类别是'时钟/计时 - 时钟缓冲器，驱动器'
时钟/计时 - 时钟缓冲器，驱动器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 制造商包装标识符 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | 包装方式 | 最大功率耗散 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 输出量 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 电路数量 | 最大电源电压 | 最小电源电压 | 工作电源电流 | 负载电容 | 电源电流 | 功率耗散 | 传播延迟 | 静态电流 | 接通延迟时间 | 家人 | 逻辑功能 | 数据率 | 最大输入电压 | 输出特性 | 无卤素 | 输入 | 比率-输入：输出 | 最大 I(ol) | 消耗功率 | 主时钟/晶体频率-名 | 差分 - 输入：输出 | Prop. Delay@Nom-Sup | 传播延迟(tpd) | 最大工作周期 | 驱动器数量 | 输入电流 | fmax-Min | 同边偏斜-最大(tskwd) | 最大结点温度（Tj） | 接收器数 | 真实输出的数量 | 占空比 | 环境温度范围高 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||
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 | STCD1040RDM6F | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Gold | 表面贴装 | 表面贴装 | 12-WFDFN | 12 | TDFN-12-8070542 | 4 | -40°C~85°C | Tape & Reel (TR) | e4 | Obsolete | 1 (Unlimited) | 12 | Fanout Buffer (Distribution) | 2.5V~3.6V | DUAL | 鸥翼 | 260 | 1 | 2.8V | 0.5mm | 52MHz | 30 | STCD10 | 12 | 2.8V | 3.6V | 2.5V | 1 | 2.8mA | 20 μs | 4mA | Clock | 1:4 | No/No | 150°C | 4 | 85°C | 800μm | 3mm | 2mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | SY58012UMG-TR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 27 Weeks | Industrial grade | Gold | 表面贴装 | 表面贴装 | 16-VFQFN Exposed Pad, 16-MLF® | 16 | 5GHz | -40°C~85°C | Tape & Reel (TR) | 2000 | Precision Edge® | e4 | 活跃 | 2 (1 Year) | 16 | Fanout Buffer (Distribution), Translator | CAN ALSO OPERATE WITH 3.3V SUPPLY | 2.375V~3.6V | QUAD | 无铅 | 260 | 1 | 2.5V | 0.5mm | 40 | SY58012 | LVPECL | 4 | 不合格 | 3.6V | 2.375V | 1 | 260 ps | 260 ps | 10.7 Gbps | CML, LVDS, LVPECL | 1:2 | Yes/Yes | 5000 MHz | 0.95mm | 3mm | 3mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||
 | PL133-27GC-R | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 6-UFDFN Exposed Pad | 150MHz | 0°C~70°C | Tape & Reel (TR) | 2016 | 活跃 | 1 (Unlimited) | 6 | Fanout Buffer (Distribution) | 1.62V~3.63V | DUAL | 无铅 | 未说明 | 1 | 1.8V | 0.4mm | 未说明 | PL133 | LVCMOS | R-PDSO-N6 | 3.63V | 1 | LVCMOS, Sine Wave | 1:2 | No/No | 0.5 ns | 0.6mm | 2mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | PL133-37TC-R | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | SOT-23-6 | 6 | 150MHz | 0°C~70°C | Tape & Reel (TR) | 2016 | e3 | 活跃 | 1 (Unlimited) | 6 | Fanout Buffer (Distribution) | Matte Tin (Sn) - annealed | 1.62V~3.63V | DUAL | 鸥翼 | 260 | 1 | 1.8V | 0.95mm | 40 | PL133 | LVCMOS | 1 | LVCMOS, Sine Wave | 1:3 | No/No | 0.25 ns | 2.9mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SI5330F-B00216-GMR | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Gold | 表面贴装 | 24-VFQFN Exposed Pad | YES | 24 | 200MHz | -40°C~85°C | Tape & Reel (TR) | 1997 | 活跃 | 2 (1 Year) | 24 | Fanout Buffer (Distribution), Translator | 1.71V~3.63V | QUAD | 无铅 | 未说明 | 1 | 1.8V | 0.5mm | 未说明 | SI5330 | CMOS | 24 | 8 | 1 | 4 ns | 10mA | 4 ns | CMOS, HSTL, LVTTL, SSTL | 1:8 | No/No | 60 % | 200 MHz | 0.9mm | 4mm | 4mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 2304NZG-1LFT | Renesas Electronics America Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8-TSSOP | 140MHz | 0°C~70°C | Tape & Reel (TR) | 活跃 | 1 (Unlimited) | Fanout Buffer (Distribution) | 3V~3.6V | ICS2304 | LVCMOS | 1 | LVCMOS | 1:4 | No/No | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | NB7V586MMNG | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | ACTIVE (Last Updated: 4 days ago) | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad | 32 | 6GHz | -40°C~85°C | Tube | 2008 | GigaComm™ | e3 | yes | 活跃 | 1 (Unlimited) | 32 | Fanout Buffer (Distribution), Multiplexer, Translator, Data | Tin (Sn) | 1.71V~1.89V | QUAD | 1.8V | NB7V586M | CML | 32 | 1.8V | 1 | 125mA | Buffer, Clock, Translator | 10 Gbps | 无卤素 | CML, LVDS, LVPECL | 2:6 | Yes/Yes | 0.3 ns | 950μm | 5mm | 5mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SN65LVEP11DGKR | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 6 days ago) | Gold | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | YES | 8 | 18.99418mg | 3.8GHz | -40°C~85°C | Tape & Reel (TR) | e4 | yes | 活跃 | 1 (Unlimited) | 8 | Fanout Buffer (Distribution) | TR | 527mW | 2.375V~3.8V | DUAL | 鸥翼 | 260 | 1 | 2.5V | 0.65mm | 65LVEP11 | ECL, PECL | 8 | 4 | +-2.5/+-3.3V | 2.375V | 1 | 45mA | 527mW | 300 ps | 300 ps | Translator | ECL, PECL | 1:2 | Yes/Yes | 0.3 ns | 0.025 ns | 1.07mm | 3mm | 3mm | 970μm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||
 | ZL40235LDF1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 40-VFQFN Exposed Pad | 40-QFN (6x6) | 1.6GHz | -40°C~85°C | Tape & Reel (TR) | 2017 | 活跃 | Fanout Buffer (Distribution), Multiplexer | 1.35V~3.465V | HCSL, LVCMOS, LVDS, LVPECL | 1 | CML, HCSL, LVCMOS, LVDS, LVPECL, SSTL | 3:5 | Yes/Yes | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | DS90LV110TMTCX/NOPB | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | ACTIVE (Last Updated: 5 days ago) | 表面贴装 | 表面贴装 | 28-TSSOP (0.173, 4.40mm Width) | 28 | 400MHz | -40°C~85°C | Tape & Reel (TR) | e3 | yes | 活跃 | 3 (168 Hours) | 28 | Fanout Buffer (Distribution) | Matte Tin (Sn) | TR | 413mW | 3V~3.6V | DUAL | 鸥翼 | 260 | 1 | 3.3V | 0.65mm | DS90LV110 | LVDS | 28 | 3.3V | 3.6V | 3V | 5pF | 2.115W | 3.6 ns | 3.6 ns | Translator | 400 Mbps | LVDS, LVPECL, PECL | 1:10 | 417W | Yes/Yes | 10 | 1 | 1.2mm | 9.7mm | 4.4mm | 1mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||
| SY89875UMG-TR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 表面贴装 | 表面贴装 | 16-VFQFN Exposed Pad, 16-MLF® | 16 | 2GHz | -40°C~85°C | Tape & Reel (TR) | 2000 | Precision Edge® | e4 | 活跃 | 3 (168 Hours) | 16 | Fanout Buffer (Distribution), Divider | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.375V~2.625V | QUAD | 260 | 1 | 2.5V | 0.5mm | 40 | SY89875 | LVDS | 2 | 2.5V | 1 | 95mA | CML, HSTL, LVDS, LVPECL | 1:2 | Yes/Yes | 0.87 ns | 0.95mm | 3mm | 3mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | NB3V8312CFAR2G | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | ACTIVE (Last Updated: 18 hours ago) | 表面贴装 | 表面贴装 | 32-LQFP | 32 | 773.99868mg | -40°C~85°C | Tape & Reel (TR) | 