类别是'嵌入式 - 微控制器'
嵌入式 - 微控制器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 最大功率耗散 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 界面 | 内存大小 | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | uPs/uCs/外围ICs类型 | 比特数 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 位元大小 | 访问时间 | 有ADC | DMA 通道 | 数据总线宽度 | 脉宽调制通道 | 数模转换器通道 | 定时器/计数器的数量 | 地址总线宽度 | 密度 | 核心架构 | EEPROM 大小 | 片上程序 ROM 宽度 | 处理器系列 | 边界扫描 | 低功率模式 | 筛选水平 | A/D转换器数量 | 外部数据总线宽度 | 可编程I/O数 | 格式 | 集成缓存 | 内存(字) | UART 通道数 | ADC通道数量 | 串行I/O数 | 定时器数量 | 外部中断数量 | PWM通道数 | I2C通道数 | 片上数据 RAM 宽度 | SPI 通道数 | DMA通道数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||||||
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 | STM32F071CBU6TR | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 37 | 131072 | 有 | 16K x 8 | ACTIVE (Last Updated: 6 months ago) | 表面贴装 | 48-UFQFN Exposed Pad | YES | A/D 13x12b; D/A 2x12b | -40°C~85°C TA | Tape & Reel (TR) | STM32F0 | 活跃 | 3 (168 Hours) | 48 | 625mW | QUAD | 无铅 | 未说明 | 3.3V | 0.5mm | 48MHz | 未说明 | STM32F07 | S-XQCC-N48 | 3.6V | 2V | HDMI, I2C, I2S, IrDA, LIN, SPI, UART, USART | Internal | 128kB | 1.65V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0 | DMA, I2S, POR, PWM, WDT | FLASH | 32-Bit | 128KB 128K x 8 | HDMI-CEC, I2C, IrDA, LINbus, SPI, UART/USART | 32 | YES | YES | 32b | YES | YES | 9 | ARM | 8 | 0.65mm | 7mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | PIC16F1516-E/MV | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 25 | 8192 | 有 | 512 x 8 | 表面贴装 | 28-UFQFN Exposed Pad | YES | 28 | A/D 17x10b | -40°C~125°C TA | Tube | 2011 | PIC® XLP™ 16F | e3 | 活跃 | 1 (Unlimited) | 28 | EAR99 | Matte Tin (Sn) - annealed | 800mW | QUAD | 260 | 0.4mm | 20MHz | 40 | PIC16F1516 | 28 | 5.5V | 2.5/5V | 2.5V | I2C, LIN, SPI, UART, USART | Internal | 14kB | 2.3V~5.5V | MICROCONTROLLER, RISC | PIC | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 8-Bit | 14KB 8K x 14 | I2C, LINbus, SPI, UART/USART | 8 | YES | NO | 8b | YES | NO | 3 | 14 | PIC | 0.55mm | 4mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
 | MK20DX256VLK7 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 52 | 262144 | 表面贴装 | 80-LQFP | YES | A/D 29x16b; D/A 1x12b | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e3 | 活跃 | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MK20DX256 | S-PQFP-G80 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 72MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 2K x 8 | CORTEX-M4 | 12mm | 12mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | PIC18F6585-I/L | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 52 | 有 | 3.25K x 8 | 表面贴装 | 表面贴装 | 68-LCC (J-Lead) | 68 | A/D 12x10b | -40°C~85°C TA | Tube | 2004 | PIC® 18F | yes | 活跃 | 3 (168 Hours) | SMD/SMT | EAR99 | 1W | 40MHz | PIC18F6585 | 68 | 5V | CAN, I2C, SPI, USART | External | 48kB | 4.25V~5.5V | MICROCONTROLLER, RISC | PIC | Brown-out Detect/Reset, LVD, POR, PWM, WDT | FLASH | 8-Bit | 48KB 24K x 16 | CANbus, I2C, SPI, UART/USART | 8b | 5 | 384 kb | 1K x 8 | 16 | 53 | 12 | 2 | 无 | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATTINY25-15MZ | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 6 | 有 | 128 x 8 | Tin | 表面贴装 | 表面贴装 | 20-WFQFN Exposed Pad | 20 | A/D 4x10b | -40°C~125°C TA | Tape & Reel (TR) | 2011 | Automotive, AEC-Q100, AVR® ATtiny | yes | 活跃 | 3 (168 Hours) | 20 | QUAD | 无铅 | 5V | 0.5mm | 16MHz | ATTINY25 | 不合格 | 5.5V | 3/5V | 4.5V | SPI, UART | Internal | 2kB | 2.7V~5.5V | MICROCONTROLLER, RISC | AVR | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 8-Bit | 2KB 1K x 16 | USI | 8 | YES | NO | 8b | YES | NO | 2 | 128 x 8 | 0.8mm | 4mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | PIC18F25K83-I/SS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 25 | Automotive grade | 表面贴装 | 28-SSOP (0.209, 5.30mm Width) | YES | A/D 24x12b; D/A 1x5b | -40°C~85°C TA | Tube | 2017 | PIC® XLP™ 18K | e3 | 活跃 | 3 (168 Hours) | 28 | Matte Tin (Sn) - annealed | OPERATES AT 2.3V MINIMUM SUPPLY AT 16 MHZ | 8542.31.00.01 | DUAL | 鸥翼 | 3V | 0.65mm | PIC18F25K83 | R-PDSO-G28 | 5.5V | 2.7V | Internal | 64MHz | 2K x 8 | 2.3V~5.5V | MICROCONTROLLER, RISC | PIC | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 32MHz | FLASH | 8-Bit | 32KB 16K x 16 | CANbus, I2C, LINbus, SPI, UART/USART | YES | YES | YES | YES | 1K x 8 | 8 | TS 16949 | 2mm | 10.2mm | 5.3mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | PIC32MX775F256H-80V/PT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 2 Weeks | 53 | 有 | 64K x 8 | 表面贴装 | 表面贴装 | 64-TQFP | 64 | A/D 16x10b | -40°C~105°C TA | Tray | 2010 | PIC® 32MX | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) - annealed | QUAD | 鸥翼 | 260 | 3.3V | 80MHz | 40 | PIC32MX775F256H | 64 | 2.3V | CAN, Ethernet, I2C, RS-232, SPI, UART, USART, USB | Internal | 256kB | 2.3V~3.6V | MICROCONTROLLER, RISC | MIPS32® M4K™ | Brown-out Detect/Reset, DMA, POR, PWM, WDT | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, Ethernet, I2C, SPI, UART/USART, USB OTG | 32 | YES | YES | 32b | YES | NO | PIC | 5 | 6 | 1.2mm | 10mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | MKL14Z64VFM4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 28 | 65536 | 表面贴装 | 32-VFQFN Exposed Pad | YES | A/D 9x12b | -40°C~105°C TA | Tray | 2010 | Kinetis KL1 | 活跃 | 3 (168 Hours) | 32 | 3A991.A.2 | 8542.31.00.01 | QUAD | 无铅 | 260 | 3.3V | 0.5mm | 40 | MKL14Z64 | S-XQCC-N32 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 8K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, LINbus, SPI, UART/USART | 32 | YES | YES | YES | NO | CORTEX-M0 | 5mm | 5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MSP430F2011TPW | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 10 | 128 | 有 | 128 x 8 | ACTIVE (Last Updated: 6 days ago) | 表面贴装 | 14-TSSOP (0.173, 4.40mm Width) | YES | 14 | 57.209338mg | Slope A/D | -40°C~105°C TA | Tube | MSP430F2xx | e4 | yes | 活跃 | 1 (Unlimited) | 14 | Nickel/Palladium/Gold (Ni/Pd/Au) | DUAL | 鸥翼 | 260 | 2.2V | 16MHz | 14 | 3.6V | 2/3.3V | I2C, SPI, UART | Internal | 2kB | 1.8V~3.6V | MICROCONTROLLER, RISC | MSP430 | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 16-Bit | 2KB 2K x 8 + 256B | 16 | NO | NO | 16b | YES | NO | 1 | YES | YES | 10 | FIXED-POINT | NO | 0 | 1.2mm | 5mm | 4.4mm | 1mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||
