类别是'嵌入式 - 微控制器'
嵌入式 - 微控制器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 最大功率耗散 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 界面 | 内存大小 | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | uPs/uCs/外围ICs类型 | 比特数 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 电源电流-最大值 | 位元大小 | 访问时间 | 有ADC | DMA 通道 | 数据总线宽度 | 脉宽调制通道 | 数模转换器通道 | 定时器/计数器的数量 | 地址总线宽度 | 密度 | 核心架构 | EEPROM 大小 | 片上程序 ROM 宽度 | 处理器系列 | 最高频率 | 边界扫描 | 低功率模式 | 筛选水平 | A/D转换器数量 | 外部数据总线宽度 | 可编程I/O数 | 格式 | 集成缓存 | 内存(字) | UART 通道数 | ADC通道数量 | 串行I/O数 | 只读存储器可编程性 | 外部中断数量 | PWM通道数 | I2C通道数 | 桶式移位器 | 内部总线架构 | 片上数据 RAM 宽度 | SPI 通道数 | DMA通道数 | USB 通道数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||||||
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 | PIC18F4580T-I/PT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 36 | 有 | 1.5K x 8 | 表面贴装 | 表面贴装 | 44-TQFP | 44 | A/D 11x10b | -40°C~85°C TA | Tape & Reel (TR) | 2004 | PIC® 18F | e3 | yes | 活跃 | 3 (168 Hours) | 44 | 3A991.A.2 | Matte Tin (Sn) | 1W | QUAD | 鸥翼 | 260 | 4.5V | 0.8mm | 40MHz | 40 | PIC18F4580 | 44 | 5.5V | 5V | CAN, I2C, SPI, UART, USART | Internal | 32kB | 4.2V~5.5V | MICROCONTROLLER | PIC | Brown-out Detect/Reset, HLVD, POR, PWM, WDT | FLASH | 8-Bit | 32KB 16K x 16 | CANbus, I2C, SPI, UART/USART | 8 | 40 μs | YES | NO | 8b | YES | NO | 4 | 256 x 8 | 16 | PIC | 1.2mm | 10mm | 无 | Non-RoHS Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||
 | PIC16C56-LP/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 有 | 25 x 8 | 通孔 | 18-DIP (0.300, 7.62mm) | NO | 18 | 12 | 0°C~70°C TA | Tube | 1997 | PIC® 16C | 活跃 | 1 (Unlimited) | 18 | 800mW | DUAL | 5V | 2.54mm | 40kHz | PIC16C56 | 6.25V | 2.5V | External | 40 MHz | 1.5kB | 2.5V~6.25V | MICROCONTROLLER, RISC | PIC | POR, WDT | OTP | 8-Bit | 1.5KB 1K x 12 | 8 | 40 ms | NO | NO | 8b | NO | NO | 1 | 12 | EPROM | 4.32mm | 22.8mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | TMS470R1B768PGET | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 86 | 48K x 8 | NRND (Last Updated: 5 days ago) | 表面贴装 | 表面贴装 | 144-LQFP | 144 | 1.290414g | A/D 16x10b | -40°C~105°C TA | Tray | TMS470 | e4 | yes | 不用于新设计 | 3 (168 Hours) | 144 | Nickel/Palladium/Gold (Ni/Pd/Au) | ALSO REQUIRES 3.3V SUPPLY | QUAD | 鸥翼 | 260 | 2V | 0.5mm | 60MHz | 470R1 | 144 | 2.05V | CAN, SCI, SPI | External | 768kB | 1.81V~2.05V | MICROCONTROLLER, RISC | ARM7® | DMA, POR, PWM, WDT | FLASH | 16/32-Bit | 768KB 768K x 8 | CANbus, SCI, SPI | 32 | 60 μs | YES | YES | 16b | YES | NO | 1 | ARM | YES | YES | 87 | FIXED-POINT | NO | 4 | 5 | 16 | 16 | 1.6mm | 20mm | 20mm | 1.4mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||
 | MC56F8246MLF | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 39 | 49152 | 表面贴装 | 48-LQFP | YES | A/D 10x12b; D/A 1x12b | -40°C~125°C TA | Tray | 1998 | 56F8xxx | e3 | 活跃 | 3 (168 Hours) | 48 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MC56F8246 | S-PQFP-G48 | 不合格 | 3.6V | 3.3V | 3V | Internal | 60MHz | 3K x 16 | 3V~3.6V | MICROCONTROLLER | 56800E | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 48KB 24K x 16 | CANbus, I2C, LINbus, SCI, SPI | 16 | YES | NO | YES | YES | 1.6mm | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC9S08AC60CFGE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 34 | 63280 | 表面贴装 | 44-LQFP | YES | A/D 8x10b | -40°C~85°C TA | Tray | 2000 | S08 | e3 | 活跃 | 3 (168 Hours) | 44 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.8mm | 40 | MC9S08AC60 | S-PQFP-G44 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 60KB 60K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | NO | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | PIC24FJ256GA106T-I/PT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 53 | 262144 | 有 | 16K x 8 | 表面贴装 | 表面贴装 | 64-TQFP | 64 | A/D 16x10b | -40°C~85°C TA | Tape & Reel (TR) | 2008 | PIC® 24F | e3 | yes | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) - annealed | QUAD | 鸥翼 | 260 | 3.3V | 32MHz | 40 | PIC24FJ256GA106 | 64 | 3.6V | 2V | I2C, SPI, UART, USART | Internal | 256kB | 2V~3.6V | MICROCONTROLLER | PIC | Brown-out Detect/Reset, LVD, POR, PWM, WDT | FLASH | 16-Bit | 256KB 85.5K x 24 | I2C, PMP, SPI, UART/USART | 24mA | 16 | YES | NO | 16b | YES | NO | 5 | PIC | 1.2mm | 10mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | TM4C1233H6PZI | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 69 | 有 | 32K x 8 | 表面贴装 | 表面贴装 | 100-LQFP | 100 | A/D 22x12b | -40°C~85°C TA | Tray | Tiva™ C | e4 | yes | 活跃 | 3 (168 Hours) | 100 | Nickel/Palladium/Gold (Ni/Pd/Au) | QUAD | 鸥翼 | 260 | 1.2V | 0.5mm | 80MHz | M4C1233 | 3.3V | CAN, I2C, I2S, SPI, UART, USB | Internal | 256kB | 1.08V~3.63V | MICROCONTROLLER, RISC | 12 | ARM® Cortex®-M4F | Brown-out Detect/Reset, DMA, POR, WDT | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB | 32 | YES | YES | 32b | YES | ARM | 2K x 8 | 22 | 8 | 2 | 6 | 4 | 1 | 1.45mm | 14.2mm | 14.2mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | MSP430FR5969IRGZT | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | FLASH, FRAM | 40 | 有 | 2K x 8 | ACTIVE (Last Updated: 1 day ago) | Gold | 表面贴装 | 表面贴装 | 48-VFQFN Exposed Pad | 48 | 139.989945mg | A/D 16x12b | -40°C~85°C TA | Tape & Reel (TR) | MSP430™ FRAM | e4 | yes | 活跃 | 3 (168 Hours) | 48 | QUAD | 无铅 | 260 | 3V | 16MHz | 未说明 | MSP430 | I2C, IrDA, LIN, SCI, SPI, UART, USART | Internal | 64kB | 1.8V~3.6V | MICROCONTROLLER, RISC | CPUXV2 | Brown-out Detect/Reset, DMA, POR, PWM, WDT | FRAM | 16-Bit | 64KB 64K x 8 | I2C, IrDA, SCI, SPI, UART/USART | 16 | YES | YES | 16b | YES | NO | 5 | NO | YES | 16 | FLOATING-POINT | NO | 2 | 2 | 2 | 1 | 3 | 1mm | 7mm | 7mm | 900μm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||
 | PIC16F18877-I/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 36 | 32768 | Automotive grade | 通孔 | 40-DIP (0.600, 15.24mm) | NO | A/D 35x10b; D/A 1x5b | -40°C~85°C TA | Tube | 2016 | PIC® XLP™ 16F | e3 | 活跃 | 1 (Unlimited) | 40 | Matte Tin (Sn) - annealed | ALSO OPERATES AT 2.3 V MINIMUM SUPPLY AT 16 MHZ | 8542.31.00.01 | DUAL | 3V | 2.54mm | PIC16F18877 | R-PDIP-T40 | 5.5V | 2.5V | Internal | 32MHz | 4K x 8 | 2.3V~5.5V | MICROCONTROLLER, RISC | PIC | Brown-out Detect/Reset, POR, PWM, WDT | 32MHz | FLASH | 8-Bit | 56KB 32K x 14 | I2C, LINbus, SPI, UART/USART | 8 | YES | NO | YES | YES | 256 x 8 | 14 | TS 16949 | 6.35mm | 51.7525mm | 