2006 | e3 | yes | 活跃 | 3 (168 Hours) | 32 | Fanout Buffer (Distribution) | Tin (Sn) | ALSO OPERATES AT 2.5V, 3.3V SUPPLY VOLTAGE | 1.6V~3.465V | QUAD | 鸥翼 | 1 | 1.8V | 0.8mm | 250MHz | NB3V8312 | LVCMOS | 32 | 12 | 2V | 1 | 150μA | 4.2 ns | 4.2 ns | LVCMOS, LVTTL | 1:12 | No/No | 55 % | 55 % | 7mm | 7mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| SY89851UMG-TR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 表面贴装 | 表面贴装 | 16-VFQFN Exposed Pad, 16-MLF® | 16 | 4GHz | -40°C~85°C | Tape & Reel (TR) | 2016 | Precision Edge® | e4 | 活跃 | 3 (168 Hours) | 16 | Fanout Buffer (Distribution), Translator | Nickel/Palladium/Gold (Ni/Pd/Au) | CAN ALSO OPERATE WITH 3.3V SUPPLY | 2.375V~3.6V | QUAD | 260 | 1 | 2.5V | 0.5mm | 40 | SY89851 | LVPECL | 2 | 1 | 340 ps | 340 ps | 4V | CML, LVDS, PECL | 1:2 | Yes/Yes | 3000 MHz | 0.95mm | 3mm | 3mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC100E111FNG | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | ACTIVE (Last Updated: 12 hours ago) | 表面贴装 | 表面贴装 | 28-LCC (J-Lead) | 28 | -40°C~85°C | Tube | 2002 | 100E | e3 | yes | 活跃 | 3 (168 Hours) | 28 | Fanout Buffer (Distribution) | Tin (Sn) | NECL MODE: VCC = 0 V WITH VEE = -4.2 V TO -5.7 V | 4.2V~5.7V | QUAD | J BEND | 260 | 1 | 5V | 800MHz | 40 | MC100E111 | ECL, PECL | 28 | 9 | 5.7V | -4.5V | 4.2V | 1 | 680 ps | 900 ps | 4.12V | 无卤素 | ECL, PECL | 1:9 | Yes/Yes | 0.66 ns | 45mA | 0.075 ns | 4.57mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||
 | ZL40212LDG1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 16-VFQFN Exposed Pad | 16 | 16-QFN (3x3) | 750MHz | -40°C~85°C | Tray | 活跃 | 3 (168 Hours) | Fanout Buffer (Distribution) | 85°C | -40°C | 2.375V~3.465V | LVDS | 2 | 1 | 3.465V | 2.375V | 2 ns | 2 ns | CML, HCSL, LVCMOS, LVDS, LVPECL | 1:2 | Yes/Yes | 5 % | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | NB3N853531EDTR2G | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 3 days ago) | 表面贴装 | 表面贴装 | 20-TSSOP (0.173, 4.40mm Width) | 20 | -40°C~85°C | Tape & Reel (TR) | 2006 | e4 | yes | 活跃 | 1 (Unlimited) | 20 | EAR99 | Fanout Buffer (Distribution), Multiplexer | Nickel/Palladium/Gold (Ni/Pd/Au) | 3.135V~3.465V | DUAL | 鸥翼 | 未说明 | 3.3V | 0.65mm | 266MHz | 未说明 | NB3N853531 | LVPECL | 20 | 1 | 60mA | 1.8 ns | 无卤素 | LVCMOS, LVTTL, Crystal | 2:4 | 266MHz | No/Yes | 6.5mm | 4.4mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ZL40220LDG1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad | 32-QFN (5x5) | 750MHz | -40°C~85°C | Tray | 2012 | 活跃 | 3 (168 Hours) | Fanout Buffer (Distribution), Multiplexer | 85°C | -40°C | 2.375V~3.465V | LVDS | 3.465V | 1 | 2 ns | CML, HCSL, LVCMOS, LVDS, LVPECL | 2:6 | Yes/Yes | 5 % | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| DS90LV110ATMTX | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 28-TSSOP (0.173, 4.40mm Width) | 28 | 200MHz | -40°C~85°C | Tape & Reel (TR) | e0 | no | Obsolete | 3 (168 Hours) | 28 | Fanout Buffer (Distribution) | Tin/Lead (Sn/Pb) | 2.115W | 3V~3.6V | DUAL | 鸥翼 | 235 | 1 | 3.3V | 0.65mm | DS90LV110 | LVDS | 28 | 3.3V | 3.6V | 3V | 1 | 3.9 ns | 3.9 ns | 400 Mbps | LVDS, LVPECL, PECL | 1:10 | 417W | Yes/Yes | 10 | 9.7mm | 4.4mm | 无 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 85314BGI-01LFT | Renesas Electronics America Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 20-TSSOP (0.173, 4.40mm Width) | 20-TSSOP | 700MHz | -40°C~85°C | Tape & Reel (TR) | 活跃 | 1 (Unlimited) | Fanout Buffer (Distribution), Multiplexer | 2.375V~3.8V | ICS85314-01 | LVPECL | 1 | HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, LVTTL, SSTL | 2:5 | Yes/Yes | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY2309NZSXI-1HT | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Gold, Tin | 表面贴装 | 16-SOIC (0.154, 3.90mm Width) | YES | 16 | 133.3MHz | -40°C~85°C | Tape & Reel (TR) | 2003 | e4 | yes | 活跃 | 3 (168 Hours) | 16 | Fanout Buffer (Distribution) | Nickel/Palladium/Gold (Ni/Pd/Au) | 3V~3.6V | DUAL | 鸥翼 | 260 | 1 | 3.3V | 30 | CY2309 | 16 | 9 | 不合格 | 3.3V | 3.6V | 3V | 1 | 9.2 ns | 32mA | 9.2 ns | Clock | 1:9 | 0.008 A | No/No | 60 % | 0.25 ns | 60 % | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| CDCLVD110AVFRG4 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 4 days ago) | Gold | 表面贴装 | 表面贴装 | 32-LQFP | 32 | 169.898692mg | -40°C~85°C | Tape & Reel (TR) | e4 | yes | 活跃 | 1 (Unlimited) | 32 | Fanout Buffer (Distribution), Multiplexer | TR | 2.375V~2.625V | QUAD | 鸥翼 | 260 | 1 | 2.5V | 0.8mm | 1.1GHz | CDCLVD110 | 32 | 10 | 2.5V | 2.625V | 2.375V | 1 | 5pF | 150mA | 35mA | 110 | 3-STATE | LVDS | 2:10 | Yes/Yes | 3 ns | 3 ns | 1.6mm | 7mm | 7mm | 1.4mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||
| ZL40217LDF1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 32-VFQFN Exposed Pad | 32-QFN (5x5) | 750MHz | -40°C~85°C | Tape & Reel (TR) | 2012 | 活跃 | 3 (168 Hours) | Fanout Buffer (Distribution) | 85°C | -40°C | 2.375V~3.465V | LVDS | 1 | 2 ns | CML, HCSL, LVCMOS, LVDS, LVPECL | 1:6 | Yes/Yes | 5 % | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ZL40220LDF1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 32-VFQFN Exposed Pad | 32-QFN (5x5) | 750MHz | -40°C~85°C | Tape & Reel (TR) | 活跃 | 3 (168 Hours) | Fanout Buffer (Distribution), Multiplexer | 85°C | -40°C | 2.375V~3.465V | LVDS | 1 | 2 ns | CML, HCSL, LVCMOS, LVDS, LVPECL | 2:6 | Yes/Yes | 5 % | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SI53304-B-GMR | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad | 725MHz | -40°C~85°C | Tape & Reel (TR) | 1997 | 活跃 | 2 (1 Year) | Fanout Buffer (Distribution), Multiplexer, Translator | 1.71V~3.63V | SI53304 | CML, HCSL, LVCMOS, LVDS, LVPECL | 1 | CML, HCSL, LVCMOS, LVDS, LVPECL | 2:6 | Yes/Yes | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| ZL40217LDG1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad | 32-QFN (5x5) | 750MHz | -40°C~85°C | Tray | 2012 | 活跃 | 3 (168 Hours) | Fanout Buffer (Distribution) | 85°C | -40°C | 2.375V~3.465V | LVDS | 3.465V | 1 | 2 ns | CML, HCSL, LVCMOS, LVDS, LVPECL | 1:6 | Yes/Yes | 5 % | 无 | ROHS3 Compliant | 无铅 |