类别是'嵌入式 - 微处理器'
嵌入式 - 微处理器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 底架 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 振荡器类型 | 速度 | 内存大小 | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 位元大小 | 有ADC | DMA 通道 | 数据总线宽度 | 脉宽调制通道 | 无卤素 | 数模转换器通道 | 地址总线宽度 | 核心架构 | 边界扫描 | 低功率模式 | 筛选水平 | 外部数据总线宽度 | 格式 | 集成缓存 | 内存(字) | 电压 - I/O | UART 通道数 | 以太网 | 核数/总线宽度 | 图形加速 | 内存控制器 | USB | 附加接口 | 定时器数量 | 协处理器/DSP | 只读存储器可编程性 | 核数量 | 总线兼容性 | 桶式移位器 | 内部总线架构 | 保安功能 | 显示和界面控制器 | 萨塔 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | RoHS状态 | 无铅 | |||
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 | SVF521R3K2CMK4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 364-LFBGA | -40°C~85°C TA | Tray | Vybrid, VF5xxR | yes | 活跃 | 3 (168 Hours) | 260 | 40 | 400MHz, 133MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A5 + Cortex®-M4 | 3.3V | 10/100Mbps (2) | 2 Core 32-Bit | 无 | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG | DCU, GPU, LCD, VideoADC, VIU | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SVF522R3K2CMK4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 364-LFBGA | -40°C~85°C TA | Tray | Vybrid, VF5xxR | yes | 活跃 | 3 (168 Hours) | 260 | 40 | 400MHz, 133MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A5 + Cortex®-M4 | 3.3V | 10/100Mbps (2) | 2 Core 32-Bit | 有 | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG | DCU, GPU, LCD, VideoADC, VIU | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MCIMX251AJM4AR2 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 400-LFBGA | YES | -40°C~85°C TA | Tape & Reel (TR) | 2013 | i.MX25 | e1 | 活跃 | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.45V | 0.8mm | 40 | MCIMX251 | S-PBGA-B400 | 1.52V | 1.2/1.51.8/3.3V | 1.38V | 400MHz | MICROPROCESSOR | ARM926EJ-S | 24MHz | 32 | 26 | YES | YES | 固定点 | YES | 2.0V 2.5V 2.7V 3.0V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | 无 | LPDDR, DDR, DDR2 | USB 2.0 + PHY (2) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection | Keypad | 1.6mm | 17mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX507CVM1BR2 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 400-LFBGA | YES | 0°C~70°C TA | Tape & Reel (TR) | 2008 | i.MX50 | e1 | 活跃 | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.275V | 0.8mm | 40 | MCIMX507 | S-PBGA-B400 | 不合格 | 1.35V | 1.2V | 800MHz | 微处理器电路 | ARM® Cortex®-A8 | 1000MHz | YES | 131072 | 1.2V 1.875V 2.775V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | 有 | LPDDR, LPDDR2, DDR2 | USB 2.0 + PHY (2) | 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART | Multimedia; NEON™ SIMD | Boot Security, Cryptography, Secure JTAG | LCD | 1.6mm | 17mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8313EVRAGDB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 516-BBGA Exposed Pad | 0°C~105°C TA | Tray | 2004 | MPC83xx | Obsolete | 3 (168 Hours) | MPC8313 | 400MHz | PowerPC e300c3 | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI | Security; SEC 2.2 | Cryptography | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC9328MXLDVP20 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 26 Weeks | 225-LFBGA | 225-MAPBGA (13x13) | -30°C~70°C TA | Tray | 1994 | i.MXL | 不用于新设计 | 3 (168 Hours) | MC9328MXL | 200MHz | ARM920T | 1.8V 3.0V | 1 Core 32-Bit | 无 | SDRAM | USB 1.x (1) | I2C, I2S, SPI, SSI, MMC/SD, UART | LCD | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8544CVTANG | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 783-BBGA, FCBGA | YES | -40°C~105°C TA | Tray | 2007 | MPC85xx | e2 | Obsolete | 3 (168 Hours) | 783 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8544 | S-PBGA-B783 | 1.05V | 0.95V | 800MHz | MICROPROCESSOR, RISC | PowerPC e500 | 133MHz | 32 | 32 | YES | YES | 32 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, DDR2, SDRAM | DUART, I2C, PCI | Signal Processing; SPE | 2.8mm | 29mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC68EC040FE25A | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 184-BCQFP | 0°C~70°C TA | Tray | 1995 | M680x0 | Obsolete | 1 (Unlimited) | MC68EC040 | 25MHz | 68040 | 5.0V | 1 Core 32-Bit | 无 | SCI, SPI | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | OMAPL137BPTPH | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 128kB | ACTIVE (Last Updated: 3 days ago) | 表面贴装 | 176-LQFP Exposed Pad | 176 | Military grade | -55°C~175°C TJ | Tray | OMAP-L1x | e4 | yes | 活跃 | 4 (72 Hours) | 176 | Nickel/Palladium/Gold (Ni/Pd/Au) | QUAD | 鸥翼 | 260 | 1.2V | 0.5mm | 300MHz | OMAPL137 | 176 | 1.2V | 1.32V | 1.32V | 1.14V | 64kB | DIGITAL SIGNAL PROCESSOR, OTHER | ARM926EJ-S | 32b | ARM | YES | YES | 浮点 | YES | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | 无 | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, MMC/SD, SPI, UART | 4 | Signal Processing; C674x, System Control; CP15 | MROM | 1 | NO | MULTIPLE | LCD | 1.6mm | 24mm | 24mm | 1.4mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||
 | LS1046AXE8P1A | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 780-FBGA, FCBGA | YES | 76 | -40°C~105°C | Tray | 2016 | QorIQ® Layerscape | 活跃 | 3 (168 Hours) | 780 | BOTTOM | BALL | 250 | 1V | 0.8mm | 30 | S-PBGA-B780 | 1.03V | 0.97V | 1.4GHz | ARM® Cortex®-A72 | 14 | YES | 64 | 10GbE (2), 2.5GbE (1), 1GbE (4) | 4 Core 64-Bit | DDR4 | USB 3.0 (3) + PHY | I2C, PCI, SPI, UART, USB | Secure Boot, TrustZone® | SATA 6Gbps (1) | 2.61mm | 23mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SPC5200CVR400BR2 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 272-BBGA | YES | Automotive grade | -40°C~85°C TA | Tape & Reel (TR) | 2003 | MPC52xx | e1 | 不用于新设计 | 3 (168 Hours) | 272 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1.27mm | 40 | PC5200 | S-PBGA-B272 | 1.58V | 1.53.3V | 1.42V | 400MHz | MICROPROCESSOR | PowerPC G2_LE | 66MHz | 32 | 32 | YES | YES | AEC-Q100 | 32 | 浮点 | YES | 2.5V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | 无 | DDR, SDRAM | USB 1.1 (2) | AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART | 2.65mm | 27mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8378ECVRAJFA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 689-BBGA Exposed Pad | YES | -40°C~125°C TA | Tray | 2002 | MPC83xx | e2 | 活跃 | 3 (168 Hours) | 689 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8378 | S-PBGA-B689 | 1.05V | 11.8/2.52.5/3.3V | 0.95V | 533MHz | MICROPROCESSOR | PowerPC e300c4s | 66.66MHz | 32 | 15 | YES | YES | 64 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | Security; SEC 3.0 | Cryptography, Random Number Generator | 2.46mm | 31mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
 | ATSAMA5D44B-CUR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 361-TFBGA | YES | Automotive grade | -40°C~85°C TA | Tape & Reel (TR) | 2017 | SAMA5D4 | 活跃 | 3 (168 Hours) | 361 | 8542.31.00.01 | BOTTOM | BALL | 1.26V | 0.8mm | ATSAMA5D44 | S-PBGA-B361 | 1.32V | 1.16V | 600MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A5 | 32 | 26 | YES | YES | TS 16949 | 32 | 浮点 | YES | 1.2V 1.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | 有 | LPDDR, LPDDR2, DDR2 | USB 2.0 (3) | EBI, I2C, MMC/SD/SDIO, SPI, SSC, UART, USART | Multimedia; NEON™ SIMD | AES, SHA, TDES, TRNG | LCD, Touchscreen | 1.2mm | 16mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | MCIMX6S7CVM08ACR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 624-LFBGA | -40°C~105°C TA | Tape & Reel (TR) | 2002 | i.MX6S | 活跃 | 3 (168 Hours) | 800MHz | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | P3041NXE7NNC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 1295-BBGA, FCBGA | YES | -40°C~105°C TA | Tray | 2002 | QorIQ P3 | e1 | 活跃 | 3 (168 Hours) | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 30 | P3041 | S-PBGA-B1295 | 1.05V | 0.95V | 1.333GHz | MICROPROCESSOR, RISC | PowerPC e500mc | 133MHz | YES | YES | 固定点 | YES | 1.5V 1.8V 2.5V 3.3V | 10/100/1000Mbps (5), 10Gbps (1) | 4 Core 32-Bit | 无 | DDR3, DDR3L | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, RapidIO, SPI | Security; SEC 4.2 | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | SATA 3Gbps (2) | 3.53mm | 37.5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8245TZU300D | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 352-LBGA | YES | -40°C~105°C TA | Tray | 1998 | MPC82xx | e0 | Obsolete | 3 (168 Hours) | 352 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 220 | 1.8V | 1.27mm | 30 | MPC8245 | S-PBGA-B352 | 1.9V | 23.3V | 1.7V | 300MHz | MICROPROCESSOR, RISC | PowerPC 603e | 66MHz | 32 | 32 | YES | YES | 32 | 浮点 | YES | 