类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 质量 | 终端数量 | 制造商包装标识符 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 界面 | 内存大小 | 工作电源电流 | 端口的数量 | 电源电流 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 无卤素 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 访问时间（最大） | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 内存IC类型 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 输出启用 | 环境温度范围高 | I2C控制字节 | 反向引脚排列 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||||||||||||||||||||||
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 | M93C86-WMN6P | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | Industrial grade | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | e4 | 活跃 | 1 (Unlimited) | 8 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 30 | M93C86 | 8 | 5.5V | 3/5V | 2.5V | Serial | 16Kb 2K x 8 1K x 16 | 2mA | 2mA | 2MHz | 200 ns | EEPROM | SPI | 1KX16 | 5ms | 16 kb | 0.00001A | MICROWIRE | 1000000 Write/Erase Cycles | 5ms | 40 | SOFTWARE | 1.25mm | 4.9mm | 3.9mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M95010-WMN6P | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | e4 | 活跃 | 1 (Unlimited) | 8 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 30 | M95010 | 8 | 5V | SPI, Serial | 1Kb 128 x 8 | 5mA | 20MHz | 35 ns | EEPROM | SPI | 5ms | 1 kb | 0.000002A | SPI | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE/SOFTWARE | 1.25mm | 4.9mm | 3.9mm | 无 | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png) | 24LC01BT-I/SNG | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 小概要 | 1 | 128 | PLASTIC/EPOXY | SOP8,.25 | -40 °C | 40 | 85 °C | 有 | 24LC01BT-I/SNG | 0.4 MHz | 128 words | SOP | RECTANGULAR | Microchip Technology Inc | 活跃 | MICROCHIP TECHNOLOGY INC | 5.11 | SOIC | YES | 8 | SOP, SOP8,.25 | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | EEPROMs | CMOS | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | 不合格 | 5.5 V | 3/5 V | INDUSTRIAL | 2.5 V | SYNCHRONOUS | 0.003 mA | 128X8 | 1.75 mm | 8 | 0.000005 A | 1024 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 1010XXXR | NO | 4.9 mm | 3.9 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M24C01-RDW6TP | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | Industrial grade | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | e4 | 活跃 | 1 (Unlimited) | 8 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 30 | M24C01 | 8 | 5.5V | 2/5V | 2-Wire, I2C, Serial | 1Kb 128 x 8 | 800μA | 400kHz | 900ns | EEPROM | I2C | 5ms | 1 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE | 1010DDDR | 1mm | 3mm | 4.4mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24FC256-I/SM | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2005 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.7V~5.5V | DUAL | 260 | 1 | 1.27mm | 40 | 24FC256 | 8 | 5.5V | 1.7V | I2C, Serial | 256Kb 32K x 8 | 3mA | 1MHz | 400ns | EEPROM | I2C | 5ms | 256 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | NO | 1.98mm | 5.33mm | 5.38mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24LC16BT/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | 0°C~70°C TA | Tape & Reel (TR) | 2005 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 3V | 1.27mm | 40 | 24LC16B | 8 | 5.5V | 3/5V | 2.5V | I2C, Serial | 16Kb 2K x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | OPEN-DRAIN | 5ms | 16 kb | 0.00003A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010MMMR | 1.5mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 25AA640A-I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2007 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 40 | 25AA640A | 8 | 5V | SPI, Serial | 64Kb 8K x 8 | 5mA | 10MHz | 160 ns | EEPROM | SPI | 5ms | 64 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1.25mm | 4.9mm | 3.9mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT93C66B-SSHM-B | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2009 | e4 | yes | 活跃 | 3 (168 Hours) | 8 | Nickel/Palladium/Gold (Ni/Pd/Au) | ALSO OPERATES WITH 1.7V-5.5V AND 2.5V-5.5V