类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 电压 | 界面 | 内存大小 | 端口的数量 | 电源电流 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 最高频率 | 筛选水平 | 访问时间（最大） | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 通用闪存接口 | I2C控制字节 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||
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 | TC58NVG1S3HBAI6 | Kioxia America, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 67-VFBGA | YES | Non-Volatile | -40°C~85°C TA | Tray | 活跃 | 3 (168 Hours) | 67 | 2.7V~3.6V | BOTTOM | 1 | 3.3V | 0.8mm | R-PBGA-B67 | 3.6V | 2.7V | 2Gb 256M x 8 | ASYNCHRONOUS | FLASH | Parallel | 256MX8 | 8 | 25ns | 2147483648 bit | 3.3V | 1mm | 8mm | 6.5mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S25FL164K0XMFV013 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | 8 | Non-Volatile | -40°C~105°C TA | Tape & Reel (TR) | 2015 | FL1-K | e3 | Obsolete | 3 (168 Hours) | 8 | ALSO CONFIGURABLE AS 64M X 1 | 2.7V~3.6V | DUAL | 未说明 | 1 | 3V | 1.27mm | 未说明 | 不合格 | 3V | 3.6V | 2.7V | SPI, Serial | 64Mb 8M x 8 | SYNCHRONOUS | 108MHz | 0.025mA | 7 ns | FLASH | SPI - Quad I/O | 16MX4 | 4 | 3ms | 24b | 64 Mb | 0.000005A | 3V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 2 | 256B | 2.159mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
 | 24AA014HT-I/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2008 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.7V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 40 | 24AA014H | 8 | 5V | 1.7V | I2C, Serial | 1Kb 128 x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 1 kb | I2C | 5ms | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
 | 23K640-E/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | Volatile | -40°C~125°C TA | Tube | 2011 | e3 | yes | 活跃 | 不适用 | 8 | EAR99 | Matte Tin (Sn) - annealed | 2.7V~3.6V | DUAL | 1 | 3V | 2.54mm | 23K640 | 8 | 3.3V | 3.6V | 2.7V | SPI, Serial | 64Kb 8K x 8 | 1 | 10mA | 20MHz | 32 ns | SRAM | SPI | 3-STATE | 8 | 1b | 64 kb | SEPARATE | Synchronous | 8b | 2.7V | 5.334mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
 | S29AL008J55TFIR20 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Tin | 表面贴装 | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | 48 | Non-Volatile | -40°C~85°C TA | Tray | 2012 | AL-J | e3 | 活跃 | 3 (168 Hours) | 48 | EAR99 | 底部启动区块 | 8542.32.00.51 | 3V~3.6V | DUAL | 1 | 3.3V | 0.5mm | 3.3V | 3.6V | 3V | 8Mb 1M x 8 512K x 16 | 12mA | FLASH | Parallel | 8b | 512KX16 | 16 | 55ns | 8 Mb | 0.000005A | 55 ns | Asynchronous | 3V | 8 | YES | YES | YES | 12115 | 16K8K32K64K | YES | BOTTOM | YES | 1.2mm | 18.4mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||
| 24LC32AFT-E/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 23 Weeks | Gold | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) - annealed | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 40 | 24LC32AF | 8 | 5V | I2C, Serial | 32Kb 4K x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 32 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE | 1010DDDR | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
 | 11AA160T-I/MS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.8V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 40 | 11AA160 | 8 | 5.5V | 2/5V | Serial | 16Kb 2K x 8 | 5mA | 100kHz | EEPROM | 单线 | 8 | 5ms | 16 kb | 0.000005A | 1-WIRE | 1000000 Write/Erase Cycles | 10ms | 200 | SOFTWARE | 1.1mm | 3mm | 3mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
 | IS25WQ040-JNLE | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | 8 | Non-Volatile | -40°C~105°C TA | Tube | 活跃 | 3 (168 Hours) | 8 | 1.65V~1.95V | DUAL | 未说明 | 1 | 1.8V | 1.27mm | 未说明 | 1.8V | 1.95V | 1.65V | SPI, Serial | 4Mb 512K x 8 | SYNCHRONOUS | 104MHz | 8 ns | FLASH | SPI | 4MX1 | 1 | 1ms | 20b | 32 Mb | 256B | 1.75mm | 4.9mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S29AL016J70BFI022 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 48-VFBGA | 48 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2003 | AL-J | e1 | 活跃 | 3 (168 Hours) | 48 | EAR99 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 底部启动区块 | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 260 | 1 | 3V | 0.8mm | 40 | 3.6V | 3/3.3V | 2.7V | 16Mb 2M x 8 1M x 16 | 12mA | FLASH | Parallel | 1MX16 | 16 | 70ns | 16 Mb | 0.000005A | 70 ns | Asynchronous | 3V | 8 | YES | YES | YES | 12131 | 16K8K32K64K | YES | BOTTOM | YES | 1mm | 8.15mm | 6.15mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||
