类别是'逻辑 - FIFO 存储器'
逻辑 - FIFO 存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 包装/外壳 | 引脚数 | 包装 | 已出版 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 电路数量 | 最大电源电压 | 最小电源电压 | 内存大小 | 元素配置 | 电源电流 | 操作模式 | 最大电源电流 | 时钟频率 | 电源电流-最大值 | 访问时间 | 数据总线宽度 | 方向 | 组织结构 | 输出特性 | 内存宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | 同步/异步 | 字长 | 内存IC类型 | 总线定向 | 重传能力 | FWFT支持 | 可编程标志支持 | 输出启用 | 周期 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | RoHS状态 | 无铅 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
.png) | 72V263L7-5BCGI8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Copper, Silver, Tin | 表面贴装 | 100 | 133.3MHz | Tape & Reel | 2009 | e1 | yes | 活跃 | 3 (168 Hours) | 100 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 85°C | -40°C | 8542.32.00.71 | BOTTOM | BALL | 260 | 1 | 3.3V | 133.3MHz | 未说明 | 100 | 3.3V | INDUSTRIAL | 3.45V | 3.15V | Dual | 35mA | 5 ns | 8KX18 | 144 kb | PARALLEL | Synchronous | 单向 | 有 | YES | 1.5mm | 11mm | 11mm | 1.4mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||
| 72V281L10TFG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | LQFP | 64 | 100MHz | Bulk | 2014 | 70°C | 0°C | 3.3V | 1 | 3.6V | 3V | 8.1kB | 55mA | 6.5 ns | 9b | 单向 | 有 | 10mm | 10mm | 1.4mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||
| 72V3642L10PFG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | LQFP | 120 | 100MHz | 2013 | 活跃 | 70°C | 0°C | 3.3V | 1 | 3.6V | 3V | 128B | Dual | 400mA | 6.5 ns | 2b | 双向 | 无 | 有 | 14mm | 14mm | 1.4mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
| 72V2103L6BC | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Lead, Tin | 表面贴装 | BGA | 100 | 166MHz | 2009 | e0 | no | 活跃 | 3 (168 Hours) | 100 | EAR99 | Tin/Lead (Sn63Pb37) | 70°C | 0°C | 8542.32.00.71 | BOTTOM | BALL | 225 | 1 | 3.3V | 166MHz | 20 | 100 | 不合格 | 3.3V | COMMERCIAL | 3.45V | 3.15V | Dual | 35mA | 35mA | 4 ns | 128KX18 | 2.3 Mb | 0.015A | PARALLEL | Synchronous | 其他先进先出 | 单向 | 有 | YES | 6 ns | 1.5mm | 11mm | 11mm | 1.4mm | 符合RoHS标准 | 含铅 | |||||||||||||||||||||||||
| 72T36125L6-7BB | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Lead, Tin | 表面贴装 | BGA | 240 | 150MHz | 2009 | e0 | no | 活跃 | 3 (168 Hours) | 240 | EAR99 | Tin/Lead (Sn63Pb37) | 70°C | 0°C | 8542.32.00.71 | BOTTOM | BALL | 225 | 1 | 2.5V | 1mm | 20 | 240 | 不合格 | 2.5V | COMMERCIAL | 2.625V | 2.375V | Dual | 90mA | 90mA | 3.8 ns | 256KX36 | 9 Mb | 0.01A | PARALLEL | Asynchronous | 36b | 其他先进先出 | 单向 | 有 | YES | 6.7 ns | 1.97mm | 19mm | 19mm | 1.76mm | 符合RoHS标准 | 含铅 | ||||||||||||||||||||||||
| 7207L30LB8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | LCC | 32 | Military grade | Tape & Reel | 2012 | e0 | no | 活跃 | 1 (Unlimited) | 32 | EAR99 | Tin/Lead (Sn/Pb) | 125°C | -55°C | RETRANSMIT | QUAD | 240 | 1 | 5V | 1.27mm | 32 | 5V | 5V | MILITARY | 5.5V | 4.5V | Dual | 150mA | 150mA | 25MHz | 30 ns | 288 kb | 0.012A | MIL-STD-883 Class B | PARALLEL | Asynchronous | 9b | 其他先进先出 | 单向 | 有 | 无 | NO | 40 ns | 3.048mm | 11.4mm | 13.97mm | 1.78mm | 符合RoHS标准 | 含铅 | |||||||||||||||||||||||
| 7203L20LB | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | LCC | 32 | Military grade | 2012 | e0 | no | 活跃 | 1 (Unlimited) | 32 | EAR99 | Tin/Lead (Sn/Pb) | 125°C | -55°C | RETRANSMIT | QUAD | 240 | 1 | 5V | 1.27mm | 32 | 5V | 5V | MILITARY | 5.5V | 4.5V | Dual | 150mA | 150mA | 33.3MHz | 20 ns | 2KX9 | 18 kb | 0.004A | MIL-STD-883 Class B | PARALLEL | Asynchronous | 9b | 其他先进先出 | 单向 | 有 | 无 | NO | 30 ns | 3.048mm | 11.4mm | 13.97mm | 1.78mm | 符合RoHS标准 | 含铅 | |||||||||||||||||||||||
| 72235LB15J8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Lead, Tin | 表面贴装 | PLCC | 68 | 66.7MHz | 2000 | e0 | no | 活跃 | 1 (Unlimited) | 68 | EAR99 | Tin/Lead (Sn85Pb15) | 70°C | 0°C | 8542.32.00.71 | QUAD | J BEND | 225 | 1 | 5V | 1.27mm | 66.7MHz | 68 | 5V | 5V | COMMERCIAL | 5.5V | 4.5V | Dual | 60mA | 60mA | 10 ns | 2KX18 | 36 kb | 0.005A | PARALLEL | Synchronous | 18b | 其他先进先出 | 单向 | 无 | 有 | YES | 15 ns | 4.572mm | 24mm | 24mm | 3.63mm | 符合RoHS标准 | 含铅 | |||||||||||||||||||||||
| 72T72105L6-7BB | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Lead, Tin | 表面贴装 | BGA | 324 | 150MHz | 2009 | e0 | no | 活跃 | 3 (168 Hours) | 324 | EAR99 | Tin/Lead (Sn63Pb37) | 70°C | 0°C | 8542.32.00.71 | BOTTOM | BALL | 225 | 1 | 2.5V | 1mm | 150MHz | 20 | 324 | 不合格 | 2.5V | COMMERCIAL | 2.625V | 2.375V | Dual | 130mA | 130mA | 3.8 ns | 64KX72 | 4.5 Mb | 0.05A | PARALLEL | Synchronous | 72b | 其他先进先出 | 单向 | 有 | YES | 6.7 ns | 1.97mm | 19mm | 19mm | 1.76mm | 符合RoHS标准 | 含铅 | |||||||||||||||||||||||
| 72V223L6PF | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Lead, Tin | 表面贴装 | TQFP | 80 | 166MHz | Bulk | 2009 | e0 | no | 活跃 | 3 (168 Hours) | 80 | EAR99 | Tin/Lead (Sn85Pb15) | 70°C | 0°C | 8542.32.00.71 | QUAD | 鸥翼 | 240 | 1 | 3.3V | 0.65mm | 166MHz | 20 | 80 | 不合格 | 3.3V | COMMERCIAL | 3.45V | 3.15V | Dual | 35mA | 4 ns | 512X18 | 9 kb | 0.015A | PARALLEL | Synchronous | 其他先进先出 | 单向 | 有 | YES | 6 ns | 1.6mm | 14mm | 14mm | 1.4mm | 符合RoHS标准 | 含铅 | ||||||||||||||||||||||||
| 72V845L10PFG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | TQFP | 128 | 100MHz | Bulk | 2009 | e3 | yes | 活跃 | 3 (168 Hours) | 128 | EAR99 | 70°C | 0°C | 8542.32.00.71 | QUAD | 鸥翼 | 260 | 1 | 3.3V | 0.5mm | 30 | 128 | 3.3V | COMMERCIAL | 3.6V | 3V | 60mA | 6.5 ns | 4KX18 | 0.01A | 73728 bit | PARALLEL | 其他先进先出 | 双向 | 无 | 有 | YES | 10 ns | 1.6mm | 20mm | 14mm | 1.4mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||
| 72T7295L10BB | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Lead, Tin | 表面贴装 | BGA | 324 | 100MHz | 2009 | e0 | no | 活跃 | 3 (168 Hours) | 324 | EAR99 | Tin/Lead (Sn63Pb37) | 70°C | 0°C | 8542.32.00.71 | BOTTOM | BALL | 225 | 1 | 2.5V | 1mm | 100MHz | 20 | 324 | 不合格 | 2.5V | COMMERCIAL | 2.625V | 2.375V | Dual | 130mA | 130mA | 4.5 ns | 32KX72 | 2.3 Mb | 0.05A | PARALLEL | Synchronous | 72b | 其他先进先出 | 单向 | 有 | YES | 10 ns | 1.97mm | 19mm | 19mm | 1.76mm | 符合RoHS标准 | 含铅 | |||||||||||||||||||||||
