类别是'嵌入式 - 片上系统(SoC)'
嵌入式 - 片上系统(SoC) (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 包装/外壳 | 引脚数 | 供应商器件包装 | 厂商 | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | 容差 | 零件状态 | 终止次数 | 温度系数 | 类型 | 电阻 | 组成 | 功率(瓦特) | 电容量 | 子类别 | 额定功率 | 电阻器类型 | Reach合规守则 | 引脚数量 | 工作频率 | 工作电源电压 | 失败率 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 程序存储器类型 | 程序内存大小 | 连接方式 | 输出功率 | 家人 | 建筑学 | 数据总线宽度 | 可编程逻辑类型 | 产品类别 | 工作温度范围 | 筛选水平 | 速度等级 | 收发器数量 | 敏感度 | 电阻公差 | ADC通道数量 | 主要属性 | 寄存器数量 | 定时器数量 | 核数量 | 闪光大小 | 特征 | 不同 Pmpp 时电压 | 功率(瓦特) - 最大 | 电流(最大工作功率) | 电压 - 开路 | 产品类别 | 产品长度 | 产品宽度 | 设备核心 | 高度 | 座位高度(最大) | 长度 | 宽度 | 评级结果 | |||||||||||||||||||||||||||||||||||||||||||||||||
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XC7Z030-2FBG484I | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 484-BBGA, FCBGA | 1.2, 3.3 V | FCBGA | 2 | 表面贴装 | 130 | Tray | XC7Z030 | 活跃 | 484-FCBGA (23x23) | AMD | Thumb-2 | -40 to 100 °C | Zynq®-7000 | 200 ppm/K | 20 Ohm | 0.2 W | Pulse Proof, High Power | 484 | 5.5, 3 V | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32 Bit | 5 | Kintex™-7 FPGA, 125K Logic Cells | - | ARM Cortex A9 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC7Z045-L2FFG900I | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 900-BBGA, FCBGA | FCBGA | 1.0000 V | 0.95 V | 362 | 1.05 V | 表面贴装 | 130 | Tray | XC7Z045 | 活跃 | Industrial grade | 900-FCBGA (31x31) | AMD | 350,000 | -40 to 100 °C | Zynq®-7000 | 200 ppm/K | 1 MOhm | 0.25 W | 通用型 | 900 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Industrial | 2L | 5 | Kintex™-7 FPGA, 350K Logic Cells | 437,200 | - | 3.2 | 1.6 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC7Z035-1FBG676C | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 676-BBGA, FCBGA | FCBGA | 1.0000 V | 130 | 表面贴装 | 130 | Tray | XC7Z035 | 活跃 | Commercial grade | 676-FCBGA (27x27) | AMD | 275,000 | 0 to 85 °C | Zynq®-7000 | 50.0000 ppm/°C | 825 Ohm | 0.5 W | Industrial | 676 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Commercial | 1 | 1 | Kintex™-7 FPGA, 275K Logic Cells | 343,800 | - | 6.1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC7Z015-L1CLG485I | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 485-LFBGA, CSPBGA | CSBGA | 1.0000 V | 0.95 V | 130 | 1.05 V | 表面贴装 | 130 | Tray | XC7Z015 | 活跃 | Industrial grade | 485-CSPBGA (19x19) | AMD | 74,000 | -40 to 100 °C | Zynq®-7000 | 100 ppm/°C | 3.65 kOhm | 0.8 W | 高可靠性 | 485 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Industrial | 1L | 1 | Artix™-7 FPGA, 74K Logic Cells | 92,400 | - | 5 | 2.49 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC7Z035-1FBG676I | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 676-BBGA, FCBGA | 1.0000 V | 0.95 V | 130 | 1.05 V | 表面贴装 | 130 | Tray | XC7Z035 | 活跃 | Industrial grade | 676-FCBGA (27x27) | AMD | 275,000 | -40 to 100 °C | Zynq®-7000 | 4.7 uF | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | XC7Z035 | MCU, FPGA | Industrial | 1 | Kintex™-7 FPGA, 275K Logic Cells | 343,800 | - | 12.04 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC7Z030-3FBG484E | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 484-BBGA, FCBGA | 1.2, 3.3 V | FCBGA | 2 | 表面贴装 | 130 | Tray | XC7Z030 | 活跃 | 484-FCBGA (23x23) | AMD | Thumb-2 | 0 to 100 °C | Zynq®-7000 | 高性能电缆 | 484 | 1 V | 1GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32 Bit | Kintex™-7 FPGA, 125K Logic Cells | - | ARM Cortex A9 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC7Z030-1SB485I | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 484-FBGA, FCBGA | FCBGA | 1.0000 V | 0.95 V | 130 | 1.05 V | 表面贴装 | 130 | Bulk | XC7Z030 | 活跃 | Industrial grade | 484-FCBGA (19x19) | AMD | 125,000 | -40 to 100 °C | Zynq®-7000 | 10 pF | 485 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Industrial | 1 | Kintex™-7 FPGA, 125K Logic Cells | 157,200 | - | 2 mm | 2 x 1.25 x 1.45 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
