你好!请登入 免费注册

我的订单 我的询价 0755-82520436 3307104213

图片

产品型号

品牌

数据表

有效性

单价(CNY)

询价

认证

工厂交货时间

生命周期状态

触点镀层

底架

包装/外壳

表面安装

引脚数

供应商器件包装

终端数量

厂商

操作温度

包装

已出版

系列

JESD-609代码

无铅代码

零件状态

湿度敏感性等级(MSL)

终止次数

ECCN 代码

端子表面处理

附加功能

HTS代码

技术

端子位置

终端形式

峰值回流焊温度(摄氏度)

电源电压

端子间距

Reach合规守则

频率

时间@峰值回流温度-最大值(s)

基本部件号

JESD-30代码

输出的数量

资历状况

工作电源电压

电源电压-最大值(Vsup)

电源

温度等级

电源电压-最小值(Vsup)

界面

最大电源电压

最小电源电压

速度

内存大小

uPs/uCs/外围ICs类型

核心处理器

周边设备

时钟频率

程序内存大小

传播延迟

连接方式

建筑学

数据总线宽度

输入数量

组织结构

座位高度-最大

可编程逻辑类型

核心架构

阀门数量

边界扫描

速度等级

内存(字)

主要属性

寄存器数量

逻辑块数量

逻辑单元数

核数量

总线兼容性

等效门数

闪光大小

座位高度(最大)

长度

宽度

辐射硬化

RoHS状态

XC7Z015-L1CLG485I XC7Z015-L1CLG485I

Xilinx Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

10 Weeks

Copper, Silver, Tin

表面贴装

484-LFBGA, CSPBGA

130

-40°C~100°C TJ

Tray

2010

Zynq®-7000

e1

活跃

3 (168 Hours)

485

EAR99

Tin/Silver/Copper (Sn/Ag/Cu)

PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

8542.39.00.01

BOTTOM

BALL

未说明

1V

0.8mm

667MHz

未说明

S-PBGA-B485

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

1.05V

950mV

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

120 ps

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

ARM

YES

256000

Artix™-7 FPGA, 74K Logic Cells

92400

CAN; ETHERNET; I2C; SPI; UART; USB

1.6mm

19mm

19mm

ROHS3 Compliant

XC7Z035-1FFG676C XC7Z035-1FFG676C

Xilinx Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

10 Weeks

676-BBGA, FCBGA

YES

130

0°C~85°C TJ

Tray

2010

Zynq®-7000

e1

活跃

4 (72 Hours)

676

3A991.D

Tin/Silver/Copper (Sn/Ag/Cu)

PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

8542.39.00.01

BOTTOM

BALL

未说明

1V

1mm

667MHz

未说明

S-PBGA-B676

1.05V

0.95V

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

ARM

YES

256000

Kintex™-7 FPGA, 275K Logic Cells

CAN; ETHERNET; I2C; SPI; UART; USB

3.37mm

27mm

27mm

ROHS3 Compliant

M2S050-FGG484 M2S050-FGG484

Atmel (Microchip Technology) 数据表

N/A

-

最小起订量: 1

倍率: 1

Details

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

267 I/O

0 C

+ 85 C

1.314 Mbit

64 kB

4695 LAB

60

BGA-484

This product may require additional documentation to export from the United States.

Tray

SmartFusion2

1.2 V

256 kB

1 Core

XCZU4CG-1SFVC784I XCZU4CG-1SFVC784I

Xilinx Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

11 Weeks

784-BFBGA, FCBGA

252

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale+™ MPSoC CG

活跃

4 (72 Hours)

8542.31.00.01

未说明

未说明

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

ROHS3 Compliant

XCZU9EG-2FFVC900I XCZU9EG-2FFVC900I

Xilinx Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

11 Weeks

900-BBGA, FCBGA

204

-40°C~100°C TJ

Tray

Zynq® UltraScale+™ MPSoC EG

e1

活跃

4 (72 Hours)

Tin/Silver/Copper (Sn/Ag/Cu)

8542.31.00.01

未说明

未说明

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

ROHS3 Compliant

M2S005S-TQG144I M2S005S-TQG144I

Atmel (Microchip Technology) 数据表

N/A

-

最小起订量: 1

倍率: 1

Details

SMD/SMT

166 MHz

-

-

64 kB

6060 LE

505 LAB

60

0.046530 oz

TQFP-144

This product may require additional documentation to export from the United States.

Tray

SmartFusion2

128 kB

1 Core

A2F500M3G-1FG256 A2F500M3G-1FG256

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

N

SMD/SMT

100 MHz

-

-

64 kB

6000 LE

117 I/O

0 C

+ 85 C

-

90

SmartFusion

1.5000 V

1.425 V

1.575 V

Tray

A2F500

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA256,16X16,40

1.5 V

30

1.425 V

85 °C

A2F500M3G-1FG256

100 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

FPBGA-256

YES

256-FPBGA (17x17)

256

微芯片技术

This product may require additional documentation to export from the United States.