SUPPLY | 1.7V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | AT93C66B | 5.5V | 4.5V | Serial | 4Kb 512 x 8 256 x 16 | 2mA | 2MHz | EEPROM | SPI | 256X16 | 5ms | 4 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 5ms | 100 | SOFTWARE | 1.5mm | 5.05mm | 3.99mm | 无 | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 23LCV1024-I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2004 | e3 | 活跃 | 1 (Unlimited) | 8 | Matte Tin (Sn) - annealed | 2.5V~5.5V | 260 | 1 | 40 | 23LCV1024 | 5.5V | 3/5V | 2.5V | SPI | 1Mb 128K x 8 | 1 | 10mA | 20MHz | 25 ns | NVSRAM | SPI - Dual I/O | 3-STATE | 24b | 1 Mb | SERIAL | SEPARATE | Synchronous | 8b | 2.5V | 1.25mm | 4.9mm | 3.9mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M95M02-DWMN3TP/K | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | Industrial grade | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | SO8N-SO-A | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | Automotive, AEC-Q100 | 活跃 | 1 (Unlimited) | 8 | 3A991.B.1.B.1 | 2.5V~5.5V | DUAL | 未说明 | 1 | 1.27mm | 未说明 | M95M02 | 5.5V | 2.5V | 2Mb 256K x 8 | SYNCHRONOUS | 10MHz | 80 ns | EEPROM | SPI | 5ms | 2097152 bit | SERIAL | SPI | 5ms | 125°C | 1.75mm | 5mm | 4mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CAT25M01VI-GT3 | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Industrial grade | ACTIVE (Last Updated: 14 hours ago) | Gold | 表面贴装 | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2008 | e4 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 40 | 8 | 5.5V | SPI, Serial | 1Mb 128K x 8 | SYNCHRONOUS | 10MHz | 40 ns | EEPROM | SPI | 无卤素 | 8 | 5ms | 1 Mb | SPI | 5ms | 1 | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M95512-WDW6TP | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | Industrial grade | ACTIVE (Last Updated: 6 months ago) | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | e4 | 活跃 | 1 (Unlimited) | 8 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 30 | M95512 | 8 | 5V | SPI, Serial | 512Kb 64K x 8 | 6mA | 16MHz | 60 ns | EEPROM | SPI | 8 | 5ms | 512 kb | 0.000005A | SPI | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE/SOFTWARE | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AT25010B-XHL-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 1997 | e4 | yes | 活跃 | 1 (Unlimited) | 8 | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 40 | AT25010 | 5.5V | 2/5V | SPI, Serial | 1Kb 128 x 8 | 10mA | 20MHz | 80 ns | EEPROM | SPI | 8 | 5ms | 1 kb | 5e-7A | SPI | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE/SOFTWARE | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24LCS22A-ISNG | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M48Z35-70PC1 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 25 Weeks | Commercial grade | 通孔 | 通孔 | 28-DIP Module (0.600, 15.24mm) | 28 | 1.088622g | Non-Volatile | 0°C~70°C TA | Tube | e3 | 活跃 | 1 (Unlimited) | 28 | EAR99 | Matte Tin (Sn) | 8542.32.00.41 | 4.75V~5.5V | DUAL | 1 | 5V | 2.54mm | 70GHz | M48Z35 | 28 | 5V | 5V | 256Kb 32K x 8 | 50mA | 1 | 50mA | NVSRAM | Parallel | 8b | 32KX8 | 3-STATE | 70ns | 256 kb | 0.003A | 70 ns | 8b | YES | 9.65mm | 39.88mm | 18.34mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | FM25040B-GTR | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2011 | F-RAM™ | e4 | 活跃 | 3 (168 Hours) | 8 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 30 | FM25040 | 8 | 不合格 | 5V | 5V | SPI, Serial | 4Kb 512 x 8 | 4mA | SYNCHRONOUS | 20MHz | 20 ns | FRAM | SPI | 8b | 8 | 4 kb | 0.00001A | 8b | 1.75mm | 4.9mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 25LC1024-I/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Industrial grade | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2007 | e3 | yes | 活跃 | 不适用 | 8 | EAR99 | Matte Tin (Sn) | 200 YEARS OF DATA RETENTION; 1000000 ENDURANCE CYCLES/WORD | 2.5V~5.5V | DUAL | 1 | 5V | 2.54mm | 25LC1024 | 8 | 5.5V | 3/5V | 2.5V | SPI, Serial | 1Mb 128K x 8 | 10mA | 20MHz | 50 ns | EEPROM | SPI | 6ms | 1 Mb | 0.000001A | SPI | 100000 Write/Erase Cycles | 6ms | HARDWARE/SOFTWARE | 3.3mm | 9.27mm | 6.35mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 25AA512T-I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2010 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 40 | 25AA512 | 8 | 5.5V | 2.5/5V | SPI, Serial | 512Kb 64K x 8 | 7mA | 20MHz | 250 ns | EEPROM | SPI | 8 | 5ms | 512 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT24C02D-STUM-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Tin | 表面贴装 | 表面贴装 | SOT-23-5 Thin, TSOT-23-5 | 5 | Non-Volatile | -40°C~85°C TC | Tape & Reel (TR) | 1997 | e3 | yes | 活跃 | 1 (Unlimited) | 5 | 1.7V~3.6V | DUAL | 260 | 1 | 1.8V | 40 | AT24C02 | 不合格 | 3.6V | 1.8/3.3V | 1.7V | 2-Wire, I2C, Serial | 2Kb 256 x 8 | SYNCHRONOUS | 1MHz | 4.5μs | EEPROM | I2C | 5ms | 2 kb | 4e-7A | I2C | 1000000 Write/Erase Cycles | 100 | HARDWARE | 1010000R | 1mm | 2.9mm | 1.6mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M48Z58Y-70PC1 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 25 Weeks | 通孔 | 通孔 | 28-DIP Module (0.600, 15.24mm) | 28 | Non-Volatile | 0°C~70°C TA | Tube | e3 | 活跃 | 1 (Unlimited) | 28 | EAR99 | Matte Tin (Sn) | BATTERY BACK-UP; POWER SUPPLY WRITE PROTECTION | 8542.32.00.41 | 4.5V~5.5V | DUAL | 1 | 5V | 2.54mm | 70GHz | M48Z58 | 28 | 5V | 5V | 64Kb 8K x 8 | 50mA | 1 | 50mA | NVSRAM | Parallel | 8b | 8KX8 | 3-STATE | 8 | 70ns | 64 kb | 0.003A | 70 ns | 8b | YES | 9.65mm | 39.625mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY62128EV30LL-45ZAXIT | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 32-TFSOP (0.465, 11.80mm Width) | 32 | Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2003 | MoBL® | e3 | yes | 活跃 | 3 (168 Hours) | 32 | EAR99 | Matte Tin (Sn) | 2.2V~3.6V | DUAL | 260 | 1 | 3V | 0.5mm | 45GHz | CY62128 | 3V | 3.6V | 2.2V | 1Mb 128K x 8 | 1 | 16mA | SRAM | Parallel | 3-STATE | 8 | 45ns | 17b | 1 Mb | 0.000003A | 45 ns | COMMON | Asynchronous | 8b | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M24256-BWDW6TP | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Industrial grade | NRND (Last Updated: 7 months ago) | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 不用于新设计 | 1 (Unlimited) | 2.5V~5.5V | M24256 | 5V | 2-Wire, I2C, Serial | 256Kb 32K x 8 | 2.5mA | 1MHz | 450ns | EEPROM | I2C | 5ms | 256 kb | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24AA128-I/MF | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | 表面贴装 | 8-VDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1000000 ERASE/WRITE CYCLES, HARDWARE WRITE PROTECT, DATA RETENTION > 200 YEARS | 1.7V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 40 | 24AA128 | 8 | 5.5V | 2/5V | 1.7V | 2-Wire, I2C, Serial | 128Kb 16K x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 5ms | 128 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 950μm | 6mm | 5mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24LC64-I/PG | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | IN-LINE | 8000 | PLASTIC/EPOXY | DIP8,.3 | -40 °C | 未说明 | 85 °C | 有 | 24LC64-I/PG | 0.4 MHz | 8192 words | 5 V | DIP | RECTANGULAR | Microchip Technology Inc | 活跃 | MICROCHIP TECHNOLOGY INC | 5.21 | DIP | NO | 8 | DIP, DIP8,.3 | e3 | 有 | EAR99 | Matte Tin (Sn) - annealed | 8542.32.00.51 | EEPROMs | CMOS | DUAL | THROUGH-HOLE | 未说明 | 1 | 2.54 mm | compliant | 8 | R-PDIP-T8 | 不合格 | 5.5 V | 3/5 V | INDUSTRIAL | 2.5 V | SYNCHRONOUS | 0.003 mA | 8KX8 | 5.334 mm | 8 | 0.000001 A | 65536 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 1010DDDR | 9.271 mm | 7.62 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AT24HC04BN-SH-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Gold, Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 1997 | e4 | yes | 活跃 | 3 (168 Hours) | 8 | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 40 | AT24HC04 | 5V | 2-Wire, I2C, Serial | 4Kb 512 x 8 | 3mA | 1MHz | 550ns | EEPROM | I2C | 8 | 5ms | 4 kb | 0.000003A | I2C | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE | 1010DDMR | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant |