类别是'嵌入式 - 微控制器'
嵌入式 - 微控制器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 最大功率耗散 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 界面 | 内存大小 | 振荡器类型 | 电源电流 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | uPs/uCs/外围ICs类型 | 比特数 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 电源电流-最大值 | 位元大小 | 访问时间 | 有ADC | DMA 通道 | 数据总线宽度 | 脉宽调制通道 | 数模转换器通道 | 定时器/计数器的数量 | 决议案 | 地址总线宽度 | 采样率 | 密度 | 核心架构 | EEPROM 大小 | 片上程序 ROM 宽度 | 处理器系列 | 低功率模式 | 筛选水平 | A/D转换器数量 | 外部数据总线宽度 | 可编程I/O数 | 格式 | UART 通道数 | ADC通道数量 | PWM通道数 | I2C通道数 | 片上数据 RAM 宽度 | SPI 通道数 | DMA通道数 | 以太网通道数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||||||
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 | MC9S08DZ60AMLH | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 53 | 表面贴装 | 64-LQFP | YES | A/D 24x12b | -40°C~125°C TA | Tray | 2006 | S08 | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3V | 0.5mm | 40 | MC9S08DZ60 | S-PQFP-G64 | 5.5V | 2.7V | External | 40MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 60KB 60K x 8 | CANbus, I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | NO | 2K x 8 | 1.6mm | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC9S08DZ60ACLH | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 53 | 表面贴装 | 64-LQFP | YES | A/D 24x12b | -40°C~85°C TA | Tray | 1996 | S08 | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3V | 0.5mm | 40 | MC9S08DZ60 | S-PQFP-G64 | 5.5V | 2.7V | External | 40MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 60KB 60K x 8 | CANbus, I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | NO | 2K x 8 | 1.6mm | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MK66FN2M0VMD18 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 100 | 262144 | 2097152 | 表面贴装 | 144-LBGA | YES | A/D 2x16b; D/A 2x12b | -40°C~105°C TA | Tray | 2002 | Kinetis K60 | 活跃 | 3 (168 Hours) | 144 | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 未说明 | 3.3V | 1mm | 未说明 | S-PBGA-B144 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 180MHz | 256K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | CORTEX-M4F | 13mm | 13mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | PIC32MZ2048ECH144-I/PH | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 120 | 有 | 512K x 8 | 表面贴装 | 144-TQFP | YES | 144 | 1.319103g | A/D 48x10b | -40°C~85°C TA | Tray | 2011 | PIC® 32MZ | e3 | 活跃 | 3 (168 Hours) | 144 | Matte Tin (Sn) - annealed | QUAD | 鸥翼 | 260 | 3.3V | 0.4mm | 200MHz | 40 | PIC32MZ2048EC | 2.3V | CAN, EBI/EMI, Ethernet, I2C, I2S, SPI, UART, USART, USB | Internal | 2MB | 2.3V~3.6V | MICROCONTROLLER | MIPS32® microAptiv™ | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, I2C, SPI, SQI, UART/USART, USB OTG | 32 | YES | YES | 32b | YES | 9 | PIC | PIC | 48 | 5 | 6 | 1 | 1.05mm | 16mm | 16mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||
 | PIC24FJ64GB110-I/PT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 83 | 有 | 16K x 8 | 表面贴装 | 表面贴装 | 100-TQFP | 100 | A/D 16x10b | -40°C~85°C TA | Tray | 1995 | PIC® 24F | e3 | yes | 活跃 | 3 (168 Hours) | 100 | SMD/SMT | Matte Tin (Sn) - annealed | QUAD | 鸥翼 | 260 | 3.3V | 32MHz | 40 | PIC24FJ64GB110 | 100 | I2C, SPI, UART, USART, USB | Internal | 64kB | 2V~3.6V | MICROCONTROLLER | PIC | Brown-out Detect/Reset, LVD, POR, PWM, WDT | FLASH | 16-Bit | 64KB 22K x 24 | I2C, SPI, UART/USART, USB OTG | 16 | YES | NO | 16b | 5 | 512 kb | PIC | 1 | 84 | 4 | 16 | 9 | 3 | 1.05mm | 12mm | 12mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||
 | MSP430FR5964IZVWR | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 68 | ACTIVE (Last Updated: 4 days ago) | 表面贴装 | 87-VFBGA | YES | 87 | A/D 20x12b | -40°C~85°C TA | Tape & Reel (TR) | MSP430™ FRAM | e1 | yes | 活跃 | 3 (168 Hours) | 87 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 3V | 0.5mm | MSP430 | 3.6V | 1.8V | Internal/External | 16MHz | 8K x 8 | 1.8V~3.6V | MICROCONTROLLER, RISC | CPUXV2 | Brown-out Detect/Reset, DMA, POR, PWM, WDT | FRAM | 16-Bit | 256KB 256K x 8 | I2C, IrDA, SPI, UART/USART | 16 | YES | YES | YES | NO | 4 | 1mm | 6mm | 6mm | 640μm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | PIC12F519-I/MS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 41 x 8 | 表面贴装 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | 5 | -40°C~85°C TA | Tube | PIC® 12F | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 700mW | DUAL | 鸥翼 | 260 | 5V | 8MHz | 40 | PIC12F519 | 8 | 2V | USB | Internal | 1kB | 2V~5.5V | MICROCONTROLLER, RISC | PIC | POR, WDT | FLASH | 8-Bit | 1.5KB 1K x 12 | 8 | NO | NO | 8b | NO | PIC | 6 | 1 | 950μm | 3mm | 3mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | S9S08SG8E2CTGR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 12 | 8192 | Automotive grade | 表面贴装 | 16-TSSOP (0.173, 4.40mm Width) | YES | A/D 8x10b | -40°C~85°C TA | Tape & Reel (TR) | 2014 | S08 | e3 | 活跃 | 3 (168 Hours) | 16 | EAR99 | 哑光锡 | 8542.31.00.01 | DUAL | 鸥翼 | 260 | 5V | 0.65mm | 40 | S9S08SG8 | R-PDSO-G16 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 512 x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | NO | AEC-Q100 | 1.2mm | 5mm | 4.4mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | STM32F439IIH6 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 140 | 2097152 | 有 | 256K x 8 | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 201-UFBGA | YES | 176 | A/D 24x12b; D/A 2x12b | -40°C~85°C TA | Tray | STM32F4 | 活跃 | 3 (168 Hours) | 176 | 5A992.C | 513mW | BOTTOM | BALL | 3.3V | 0.65mm | 180MHz | STM32F439 | 3.6V | 2/3.3V | 1.7V | CAN, EBI/EMI, Ethernet, I2C, I2S, IrDA, LIN, SDIO, SPI, UART, USART, USB | Internal | 2MB | 1.8V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, SPI, UART/USART, USB OTG | 32 | YES | YES | 32b | YES | 14 | ARM | 8 | CORTEX-M4F | 24 | 0.6mm | 10mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | PIC32MX210F016D-I/PT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 33 | 16384 | 有 | 4K x 8 | 表面贴装 | 44-TQFP | YES | 44 | A/D 13x10b | -40°C~85°C TA | Tray | 2009 | PIC® 32MX | e3 | 活跃 | 3 (168 Hours) | 44 | Matte Tin (Sn) - annealed | QUAD | 鸥翼 | 260 | 3.3V | 0.8mm | 40MHz | 40 | PIC32MX210F016D | 44 | 3.6V | I2C, I2S, IrDA, LIN, SPI, UART, USART, USB | Internal | 16kB | 2.3V~3.6V | MICROCONTROLLER, RISC | MIPS32® M4K™ | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | FLASH | 32-Bit | 16KB 16K x 8 | I2C, IrDA, LINbus, PMP, SPI, UART/USART, USB OTG | 30mA | 32 | YES | YES | 32b | YES | NO | 15 | PIC | PIC | 2 | 10mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | PIC16C774-I/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | EPROM, OTP | 33 | 有 | 256 x 8 | 通孔 | 通孔 | 40-DIP (0.600, 15.24mm) | 40 | A/D 10x12b | -40°C~85°C TA | Tube | 2016 | PIC® 16C | e3 | yes | 活跃 | 1 (Unlimited) | 40 | EAR99 | Matte Tin (Sn) - annealed | 1W | DUAL | 5V | 20MHz | PIC16C774 | 40 | 5V | 5V | I2C, SPI, SSP, UART, USART | External | 2mA | 7kB | 4V~5.5V | MICROCONTROLLER, RISC | 8 | PIC | Brown-out Detect/Reset, POR, PWM, WDT | OTP | 8-Bit | 7KB 4K x 14 | I2C, SPI, UART/USART | 8 | 20 μs | YES | NO | 8b | 3 | 8b | 14 | PIC | 10 | 2 | 4.06mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||
| PIC32MX795F512LT-80V/PT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 85 | 有 | 128K x 8 | 表面贴装 | 表面贴装 | 100-TQFP | 100 | A/D 16x10b | -40°C~105°C TA | Tape & Reel (TR) | 2009 | PIC® 32MX | e3 | 活跃 | 3 (168 Hours) | 100 | 3A001.A.3 | Matte Tin (Sn) - annealed | QUAD | 鸥翼 | 260 | 3.3V | 0.4mm | 80MHz | 40 | PIC32MX795F512L | 100 | 2.3V | CAN, Ethernet, I2C, RS-232, SPI, UART, USART, USB | Internal | 512kB | 2.3V~3.6V | MICROCONTROLLER, RISC | MIPS32® M4K™ | Brown-out Detect/Reset, DMA, POR, PWM, WDT | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, Ethernet, I2C, SPI, UART/USART, USB OTG | 32 | YES | YES | 32b | YES | NO | PIC | 5 | 6 | 1.2mm | 12mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATSAMD21E15B-MUT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 26 | 有 | 4K x 8 | Tin | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad | 32 | A/D 10x12b; D/A 1x10b | -40°C~85°C TA | Tape & Reel (TR) | 2016 | SAM D21E | yes | 活跃 | 3 (168 Hours) | 32 | QUAD | 无铅 | 3.3V | 0.5mm | 48MHz | ATSAMD21E15 | 3.3V | I2C, I2S, LIN, SPI, UART, USART, USB | Internal | 32kB | 1.62V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | FLASH | 32-Bit | 32KB 32K x 8 | I2C, LINbus, SPI, UART/USART, USB | 32 | YES | YES | YES | YES | 6 | ARM | 1mm | 5mm | 5mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | STM32F745IET6 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 140 | 320K x 8 | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 176-LQFP | YES | 176 | A/D 24x12b; D/A 2x12b | -40°C~85°C TA | Tray | STM32F7 | 活跃 | 3 (168 Hours) | 176 | 3.3V | 0.5mm | 216MHz | STM32F745 | 3.6V | 1.7V | Internal | 512kB | 1.7V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M7 | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, SAI, SD, SPDIF-Rx, SPI, UART/USART, USB OTG | 32 | YES | YES | YES | 24 | 8 | 24mm | 24mm | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATMEGA64A-MUR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 32768 | A/D 8x10b | 有 | 4K x 8 | Gold | 表面贴装 | 表面贴装 | 64-VFQFN Exposed Pad | 64 | 53 | -40°C~85°C TA | Tape & Reel (TR) | 1997 | AVR® ATmega | yes | 活跃 | 3 (168 Hours) | 64 | ALSO OPERATES MIN 2.7 V AT 8MHZ | QUAD | 5V | 0.5mm | 16MHz | ATMEGA64A | 5.5V | 3/5V | I2C, SPI, UART, USART | Internal | 64kB | 2.7V~5.5V | MICROCONTROLLER, RISC | AVR | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 8-Bit | 64KB 32K x 16 | I2C, SPI, UART/USART | 8 | YES | NO | 8b | YES | NO | 4 | 2K x 8 | 1mm | 9mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | STM32F745VEH6 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | A/D 16x12b; D/A 2x12b | 320K x 8 | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 100-UFBGA | YES | 82 | -40°C~85°C TA | Tray | STM32F7 | e1 | 活跃 | 3 (168 Hours) | 100 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 3.3V | 0.8mm | 216MHz | STM32F745 | 3.6V | 1.7V | CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SD, SPI, UART, USART, USB | Internal | 512kB | 1.7V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M7 | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, SAI, SD, SPDIF-Rx, SPI, UART/USART, USB OTG | 32 | YES | YES | YES | 24 | ARM | 8 | 8mm | 8mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATSAM4E16CA-AUR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 2 Weeks | 79 | 262144 | 有 | 128K x 8 | Tin | 表面贴装 | 100-LQFP | YES | 100 | A/D 16x12b; D/A 2x12b | -40°C~85°C TA | Tape & Reel (TR) | 2005 | SAM4E | e3 | yes | 活跃 | 3 (168 Hours) | 100 | QUAD | 鸥翼 | 260 | 1.2V | 0.5mm | 120MHz | 40 | ATSAM4E | 不合格 | 1.2V | 1.08V | CAN, Ethernet, I2C, IrDA, MMC, SD, SPI, UART, USART, USB | Internal | 1MB | 1.62V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | Brown-out Detect/Reset, DMA, POR, PWM, WDT | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, Ethernet, IrDA, MMC/SD, SPI, UART/USART, USB | 32 | YES | YES | 32b | YES | YES | 3 | 24 | ARM | 32 | CORTEX-M4F | YES | 32 | 4 | 1.6mm | 14mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
| PIC32MX170F256D-I/PT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 35 | 有 | Automotive grade | 64K x 8 | 表面贴装 | 表面贴装 | 44-TQFP | 44 | A/D 13x10b | -40°C~85°C TA | Tray | 2012 | PIC® 32MX | e3 | 活跃 | 3 (168 Hours) | 44 | Matte Tin (Sn) - annealed | QUAD | 鸥翼 | 260 | 3.3V | 0.8mm | 50MHz | 40 | PIC32MX170F256D | 3.6V | I2C, I2S, IrDA, LIN, SPI, UART, USART, USB | Internal | 40 MHz | 256kB | 2.3V~3.6V | MICROCONTROLLER, RISC | MIPS32® M4K™ | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | FLASH | 32-Bit | 256KB 256K x 8 | I2C, IrDA, LINbus, SPI, UART/USART | 32 | YES | YES | 32b | YES | 5 | PIC | TS 16949 | 34 | 13 | 2 | 1.05mm | 10mm | 10mm | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
 | DSPIC33FJ128GP802-I/MM | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 21 | 有 | 16K x 8 | 表面贴装 | 表面贴装 | 28-VQFN Exposed Pad | 28 | A/D 10x10b/12b; D/A 2x16b | -40°C~85°C TA | Tube | 2009 | dsPIC™ 33F | e3 | yes | 活跃 | 1 (Unlimited) | 28 | Matte Tin (Sn) - annealed | QUAD | 260 | 3.3V | 40MHz | 40 | DSPIC33FJ128GP802 | 28 | 3.3V | 3.6V | CAN, I2C, IrDA, LIN, SPI, UART, USART | Internal | 128kB | 3V~3.6V | MICROCONTROLLER | dsPIC | Brown-out Detect/Reset, DCI, DMA, I2S, POR, PWM, WDT | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, I2C, IrDA, LINbus, SPI, UART/USART | 16 | YES | YES | 16b | 5 | 1 Mb | FLOATING-POINT | 10 | 4 | 1 | 2 | 950μm | 6mm | 6mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||
| STM32F303VCT6TR | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 87 | 262144 | 有 | 40K x 8 | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 100-LQFP | YES | 100 | A/D 39x12b; D/A 2x12b | -40°C~85°C TA | Tape & Reel (TR) | STM32F3 | e4 | 活跃 | 3 (168 Hours) | 100 | 3A991.A.2 | Nickel/Palladium/Gold (Ni/Pd/Au) | 488mW | QUAD | 鸥翼 | 3.3V | 0.5mm | 72MHz | STM32F303 | 3.6V | 2.5/3.3V | 2V | CAN, I2C, I2S, IrDA, LIN, SPI, UART, USART, USB | Internal | 256kB | 2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, POR, PWM, WDT | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, I2C, IrDA, LINbus, SPI, UART/USART, USB | 32 | YES | YES | 32b | YES | YES | 10 | ARM | 8 | CORTEX-M4F | 1.6mm | 14mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
 | ATTINY13-20MU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 6 | 有 | 64 x 8 | Tin | 表面贴装 | 表面贴装 | 20-WFQFN Exposed Pad | 20 | A/D 4x10b | -40°C~85°C TA | Tray | 2004 | AVR® ATtiny | e3 | yes | 活跃 | 3 (168 Hours) | 20 | QUAD | 260 | 5V | 0.5mm | 20MHz | 40 | ATTINY13 | 5.5V | 3/5V | SPI | Internal | 1kB | 2.7V~5.5V | MICROCONTROLLER, RISC | AVR | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 8-Bit | 1KB 512 x 16 | 8 | 20 μs | YES | NO | 8b | 64 x 8 | 4 | 2 | 1 | 750μm | 4mm | 4mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||
| DSPIC30F3014-20I/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 30 | 有 | 2K x 8 | 通孔 | 通孔 | 40-DIP (0.600, 15.24mm) | 40 | A/D 13x12b | -40°C~85°C TA | Tube | 2007 | dsPIC™ 30F | e3 | yes | 活跃 | 1 (Unlimited) | 40 | Matte Tin (Sn) | DUAL | 5V | 20MHz | DSPIC30F3014 | 40 | 5.5V | 4.5V | I2C, SPI, UART, USART | Internal | 24kB | 2.5V~5.5V | MICROCONTROLLER, RISC | 16 | dsPIC | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 16-Bit | 24KB 8K x 24 | I2C, SPI, UART/USART | 16 | YES | NO | 16b | YES | 3 | 192 kb | 1K x 8 | FIXED-POINT | 2 | 13 | 1 | 4.9mm | 53.2mm | 14.7mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||
 | ADUC848BSZ62-5 | Analog Devices Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 34 | 有 | 2.25K x 8 | PRODUCTION (Last Updated: 3 months ago) | Tin | 表面贴装 | 表面贴装 | 52-QFP | 52 | A/D 10x16b; D/A 1x12b, 2x16b | -40°C~125°C TA | Tray | MicroConverter® ADuC8xx | e3 | no | 活跃 | 3 (168 Hours) | 52 | SMD/SMT | EAR99 | QUAD | 鸥翼 | 260 | 5V | 0.65mm | 12.58MHz | 30 | ADUC848 | 52 | 5V | I2C, SPI, UART, USART | Internal | 62kB | 4.75V~5.25V | MICROCONTROLLER | 8052 | POR, PSM, PWM, Temp Sensor, WDT | FLASH | 8-Bit | 62KB 62K x 8 | I2C, SPI, UART/USART | 8 | 12.6 μs | YES | NO | 8b | 3 | 2 B | 1.37 ksps | 496 kb | 4K x 8 | 24 | 10 | 2 | 1 | 2mm | 10mm | 10mm | 无 | 无SVHC | ROHS3 Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||
 | LPC812M101JDH20FP | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 4096 | 16384 | 表面贴装 | 20-TSSOP (0.173, 4.40mm Width) | YES | 18 | -40°C~105°C TA | Tube | 2010 | LPC81xM | 活跃 | 1 (Unlimited) | 20 | DUAL | 鸥翼 | 未说明 | 3.3V | 0.65mm | 未说明 | 20 | R-PDSO-G20 | 不合格 | 3.6V | 3.3V | 1.8V | Internal | 30MHz | 4K x 8 | 1.8V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 16KB 16K x 8 | I2C, SPI, UART/USART | 32 | NO | NO | YES | NO | CORTEX-M0 | 1.1mm | 6.5mm | 4.4mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PIC24FJ128GA110-I/PT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 85 | 有 | 16K x 8 | Tin | 表面贴装 | 表面贴装 | 100-TQFP | 100 | A/D 16x10b | -40°C~85°C TA | Tray | 2008 | PIC® 24F | e3 | yes | 活跃 | 3 (168 Hours) | 100 | SMD/SMT | QUAD | 鸥翼 | 260 | 3.3V | 32MHz | 40 | PIC24FJ128GA110 | 100 | 2V | I2C, SPI, UART, USART | Internal | 128kB | 2V~3.6V | MICROCONTROLLER | PIC | Brown-out Detect/Reset, LVD, POR, PWM, WDT | FLASH | 16-Bit | 128KB 43K x 24 | I2C, PMP, SPI, UART/USART | 16 | YES | NO | 16b | 5 | 1 Mb | PIC | 1 | 84 | 4 | 16 | 9 | 3 | 1.05mm | 12mm | 12mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 |