15.24mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MKL26Z64VFT4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 36 | 表面贴装 | 48-VFQFN Exposed Pad | YES | A/D - 16bit; D/A - 12bit | -40°C~105°C TA | Tray | 2002 | Kinetis KL2 | 活跃 | 3 (168 Hours) | 48 | 3A991.A.2 | DIFFERENTIAL ANALOG CHANNEL INPUTS: 2-CH 16-BIT | 8542.31.00.01 | QUAD | 无铅 | 260 | 3.3V | 0.5mm | 40 | MKL26Z64 | S-XQCC-N48 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 8K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, LINbus, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | CORTEX-M0 | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | TM4C123GH6ZRBI | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 120 | 有 | 32K x 8 | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 157-VFBGA | 157 | A/D 24x12b | -40°C~85°C TA | Tray | Tiva™ C | e1 | yes | 活跃 | 3 (168 Hours) | 157 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.2V | 80MHz | M4C123 | 3.3V | CAN, I2C, I2S, SPI, UART, USB | Internal | 256kB | 1.08V~3.63V | MICROCONTROLLER, RISC | 12 | ARM® Cortex®-M4F | Brown-out Detect/Reset, DMA, Motion PWM, POR, WDT | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, I2C, IrDA, Microwire, QEI, SPI, SSI, UART/USART, USB OTG | 32 | YES | YES | 32b | YES | ARM | 2K x 8 | 24 | 8 | 2 | 6 | 4 | 1 | 770μm | 9.1mm | 9.1mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | DSPIC33FJ16GS502-50I/SO | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 21 | Automotive grade | 2K x 8 | 表面贴装 | 28-SOIC (0.295, 7.50mm Width) | YES | A/D 16x10b; D/A 4x10b | -40°C~85°C TA | Tube | 2012 | dsPIC™ 33F | e3 | 活跃 | 1 (Unlimited) | 28 | Matte Tin (Sn) - annealed | DUAL | 鸥翼 | 250 | 3.3V | 1.27mm | 40 | DSPIC33FJ16GS502 | R-PDSO-G28 | 3.3V | I2C, IrDA, LIN, SPI, UART, USART | Internal | 50 MIPs | 16kB | 3V~3.6V | DIGITAL SIGNAL PROCESSOR, OTHER | dsPIC | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 16-Bit | 16KB 16K x 8 | I2C, IrDA, LINbus, SPI, UART/USART | 16 | YES | NO | 16b | YES | NO | 3 | 8 | 40MHz | YES | YES | TS 16949 | 固定点 | NO | 2048 | 3 | YES | MULTIPLE | 8 | 2.65mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
 | MCF51AC256ACLKE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 69 | 262144 | 表面贴装 | 80-LQFP | YES | A/D 24x12b | -40°C~85°C TA | Tray | 2007 | MCF51AC | e3 | 活跃 | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.65mm | 40 | MCF51AC256 | S-PQFP-G80 | 不合格 | 5.5V | 3/5V | 2.7V | External | 50MHz | 32K x 8 | 2.7V~5.5V | MICROCONTROLLER | Coldfire V1 | LVD, PWM, WDT | 16MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, I2C, SCI, SPI | 32 | YES | NO | YES | NO | 1.74mm | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | PIC32MX170F256B-I/ML | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 21 | 有 | Automotive grade | 64K x 8 | 表面贴装 | 28-VQFN Exposed Pad | YES | 28 | 70.788759mg | A/D 10x10b | -40°C~85°C TA | Tube | 2007 | PIC® 32MX | e3 | 活跃 | 3 (168 Hours) | 28 | 3A991.A.2 | Matte Tin (Sn) - annealed | QUAD | 无铅 | 260 | 3.3V | 40MHz | 40 | PIC32MX170F256B | 3.6V | I2C, I2S, IrDA, LIN, SPI, UART, USART, USB | Internal | 256kB | 2.3V~3.6V | MICROCONTROLLER, RISC | MIPS32® M4K™ | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | FLASH | 