 | MC56F82748VLH | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 54 | 65536 | 表面贴装 | 64-LQFP | YES | A/D 16x12b; D/A 2x12b | -40°C~105°C TA | Tray | 2002 | 56F8xxx | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MC56F82748 | S-PQFP-G64 | 不合格 | 3.6V | 3.3V | 2.7V | Internal | 100MHz | 4K x 16 | 2.7V~3.6V | MICROCONTROLLER | 56800EX | DMA, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 64KB 32K x 16 | CANbus, I2C, SCI, SPI | 32 | YES | YES | YES | YES | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MKL34Z64VLH4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 50 | 65536 | 表面贴装 | 64-LQFP | YES | A/D - 16bit | -40°C~105°C TA | Tray | 2014 | Kinetis KL3 | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 1V | 0.5mm | 40 | MKL34Z64 | S-PQFP-G64 | 不合格 | 1.1V | 1.8/3.3V | 0.9V | Internal | 48MHz | 8K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, I2S, LCD, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, LINbus, SPI, UART/USART | 32 | YES | YES | YES | CORTEX-M0 | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | PIC24HJ128GP502-I/SP | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 2 Weeks | 21 | 有 | 8K x 8 | 通孔 | 通孔 | 28-DIP (0.300, 7.62mm) | 28 | A/D 10x10b/12b | -40°C~85°C TA | Tube | PIC® 24H | e3 | yes | 活跃 | 1 (Unlimited) | 28 | Matte Tin (Sn) | DUAL | 3.3V | 80MHz | PIC24HJ128GP502 | 28 | 3.6V | 3.3V | CAN, I2C, IrDA, LIN, SPI, UART, USART | Internal | 128kB | 3V~3.6V | MICROCONTROLLER | 16 | PIC | Brown-out Detect/Reset, DMA, POR, PWM, WDT | FLASH | 16-Bit | 128KB 43K x 24 | CANbus, I2C, IrDA, LINbus, PMP, SPI, UART/USART | 16 | YES | YES | 16b | 5 | PIC | 10 | 4 | 1 | 2 | 3.81mm | 35.56mm | 7.493mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | STM32F091RCY6TR | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 52 | 262144 | 32K x 8 | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 64-UFBGA, WLCSP | YES | 64 | A/D 19x12b; D/A 2x12b | -40°C~85°C TA | Tape & Reel (TR) | STM32F0 | 活跃 | 1 (Unlimited) | 64 | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 3.3V | 0.4mm | 48MHz | STM32F09 | 不合格 | 3.6V | 2V | CAN, I2C, IrDA, LIN, SPI, UART, USART | Internal | 256kB | 2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0 | DMA, I2S, POR, PWM, WDT | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, I2C, IrDA, LINbus, SPI, UART/USART | 32 | YES | YES | YES | YES | ARM | 8 | CORTEX-M0 | NO | YES | FIXED-POINT | NO | 327680 | 16 | 8 | 12 | 0.62mm | 4.911mm | 4.539mm | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
 | MPC5554MVR132 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 25 Weeks | 256 | 2097152 | 表面贴装 | 416-BBGA | YES | A/D 40x12b | -40°C~125°C TA | Tray | 2003 | MPC55xx Qorivva | e1 | 不用于新设计 | 3 (168 Hours) | 416 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | IT ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | MPC5554 | S-PBGA-B416 | 不合格 | 1.65V | 1.53.35V | 1.35V | External | 132MHz | 64K x 8 | 1.35V~1.65V | MICROCONTROLLER | e200z6 | DMA, POR, PWM, WDT | 20MHz | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, SCI, SPI | 32 | YES | NO | YES | NO | 24 | 32 | 2.55mm | 27mm | 27mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC9S12DG256CFUE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 59 | 262144 | 表面贴装 | 80-QFP | YES | A/D 16x10b | -40°C~85°C TA | Tray | 2001 | HCS12 | e3 | 活跃 | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 2.5V | 0.65mm | 40 | MC9S12DG256 | S-PQFP-G80 | 不合格 | 2.75V | 2.55V | 2.35V | Internal | 25MHz | 12K x 8 | 2.35V~5.25V | MICROCONTROLLER | PWM, WDT | 16MHz | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, I2C, SCI, SPI | 16 | YES | NO | YES | NO | 16 | 4K x 8 | CPU12 | 16 | 2.45mm | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
 | PIC16C74B-20I/L | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 33 | 4096 | 有 | 192 x 8 | 表面贴装 | 44-LCC (J-Lead) | YES | 44 | A/D 8x8b | -40°C~85°C TA | Tube | 1997 | PIC® 16C | e3 | yes | 活跃 | 3 (168 Hours) | 44 | Matte Tin (Sn) | 1W | QUAD | J BEND | 245 | 5V | 20MHz | 40 | PIC16C74B | 44 | 5.5V | 5V | 4.5V | I2C, SPI, UART, USART | External | 7kB | 4V~5.5V | MICROCONTROLLER, RISC | PIC | Brown-out Detect/Reset, POR, PWM, WDT | OTP | 8-Bit | 7KB 4K x 14 | I2C, SPI, UART/USART | 8 | 20 μs | YES | NO | 8b | 3 | PIC | 1 | 8 | 2 | 4.064mm | 16.6624mm | 16.6624mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||
 | PIC16F685-E/SS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 18 | 4096 | 有 | 256 x 8 | 表面贴装 | 表面贴装 | 20-SSOP (0.209, 5.30mm Width) | 20 | A/D 12x10b | -40°C~125°C TA | Tube | 2006 | PIC® 16F | e3 | yes | 活跃 | 1 (Unlimited) | 20 | EAR99 | Matte Tin (Sn) | ALSO OPERATES AT 2V SUPPLY AT 8 MHZ | 800mW | DUAL | 鸥翼 | 260 | 5V | 0.65mm | 20MHz | 40 | PIC16F685 | 20 | 5V | I2C, SPI | Internal | 7kB | 2V~5.5V | MICROCONTROLLER, RISC | PIC | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 8-Bit | 7KB 4K x 14 | 8 | 20 μs | YES | NO | 8b | YES | NO | 3 | 256 x 8 | 14 | PIC | 2mm | 7.2mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||
 | AT91SAM7S128D-MU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 32 | 32K x 8 | 表面贴装 | 表面贴装 | 64-VFQFN Exposed Pad | 64 | A/D 8x10b | -40°C~85°C TA | Tray | 2005 | SAM7S | yes | 活跃 | 3 (168 Hours) | 64 | QUAD | 无铅 | 1.8V | 0.5mm | 55MHz | AT91SAM7S128 | 不合格 | 1.95V | 1.83.3V | 1.65V | I2C, SPI, UART, USART, USB | Internal | 128kB | 1.65V~1.95V | MICROCONTROLLER, RISC | ARM7® | Brown-out Detect/Reset, DMA, POR, PWM, WDT | FLASH | 16/32-Bit | 128KB 128K x 8 | I2C, SPI, SSC, UART/USART, USB | 32 | YES | YES | YES | NO | 2 | ARM | 0.9mm | 9mm | 9mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MSP430F2112IRHBT | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 24 | 256 | 有 | 256 x 8 | ACTIVE (Last Updated: 1 day ago) | 表面贴装 | 32-VFQFN Exposed Pad | YES | 32 | 71.809342mg | A/D 8x10b | -40°C~85°C TA | Tape & Reel (TR) | MSP430F2xx | e4 | yes | 活跃 | 2 (1 Year) | 32 | Nickel/Palladium/Gold (Ni/Pd/Au) | QUAD | 260 | 16MHz | 32 | 3.6V | 3.3V | I2C, IrDA, LIN, SCI, SPI, UART, USART | Internal | 2kB | 1.8V~3.6V | MICROCONTROLLER, RISC | MSP430 | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 16-Bit | 2KB 2K x 8 + 256B | I2C, IrDA, LINbus, SCI, SPI, UART/USART | 16 | YES | NO | 16b | YES | NO | YES | YES | 8 | FIXED-POINT | NO | 1 | 2 | 1 | 2 | 1mm | 5mm | 5mm | 900μm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||
