类别是'嵌入式 - 微处理器'
嵌入式 - 微处理器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 安装类型 | 包装/外壳 | 表面安装 | 供应商器件包装 | 终端数量 | Date Of Intro | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 温度等级 | 速度 | uPs/uCs/外围ICs类型 | 核心处理器 | 电源电流-最大值 | 位元大小 | 座位高度-最大 | 地址总线宽度 | 边界扫描 | 低功率模式 | 外部数据总线宽度 | 格式 | 集成缓存 | 内存(字) | 电压 - I/O | 以太网 | 核数/总线宽度 | 图形加速 | 内存控制器 | USB | 附加接口 | 串行I/O数 | 协处理器/DSP | 外部中断数量 | 保安功能 | 显示和界面控制器 | DMA通道数 | 长度 | 宽度 | |||||||||||||||||
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![]() | IDT79R4700-100MS | Integrated Device Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | INTEGRATED DEVICE TECHNOLOGY INC | QFP | MQUAD-208 | 100 MHz | 85 °C | PLASTIC/EPOXY | FQFP | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | 5.25 V | 4.75 V | 5 V | YES | 208 | 无 | e0 | 3A991.B.2.B | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | 鸥翼 | 0.5 mm | not_compliant | 208 | S-PQFP-G208 | 不合格 | OTHER | 100 MHz | MICROPROCESSOR, RISC | 1400 mA | 64 | 3.86 mm | 64 | NO | YES | 64 | 浮点 | YES | 0 | 7 | 27.69 mm | 27.69 mm | ||||||||||||||||||||||||||||
![]() | FH8066501715938 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | INTEL CORP | BGA, | PLASTIC/EPOXY | BGA | RECTANGULAR | 网格排列 | YES | 1170 | 2018-07-13 | 活跃 | 5A992.C | 8542.31.00.01 | BOTTOM | BALL | compliant | R-PBGA-B1170 | 2240 MHz | MICROPROCESSOR | 64 | NO | NO | 固定点 | YES | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TS80C188EC25 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | INTEL CORP | QFP | QFP, | 50 MHz | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | RECTANGULAR | FLATPACK | 5.5 V | 4.5 V | 5 V | YES | 100 | Obsolete | 3A991.A.2 | DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE | 8542.31.00.01 | QUAD | 鸥翼 | 0.65 mm | unknown | 100 | R-PQFP-G100 | 不合格 | INDUSTRIAL | 25 MHz | MICROPROCESSOR | 125 mA | 16 | 3.15 mm | 20 | NO | YES | 8 | 固定点 | NO | 0 | 2 | 9 | 4 | 20 mm | 14 mm | ||||||||||||||||||||||||||||
![]() | NQ80332M667 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | E52473A53D | ELMOS SEMICONDUCTOR AG | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TC86R4600-100 | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | TOSHIBA CORP | PGA, PGA179,18X18 | PLASTIC/EPOXY | PGA | PGA179,18X18 | SQUARE | 网格排列 | 3.3 V | NO | 179 | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | PERPENDICULAR | PIN/PEG | 2.54 mm | unknown | S-PPGA-P179 | 不合格 | 100 MHz | MICROPROCESSOR, RISC | 64 | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | PPC8323EVRADDC | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SAB8086-1-C | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SAB8086-1-C | Siemens | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | NSC800D-35/883 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NATIONAL SEMICONDUCTOR CORP | DIP, | 7.0422 MHz | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DIP | RECTANGULAR | IN-LINE | 5.5 V | 4.5 V | 5 V | NO | 40 | Obsolete | 3A001.A.2.C | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-CDIP-T40 | 不合格 | MILITARY | 3.5 MHz | MICROPROCESSOR | 8 | 5.08 mm | 16 | NO | YES | 8 | 固定点 | NO | 15.24 mm | |||||||||||||||||||||||||||||||||||||
![]() | SPEAR1340-2 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | STMICROELECTRONICS | 3 | 有 | e2 | 锡银 | 8542.31.00.01 | 260 | compliant | 30 | MICROPROCESSOR, RISC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | IBM25PPC750CXRKQ5024T | IBM | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | IBM MICROELECTRONICS | BGA | LBGA, BGA256,20X20,50 | 133 MHz | PLASTIC/EPOXY | LBGA | BGA256,20X20,50 | SQUARE | GRID ARRAY, LOW PROFILE | 1.95 V | 1.85 V | 1.9 V | YES | 256 | 有 | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | 256 | S-PBGA-B256 | 不合格 | 500 MHz | MICROPROCESSOR, RISC | 32 | 1.666 mm | 32 | YES | YES | 64 | 浮点 | YES | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||
![]() | TSC695F-25SASV | Atmel Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ATMEL CORP | QFF, | 125 °C | -55 °C | PLASTIC/EPOXY | QFF | SQUARE | FLATPACK | 5.5 V | 4.5 V | 5 V | YES | 256 | Transferred | e4 | 3A001.A.2.C | GOLD | 8542.31.00.01 | QUAD | FLAT | 0.508 mm | unknown | S-PQFP-F256 | MILITARY | 25 MHz | MICROPROCESSOR, RISC | 32 | 3.18 mm | 32 | YES | YES | 32 | 浮点 | NO | 37.085 mm | 37.085 mm | ||||||||||||||||||||||||||||||||||||
![]() | TMS8080ANL | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | TEXAS INSTRUMENTS INC | DIP, DIP40,.6 | 70 °C | PLASTIC/EPOXY | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | NO | 40 | 无 | 8542.31.00.01 | DUAL | THROUGH-HOLE | 未说明 | 2.54 mm | not_compliant | 未说明 | R-PDIP-T40 | 不合格 | COMMERCIAL | MICROPROCESSOR, RISC | 8 | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AM6231ATGGHAALWR | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 425-VFBGA, FCCSPBGA | 425-FCCSP (13x13) | -40°C ~ 105°C (TJ) | Tape & Reel (TR);Cut Tape (CT);Digi-Reel® | Sitara™ | 活跃 | 1.4GHz | ARM® Cortex®-A53 | 1.1V, 1.2V, 1.8V, 3.3V | 10/100/1000Mbps (2) | 1 Core, 64-Bit | 无 | DDR4, LPDDR4 | USB 2.0 (2) | DMA, GPIO, I2C, I2S, MMC/SD, QSPI, SPDIF, SPI, TDM, UART/USART | ARM® Cortex®-M4F | AES, ARM TZ, Cryptography, DRBG, ECC, MD5, PKA, Random Number Generator, RSA, Secure Boot, SHA2, SMS | LVDS, MIPI/CSI, MIPI-DPI, OLDI | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AM6234ASCGHAALWR | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 425-VFBGA, FCCSPBGA | 425-FCCSP (13x13) | -40°C ~ 105°C (TJ) | Tape & Reel (TR);Cut Tape (CT);Digi-Reel® | Sitara™ | 活跃 | 1GHz | ARM® Cortex®-A53 | 1.1V, 1.2V, 1.8V, 3.3V | 10/100/1000Mbps (2) | 4 Core, 64-Bit | 无 | DDR4, LPDDR4 | USB 2.0 (2) | DMA, GPIO, I2C, I2S, MMC/SD, QSPI, SPDIF, SPI, TDM, UART/USART | ARM® Cortex®-M4F | AES, ARM TZ, Cryptography, DRBG, ECC, MD5, PKA, Random Number Generator, RSA, Secure Boot, SHA2, SMS | LVDS, MIPI/CSI, MIPI-DPI, OLDI | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AM6232ASCGHAALWR | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 425-VFBGA, FCCSPBGA | 425-FCCSP (13x13) | -40°C ~ 105°C (TJ) | Tape & Reel (TR);Cut Tape (CT);Digi-Reel® | Sitara™ | 活跃 | 1GHz | ARM® Cortex®-A53 | 1.1V, 1.2V, 1.8V, 3.3V | 10/100/1000Mbps (2) | 2 Core, 64-Bit | 无 | DDR4, LPDDR4 | USB 2.0 (2) | DMA, GPIO, I2C, I2S, MMC/SD, QSPI, SPDIF, SPI, TDM, UART/USART | ARM® Cortex®-M4F | AES, ARM TZ, Cryptography, DRBG, ECC, MD5, PKA, Random Number Generator, RSA, Secure Boot, SHA2, SMS | LVDS, MIPI/CSI, MIPI-DPI, OLDI | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MT8390IV/KZA | MediaTek | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 1204-VFBGA | 1204-VFBGA (15x15) | -40°C ~ 105°C (TJ) | Tape & Reel (TR);Cut Tape (CT);Digi-Reel® | 活跃 | 2GHz, 2.2GHz | ARM® Cortex®-A55, ARM® Cortex®-A78 | 1.2V, 1.8V | MII, RGMII, RMII | 6, 2 Core, 64-Bit | 有 | LPDDR4x | USB 2.0 (2), USB 3.1 (1) | I2C, I2S, MMC/SD/SDIO, PCM, SPI, UART | ARM® Mali-G57MC3 | AES | MIPI-CSI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MT8390AV/AZA | MediaTek | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 1204-VFBGA | 1204-VFBGA (15x15) | -20°C ~ 95°C (TJ) | Tape & Reel (TR);Cut Tape (CT);Digi-Reel® | 活跃 | 2GHz, 2.2GHz | ARM® Cortex®-A55, ARM® Cortex®-A78 | 1.2V, 1.8V | MII, RGMII, RMII | 6, 2 Core, 64-Bit | 有 | LPDDR4x | USB 2.0 (2), USB 3.1 (1) | I2C, I2S, MMC/SD/SDIO, PCM, SPI, UART | ARM® Mali-G57MC3 | AES | MIPI-CSI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | IBM25PPC750FX-GR0132V | IBM | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Bulk | * | 活跃 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPC8560VT833LC | Rochester Electronics LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | ROCHESTER ELECTRONICS LLC | BGA | 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, FCBGA-783 | 166 MHz | 3 | 105 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.26 V | 1.14 V | 1.2 V | YES | 783 | 有 | e2 | 无 | TIN COPPER/TIN SILVER | BOTTOM | BALL | 260 | 1 mm | unknown | 40 | 783 | S-PBGA-B783 | COMMERCIAL | OTHER | 833 MHz | MICROPROCESSOR, RISC | 32 | 3.85 mm | 64 | YES | YES | 64 | 固定点 | YES | 29 mm | 29 mm | ||||||||||||||||||||||||||||||
![]() | BXCP-57H-11M-J19-3-A1-00-0-3 | Bridgelux Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | QG80331M500 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | INTEL CORP | BGA | BGA, | 133 MHz | 4 | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 3.6 V | 3 V | 3.3 V | YES | 829 | 有 | e1 | 3A991.A.2 | 锡银铜 | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | compliant | 829 | S-PBGA-B829 | 不合格 | 500 MHz | MICROPROCESSOR | 2.942 mm | 64 | YES | YES | 64 | 固定点 | YES | 37.5 mm | 37.5 mm | ||||||||||||||||||||||||||||||||||
![]() | P5021PSE72QC | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | NXP SEMICONDUCTORS | BGA, | 105 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.23 V | 1.17 V | 1.2 V | YES | 1295 | 有 | e1 | 锡银铜 | 8542.31.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1295 | OTHER | 2200 MHz | MICROPROCESSOR, RISC | 3.53 mm | 16 | YES | YES | 64 | 固定点 | YES | 37.5 mm | 37.5 mm | ||||||||||||||||||||||||||||||||||||||
![]() | SC1201UFH-266F | Rochester Electronics LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | ROCHESTER ELECTRONICS LLC | BGA | LEAD FREE, MS-034BAU1, TEPBGA-481 | 27 MHz | 3 | 85 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 2.1 V | 1.71 V | 1.8 V | YES | 481 | 有 | e2 | 无 | 锡银 | BOTTOM | BALL | 未说明 | 1.27 mm | unknown | 未说明 | 481 | S-PBGA-B481 | COMMERCIAL | 商业扩展 | 266 MHz | MICROPROCESSOR | 32 | 2.59 mm | 32 | YES | YES | 32 | 浮点 | YES | 40 mm | 40 mm |