10AS048 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | PEI-Genesis | Bulk | * | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
AGIB027R31B3I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | - | 活跃 | 720 | - | PEI-Genesis | Bulk | -40°C ~ 100°C (TJ) | * | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
AGFA008R24C2I2V | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 0805 (2012 Metric) | RN73R2A | 活跃 | 576 | 0805 | KOA Speer Electronics, Inc. | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | -55°C ~ 155°C | RN73R | 0.079 L x 0.049 W (2.00mm x 1.25mm) | ±0.5% | 2 | ±50ppm/°C | 59 Ohms | Thin Film | 0.125W, 1/8W | - | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | Automotive AEC-Q200, Moisture Resistant | 0.024 (0.60mm) | AEC-Q200 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
5CSXFC6C6U23I7LN | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Intel Corporation | 活跃 | INTEL CORP | 5.8 | 5CSXFC6C6U23I7LN | Tray | * | 活跃 | compliant | 现场可编程门阵列 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
10AS027E4F29I3SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA-780 | 360 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 270000 LE | 1 | SMD/SMT | 33750 LAB | 965265 | Intel | Intel / Altera | Arria 10 SoC | 2 x 32 kB | - | SoC FPGA | 16 | Non-Compliant | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | SOC - Systems on a Chip | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 270K Logic Elements | 2 Core | -- | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
AGFB014R24B2E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Cell (36) | TPS-12 | 活跃 | 2.19 A | 768 | - | Tycon Systems Inc. | Box | -40°C ~ 85°C | - | 21.457 L x 19.291 W x 1.378 H (545.00mm x 490.00mm x 35.00mm) | Monocrystalline | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | 16.92 V | 35 W | 2.07 A | 20.87 V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU7EG-L1FBVB900I4560 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FCBGA-900 | SMD/SMT | 600 MHz, 667 MHz, 1.5 GHz | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | - | 504000 LE | 204 I/O | - 40 C | + 100 C | 6.2 Mbit | 11 Mbit | 28800 LAB | 1 | Zynq UltraScale+ | This product may require additional documentation to export from the United States. | XCZU7EG | 720 mV/850 mV | - | 16 Transceiver | 7 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU6EG-L1FFVB1156I4560 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FCBGA-1156 | SMD/SMT | 600 MHz, 667 MHz, 1.5 GHz | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | - | 469446 LE | 328 I/O | - 40 C | + 100 C | 6.9 Mbit | 25.1 Mbit | 26825.5 LAB | 1 | Zynq UltraScale+ | This product may require additional documentation to export from the United States. | XCZU6EG | 720 mV/850 mV | - | 24 Transceiver | 7 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU4EG-L1FBVB900I4560 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FCBGA-900 | SMD/SMT | 600 MHz, 667 MHz, 1.5 GHz | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | - | 192150 LE | 204 I/O | - 40 C | + 100 C | 2.6 Mbit | 4.5 Mbit | 10980 LAB | 1 | Zynq UltraScale+ | This product may require additional documentation to export