3.3V | 1 Core 32-Bit | 无 | SDRAM | I2C, I2O, PCI, UART | 1.65mm | 35mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT91SAM9260B-CU-100 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 96 | 217-LFBGA | 217 | 217-LFBGA (15x15) | ROM | -40°C~85°C TA | Tray | 1997 | AT91SAM | 活跃 | 3 (168 Hours) | 85°C | -40°C | 180MHz | AT91SAM9260 | 3.3V | EBI/EMI, Ethernet, I2C, MMC, SPI, UART, USART, USB | Internal | 180MHz | 32kB | ARM926EJ-S | POR, WDT | 32b | ARM | 1.8V 2.5V 3.3V | 10/100Mbps | 1 Core 32-Bit | 无 | SDRAM, SRAM | USB 2.0 (2) | EBI/EMI, I2C, ISI, MMC/SD/SDIO, SPI, SSC, UART/USART | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | XAM3359ZCZ | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 324-LFBGA | 324 | 1.713814g | Cache, RAM, ROM | 0°C~90°C TJ | Tray | Sitara™ | e1 | Discontinued | 3 (168 Hours) | Tin/Silver/Copper (Sn/Ag/Cu) | 260 | 600MHz | 未说明 | AM3359 | 1.15V | CAN, Ethernet, I2C, SPI, UART, USB | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32b | ARM | 1.8V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 有 | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | Cryptography, Random Number Generator | LCD, Touchscreen | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC755CPX350LE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 360-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2001 | MPC7xx | e0 | Obsolete | 3 (168 Hours) | 360 | 3A991.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 2V | 1.27mm | 30 | MPC755 | S-PBGA-B360 | 2.1V | 1.8V | 350MHz | MICROPROCESSOR, RISC | PowerPC | 100MHz | 32 | 32 | YES | YES | 64 | 浮点 | YES | 2.5V 3.3V | 1 Core 32-Bit | 无 | 2.77mm | 25mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC68302EH16CR2 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 132-BQFP Bumpered | 0°C~70°C TA | Tape & Reel (TR) | 1995 | M683xx | 不用于新设计 | 3 (168 Hours) | 3A991.A.2 | 8542.31.00.01 | UNSPECIFIED | UNSPECIFIED | 5V | MC68302 | 5.5V | 4.5V | 16MHz | 微处理器电路 | M68000 | 5.0V | 1 Core 8/16-Bit | 无 | DRAM | GCI, IDL, ISDN, NMSI, PCM, SCPI | Communications; RISC CPM | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MCIMX6D4AVT08AE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 624-FBGA, FCBGA | -40°C~125°C TJ | Tray | 2002 | i.MX6D | 活跃 | 3 (168 Hours) | 260 | 40 | 852MHz | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MPC8555EPXAQF | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 783-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2002 | MPC85xx | e0 | Obsolete | 3 (168 Hours) | 783 | 5A002.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.3V | 1mm | 30 | MPC8555 | S-PBGA-B783 | 1.35V | 1.25V | 1.0GHz | MICROPROCESSOR, RISC | PowerPC e500 | 166MHz | 32 | 64 | YES | YES | 64 | 浮点 | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, SDRAM | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | Communications; CPM, Security; SEC | Cryptography, Random Number Generator | 3.75mm | 29mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
.png) | MC68340PV16E | Freescale Semiconductor, Inc. (NXP Semiconductors) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | LQFP | YES | 16 | Bulk | e0 | 4 (72 Hours) | 144 | EAR99 | Tin/Lead (Sn/Pb) | 70°C | 0°C | QUAD | 鸥翼 | 220 | 5V | 0.5mm | 16MHz | 30 | 144 | 不合格 | 5.25V | 5V | COMMERCIAL | 4.75V | MICROCONTROLLER | 32 | NO | YES | NO | 不含卤素 | NO | 32 | 16 | 1 | 20mm | 20mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8271VRMIBA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 516-BBGA | YES | 57 | 0°C~105°C TA | Tray | 2002 | MPC82xx | e2 | 活跃 | 3 (168 Hours) | 516 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.5V | 1mm | 30 | MPC8271 | S-PBGA-B516 | 1.575V | 1.53.3V | 1.425V | 266MHz | MICROCONTROLLER, RISC | PowerPC G2_LE | 66.7MHz | 32 | NO | YES | NO | 30 | 64 | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | 无 | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | 27mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
 | P1015NXN5DFB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 561-FBGA | -40°C~125°C TA | Tray | 2002 | QorIQ P1 | 活跃 | 3 (168 Hours) | P1015 | 667MHz | PowerPC e500v2 | 10/100/1000Mbps (3) | 1 Core 32-Bit | 无 | DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | ROHS3 Compliant |