 | AT24CS32-SSHM-B | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Gold | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | Non-Volatile | -40°C~85°C TA | Tube | 2005 | e4 | yes | 活跃 | 3 (168 Hours) | 8 | 1.7V~5.5V | DUAL | 1 | 2.5V | 1.27mm | AT24CS32 | R-PDSO-G8 | 5.5V | 1.7V | 2-Wire, I2C, Serial | 32Kb 4K x 8 | SYNCHRONOUS | 1MHz | 550ns | EEPROM | I2C | 4KX8 | 8 | 5ms | 32 kb | I2C | 5ms | 1.75mm | 4.925mm | 3.9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY62167G30-45BVXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 48-VFBGA | YES | 48 | Volatile | -40°C~85°C TA | Tray | 2011 | MoBL® | e1 | 活跃 | 3 (168 Hours) | 48 | 3A991.B.2.B | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.32.00.41 | 2.2V~3.6V | BOTTOM | 260 | 1 | 3V | 0.75mm | 30 | CY62167 | 3.6V | 2.2V | 16Mb 2M x 8 1M x 16 | SRAM | Parallel | 1MX16 | 16 | 45ns | 16777216 bit | 45 ns | 8 | 1mm | 8mm | 6mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24LCS52/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | 0°C~70°C TA | Tube | 2005 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1000K ERASE/WRITE CYCLES; HARDWARE WRITE PROTECT; DATA RETENTION > 200 YEARS | 2.2V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 40 | 24LCS52 | 8 | 5.5V | 3/5V | 2.2V | I2C, Serial | 2Kb 256 x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 2 kb | 0.00003A | I2C | 1000000 Write/Erase Cycles | 10ms | 200 | HARDWARE/SOFTWARE | 1010DDDR | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||
| 25LC128-H/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~150°C TA | Tube | 2009 | e3 | yes | 活跃 | 3 (168 Hours) | 8 | 3A001.A.2.A | Matte Tin (Sn) | 2.5V~5.5V | DUAL | 260 | 1 | 2.7V | 1.27mm | 40 | 25LC128 | 8 | 5V | SPI, Serial | 128Kb 16K x 8 | 5mA | 5MHz | 100 ns | EEPROM | SPI | 8 | 6ms | 128 kb | SPI | 6ms | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
 | S25FL512SAGMFB013 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | Automotive grade | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | YES | Non-Volatile | -40°C~105°C TA | Tape & Reel (TR) | Automotive, AEC-Q100, FL-S | e3 | 活跃 | 3 (168 Hours) | 16 | Matte Tin (Sn) | ITS ALSO CONFIGURABLE AS 512MX1 | 8542.32.00.51 | 2.7V~3.6V | DUAL | 未说明 | 1 | 3V | 1.27mm | 未说明 | R-PDSO-G16 | 3.6V | 2.7V | SPI, Serial | 512Mb 64M x 8 | SYNCHRONOUS | 133MHz | FLASH | SPI - Quad I/O | 64MX8 | 8 | 512753664 bit | AEC-Q100; TS 16949 | 3V | 1 | 2.65mm | 10.3mm | 7.5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
 | CY62138FV30LL-45BVXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 36-VFBGA | 36 | Volatile | -40°C~85°C TA | Tray | 2003 | MoBL® | e1 | yes | 活跃 | 3 (168 Hours) | 36 | Tin/Silver/Copper (Sn/Ag/Cu) | 2.2V~3.6V | BOTTOM | 260 | 1 | 3V | 0.75mm | 20 | CY62138 | 36 | 3V | 3.6V | 2.2V | 2Mb 256K x 8 | 1 | 18mA | SRAM | Parallel | 256KX8 | 3-STATE | 8 | 45ns | 18b | 2 Mb | 0.000004A | 22MHz | 45 ns | COMMON | Asynchronous | 8b | 8mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||
 | S29GL128P11FFIV10 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 64-LBGA | 64 | Non-Volatile | -40°C~85°C TA | Tray | 2003 | GL-P | e1 | 活跃 | 3 (168 Hours) | 64 | 3A991.B.1.A | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.32.00.51 | 1.65V~3.6V | BOTTOM | 260 | 1 | 3V | 1mm | 40 | 3V | 128Mb 16M x 8 | 110mA | FLASH | Parallel | 8b | 128MX1 | 1 | 110ns | 128 Mb | 0.000005A | 110 ns | Asynchronous | 8 | YES | YES | YES | 128 | 128K | 8/16words | YES | YES | 1.4mm | 13mm | 无 | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||