from the United States. | XCZU4EG | 720 mV/850 mV | - | 16 Transceiver | 7 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU7CG-L1FBVB900I4560 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FCBGA-900 | SMD/SMT | 600 MHz, 1.5 GHz | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | - | 504000 LE | 204 I/O | - 40 C | + 100 C | 6.2 Mbit | 11 Mbit | 28800 LAB | 1 | Zynq UltraScale+ | This product may require additional documentation to export from the United States. | XCZU7CG | 720 mV/850 mV | - | 16 Transceiver | 4 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XC7Z030-3FBG676E5212 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | BGA-676 | 866 MHz | 32 kB | 32 kB | 256 kB | 125000 LE | 130 I/O | 0 C | + 100 C | 9825 LAB | 1 | SMD/SMT | 2 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
PIC32CX1025SG41128-E/Z2X | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | TQFP-128 | - 40 C | + 125 C | CAN, Ethernet, USB | SMD/SMT | 1000 | Tray | 活跃 | EV06X38A | 120 MHz | PIC32CX | 99 I/O | 3.63 V | 1.71 V | 微芯片技术 | Details | Tray | - | 1.71 V to 3.63 V | Flash | 1 MB | - 40 C to + 125 C | 32 Channel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
PIC32CX1025SG41128-I/Z2X | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | TQFP-128 | - 40 C | + 85 C | CAN, Ethernet, USB | SMD/SMT | 1000 | Tray | 活跃 | EV06X38A | 120 MHz | PIC32CX | 99 I/O | 3.63 V | 1.71 V | 微芯片技术 | Details | Tray | - | 1.71 V to 3.63 V | Flash | 1 MB | - 40 C to + 85 C | 32 Channel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
PIC32CX1012BZ25048-I/MYX | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | QFN-48 | 2 Mb/s | 1.9 V | 40.6 mA | 96.7 mA | - 40 C | + 85 C | 128 kB | SRAM | GPIO, I2C, QSPI, SPI, UART | 64 MHz | SMD/SMT | 29 I/O | 416 | 3.6 V | Tray | PIC32CX1012 | 活跃 | 微芯片技术 | Details | Tray | - | Bluetooth, Zigbee | 2.4 GHz | 1.9 V to 3.6 V | Flash | 1 MB | 12 dBm | 32 bit | - 40 C to + 85 C | - 96 dBm | 8 Channel | 4 Timer | 0.9 mm | 7 mm | 7 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
PIC32MZ1025W104132-I/NX | Atmel (Microchip Technology) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | DQFN-132 | 2.97 V | 3.63 V | 88 mA | 287 mA | - 40 C | + 85 C | 256 kB | SRAM | CAN, I2C, SPI, UART | 80 MHz | 有 | SMD/SMT | 64 I/O | 168 | 54 Mbps | Tray | Wi-Fi | 2.4 GHz | Flash | 1 MB | 21.5 dBm | 32 bit | - 76 dBm | 20 Channel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MPFS250T-1FCSG536EES | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FCSG-536 | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 254000 LE | 372 I/O | 0 C | + 100 C | 667 MHz | 有 | 1 | Tray | 活跃 | 536-LFBGA | 微芯片技术 | This product may require additional documentation to export from the United States. | 0°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MPFS250T-1FCVG784EES | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FCVG-784 | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 254000 LE | 372 I/O | 0 C | + 100 C | 667 MHz | 有 | 1 | Tray | 活跃 | 784-FCBGA (23x23) | 微芯片技术 | This product may require additional documentation to export from the United States. | 0°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MPFS250T-FCVG484EES | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FCVG-484 | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 254000 LE | 372 I/O | 0 C | + 100 C | 667 MHz | 有 | 1 | Tray | 活跃 | 484-FCBGA (19x19) | 微芯片技术 | This product may require additional documentation to export from the United States. | 0°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB |