类别是'嵌入式 - 微处理器'
嵌入式 - 微处理器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 振荡器类型 | 速度 | 内存大小 | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 位元大小 | 有ADC | DMA 通道 | 数据总线宽度 | 定时器/计数器的数量 | 地址总线宽度 | 核心架构 | 最高频率 | 边界扫描 | 低功率模式 | 外部数据总线宽度 | 可编程I/O数 | 格式 | 集成缓存 | 内存(字) | 电压 - I/O | UART 通道数 | ADC通道数量 | 以太网 | 核数/总线宽度 | 图形加速 | 内存控制器 | USB | 附加接口 | 串行I/O数 | 协处理器/DSP | 核数量 | PWM通道数 | 总线兼容性 | 保安功能 | 显示和界面控制器 | DMA通道数 | 萨塔 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||
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 | AT91SAM9XE256-CU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 96 | 32kB | 表面贴装 | 217-LFBGA | 217 | 217-LFBGA (15x15) | FLASH, ROM | -40°C~85°C TA | Tray | 1997 | SAM9XE | Obsolete | 3 (168 Hours) | 85°C | -40°C | 180MHz | AT91SAM9XE256 | 3.3V | 2-Wire, EBI/EMI, Ethernet, I2C, I2S, MMC, SPI, UART, USART, USB | 3.6V | 1.65V | Internal | 180MHz | 32kB | ARM926EJ-S | Brown-out Detect/Reset, POR, PWM, WDT | 32b | 6 | ARM | 180MHz | 96 | 1.8V 2.5V 3.3V | 10/100Mbps | 1 Core 32-Bit | 无 | SDRAM, SRAM | USB 2.0 (3) | EBI/EMI, I2C, ISI, MMC/SD/SDIO, SPI, SSC, UART/USART | LCD, Touchscreen | 15mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AM3352ZCE50 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 64kB | Copper, Silver, Tin | 表面贴装 | 298-LFBGA | 298 | Cache, RAM, ROM | 0°C~90°C TJ | Tray | Sitara™ | e1 | Obsolete | 3 (168 Hours) | 298 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.1V | 0.65mm | 500MHz | AM3352 | 1.15V | CAN, Ethernet, I2C, SPI, UART, USB | 1.89V | 1.71V | 320kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 32b | 16 | ARM | YES | YES | 固定点 | YES | 1.8V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 有 | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | Cryptography, Random Number Generator | LCD, Touchscreen | 无 | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
 | MC9328MXLVM15 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 26 Weeks | 256-LFBGA | YES | 0°C~70°C TA | Tray | 1994 | i.MXL | e1 | 不用于新设计 | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.8V | 0.8mm | 40 | MC9328MXL | S-PBGA-B256 | 1.9V | 1.7V | 150MHz | MICROPROCESSOR, RISC | ARM920T | 16MHz | 32 | 25 | YES | YES | 32 | 固定点 | YES | 1.8V 3.0V | 1 Core 32-Bit | 无 | SDRAM | USB 1.x (1) | I2C, I2S, SPI, SSI, MMC/SD, UART | LCD | 1.6mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | P1021NXN2HFB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 689-BBGA Exposed Pad | YES | -40°C~105°C TA | Tray | 2002 | QorIQ P1 | e2 | 活跃 | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | P1021 | S-PBGA-B689 | 1.05V | 0.95V | 800MHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 32 | YES | YES | 固定点 | YES | 10/100/1000Mbps (3) | 2 Core 32-Bit | 无 | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | Communications; QUICC Engine | 2.46mm | 31mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MCIMX6S8DVM10AB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 624-LFBGA | YES | 0°C~95°C TJ | Tray | 2002 | i.MX6S | 不用于新设计 | 3 (168 Hours) | 624 | BOTTOM | BALL | 未说明 | 0.8mm | 未说明 | MCIMX6 | S-PBGA-B624 | 1.5V | 1.35V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 26 | YES | YES | 32 | 固定点 | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.6mm | 21mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8313EVRAFFC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 516-BBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | 活跃 | 3 (168 Hours) | 516 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8313 | S-PBGA-B516 | 1.05V | 11.8/2.53.3V | 