 | M29W640GB70NA6E | Micron Technology Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | YES | 48 | Non-Volatile | -40°C~85°C TA | Tray | 2009 | e4 | yes | Obsolete | 3 (168 Hours) | 48 | 3A991.B.1.A | Nickel/Palladium/Gold (Ni/Pd/Au) | 底部启动区块 | 8542.32.00.51 | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 0.5mm | 30 | M29W640 | 48 | 3/3.3V | 2.7V | 64Mb 8M x 8 4M x 16 | 10mA | FLASH | Parallel | 4MX16 | 16 | 70ns | 64 Mb | 0.0001A | 70 ns | Asynchronous | 8 | YES | YES | YES | 8127 | 8K64K | 4/8words | YES | BOTTOM | YES | 1.2mm | 18.4mm | 12mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||
 | BR24G128FVT-3AGE2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Industrial grade | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2015 | 活跃 | 1 (Unlimited) | 8 | 1.7V~5.5V | DUAL | 未说明 | 1 | 0.65mm | 未说明 | BR24G128 | 5.5V | 1.7V | 2-Wire, I2C, Serial | 128Kb 16K x 8 | SYNCHRONOUS | 1MHz | 450 ns | EEPROM | I2C | 8 | 5ms | 128 kb | I2C | 5ms | 1.2mm | 4.4mm | 3mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| 25LC080D-I/MS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 表面贴装 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) - annealed | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 40 | 25LC080D | 8 | 5V | SPI, Serial | 8Kb 1K x 8 | 5mA | 10MHz | 100 ns | EEPROM | SPI | 8 | 5ms | 8 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1.1mm | 3mm | 3mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
| 25LC256X-I/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2005 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 4.5V | 0.65mm | 40 | 25LC256 | 8 | 5V | SPI, Serial | 256Kb 32K x 8 | 6mA | 10MHz | 50 ns | EEPROM | SPI | 8 | 5ms | 256 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1.1mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||
 | 24LC08B-E/MC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-VFDFN Exposed Pad | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2012 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 0.5mm | 40 | 24LC08B | 8 | 5.5V | 3/5V | 2.5V | I2C, Serial | 8Kb 256 x 8 x 4 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 8 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010XMMR | 1mm | 3mm | 2mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
| AT25640B-SSPDGV-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | Automotive, AEC-Q100 | e4 | 活跃 | 3 (168 Hours) | 8 | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 30 | R-PDSO-G8 | 5.5V | 2.5V | 64Kb 8K x 8 | SYNCHRONOUS | 5MHz | EEPROM | SPI | 8KX8 | 8 | 5ms | 65536 bit | SERIAL | SPI | 5ms | 1.75mm | 4.9mm | 3.9mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | BR24T64FV-WE2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Copper, Tin | 表面贴装 | 表面贴装 | 8-LSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2013 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | Matte Tin (Sn) | 1.6V~5.5V | DUAL | 225 | 1 | 2.5V | 0.65mm | 未说明 | 不合格 | 5.5V | 1.6V | 2-Wire, I2C, Serial | 64Kb 8K x 8 | SYNCHRONOUS | 400kHz | 900 ns | EEPROM | I2C | 8 | 5ms | 64 kb | 0.000002A | I2C | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE | 1010DDDR | 1.35mm | 4.4mm | 3mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||
 | 25LC512T-I/MF | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 8-VDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2008 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 25LC512 | 8 | 5.5V | 2.5/5V | 2.5V | SPI, Serial | 512Kb 64K x 8 | 5mA | 20MHz | 50 ns | EEPROM | SPI | 8 | 5ms | 512 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1mm | 6mm | 5mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||
 | CY7C09349AV-12AC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 100-LQFP | 100 | Volatile | 0°C~70°C TA | Tray | 2000 | e0 | Obsolete | 3 (168 Hours) | 100 | EAR99 | 锡铅 | 3V~3.6V | QUAD | 240 | 1 | 3.3V | 0.5mm | unknown | 30 | CY7C09349 | 100 | 不合格 | 3.3V | 3.6V | 3V | 72Kb 4K x 18 | 2 | 180mA | 50MHz | 12ns | SRAM | Parallel | 4KX18 | 3-STATE | 18 | 12b | 72 kb | 0.0005A | COMMON | Synchronous | 18b | 3V | 1.6mm | 14mm | Non-RoHS Compliant | 含铅 |