类别是'接口 - 专用'
接口 - 专用 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 包装 | 已出版 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 界面 | 端口的数量 | uPs/uCs/外围ICs类型 | 时钟频率 | 电源电流-最大值 | 数据率 | 边界扫描 | 总线兼容性 | 最大数据传输率 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | RoHS状态 | 无铅 | ||||
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![]() | 73S8024R-ILR/F | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | BCM5398KPBGG | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | 1 (Unlimited) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AT83C24B-Z1RUL | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 28-VFQFN Exposed Pad | Tape & Reel (TR) | 2016 | Obsolete | 3 (168 Hours) | 3V~5.5V | AT83C24 | 2-Wire | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AT83C24B-Z1TUM | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 28-VFQFN Exposed Pad | Tray | 2016 | Obsolete | 3 (168 Hours) | 3V~5.5V | AT83C24 | 2-Wire | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | TSI148-133CLY | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | BGA | 456 | 70°C | 1999 | e1 | yes | Discontinued | 3 (168 Hours) | 456 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO OPERATES AT 3.3V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.8V | 1mm | 456 | 1.95V | COMMERCIAL | 1.65V | PCI | BUS CONTROLLER, VME | 133MHz | PCI | 2.36mm | 27mm | 27mm | 2.65mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||
![]() | 89H32NT8BG2ZCHL8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | FCBGA | 484 | 125MHz | 1999 | no | 活跃 | 70°C | 0°C | 484 | 3.3V | PCI Express | 8 | BUS CONTROLLER, PCI | 256 Gbps | 2.92mm | 23mm | 23mm | 2.92mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||
![]() | 89H32NT8BG2ZCHL | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | FCBGA | 484 | 125MHz | 1999 | e0 | no | 活跃 | 4 (72 Hours) | 484 | EAR99 | Tin/Lead (Sn/Pb) | 70°C | 0°C | ALSO OPERATES AT 100 MHZ | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 未说明 | 484 | 不合格 | 3.3V | 1.1V | COMMERCIAL | PCI Express | 8 | BUS CONTROLLER, PCI | 3400mA | 256 Gbps | I2C; ISA; VGA | 2.92mm | 23mm | 23mm | 2.92mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||
![]() | 89H34H16G2ZCBLGI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 1156 | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 85°C | -40°C | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 未说明 | 不合格 | 1.1V | 12.52.5/3.3V | INDUSTRIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | 6264mA | I2C; ISA; PCI; SMBUS; VGA | 34000 MBps | 2.82mm | 35mm | 35mm | 2.82mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||
![]() | TSI107D-133LEY | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | FCBGA | 503 | 64 | 1999 | e1 | no | Discontinued | 3 (168 Hours) | 503 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 105°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 260 | 2.5V | 1.27mm | 503 | 2.625V | 2.375V | PCI | 66MHz | YES | 33mm | 33mm | 2.75mm | 无 | 符合RoHS标准 | 含铅 | ||||||||||||||||||||||||||
![]() | 89HPES24T3G2ZBBLG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 676 | Tape & Reel (TR) | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | 676 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | HAVING 125MHZ INPUT REFERENCE CLOCK FREQUENCY. | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 未说明 | 676 | 1.1V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | SMBUS | 625 MBps | 3.22mm | 27mm | 27mm | 3.4mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||
![]() | 89H64H16G2ZCBL | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | FCBGA | 1156 | 70°C | 1999 | e0 | no | 活跃 | 4 (72 Hours) | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 未说明 | 不合格 | 1.1V | 12.5/3.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | I2C; ISA; PCI; SMBUS; VGA | 64000 MBps | 2.82mm | 35mm | 35mm | 2.82mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||
![]() | 89HPES12T3G2ZABC8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | BGA | 324 | Tape & Reel (TR) | 1999 | e0 | no | 活跃 | 3 (168 Hours) | 324 | EAR99 | Tin/Lead (Sn63Pb37) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 未说明 | 324 | 不合格 | 1.1V | 3.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI; SMBUS | 12000 MBps | 1.72mm | 19mm | 19mm | 1.4mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||
![]() | 89HPES4T4G2ZBAL8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | FCBGA | 324 | Tape & Reel (TR) | 2009 | no | 活跃 | EAR99 | 70°C | 0°C | 8542.39.00.01 | not_compliant | 324 | PCI Express | 3.27mm | 19mm | 19mm | 3.27mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||
