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类别是'嵌入式 - 片上系统（SoC）'

嵌入式 - 片上系统（SoC） (6000)

产品型号	品牌	数据表	有效性	单价(CNY)	询价	工厂交货时间	包装/外壳	表面安装	供应商器件包装		操作温度	包装	已出版	系列	JESD-609代码	无铅代码	零件状态	湿度敏感性等级(MSL)	终止次数	端子表面处理	附加功能	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	电源电压	端子间距	时间@峰值回流温度-最大值(s)	基本部件号	JESD-30代码	输出的数量	资历状况	电源电压-最大值(Vsup)	电源	电源电压-最小值(Vsup)	速度	内存大小	uPs/uCs/外围ICs类型	核心处理器	周边设备	连接方式	建筑学	输入数量	可编程逻辑类型	主要属性	逻辑单元数	座位高度(最大)	长度	宽度	RoHS状态
XCZU7EG-3FFVF1517E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 倍率: 1	11 Weeks	1517-BBGA, FCBGA			464	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)				8542.31.00.01			未说明			未说明								600MHz, 667MHz, 1.5GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 504K+ Logic Cells					ROHS3 Compliant
XCZU4EV-3FBVB900E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 倍率: 1	11 Weeks	900-BBGA, FCBGA			204	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV			活跃	4 (72 Hours)				8542.31.00.01			未说明			未说明								600MHz, 1.5GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 192K+ Logic Cells					ROHS3 Compliant
10AS016E4F29E3SG	Intel	数据表	N/A	-	最小起订量: 1 倍率: 1	8 Weeks	780-BBGA, FCBGA	YES		288	0°C~100°C TJ	Tray		Arria 10 SX			活跃	3 (168 Hours)	780			8542.39.00.01	BOTTOM	BALL	未说明	0.9V	1mm	未说明		S-PBGA-B780	288	不合格	0.93V	0.9V	0.87V	1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	288	现场可编程门阵列	FPGA - 160K Logic Elements	160000	3.35mm	29mm	29mm	符合RoHS标准
5CSEMA6F31I7N	Intel	数据表	N/A	-	最小起订量: 1 倍率: 1	8 Weeks	896-BGA	YES		MCU - 181, FPGA - 288	-40°C~100°C TJ	Tray	2018	Cyclone® V SE	e1		活跃	3 (168 Hours)	896	Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01	BOTTOM	BALL	未说明	1.1V	1mm	未说明	5CSEMA6	S-PBGA-B896	288	不合格	1.13V	1.11.2/3.32.5V	1.07V	800MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	288	现场可编程门阵列	FPGA - 110K Logic Elements	110000	2mm	31mm	31mm	符合RoHS标准
5CSEBA2U19A7N	Intel	数据表	N/A	-	最小起订量: 1 倍率: 1	8 Weeks	484-FBGA	YES		MCU - 151, FPGA - 66	-40°C~125°C TJ	Tray	2017	Automotive, AEC-Q100, Cyclone® V SE			活跃	3 (168 Hours)	484				BOTTOM	BALL	未说明	1.1V	0.8mm	未说明		S-PBGA-B484	66	不合格	1.13V	1.11.2/3.32.5V	1.07V	700MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	66	现场可编程门阵列	FPGA - 25K Logic Elements	25000	1.9mm	19mm	19mm	符合RoHS标准
XCZU9EG-L2FFVC900E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 倍率: 1	11 Weeks	900-BBGA, FCBGA	YES		204	0°C~100°C TJ	Bulk	2013	Zynq® UltraScale+™ MPSoC EG	e1		活跃	4 (72 Hours)	900	Tin/Silver/Copper (Sn/Ag/Cu)	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明		R-PBGA-B900			0.742V		0.698V	533MHz, 600MHz, 1.3GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 599K+ Logic Cells					ROHS3 Compliant
XCZU19EG-L2FFVD1760E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 倍率: 1	11 Weeks	1760-BBGA, FCBGA	YES		308	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明		R-PBGA-B1760			0.742V		0.698V	533MHz, 600MHz, 1.3GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells					ROHS3 Compliant
10AS066N3F40I2SG	Intel	数据表	N/A	-	最小起订量: 1 倍率: 1	8 Weeks	1517-BBGA, FCBGA	YES		588	-40°C~100°C TJ	Tray		Arria 10 SX			活跃	3 (168 Hours)				8542.39.00.01	BOTTOM	BALL	未说明	0.9V	1mm	未说明		S-PBGA-B1517	588	不合格	0.93V	0.9V	0.87V	1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	588	现场可编程门阵列	FPGA - 660K Logic Elements	660000	3.5mm	40mm	40mm	符合RoHS标准
XCZU2EG-L2SBVA484E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 倍率: 1	11 Weeks	484-BFBGA, FCBGA	YES		82	0°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)	484		ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明		R-PBGA-B484			0.742V		0.698V	533MHz, 600MHz, 1.3GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 103K+ Logic Cells					ROHS3 Compliant
XCZU2CG-L2SFVA625E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 倍率: 1	11 Weeks	625-BFBGA, FCBGA	YES		180	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)	625		ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明		R-PBGA-B625			0.742V		0.698V	533MHz, 1.3GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 103K+ Logic Cells					ROHS3 Compliant
XCZU4EG-L1FBVB900I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 倍率: 1	11 Weeks	900-BBGA, FCBGA	YES		204	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)	900		ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明		R-PBGA-B900			0.742V		0.698V	500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 192K+ Logic Cells					ROHS3 Compliant
XC7Z014S-2CLG484E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 倍率: 1	10 Weeks	484-LFBGA, CSPBGA		484-CSPBGA (19x19)	200	0°C~100°C TJ	Tray	2014	Zynq®-7000			活跃	3 (168 Hours)																		766MHz	256KB		Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Artix™-7 FPGA, 65K Logic Cells					ROHS3 Compliant
XCZU11EG-L1FFVC1760I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 倍率: 1	11 Weeks	1760-BBGA, FCBGA	YES		512	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明		R-PBGA-B1760			0.742V		0.698V	500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 653K+ Logic Cells					ROHS3 Compliant
10AS022E3F27E2SG	Intel	数据表	N/A	-	最小起订量: 1 倍率: 1	8 Weeks	672-BBGA, FCBGA	YES		240	0°C~100°C TJ	Tray		Arria 10 SX			活跃	3 (168 Hours)	672			8542.39.00.01	BOTTOM	BALL	未说明	0.9V	1mm	未说明		S-PBGA-B672	240	不合格	0.93V	0.9V	0.87V	1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	240	现场可编程门阵列	FPGA - 220K Logic Elements	220000	3.25mm	27mm	27mm	符合RoHS标准
10AS032E3F29E2SG	Intel	数据表	N/A	-	最小起订量: 1 倍率: 1	8 Weeks	780-BBGA, FCBGA	YES		360	0°C~100°C TJ	Tray		Arria 10 SX			活跃	3 (168 Hours)	780			8542.39.00.01	BOTTOM	BALL	未说明	0.9V	1mm	未说明		S-PBGA-B780	360	不合格	0.93V	0.9V	0.87V	1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	360	现场可编程门阵列	FPGA - 320K Logic Elements	320000	3.35mm	29mm	29mm	符合RoHS标准
XCZU3CG-2SFVA625E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 倍率: 1	11 Weeks	625-BFBGA, FCBGA			180	0°C~100°C TJ	Bulk	2016	Zynq® UltraScale+™ MPSoC CG		yes	活跃	4 (72 Hours)				8542.31.00.01			未说明			未说明								533MHz, 1.3GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 154K+ Logic Cells					ROHS3 Compliant
XCZU2CG-2SBVA484I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 倍率: 1	11 Weeks	484-BFBGA, FCBGA	YES		82	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)	484			8542.31.00.01	BOTTOM	BALL	未说明	0.85V		未说明		R-PBGA-B484			0.876V			533MHz, 1.3GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 103K+ Logic Cells					ROHS3 Compliant
10AS057K4F35E3LG	Intel	数据表	N/A	-	最小起订量: 1 倍率: 1	12 Weeks	1152-BBGA, FCBGA	YES		396	0°C~100°C TJ	Tray		Arria 10 SX			活跃	3 (168 Hours)				8542.39.00.01	BOTTOM	BALL	未说明	0.9V	1mm	未说明		S-PBGA-B1152	396	不合格	0.93V	0.9V	0.87V	1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	396	现场可编程门阵列	FPGA - 570K Logic Elements	570000	3.5mm	35mm	35mm	符合RoHS标准
10AS066K3F35I2LG	Intel	数据表	N/A	-	最小起订量: 1 倍率: 1	12 Weeks	1152-BBGA, FCBGA	YES		396	-40°C~100°C TJ	Tray		Arria 10 SX			活跃	3 (168 Hours)				8542.39.00.01	BOTTOM	BALL	未说明	0.9V	1mm	未说明		S-PBGA-B1152	396	不合格	0.93V	0.9V	0.87V	1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	396	现场可编程门阵列	FPGA - 660K Logic Elements	660000	3.5mm	35mm	35mm	符合RoHS标准
XCZU19EG-2FFVE1924E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 倍率: 1	11 Weeks	1924-BBGA, FCBGA			668	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		yes	活跃	4 (72 Hours)				8542.31.00.01			未说明			未说明								533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells					ROHS3 Compliant
XCZU11EG-3FFVF1517E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 倍率: 1	11 Weeks	1517-BBGA, FCBGA			464	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)				8542.31.00.01			未说明			未说明								600MHz, 667MHz, 1.5GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 653K+ Logic Cells					ROHS3 Compliant
10AS057K2F35E2SG	Intel	数据表	N/A	-	最小起订量: 1 倍率: 1	8 Weeks	1152-BBGA, FCBGA	YES		396	0°C~100°C TJ	Tray		Arria 10 SX			活跃	3 (168 Hours)				8542.39.00.01	BOTTOM	BALL	未说明	0.9V	1mm	未说明		S-PBGA-B1152	396	不合格	0.93V	0.9V	0.87V	1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	396	现场可编程门阵列	FPGA - 570K Logic Elements	570000	3.5mm	35mm	35mm	符合RoHS标准
XCZU3CG-2SFVC784E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 倍率: 1	11 Weeks	784-BFBGA, FCBGA			252	0°C~100°C TJ	Bulk	2016	Zynq® UltraScale+™ MPSoC CG		yes	活跃	4 (72 Hours)				8542.31.00.01			未说明			未说明								533MHz, 1.3GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 154K+ Logic Cells					ROHS3 Compliant
XCZU7EG-L1FFVF1517I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 倍率: 1	11 Weeks	1517-BBGA, FCBGA	YES		464	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明		R-PBGA-B1517			0.742V		0.698V	500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 504K+ Logic Cells					ROHS3 Compliant
XCZU19EG-1FFVC1760E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 倍率: 1	11 Weeks	1760-BBGA, FCBGA			512	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)				8542.31.00.01			未说明			未说明								500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells					ROHS3 Compliant

嵌入式 - 片上系统（SoC） (6000)