类别是'嵌入式 - 微处理器'
嵌入式 - 微处理器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 底架 | 安装类型 | 包装/外壳 | 引脚数 | 供应商器件包装 | 厂商 | 操作温度 | 系列 | 零件状态 | 最高工作温度 | 频率 | 工作电源电压 | 速度 | 核心处理器 | 数据总线宽度 | 最高频率 | 电压 - I/O | 以太网 | 核数/总线宽度 | 图形加速 | 内存控制器 | USB | 附加接口 | 协处理器/DSP | 核数量 | 保安功能 | 显示和界面控制器 | 萨塔 | ||||||||||
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![]() | AM5716BABCXSR | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | 表面贴装 | 760-BFBGA, FCBGA | 760-FCBGA (23x23) | 德州仪器 | Bulk | 0°C ~ 90°C (TJ) | Sitara™ | 1.5GHz | ARM® Cortex®-A15 | 1.8V, 3.3V | 10/100/1000Mbps (1) | 1 Core, 32-Bit | 无 | DDR3, SRAM | USB 2.0 + PHY (2), USB 3.0 + PHY (2) | ARM® Cortex®-M4, C66x | HDMI, LCD | SATA 3Gbps (1) | ||||||||||||||||||||
![]() | MPC8377EVRAJF | Freescale | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | 表面贴装 | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 飞思卡尔半导体 | Tray | 0°C ~ 125°C (TA) | MPC83xx | 533MHz | PowerPC e300c4s | 1.8V, 2.5V, 3.3V | 10/100/1000Mbps (2) | 1 Core, 32-Bit | 无 | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I²C, MMC/SD, PCI, SPI | Security; SEC 3.0 | Cryptography, Random Number Generator | - | SATA 3Gbps (2) | ||||||||||||||||||
![]() | AM5716BABCXEASR | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | 表面贴装 | 760-BFBGA, FCBGA | 760-FCBGA (23x23) | 德州仪器 | Bulk | -40°C ~ 105°C (TJ) | Sitara™ | 1.5GHz | ARM® Cortex®-A15 | 1.8V, 3.3V | 10/100/1000Mbps (1) | 1 Core, 32-Bit | 无 | DDR3, SRAM | USB 2.0 + PHY (2), USB 3.0 + PHY (2) | ARM® Cortex®-M4, C66x | HDMI, LCD | SATA 3Gbps (1) | ||||||||||||||||||||
![]() | MCIMX6G1CVM05AA | Freescale | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | 表面贴装 | 289-LFBGA | 289-MAPBGA (14x14) | 飞思卡尔半导体 | Bulk | -40°C ~ 105°C (TJ) | i.MX6UL | 528MHz | ARM® Cortex®-A7 | 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V | 10/100Mbps (1) | 1 Core, 32-Bit | 无 | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, EBI/EMI, I²C, I²S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | LVDS | - | ||||||||||||||||||
![]() | ATSAMA5D29-CN | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | 32 kB | 500 MHz | + 105 C | - 40 C | SMD/SMT | 32 kB | 表面贴装 | 289-LFBGA | 289-LFBGA (14x14) | 微芯片技术 | Tray | -40°C ~ 105°C (TA) | SAMA5D2 | 500MHz | ARM® Cortex®-A5 | 32 bit | 1.2V, 1.35V, 1.5V, 1.8V, 3.3V | 10/100Mbps (1) | 1 Core, 32-Bit | 有 | DDR2, DDR3, DDR3L, LPDDR, LPDDR2, LPDDR3 | USB (3)+ HSIC (3) | EBI/EMI, I²C, I²S, MMC/SD/SDIO, QSPI, SMC, SPI, UART, USART | Multimedia; NEON™ MPE | 1 Core | AES, ARM TZ, Boot Security, Cryptography, Secure JTAG, Secure Memory, Secure RTC, SHA, TDES, TRNG | LCD, Touchscreen | - | ||||||||||
![]() | MPC8313EZQAFFC | Freescale | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | MPC83 | 活跃 | 表面贴装 | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | 飞思卡尔半导体 | Bulk | 0°C ~ 105°C (TA) | MPC83xx | 333MHz | PowerPC e300c3 | 1.8V, 2.5V, 3.3V | 10/100/1000Mbps (2) | 1 Core, 32-Bit | 无 | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I²C, PCI, SPI | Security; SEC 2.2 | Cryptography | - | - | |||||||||||||||||