| IDT7200L20SO | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | SOIC | 2009 | e0 | no | 3 (168 Hours) | 28 | EAR99 | Tin/Lead (Sn85Pb15) | 70°C | 0°C | RETRANSMIT | 8542.32.00.71 | DUAL | 鸥翼 | 225 | 1 | 5V | 1.27mm | 30 | 28 | R-PDSO-G28 | 5.5V | 5V | COMMERCIAL | 4.5V | 80mA | 33.3MHz | 20 ns | 256X9 | 3-STATE | 9 | 0.0005A | 2304 bit | PARALLEL | 其他先进先出 | 单向 | 有 | 无 | NO | 30 ns | 3.048mm | 18.3642mm | 8.763mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
| 72V3680L6BBG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Copper, Silver, Tin | 表面贴装 | BGA | 144 | 166MHz | Tape & Reel | 2008 | e1 | yes | 活跃 | 3 (168 Hours) | 144 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | 8542.32.00.71 | BOTTOM | BALL | 260 | 1 | 3.3V | 1mm | 166MHz | 30 | 144 | 不合格 | 3.3V | COMMERCIAL | 3.45V | 3.15V | Dual | 40mA | 40mA | 4 ns | 16KX36 | 576 kb | 0.015A | PARALLEL | Synchronous | 36b | 其他先进先出 | 单向 | 有 | YES | 6 ns | 1.97mm | 13mm | 13mm | 1.76mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||
| 72T1845L5BB | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Lead, Tin | 表面贴装 | BGA | 144 | 200MHz | Bulk | 2009 | 活跃 | 70°C | 0°C | 2.5V | 2.625V | 2.375V | Dual | 60mA | 60mA | 3.6 ns | 36 kb | Asynchronous | 单向 | 有 | 13mm | 13mm | 1.76mm | 符合RoHS标准 | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
| 723641L15PQFG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | PQFP | 132 | 66.7MHz | Bulk | 2009 | e3 | yes | Discontinued | 3 (168 Hours) | 132 | EAR99 | 哑光锡 | 70°C | 0°C | MAIL BOX; RETRANSMIT | 8542.32.00.71 | QUAD | 鸥翼 | 260 | 1 | 5V | 0.635mm | 132 | 5V | 5V | COMMERCIAL | Dual | 400μA | 11 ns | 36b | 1KX36 | 36 kb | PARALLEL | 其他先进先出 | 双向 | 有 | YES | 15 ns | 4.57mm | 24.13mm | 24.13mm | 3.55mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||
| 72V3640L6BB8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Lead, Tin | 表面贴装 | BGA | 144 | 166MHz | Tape & Reel | 2008 | e0 | no | 活跃 | 3 (168 Hours) | 144 | EAR99 | Tin/Lead (Sn63Pb37) | 70°C | 0°C | 8542.32.00.71 | BOTTOM | BALL | 225 | 1 | 3.3V | 1mm | 166MHz | 20 | 144 | 不合格 | 3.3V | COMMERCIAL | 3.45V | 3.15V | Dual | 40mA | 40mA | 4 ns | 1KX36 | 36 kb | 0.015A | PARALLEL | Synchronous | 36b | 其他先进先出 | 单向 | 有 | YES | 6 ns | 1.97mm | 13mm | 13mm | 1.76mm | 符合RoHS标准 | 含铅 | ||||||||||||||||||||||
 | 72V3642L10PF | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | TQFP | 120 | 100MHz | 2013 | e0 | no | Discontinued | 4 (72 Hours) | 120 | EAR99 | Tin/Lead (Sn85Pb15) | 70°C | 0°C | 信箱旁路登记 | 8542.32.00.71 | QUAD | 鸥翼 | 240 | 1 | 3.3V | 0.4mm | 100MHz | 20 | 120 | 3.3V | COMMERCIAL | 3.6V | 3V | Dual | 400mA | 400mA | 6.5 ns | 36b | 1KX36 | 72 kb | 0.001A | PARALLEL | Synchronous | 36b | BI-DIRECTIONAL FIFO | 双向 | 有 | YES | 10 ns | 1.6mm | 14mm | 14mm | 1.4mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||