 | MSP430F436IPZ | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 48 | 有 | 1K x 8 | ACTIVE (Last Updated: 6 days ago) | 表面贴装 | 100-LQFP | YES | 100 | 677.610302mg | A/D 8x12b | -40°C~85°C TA | Tray | MSP430x4xx | e4 | yes | 活跃 | 3 (168 Hours) | 100 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | QUAD | 鸥翼 | 260 | 3V | 0.5mm | 8MHz | 100 | SPI, UART, USART | Internal | 24kB | 1.8V~3.6V | MICROCONTROLLER, RISC | MSP430 | Brown-out Detect/Reset, LCD, POR, PWM, WDT | FLASH | 16-Bit | 24KB 24K x 8 + 256B | SPI, UART/USART | 16 | 8 μs | NO | NO | 16b | NO | YES | YES | 8 | FIXED-POINT | NO | 1 | 1 | 2 | 7 | 3 | 2 | 1.6mm | 14mm | 14mm | 1.4mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||
 | AT89C51AC3-RLTUM | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 36 | 有 | 2.25K x 8 | 表面贴装 | 表面贴装 | 44-LQFP | 44 | A/D 8x10b | -40°C~85°C TA | Tray | 2002 | 89C | e3 | yes | 活跃 | 3 (168 Hours) | 44 | Matte Tin (Sn) - annealed | ALSO OPERATES AT 2.7V SUPPLY AT 40 MHZ | 1W | QUAD | 鸥翼 | 260 | 5V | 0.8mm | 60MHz | 40 | AT89C51AC3 | 5V | SPI, UART, USART | External | 64kB | 3V~5.5V | MICROCONTROLLER | 80C51 | POR, PWM, WDT | FLASH | 8-Bit | 64KB 64K x 8 | UART/USART | 8 | 60 μs | YES | NO | 8b | YES | NO | 3 | 16 | 8051 | 2K x 8 | 1.6mm | 10mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||
| MKL15Z128VLH4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 54 | 131072 | 表面贴装 | 64-LQFP | YES | A/D 16x16b; D/A 1x12b | -40°C~105°C TA | Tray | 2002 | Kinetis KL1 | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | 16-BIT ADC AND 12-BIT DAC AVAILABLE | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MKL15Z128 | S-PQFP-G64 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, LINbus, SPI, TSI, UART/USART | 32 | YES | YES | YES | YES | CORTEX-M0 | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC9S08DV16ACLF | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 39 | 表面贴装 | 48-LQFP | YES | A/D 16x12b | -40°C~85°C TA | Tray | 2013 | S08 | e3 | 活跃 | 3 (168 Hours) | 48 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3V | 0.5mm | 40 | MC9S08DV16 | S-PQFP-G48 | 5.5V | 2.7V | External | 40MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 16KB 16K x 8 | CANbus, I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | NO | 1.6mm | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATSAME70Q21B-CNT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 114 | 2097152 | Automotive grade | 表面贴装 | 144-LFBGA | YES | A/D 24x12b; D/A 2x12b | -40°C~105°C TA | Tape & Reel (TR) | 2018 | SAM E70 | 活跃 | 3 (168 Hours) | 144 | CONNECTIVITY: RS-485, SD, SPI(5), SSC, TWI(3), UART(5), USART(3), USB | 8542.31.00.01 | BOTTOM | BALL | 1.2V | 0.5mm | ATSAME70Q | S-PBGA-B144 | 1.32V | 1.08V | Internal | 300MHz | 384K x 8 | 1.62V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M7 | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | 20MHz | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SPI, UART/USART, USB | 32 | YES | YES | YES | YES | 24 | 8 | TS 16949 | 16 | 20mm | 20mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC9S08DZ32AMLC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 25 | 表面贴装 | 32-LQFP | 32-LQFP (7x7) | A/D 10x12b | -40°C~125°C TA | Tray | 2008 | S08 | 活跃 | 3 (168 Hours) | MC9S08DZ32 | External | 40MHz | 2K x 8 | 2.7V~5.5V | S08 | LVD, POR, PWM, WDT | FLASH | 8-Bit | 32KB 32K x 8 | CANbus, I2C, LINbus, SCI, SPI | 1K x 8 | ROHS3 Compliant |