32-Bit | 256KB 256K x 8 | I2C, IrDA, LINbus, SPI, UART/USART | 32 | YES | YES | 32b | YES | 5 | PIC | 8 | TS 16949 | 13 | 1mm | 6mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SPC5602DF1VLL4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 79 | 262144 | Automotive grade | 表面贴装 | 100-LQFP | YES | A/D 33x12b | -40°C~105°C TA | Tray | 2003 | MPC56xx Qorivva | e3 | 活跃 | 3 (168 Hours) | 100 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | SPC5602 | S-PQFP-G100 | 不合格 | 3.6V | 3.3/5V | 3V | Internal | 48MHz | 16K x 8 | 3V~5.5V | MICROCONTROLLER | e200z0h | DMA, POR, PWM, WDT | 16MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, LINbus, SCI, SPI | 130mA | 32 | YES | YES | YES | NO | 4K x 16 | AEC-Q100 | 1.7mm | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATTINY2313-20MUR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 18 | 128 x 8 | Tin | 表面贴装 | 表面贴装 | 20-WFQFN Exposed Pad | 20 | FLASH, OTP | -40°C~85°C TA | Tape & Reel (TR) | 1997 | AVR® ATtiny | yes | 活跃 | 3 (168 Hours) | 20 | QUAD | 5V | 0.5mm | 4MHz | ATTINY2313 | 5.5V | 3/5V | 4.5V | SPI, UART, USART | Internal | 1.5kB | 2.7V~5.5V | MICROCONTROLLER, RISC | AVR | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 8-Bit | 2KB 1K x 16 | SPI, UART/USART | 8 | NO | NO | 8b | YES | NO | 2 | 128 x 8 | 0.8mm | 4mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | PIC10LF320T-I/OT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 3 | 256 | 有 | 64 x 8 | 表面贴装 | SOT-23-6 | YES | 6 | A/D 3x8b | -40°C~85°C TA | Tape & Reel (TR) | 2011 | PIC® 10F | e3 | 活跃 | 1 (Unlimited) | 6 | EAR99 | Matte Tin (Sn) | 800mW | DUAL | 鸥翼 | 260 | 3.3V | 0.95mm | 16MHz | 40 | PIC10LF320 | 6 | 3.3V | Internal | 448B | 1.8V~3.6V | MICROCONTROLLER, RISC | PIC | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 8-Bit | 448B 256 x 14 | 8 | YES | NO | 8b | NO | 14 | PIC | 4 | 2 | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | PIC16F636T-I/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 有 | 128 x 8 | 表面贴装 | 表面贴装 | 14-TSSOP (0.173, 4.40mm Width) | 14 | 11 | -40°C~85°C TA | Tape & Reel (TR) | 2005 | PIC® 16F | e3 | yes | 活跃 | 1 (Unlimited) | 14 | EAR99 | Matte Tin (Sn) | 800mW | DUAL | 鸥翼 | 260 | 5V | 0.65mm | 20MHz | 40 | PIC16F636 | 14 | 5.5V | 4.5V | RS-232, SPI, USB | Internal | 3.5kB | 2V~5.5V | MICROCONTROLLER, RISC | PIC | Brown-out Detect/Reset, LVD, POR, WDT | FLASH | 8-Bit | 3.5KB 2K x 14 | 8 | 20 μs | NO | NO | 8b | NO | NO | 2 | 14 | PIC | 12 | 1.1mm | 5mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
| STM32F373V8T6 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 84 | 有 | 16K x 8 | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 100-LQFP | YES | 100 | A/D 1x12b, 3x16b; D/A 3x12b | -40°C~85°C TA | Tray | STM32F3 | 活跃 | 3 (168 Hours) | 100 | 434mW | QUAD | 鸥翼 | 3.3V | 0.5mm | 72MHz | STM32F373 | 100 | 2V | CAN, I2C, I2S, IrDA, LIN, SPI, UART, USART, USB | Internal | 64kB | 2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, POR, PWM, WDT | FLASH | 32-Bit | 64KB 64K x 8 | CANbus, I2C, IrDA, LINbus, SPI, UART/USART, USB | 75.7mA | 32 | YES | YES | 32b | YES | 14 | ARM | CORTEX-M4F | 16 | 2 | 3 | 1 | 1.45mm | 14mm | 