![]() | P5010NSE1QMB557 | Freescale | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | 表面贴装 | 1295-BBGA, FCBGA | 1295-FCPBGA (37.5x37.5) | 飞思卡尔半导体 | Bulk | 0°C ~ 105°C (TA) | QorIQ P5 | 2GHz | PowerPC e5500 | 1V, 1.1V | 1Gbps (5), 10Gbps (1) | 1 Core, 64-Bit | 无 | DDR3, DDR3L | USB 2.0 + PHY (2) | DUART, I²C, MMC/SD, SPI | Security; SEC 4.2 | Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection | - | SATA 3Gbps (2) | ||||||||||||||||||
![]() | P1021NSN2HFB | Freescale | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | 表面贴装 | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 飞思卡尔半导体 | Bulk | 0°C ~ 125°C (TA) | QorIQ P1 | 800MHz | PowerPC e500v2 | - | 10/100/1000Mbps (3) | 2 Core, 32-Bit | 无 | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I²C, MMC/SD, SPI | Communications; QUICC Engine | - | - | - | ||||||||||||||||||
![]() | MPC8548ECVTAQGD | Freescale | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | 表面贴装 | 783-BBGA, FCBGA | 783-FCPBGA (29x29) | 飞思卡尔半导体 | Tray | -40°C ~ 105°C (TA) | MPC85xx | 1.0GHz | PowerPC e500 | 1.8V, 2.5V, 3.3V | 10/100/1000Mbps (4) | 1 Core, 32-Bit | 无 | DDR, DDR2, SDRAM | - | DUART, I²C, PCI, RapidIO | Signal Processing; SPE, Security; SEC | Cryptography, Random Number Generator | - | - | ||||||||||||||||||
![]() | MC68LC302AF20CT | Freescale | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | 表面贴装 | 100-LQFP | 100-LQFP (14x14) | 飞思卡尔半导体 | Bulk | 0°C ~ 70°C (TA) | M683xx | 20MHz | M68000 | 5.0V | - | 1 Core, 8/16-Bit | 无 | DRAM | - | GCI, IDL, ISDN, NMSI, PCM, SCPI | Communications; RISC CPM | - | - | - | ||||||||||||||||||
![]() | MPC8349EVVAJFB,557 | Freescale | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | 飞思卡尔半导体 | Tray | * | |||||||||||||||||||||||||||||||||||
![]() | MPC885VR66 | Freescale | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | MPC88 | 活跃 | 表面贴装 | 357-BBGA | 357-PBGA (25x25) | 飞思卡尔半导体 | Bulk | 0°C ~ 95°C (TA) | MPC8xx | 66MHz | MPC8xx | 3.3V | 10Mbps (3), 10/100Mbps (2) | 1 Core, 32-Bit | 无 | DRAM | USB 2.0 (1) | HDLC/SDLC, I²C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM, Security; SEC | Cryptography | - | - | |||||||||||||||||
![]() | MPC8536BVTANGA | Freescale | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | 表面贴装 | 783-BBGA, FCBGA | 783-FCPBGA (29x29) | 飞思卡尔半导体 | Tray | 0°C ~ 105°C (TA) | MPC85xx | 800MHz | PowerPC e500 | 1.8V, 2.5V, 3.3V | 10/100/1000Mbps (2) | 1 Core, 32-Bit | 无 | DDR2, DDR3 | USB 2.0 (3) | DUART, I²C, MMC/SD, PCI, SPI | - | - | - | SATA 3Gbps (2) | ||||||||||||||||||
![]() | MCIMX7S3DVK08SC | Freescale | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | 表面贴装 | 488-TFBGA | 488-TFBGA (12x12) | 飞思卡尔半导体 | Bulk | 0°C ~ 95°C (TJ) | i.MX7S | 800MHz | ARM® Cortex®-A7, ARM® Cortex®-M4 | 1.8V, 3.3V | 10/100/1000Mbps (1) | 1 Core, 32-Bit | 无 | LPDDR2, LPDDR3, DDR3, DDR3L | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) | AC97, eCSPI, I²C, I²S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | Keypad, LCD, MIPI | - | ||||||||||||||||||
![]() | P1024NXE5BFB | Freescale | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | 表面贴装 | 561-FBGA | 561-TEPBGA I (23x23) | 飞思卡尔半导体 | Bulk | -40°C ~ 125°C (TJ) | QorIQ P1 | 400MHz | PowerPC e500v2 | - | 10/100/1000Mbps (3) | 2 Core, 32-Bit | 无 | DDR3 | USB 2.0 + PHY (2) | DUART, I²C, MMC/SD, SPI | Security; SEC 3.3 | Cryptography, Random Number Generator | - | - | ||||||||||||||||||
![]() | MPC8347ZUALFB | Freescale | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | MPC83 | 活跃 | 表面贴装 | 620-BBGA Exposed Pad | 620-PBGA (29x29) | 飞思卡尔半导体 | Bulk | 0°C ~ 105°C (TA) | MPC83xx | 667MHz | PowerPC e300 | 2.5V, 3.3V | 10/100/1000Mbps (2) | 1 Core, 32-Bit | 无 | DDR | USB 2.0 + PHY (2) | DUART, I²C, PCI, SPI | - | - | - | - | |||||||||||||||||
![]() | MPC8569ECVTAQLJB | Freescale | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | 表面贴装 | 783-BBGA, FCBGA | 783-FCPBGA (29x29) | 飞思卡尔半导体 | Tray | -40°C ~ 105°C (TA) | MPC85xx | 1.067GHz | PowerPC e500v2 | 1.0V, 1.5V, 1.8V, 2.5V, 3.3V | 10/100Mbps (8), 1Gbps (4) | 1 Core, 32-Bit | 无 | DDR2, DDR3, SDRAM | USB 2.0 (1) | DUART, HSSI, I²C, MMC/SD, PCI, RapidIO, SPI, TDM, UART | Communications; QUICC Engine, Security; SEC | Cryptography, Random Number Generator | - | - | ||||||||||||||||||
![]() | MPC852TCZT66A | Freescale | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | MPC85 | 活跃 | 表面贴装 | 256-BBGA | 256-PBGA (23x23) | 飞思卡尔半导体 | Bulk | -40°C ~ 100°C (TA) | MPC8xx | 66MHz | MPC8xx | 3.3V | 10Mbps (1) | 1 Core, 32-Bit | 无 | DRAM | - | HDLC/SDLC, PCMCIA, SPI, UART | Communications; CPM | - | - | - | |||||||||||||||||
![]() | P1010NXE5KHA557 | Freescale | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | 飞思卡尔半导体 | Bulk | * | |||||||||||||||||||||||||||||||||||
![]() | MPC862PCVR66B | Freescale | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | MPC86 | 活跃 | 表面贴装 | 357-BBGA | 357-PBGA (25x25) | 飞思卡尔半导体 | Bulk | -40°C ~ 115°C (TA) | MPC8xx | 66MHz | MPC8xx | 3.3V | 10Mbps (4), 10/100Mbps (1) | 1 Core, 32-Bit | 无 | DRAM | - | HDLC/SDLC, I²C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | - | - | - | |||||||||||||||||
![]() | MPC8569VJAUNLB | Freescale | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | MPC85 | 活跃 | 表面贴装 | 783-BBGA, FCBGA | 783-FCPBGA (29x29) | 飞思卡尔半导体 | Bulk | 0°C ~ 105°C (TA) | MPC85xx | 1.333GHz | PowerPC e500v2 | 1.0V, 1.5V, 1.8V, 2.5V, 3.3V | 10/100Mbps (8), 1Gbps (4) | 1 Core, 32-Bit | 无 | DDR2, DDR3, SDRAM | USB 2.0 (1) | DUART, HSSI, I²C, MMC/SD, PCI, RapidIO, SPI, TDM, UART | Communications; QUICC Engine | - | - | - | |||||||||||||||||
![]() | LW80603002589AAS LC3A | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||
![]() | LE80536NC0211M S LJ92 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 479 | Compliant | 100 °C | 1.5 GHz | 1.292 V | 32 b | 1.5 GHz | 1 | ||||||||||||||||||||||||||||||
![]() | RM7035C-600L-D004 | Microsemi | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | * | 活跃 | |||||||||||||||||||||||||||||||||||||
![]() | MC7447AVU733NB | Freescale | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | MC7447AVU733 | 活跃 | 表面贴装 | 360-BCBGA, FCCBGA | 360-FCCBGA (25x25) | 飞思卡尔半导体 | Bulk | 0°C ~ 105°C (TA) | MPC74xx | 733MHz | PowerPC G4 | 1.8V, 2.5V | - | 1 Core, 32-Bit | 无 | - | - | - | Multimedia; SIMD | - | - | - |