![]() | 89HPES4T4ZBNQG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Tin | 表面贴装 | 132 | 70°C | 1999 | e3 | yes | 活跃 | 3 (168 Hours) | 132 | EAR99 | 8542.39.00.01 | QUAD | 无铅 | 260 | 1V | 0.65mm | 未说明 | 132 | 不合格 | 1.1V | 13.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI | 0.9mm | 10mm | 10mm | 900μm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||
![]() | 89HPES16T4G2ZABXG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | 288 | Tape & Reel (TR) | 1999 | e1 | yes | 活跃 | 3 (168 Hours) | 288 | EAR99 | 锡银铜 | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 未说明 | 288 | 不合格 | 1.1V | 1.22.53.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI; SMBUS | 16000 MBps | 1.7mm | 23mm | 23mm | 1.1mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||
![]() | 89HPES24T61ZCBXG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | BGA | 420 | 1999 | e1 | yes | 3 (168 Hours) | 420 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | ALSO REQUIRES 3.3V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 30 | 420 | 不合格 | 1.1V | 3.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI | 1.7mm | 27mm | 27mm | 符合RoHS标准 | ||||||||||||||||||||||
![]() | 89HPES24T61ZCBXG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Copper, Silver, Tin | 表面贴装 | BGA | 420 | Tape & Reel (TR) | 1999 | e1 | 3 (168 Hours) | 420 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 3.3V | 1mm | 不合格 | 3.3V | COMMERCIAL | PCI Express | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||
![]() | 89H48H12G3ZAHLG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Copper, Silver, Tin | 表面贴装 | FCBGA | 676 | 70°C | 1999 | e1 | yes | Discontinued | 4 (72 Hours) | 676 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 未说明 | 676 | 1.1V | COMMERCIAL | 0.95V | PCI Express | BUS CONTROLLER, PCI | ISA; SMBUS; VGA | 96000 MBps | 2.9mm | 27mm | 27mm | 3.2mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||
![]() | 89HPES24T3G2ZBBLG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 676 | 70°C | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | 676 | EAR99 | 锡银铜 | ALSO REQUIRES 3.3V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 未说明 | 676 | 不合格 | 1.1V | 12.53.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI | 3.4mm | 27mm | 27mm | 3.4mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||
![]() | 89H48H12G2ZCBLI8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | -40°C | 表面贴装 | FCBGA | 676 | 85°C | Tape & Reel (TR) | 1999 | e0 | no | 活跃 | 4 (72 Hours) | 676 | EAR99 | Tin/Lead (Sn/Pb) | HAVING 125MHZ INPUT REFERENCE CLOCK FREQUENCY. | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 未说明 | 676 | 1.1V | INDUSTRIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | I2C; ISA; SMBUS; VGA | 48000 MBps | 3.4mm | 27mm | 27mm | 3.4mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||
![]() | 89HPES24T3G2ZCALI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | FCBGA | 324 | 1999 | e0 | no | 活跃 | 4 (72 Hours) | 324 | EAR99 | Tin/Lead (Sn63Pb37) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 30 | 324 | 不合格 | 1.1V | 12.53.3V | INDUSTRIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI | 3.27mm | 19mm | 19mm | 3.27mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||
![]() | 89HPES4T4G2ZCAL8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | FCBGA | 324 | Tape & Reel (TR) | 2009 | e0 | no | 活跃 | 4 (72 Hours) | 324 | EAR99 | Tin/Lead (Sn63Pb37) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 未说明 | 324 | 不合格 | 1.1V | 13.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 100MHz | PCI; SMBUS | 3.27mm | 19mm | 19mm | 3.27mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||
![]() | 89HPES34H16ZABR | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 1156 | 125MHz | 1999 | e1 | no | 活跃 | 4 (72 Hours) | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 未说明 | 不合格 | 3.3V | 1.1V | COMMERCIAL | PCI Express | 16 | BUS CONTROLLER, PCI | 3.42mm | 35mm | 35mm | 2.82mm | 符合RoHS标准 | 含铅 | |||||||||||||||||||||||
![]() | 89H64H16G3ZABLGI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | -40°C | YES | 1156 | 85°C | 1999 | e1 | yes | Discontinued | 4 (72 Hours) | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 245 | 1V | 1mm | 未说明 | 1.1V | INDUSTRIAL | 0.95V | PCI Express | BUS CONTROLLER, PCI | ISA; SMBUS; VGA | 128000 MBps | 3.42mm | 35mm | 35mm | 2.82mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||
![]() | 89H64H16G3ZABLI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | -40°C | YES | 1156 | 85°C | 1999 | e0 | no | Discontinued | 4 (72 Hours) | Tin/Lead (Sn/Pb) | BOTTOM | BALL | 225 | 1V | 1mm | 未说明 | 1.1V | INDUSTRIAL | 0.95V | PCI Express | BUS CONTROLLER, PCI | ISA; SMBUS; VGA | 128000 MBps | 3.42mm | 35mm | 35mm | 2.82mm | 符合RoHS标准 | 含铅 |