类别是'接口 - 专用'
接口 - 专用 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 包装/外壳 | 表面安装 | 引脚数 | 包装 | 已出版 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 界面 | 最大电源电压 | 最小电源电压 | 工作电源电流 | 端口的数量 | 电源电流 | uPs/uCs/外围ICs类型 | 时钟频率 | 电源电流-最大值 | 数据率 | 数据总线宽度 | 地址总线宽度 | 外部数据总线宽度 | 通信IC类型 | 消费者集成电路类型 | 总线兼容性 | 最大数据传输率 | DMA通道数 | 驱动接口标准 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||
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 | 89H12T3BG2ZBBCG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Copper, Silver, Tin | 表面贴装 | BGA | 324 | Tape & Reel (TR) | 1999 | PCI Express | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 89HPES5T5ZBBCGI8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | 196 | 125MHz | Tape & Reel (TR) | 1999 | e1 | yes | 活跃 | 3 (168 Hours) | 196 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 85°C | -40°C | BOTTOM | BALL | 260 | 1V | 1mm | 未说明 | 196 | 不合格 | 3.3V | 1.1V | INDUSTRIAL | PCI Express | 5 | BUS CONTROLLER, PCI | PCI; SMBUS | 1.4mm | 15mm | 15mm | 1.4mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||
 | 89HPES5T5ZBBC | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | 196 | 125MHz | 1999 | e0 | no | 活跃 | 3 (168 Hours) | 196 | EAR99 | Tin/Lead (Sn63Pb37) | 70°C | 0°C | ALSO REQUIRES 3.3V SUPPLY | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 20 | 196 | 不合格 | 3.3V | 1.1V | COMMERCIAL | PCI Express | 5 | BUS CONTROLLER, PCI | PCI | 15mm | 15mm | 1.4mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||
 | 89H12NT12G2ZBHLG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 324 | 125MHz | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | 324 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | ALSO OPERATES AT 100 MHZ | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 未说明 | 324 | 不合格 | 3.3V | 1.1V | COMMERCIAL | PCI Express | 12 | BUS CONTROLLER, PCI | 3300mA | 96 Gbps | I2C; ISA; VGA | 2.88mm | 19mm | 19mm | 3.02mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||
 | 89H12NT12G2ZAHLGI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | FCBGA | 125MHz | 1999 | 85°C | -40°C | 3.3V | PCI Express | 12 | 96 Gbps | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CS82C37AZ | Intersil (Renesas Electronics America) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | PLCC | 44 | 1996 | e3 | yes | 活跃 | 3 (168 Hours) | 44 | Matte Tin (Sn) - annealed | 70°C | 0°C | 8542.31.00.01 | QUAD | J BEND | 5V | 1.27mm | 44 | 5.5V | 5V | COMMERCIAL | 4.5V | DMA控制器 | 8MHz | 8 | 8 | 80C286; 80286; 80186; 80C86; 8086; 80C88; 8088; 8085; Z80; NSC800 | 4 | 4.57mm | 16.585mm | 16.585mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
 | 89HT0808PYAABGI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | BGA | 100 | 1999 | I2C | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | TSI721-16GIL | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | FCBGA | 143 | 2012 | 活跃 | 13mm | 13mm | 1.51mm | 符合RoHS标准 | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png) | TSI109-200ILY | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | -40°C | 表面贴装 | FCBGA | 1023 | 85°C | 1999 | e1 | no | 活跃 | 4 (72 Hours) | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 1.26V | INDUSTRIAL | 1.14V | PCI | 33.33MHz | POWERPC 60X | 2.76mm | 33mm | 33mm | 2mm | 无 | 符合RoHS标准 | 含铅 | ||||||||||||||||||||||||||||||||||
 | 89H24NT24G2ZAHLGI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | FCBGA | 125MHz | 1999 | 85°C | -40°C | 3.3V | PCI Express | 24 | 192 Gbps | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AMB0483D0RJ | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FCBGA | 655 | 2008 | Discontinued | 24.5mm | 19.5mm | 2.55mm | 无 | 符合RoHS标准 | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 89HPES12N3AZGBCG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | BGA | 324 | 1999 | e1 | yes | 活跃 | 3 (168 Hours) | 324 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | ALSO REQUIRES 3.3V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 30 | 324 | 不合格 | 1.1V | 3.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI | 1.5mm | 19mm | 19mm | 1.4mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||
 | 89HPES24T3G2ZBALG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 324 | 70°C | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | 324 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO REQUIRES 3.3V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 30 | 324 | 不合格 | 1.1V | 12.53.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI | 3.42mm | 19mm | 19mm | 3.27mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||
 | TSI148-133IL | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | BGA | YES | 456 | Bulk | 1999 | e0 | no | Discontinued | 3 (168 Hours) | 456 | 3A001.A.3 | Tin/Lead (Sn/Pb) | 85°C | -40°C | ALSO OPERATES AT 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 225 | 1.8V | 1mm | 456 | 1.95V | INDUSTRIAL | 1.65V | BUS CONTROLLER, VME | 133MHz | PCI | IEEE 1149.1 | 2.36mm | 27mm | 27mm | 2.65mm | 无 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||
 | 89HP0504PZBAB | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | 100 | 70°C | 2011 | e0 | no | 活跃 | 3 (168 Hours) | 100 | EAR99 | Tin/Lead (Sn63Pb37) | ALSO AVAILABLE 3.3V SUPPLY-NOM FOR I2C | 8542.39.00.01 | BOTTOM | BALL | 240 | 1 | 0.8mm | not_compliant | 未说明 | 100 | 1.26V | COMMERCIAL | 1.14V | PCI Express | 消费电路 | 9mm | 9mm | 1.7mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||
 | QLX4600SIQT7 | Intersil (Renesas Electronics America) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 19 Weeks | 表面贴装 | QFN EP | 46 | Cut Tape (CT) | 2009 | e4 | 活跃 | 1 (Unlimited) | 46 | Nickel/Palladium/Gold (Ni/Pd/Au) | 70°C | 0°C | 8542.39.00.01 | QUAD | 无铅 | 260 | 1 | 1.2V | 0.4mm | 30 | 46 | 不合格 | 1.2V | COMMERCIAL | 1.3V | 1.1V | 260mA | 260mA | 6.25 Gbps | 电信电路 | 0.75mm | 7mm | 4mm | 无SVHC | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||
 | 89HPES6T6G2ZCALGI8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | -40°C | Copper, Silver, Tin | 表面贴装 | FCBGA | 324 | 85°C | Tape & Reel (TR) | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | 324 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 未说明 | 324 | 不合格 | 1.1V | 13.3V | INDUSTRIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 100MHz | PCI; SMBUS | 3.42mm | 19mm | 19mm | 3.27mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||
 | 89HT0808PYBABG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 100 | 1999 | yes | 活跃 | 100 | I2C | 9mm | 9mm | 1.7mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 89H32T8G2ZCBLGI8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | FCBGA | 484 | 125MHz | Tape & Reel (TR) | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | 484 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 85°C | -40°C | HAVING 125MHZ INPUT REFERENCE CLOCK FREQUENCY. | BOTTOM | BALL | 245 | 1V | 1mm | 未说明 | 484 | 3.3V | 1.1V | INDUSTRIAL | PCI Express | 8 | BUS CONTROLLER, PCI | 256 Gbps | I2C; ISA; SMBUS; VGA | 32000 MBps | 3.34mm | 23mm | 23mm | 3.34mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||
 | 89HPES24T3G2ZBALG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 324 | 70°C | Tape & Reel (TR) | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | 324 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | HAVING 125MHZ INPUT REFERENCE CLOCK FREQUENCY. | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 未说明 | 324 | 1.1V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | SMBUS | 625 MBps | 3.42mm | 19mm | 19mm | 3.27mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||
 | 89HPES5T5ZBBCI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | 196 | 125MHz | 1999 | e0 | no | 活跃 | 3 (168 Hours) | 196 | EAR99 | Tin/Lead (Sn63Pb37) | 85°C | -40°C | ALSO REQUIRES 3.3V SUPPLY | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 20 | 196 | 不合格 | 3.3V | 1.1V | INDUSTRIAL | PCI Express | 5 | BUS CONTROLLER, PCI | PCI | 1.4mm | 15mm | 15mm | 1.4mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||
| 89H48H12G3YCHLG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 676 | 125MHz | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | 676 | EAR99 | 锡银铜 | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 未说明 | 676 | 不合格 | 1.1V | 11.83.3V | COMMERCIAL | 0.95V | PCI Express | 12 | BUS CONTROLLER, PCI | 7420mA | 768 Gbps | ISA; VGA | 2.9mm | 27mm | 27mm | 3.2mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||
 | TSI350A-66CLV | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | BGA | YES | 256 | 66MHz | 2009 | e1 | yes | Discontinued | 3 (168 Hours) | 256 | 3A001.A.3 | Tin/Silver/Copper (Sn/Ag/Cu) | 85°C | 0°C | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 256 | 3.6V | OTHER | BUS CONTROLLER, PCI | 32b | PCI | IEEE 1149.1 | 1.8mm | 17mm | 17mm | 1.61mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||
 | 89HPES22H16ZABR | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 484 | 125MHz | 1999 | e1 | no | 活跃 | 4 (72 Hours) | 484 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 30 | 484 | 不合格 | 3.3V | 1.1V | COMMERCIAL | PCI Express | 16 | BUS CONTROLLER, PCI | 88 Gbps | PCI | 3.32mm | 23mm | 23mm | 3.34mm | 符合RoHS标准 | 含铅 | |||||||||||||||||||||||||||
 | TSI382-66CQY | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | TQFP | 176 | 66MHz | 1999 | e3 | yes | 活跃 | 3 (168 Hours) | 176 | Tin (Sn) | 85°C | 0°C | QUAD | 鸥翼 | 260 | 1.2V | 0.4mm | 176 | 3.3V | 1.26V | COMMERCIAL | PCI | 32b | ISA; VGA | 312.5 MBps | 1.6mm | 20mm | 20mm | 1.4mm | 无 | 符合RoHS标准 | 无铅 |