0.95V | 333MHz | MICROPROCESSOR | PowerPC e300c3 | 66.67MHz | 32 | 32 | YES | YES | 32 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI | Security; SEC 2.2 | Cryptography | 2.55mm | 27mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC870VR66 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 256-BBGA | YES | 0°C~95°C TA | Tray | 1999 | MPC8xx | e1 | 最后一次购买 | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | 30 | MPC870 | S-PBGA-B256 | 1.9V | 1.83.3V | 1.7V | 66MHz | MICROPROCESSOR, RISC | 32 | 32 | YES | YES | 32 | 固定点 | YES | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | 无 | DRAM | USB 2.0 (1) | I2C, PCMCIA, SPI, TDM, UART | Communications; CPM | 2.54mm | 23mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC855TVR50D4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 357-BBGA | YES | 0°C~95°C TA | Tray | 1997 | MPC8xx | e1 | 不用于新设计 | 3 (168 Hours) | 357 | 3A991.A.2 | 锡银铜 | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC855 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | 固定点 | YES | 3.3V | 10Mbps (1), 10/100Mbps (1) | 1 Core 32-Bit | 无 | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
| AT91SAM9261SB-CU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 96 | 160kB | 表面贴装 | 217-LFBGA | 217 | 217-LFBGA (15x15) | ROM | -40°C~85°C TA | Tray | 1997 | AT91SAM | Obsolete | 3 (168 Hours) | 85°C | -40°C | 190MHz | AT91SAM9261 | 3.3V | 2-Wire, EBI/EMI, I2C, I2S, MMC, SPI, UART, USART, USB | 3.6V | 3V | Internal | 190MHz | 32kB | ARM926EJ-S | DMA, LCD, POR, PWM, WDT | 32b | 4 | ARM | 190MHz | 96 | 3.0V 3.3V | 1 Core 32-Bit | 无 | SDRAM, SRAM | USB 2.0 (2) | EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART | LCD | 15mm | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | P2041NXN7NNC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 780-BFBGA | -40°C~105°C TA | Tray | 2002 | QorIQ P2 | e1 | 活跃 | 3 (168 Hours) | 3A991.A.1 | 锡银铜 | 8542.31.00.01 | 245 | 30 | P2041 | 1.3GHz | MICROPROCESSOR, RISC | PowerPC e500mc | 1.0V 1.35V 1.5V 1.8V 2.5V 3.3V | 10/100/1000Mbps (5), 10Gbps (1) | 4 Core 32-Bit | 无 | DDR3, DDR3L | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, RapidIO, SPI | SATA 3Gbps (2) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8548VJAQGD | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 783-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2002 | MPC85xx | e2 | 活跃 | 3 (168 Hours) | 783 | 3A991.A.2 | Tin/Silver (Sn/Ag) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.1V | 1mm | 40 | MPC8548 | S-PBGA-B783 | 1.155V | 1.11.8/2.52.5/3.3V | 1.045V | 1.0GHz | MICROPROCESSOR, RISC | PowerPC e500 | 133MHz | 32 | 16 | YES | YES | 64 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (4) | 1 Core 32-Bit | 无 | DDR, DDR2, SDRAM | DUART, I2C, PCI, RapidIO | Signal Processing; SPE | 3.38mm | 29mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | MCIMX353DJQ5C | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 400-LFBGA | YES | 4 | -20°C~70°C TA | Tray | 2008 | i.MX35 | e1 | 活跃 | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 0.8mm | MCIMX353 | S-PBGA-B400 | 不合格 | 1.47V | 1.33V | 532MHz | 多功能外围设备 | ARM1136JF-S | 24MHz | YES | 128000 | 1.8V 2.0V 2.5V 2.7V 3.0V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | 有 | LPDDR, DDR2 | USB 2.0 + PHY (2) | 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART | 2 | Multimedia; GPU, IPU, VFP | CAN; ETHERNET; I2C; IRDA; SPI; UART; USB | Secure Fusebox, Secure JTAG, Tamper Detection | Keypad, KPP, LCD | 1.6mm | 17mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8360EVVAGDGA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 