0 to 85 °C

Tray

A2F500

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

66

不合格

1.5,1.8,2.5,3.3 V

OTHER

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

66

11520 CLBS, 500000 GATES

1.7 mm

现场可编程门阵列

500000

1

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

11520

11520

1 Core

500000

512KB

17 mm

17 mm

XC7Z020-L1CLG400I XC7Z020-L1CLG400I

Xilinx Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

10 Weeks

Copper, Silver, Tin

表面贴装

400-LFBGA, CSPBGA

130

-40°C~100°C TJ

Tray

2010

Zynq®-7000

e1

活跃

3 (168 Hours)

400

3A991.D

Tin/Silver/Copper (Sn/Ag/Cu)

PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

8542.39.00.01

BOTTOM

BALL

未说明

1V

0.8mm

667MHz

未说明

S-PBGA-B400

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

1.05V

950mV

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

ARM

YES

256000

Artix™-7 FPGA, 85K Logic Cells

106400

CAN; ETHERNET; I2C; SPI; UART; USB

1.6mm

17mm

17mm

ROHS3 Compliant

M2S060-1FCS325I M2S060-1FCS325I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

N

166 MHz

-

-

64 kB

56520 LE

4710 LAB

176

SmartFusion2

200

Tray

M2S060

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

1.14 V

M2S060-1FCS325I

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.87

Production (Last Updated: 2 months ago)

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.5 mm

not_compliant

S-PBGA-B325

200

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

200

1.01 mm

现场可编程门阵列

FPGA - 60K Logic Modules

56520

1 Core

256KB

11 mm

11 mm

XC7Z030-L2FFG676I XC7Z030-L2FFG676I

Xilinx Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

10 Weeks

Copper, Silver, Tin

表面贴装

676-BBGA, FCBGA

130

-40°C~100°C TJ

Tray

2010

Zynq®-7000

e1

活跃

4 (72 Hours)

676

3A991.D

Tin/Silver/Copper (Sn/Ag/Cu)

PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

8542.39.00.01

BOTTOM

BALL

未说明

1V

1mm

800MHz

未说明

S-PBGA-B676

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

1.05V

950mV

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

100 ps

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

ARM

YES

256000

Kintex™-7 FPGA, 125K Logic Cells

157200

CAN; ETHERNET; I2C; SPI; UART; USB

3.24mm

27mm

27mm

ROHS3 Compliant

XCZU4EG-1SFVC784I XCZU4EG-1SFVC784I

Xilinx Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

11 Weeks

784-BFBGA, FCBGA

252

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale+™ MPSoC EG

活跃

4 (72 Hours)

8542.31.00.01

未说明

未说明

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

ROHS3 Compliant

XCZU7EV-2FFVC1156I XCZU7EV-2FFVC1156I

Xilinx Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

11 Weeks

1156-BBGA, FCBGA

360

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale+™ MPSoC EV

活跃

4 (72 Hours)

8542.31.00.01

未说明

未说明

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

ROHS3 Compliant

A2F500M3G-1PQ208I A2F500M3G-1PQ208I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

N

SMD/SMT

100 MHz

-

-

64 kB

6000 LE

113 I/O

- 40 C

+ 100 C

-

24

SmartFusion

0.183425 oz

Tray

A2F500M3G

Obsolete

208-BFQFP

208-PQFP (28x28)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

A2F500

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

Ethernet, I²C, SPI, UART/USART

MCU, FPGA

500000

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

1 Core

512KB

XCZU3CG-1SFVA625E XCZU3CG-1SFVA625E

Xilinx Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

11 Weeks

625-BFBGA, FCBGA

180

0°C~100°C TJ

Bulk

2016

Zynq® UltraScale+™ MPSoC CG

活跃

4 (72 Hours)

8542.31.00.01

未说明

未说明

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

ROHS3 Compliant

XCZU19EG-L1FFVC1760I XCZU19EG-L1FFVC1760I

Xilinx Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

11 Weeks

1760-BBGA, FCBGA

YES

512

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale+™ MPSoC EG

活跃

4 (72 Hours)

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

8542.31.00.01

BOTTOM

BALL

未说明

0.72V

未说明

R-PBGA-B1760

0.742V

0.698V

500MHz, 600MHz, 1.2GHz

256KB

微处理器电路

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

ROHS3 Compliant

XCZU2CG-1SFVC784E XCZU2CG-1SFVC784E

Xilinx Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

11 Weeks

784-BFBGA, FCBGA

252

0°C~100°C TJ

Tray

Zynq® UltraScale+™ MPSoC CG

活跃

4 (72 Hours)

8542.31.00.01

未说明

未说明

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

ROHS3 Compliant

M2S150T-1FC1152I M2S150T-1FC1152I

Atmel (Microchip Technology) 数据表

N/A

-

最小起订量: 1

倍率: 1

SMD/SMT

166 MHz

-

-

64 kB

146124 LE

12177 LAB

24

1.234218 oz

FCBGA-1152

N

Tray

SmartFusion2

512 kB

1 Core

XC7Z014S-1CLG484I XC7Z014S-1CLG484I

Xilinx Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

10 Weeks

484-LFBGA, CSPBGA

YES

200

-40°C~100°C TJ

Tray

2016

Zynq®-7000

e3

yes

活跃

3 (168 Hours)

484

Matte Tin (Sn)

8542.31.00.01

BOTTOM

BALL

未说明

1V

0.8mm

未说明

S-PBGA-B484

1.05V

0.95V

667MHz

256KB

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

667MHz

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

YES

256000

Artix™-7 FPGA, 65K Logic Cells

CAN; ETHERNET; I2C; SPI; UART; USB

1.6mm

19mm

19mm

ROHS3 Compliant

XC7Z045-L2FFG900I XC7Z045-L2FFG900I

Xilinx Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

10 Weeks

900-BBGA, FCBGA

YES

130

-40°C~100°C TJ

Tray

2010

Zynq®-7000

e1

活跃

4 (72 Hours)

900

3A991.D

Tin/Silver/Copper (Sn/Ag/Cu)

PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

8542.39.00.01

BOTTOM

BALL

245

1V

1mm

800MHz

30

S-PBGA-B900

1.05V

0.95V

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

ARM

YES

256000

Kintex™-7 FPGA, 350K Logic Cells

CAN; ETHERNET; I2C; SPI; UART; USB

3.35mm

31mm

31mm

ROHS3 Compliant

XC7Z030-3FFG676E XC7Z030-3FFG676E

Xilinx Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

10 Weeks

Copper, Silver, Tin

676-BBGA, FCBGA

YES

676

130

0°C~100°C TJ

Tray

2009

Zynq®-7000

e1

活跃

4 (72 Hours)

676

3A991.D

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

245

1V

1mm

1GHz

30

XC7Z030

1V

1.05V

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

32b

ARM

YES

-3

256000

Kintex™-7 FPGA, 125K Logic Cells

CAN; ETHERNET; I2C; SPI; UART; USB

3.24mm

27mm

ROHS3 Compliant

M2S050T-1FGG484I M2S050T-1FGG484I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

Details

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

4695 LAB

60

267

Tray

M2S050

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

1.14 V

M2S050T-1FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.76

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

40

S-PBGA-B484

267

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

现场可编程门阵列

1

FPGA - 50K Logic Modules

56340

1 Core

256KB

23 mm

23 mm

XCZU2EG-1SFVC784E XCZU2EG-1SFVC784E

Xilinx Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

11 Weeks

784-BFBGA, FCBGA

252

0°C~100°C TJ

Tray

2013

Zynq® UltraScale+™ MPSoC EG

活跃

4 (72 Hours)

8542.31.00.01

未说明

未说明

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

ROHS3 Compliant

5CSEBA2U23C8N 5CSEBA2U23C8N

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

8 Weeks

672-FBGA

YES

MCU - 181, FPGA - 145

0°C~85°C TJ

Tray

2018

Cyclone® V SE

活跃

3 (168 Hours)

672

8542.39.00.01

BOTTOM

BALL

未说明

1.1V

0.8mm

未说明

S-PBGA-B672

145

不合格

1.13V

1.11.2/3.32.5V

1.07V

600MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

145

现场可编程门阵列

FPGA - 25K Logic Elements

25000

1.85mm

23mm

23mm

符合RoHS标准

5CSEBA6U23C7N 5CSEBA6U23C7N

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

8 Weeks

672-FBGA

YES

MCU - 181, FPGA - 145

0°C~85°C TJ

Tray

2018

Cyclone® V SE

活跃

3 (168 Hours)

672

8542.39.00.01

BOTTOM

BALL

未说明

1.1V

0.8mm

未说明

5CSEBA6

S-PBGA-B672

145

不合格

1.13V

1.11.2/3.32.5V

1.07V

800MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

145

现场可编程门阵列

FPGA - 110K Logic Elements

110000

1.85mm

23mm

23mm

符合RoHS标准

M2S050T-FGG896 M2S050T-FGG896

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

Details

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

377 I/O

0 C

+ 85 C

4695 LAB

27

1.2000 V

Tray

M2S050

活跃

FBGA-896

网格排列

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

40

1.14 V

85 °C

M2S050T-FGG896

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

2.31

FPBGA-896

YES

896-FBGA (31x31)

896

微芯片技术

This product may require additional documentation to export from the United States.

0 to 85 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B896

377

不合格

1.2 V

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

377

2.44 mm

现场可编程门阵列

STD

FPGA - 50K Logic Modules

56340

1 Core

256KB

31 mm

31 mm