 8Kb 1K x 8 | 2mA | SYNCHRONOUS | 10MHz | 40 ns | EEPROM | SPI | 无卤素 | 5ms | 8 kb | 0.000002A | SPI | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE/SOFTWARE | 500μm | 2.1mm | 2.1mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||
 | AS6C8016A-55BIN | Alliance Memory, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 48-VFBGA | YES | 48 | Volatile | -40°C~85°C TA | Tray | 1997 | yes | 活跃 | 3 (168 Hours) | 48 | 2.7V~3.6V | BOTTOM | 1 | 3.3V | 0.75mm | 48 | 3.3V | 3.6V | 2.7V | 8Mb 512K x 16 | 1 | SRAM | Parallel | 16 | 55ns | 19b | 8 Mb | 55 ns | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 34AA02T-E/OT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Tin | 表面贴装 | 表面贴装 | SOT-23-6 | 6 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2010 | e3 | yes | 活跃 | 1 (Unlimited) | 6 | EAR99 | 8542.32.00.51 | 1.7V~5.5V | DUAL | 260 | 1 | 2.5V | 0.95mm | 40 | 34AA02 | 6 | 5V | 1.7V | I2C, Serial | 2Kb 256 x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 2 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | SOFTWARE | 10100DDR | 1.45mm | 2.9mm | 1.55mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
 | CY7C09099V-7AXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 100-LQFP | 100 | Volatile | -40°C~85°C TA | Tray | 2008 | e3 | yes | Obsolete | 3 (168 Hours) | 100 | Matte Tin (Sn) | FLOW-THROUGH OR PIPELINED ARCHITECTURE | 3V~3.6V | QUAD | 260 | 1 | 3.3V | 0.5mm | 20 | CY7C09099 | 100 | 3.3V | 3.6V | 3V | 1Mb 128K x 8 | 2 | 390mA | 83MHz | 7.5ns | SRAM | Parallel | 3-STATE | 8 | 34b | 1 Mb | COMMON | Synchronous | 8b | 3V | 1.6mm | 14mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||
 | 24AA256T-E/SM | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Automotive grade | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | YES | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2012 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 1.7V~5.5V | DUAL | 260 | 1 | 1.27mm | 40 | 24AA256 | 8 | 不合格 | 5.5V | 1.7V | I2C, Serial | 256Kb 32K x 8 | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 256 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | NO | 2.03mm | 5.26mm | 5.25mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
 | AT27C010-15PC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 32-DIP (0.600, 15.24mm) | 32-PDIP | Non-Volatile | 0°C~70°C TC | Tube | 1998 | Obsolete | 1 (Unlimited) | 4.5V~5.5V | AT27C010 | 1Mb 128K x 8 | 150ns | EPROM | Parallel | Non-RoHS Compliant |