740-LBGA | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | 活跃 | 3 (168 Hours) | 740 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8360 | S-PBGA-B740 | 1.26V | 1.8/2.53.3V | 1.14V | 400MHz | MICROPROCESSOR, RISC | PowerPC e300 | 66.67MHz | 32 | 32 | YES | YES | 32 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 1.x (1) | DUART, HDLC, I2C, PCI, SPI, UART | Communications; QUICC Engine, Security; SEC | Cryptography, Random Number Generator | 1.69mm | 37.5mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
 | P1010NSE5HHB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 425-FBGA | YES | 0°C~105°C TA | Tray | 2002 | QorIQ P1 | 活跃 | 3 (168 Hours) | 425 | 8542.31.00.01 | 1V | P1010 | 1V | 1.0GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 32 | 10/100/1000Mbps (3) | 1 Core 32-Bit | 无 | DDR3, DDR3L | USB 2.0 + PHY (1) | CAN, DUART, I2C, MMC/SD, SPI | Security; SEC 4.4 | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | SATA 3Gbps (2) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MPC8360EVVAJDGA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 740-LBGA | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e1 | 活跃 | 3 (168 Hours) | 740 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.3V | 1mm | 40 | MPC8360 | S-PBGA-B740 | 1.35V | 1.8/2.53.3V | 1.15V | 533MHz | MICROPROCESSOR, RISC | PowerPC e300 | 66.67MHz | 32 | 32 | YES | YES | 32 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 1.x (1) | DUART, HDLC, I2C, PCI, SPI, UART | Communications; QUICC Engine, Security; SEC | Cryptography, Random Number Generator | 1.69mm | 37.5mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
 | ATSAMA5D27C-CNR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 289-LFBGA | YES | -40°C~105°C TA | Cut Tape (CT) | 2017 | SAMA5D2 | 活跃 | 3 (168 Hours) | 289 | 8542.31.00.01 | BOTTOM | BALL | 1.2V | 0.8mm | ATSAMA5D27 | S-PBGA-B289 | 1.32V | 1.1V | 500MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A5 | 24MHz | 26 | YES | YES | 32 | 浮点 | YES | 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | 有 | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | USB 2.0 + HSIC | I2C, SMC, SPI, UART, USART, QSPI | Multimedia; NEON™ MPE | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keyboard, LCD, Touchscreen | 1.4mm | 14mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MIMX8MQ6CVAHZAA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 621-FBGA, FCBGA | YES | 16 | -40°C~105°C TJ | Tray | i.MX8MQ | 不用于新设计 | 3 (168 Hours) | 621 | BOTTOM | BALL | 260 | 1V | 0.65mm | compliant | 未说明 | S-PBGA-B621 | 1.05V | 0.9V | 1.3GHz | ARM® Cortex®-A53 | 40MHz | YES | 160K | GbE | 4 Core 32-Bit | 有 | DDR3L, DDR4, LPDDR4 | USB 3.0 (2) | EBI/EMI, I2C, PCIe, SPI, UART, uSDHC | ARM® Cortex®-M4 | ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB | ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS | eDP, HDMI, MIPI-CSI, MIPI-DSI | 2.18mm | 17mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT91SAM9M11B-CU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 160 | 64kB | Copper, Silver, Tin | 表面贴装 | 324-TFBGA | 324 | FLASH, ROM | -40°C~85°C TA | Tray | 2010 | SAM9M | yes | 活跃 | 3 (168 Hours) | 324 | BOTTOM | BALL | 1V | 400MHz | AT91SAM9M11 | 1.95V | 2-Wire, EBI/EMI, Ethernet, I2C, SPI, UART, USART, USB | 3.6V | 1.65V | Internal | 64kB | MICROCONTROLLER, RISC | ARM926EJ-S | DMA, LCD, POR, PWM, WDT | 32 | YES | YES | 32b | 2 | 26 | ARM | 1.8V 3.3V | 8 | 10/100Mbps | 1 Core 32-Bit | 无 | LPDDR, LPSDR, DDR2, SDR, SRAM | USB 2.0 (3) | AC97, EBI/EMI, I2C, ISI, MMC/SD/SDIO, SPI, SSC, UART/USART | 4 | Cryptography | LCD, Touchscreen, Video Decoder | 15mm | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
 | MC68302EH25C | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 132-BQFP Bumpered | 0°C~70°C TA | Tray | 1995 | M683xx | 不用于新设计 | 3 (168 Hours) | 3A991.A.2 | 8542.31.00.01 | UNSPECIFIED | UNSPECIFIED | 5V | MC68302 | 5.5V | 4.5V | 25MHz | 微处理器电路 | M68000 | 5.0V | 1 Core 8/16-Bit | 无 | DRAM | GCI, IDL, ISDN, NMSI, PCM, SCPI | Communications; RISC CPM | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MCIMX6DP4AVT1AA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 624-FBGA, FCBGA | YES | Automotive grade | -40°C~125°C TJ | Tray | 2002 | i.MX6DP | 活跃 | 3 (168 Hours) | 624 | 5A992 | 8542.31.00.01 | BOTTOM | BALL | 未说明 | 0.8mm | 未说明 | S-PBGA-B624 | 1.5V | 1.35V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 32 | 26 | YES | YES | 64 | 浮点 | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | 有 | LPDDR2, DDR3L, DDR3 | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | SATA 3Gbps (1) | 2.16mm | 21mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | AM1707BZKBA3 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8kB | 表面贴装 | 256-BGA | 256 | -40°C~105°C TJ | Tray | Sitara™ | e1 | no | Obsolete | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.2V | 0.5mm | 375MHz | AM1707 | 256 | 1.2V | 1.32V | I2C, SPI, UART | 1.32V | 1.14V | 16kB | ARM926EJ-S | 32 | 32b | 16 | RISC | YES | YES | 固定点 | YES | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | 无 | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | I2C, McASP, SPI, MMC/SD, UART | System Control; CP15 | LCD | 2.05mm | 17mm | ROHS3 Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||
 | AM4372BZDNA60 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | ACTIVE (Last Updated: 6 days ago) | 491-LFBGA | YES | 491 | -40°C~105°C TJ | Tray | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 491 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1.1V | 0.65mm | AM4372 | 1.144V | 1.056V | 600MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 26MHz | 32 | YES | YES | 浮点 | YES | 65536 | 1.8V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, HDQ/1-Wire, I2C, McASP, MMC/SD/SDIO, QSPI, SPI, SD/SDIO, UART | Multimedia; NEON™ SIMD | 加密加速器 | TSC, WXGA | 64 | 1.3mm | 17mm | 17mm | 900μm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6S5EVM10ACR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 624-LFBGA | -20°C~105°C TJ | Tape & Reel (TR) | 2002 | i.MX6S | 活跃 | 3 (168 Hours) | 1.0GHz | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MPC860PZQ80D4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 357-BBGA | YES | 0°C~95°C TA | Tray | 1995 | MPC8xx | e0 | 不用于新设计 | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 80MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | 固定点 | YES | 3.3V | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | 无 | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
| MPC885CVR133 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 357-BBGA | YES | -40°C~100°C TA | Tray | 1999 | MPC8xx | e1 | 最后一次购买 | 3 (168 Hours) | 357 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.8V | 1.27mm | 40 | MPC885 | S-PBGA-B357 | 1.9V | 1.83.3V | 1.7V | 133MHz | MICROPROCESSOR, RISC | 32 | 32 | YES | YES | 32 | 固定点 | YES | 3.3V | 10Mbps (3), 10/100Mbps (2) | 1 Core 32-Bit | 无 | DRAM | USB 2.0 (1) | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM, Security; SEC | Cryptography | 2.52mm | 25mm | ROHS3 Compliant |