| IDT72T51248L5BB | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | BGA | 2009 | e0 | 3 (168 Hours) | 324 | EAR99 | Tin/Lead (Sn63Pb37) | 70°C | 0°C | 8542.32.00.71 | BOTTOM | BALL | 225 | 1 | 2.5V | 1mm | not_compliant | 30 | 324 | 不合格 | 2.625V | 1.5/2.52.5V | COMMERCIAL | 2.375V | SYNCHRONOUS | 200MHz | 5 ns | 32KX40 | 40 | 1310720 bit | PARALLEL | 其他先进先出 | YES | 1.97mm | 19mm | 19mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||
| 72215LB10J | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Lead, Tin | 表面贴装 | PLCC | 68 | 100MHz | 2000 | e0 | no | 活跃 | 1 (Unlimited) | 68 | EAR99 | Tin/Lead (Sn85Pb15) | 70°C | 0°C | 8542.32.00.71 | QUAD | J BEND | 225 | 1 | 5V | 1.27mm | 100MHz | 68 | 5V | 5V | COMMERCIAL | 5.5V | 4.5V | Dual | 60mA | 60mA | 6.5 ns | 512X18 | 9 kb | 0.005A | PARALLEL | Synchronous | 18b | 其他先进先出 | 单向 | 无 | 有 | YES | 10 ns | 4.572mm | 24mm | 24mm | 3.63mm | 符合RoHS标准 | 含铅 | |||||||||||||||||||||||
| 72225LB10J8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Lead, Tin | 表面贴装 | PLCC | 68 | 100MHz | 2000 | 活跃 | 70°C | 0°C | 100MHz | 5V | 5.5V | 4.5V | Dual | 60mA | 60mA | 6.5 ns | 单向 | 18 kb | Synchronous | 18b | 单向 | 无 | 无 | 有 | 24mm | 24mm | 3.63mm | 符合RoHS标准 | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||
| IDT723611L15PQF | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | PQFP | 2009 | e0 | 3 (168 Hours) | 132 | EAR99 | Tin/Lead (Sn/Pb) | 70°C | 0°C | MAILBOX; PARITY GENERATOR/CHECKER | 8542.32.00.71 | QUAD | 鸥翼 | 225 | 1 | 5V | 0.635mm | 20 | 132 | 5.5V | 5V | COMMERCIAL | 4.5V | 130mA | 66.7MHz | 10 ns | 64X36 | 3-STATE | 36 | 0.06A | 2304 bit | PARALLEL | 其他先进先出 | 双向 | 无 | 有 | YES | 15 ns | 4.57mm | 24.13mm | 24.13mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
| 72V811L10TFG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | LQFP | 64 | 100MHz | 2008 | Discontinued | 70°C | 0°C | 100MHz | 3.3V | 3.6V | 3V | 40mA | 40mA | 6.5 ns | 9b | 9 kb | Synchronous | 9b | 双向 | 有 | 10mm | 10mm | 1.4mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
| 7204L20TDB | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 通孔 | CDIP | 28 | Military grade | Bulk | 2012 | e0 | no | 活跃 | 1 (Unlimited) | 28 | EAR99 | Tin/Lead (Sn/Pb) | 125°C | -55°C | RETRANSMIT | 8542.32.00.71 | 240 | 1 | 5V | 2.54mm | 28 | 5V | 5V | MILITARY | 5.5V | 4.5V | Dual | 150mA | 150mA | 33.3MHz | 20 ns | 4KX9 | 36 kb | 0.004A | MIL-STD-883 Class B | PARALLEL | Asynchronous | 9b | 其他先进先出 | 单向 | 有 | 无 | NO | 30 ns | 5.08mm | 37.72mm | 7.62mm | 3.56mm | 符合RoHS标准 | 含铅 | ||||||||||||||||||||||
| IDT72V72100L15BB | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 256 | 2005 | e0 | 3 (168 Hours) | 256 | EAR99 | Tin/Lead (Sn63Pb37) | 70°C | 0°C | RETRANSMIT | 8542.32.00.71 | BOTTOM | BALL | 225 | 1 | 3.3V | 1mm | not_compliant | 30 | 256 | 不合格 | 3.45V | 3.3V | COMMERCIAL | 3.15V | SYNCHRONOUS | 66.7MHz | 0.075mA | 15 ns | 64KX72 | 72 | 0.015A | 4718592 bit | PARALLEL | 其他先进先出 | YES | 3.5mm | 17mm | 17mm | Non-RoHS Compliant |