14.2mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | STM32F765VIH6 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 82 | 表面贴装 | 100-TFBGA | YES | A/D 16x12b; D/A 2x12b | -40°C~85°C TA | Tray | STM32F7 | 活跃 | 3 (168 Hours) | 100 | BOTTOM | BALL | 3.3V | 0.8mm | STM32F765 | 3.6V | 1.7V | Internal | 216MHz | 512K x 8 | 1.7V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M7 | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART/USART, USB OTG | 32 | YES | YES | YES | 8 | 16 | 8mm | 8mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | STM8L151C6U6 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | FLASH, ROM | 41 | 32768 | 有 | 2K x 8 | ACTIVE (Last Updated: 6 months ago) | 表面贴装 | 表面贴装 | 48-UFQFN Exposed Pad | 48 | A/D 25x12b; D/A 1x12b | -40°C~85°C TA | Tray | STM8L EnergyLite | 活跃 | 3 (168 Hours) | 48 | EAR99 | QUAD | 3V | 0.5mm | 16MHz | STM8L | 48 | 3.6V | 1.8/3.3V | 1.65V | I2C, IrDA, SPI, UART, USART | Internal | 32kB | 1.8V~3.6V | MICROCONTROLLER, RISC | STM8 | Brown-out Detect/Reset, DMA, IR, POR, PWM, WDT | FLASH | 8-Bit | 32KB 32K x 8 | I2C, IrDA, SPI, UART/USART | 80mA | 8 | YES | YES | 8b | YES | YES | 4 | 1K x 8 | 8 | ST8 | 1mm | 7mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MSP430F412IPMR | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 48 | 256 | 有 | 256 x 8 | ACTIVE (Last Updated: 4 days ago) | 表面贴装 | 64-LQFP | YES | 64 | 342.689036mg | Slope A/D | -40°C~85°C TA | Tape & Reel (TR) | MSP430x4xx | e4 | yes | 活跃 | 3 (168 Hours) | 64 | Nickel/Palladium/Gold (Ni/Pd/Au) | ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ | QUAD | 鸥翼 | 260 | 3V | 8MHz | 64 | 3.6V | UART | Internal | 4kB | 1.8V~3.6V | MICROCONTROLLER, RISC | MSP430 | Brown-out Detect/Reset, LCD, POR, PWM, WDT | FLASH | 16-Bit | 4KB 4K x 8 + 256B | 16 | NO | NO | 16b | YES | NO | 2 | YES | YES | 48 | FIXED-POINT | NO | 0 | 1.6mm | 10mm | 10mm | 1.4mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||
| PIC16F59-I/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 有 | 134 x 8 | 通孔 | 通孔 | 40-DIP (0.600, 15.24mm) | 40 | 32 | -40°C~85°C TA | Tube | PIC® 16F | e3 | yes | 活跃 | 1 (Unlimited) | 40 | EAR99 | Matte Tin (Sn) | 800mW | DUAL | 3V | 2.54mm | 20MHz | PIC16F59 | 40 | 5.5V | 2/5.5V | 2V | External | 3kB | 2V~5.5V | MICROCONTROLLER, RISC | 8 | PIC | POR, WDT | FLASH | 8-Bit | 3KB 2K x 12 | 7mA | 8 | 20 μs | NO | NO | 8b | NO | NO | 1 | 24 kb | PIC | 4.953mm | 53.213mm | 14.732mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | PIC16LC711-04/SS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 13 | 有 | 68 x 8 | 表面贴装 | 20-SSOP (0.209, 5.30mm Width) | YES | 20 | A/D 4x8b | 0°C~70°C TA | Tube | 1997 | PIC® 16C | e3 | yes | 活跃 | 1 (Unlimited) | 20 | EAR99 | Matte Tin (Sn) | 1W | DUAL | 鸥翼 | 260 | 5V | 0.65mm | 4MHz | 40 | PIC16LC711 | 20 | 5V | 6V | External | 1.8kB | 2.5V~6V | MICROCONTROLLER, RISC | PIC | Brown-out Detect/Reset, PWM, WDT | OTP | 8-Bit | 1.75KB 1K x 14 | 3.8mA | 8 | 4 μs | YES | NO | 8b | NO | NO | 1 | 14 | PIC | 2mm | 7.2mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | PIC18LF4510-I/ML | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 36 | 有 | 1.5K x 8 | 表面贴装 | 表面贴装 | 44-VQFN Exposed Pad | 44 | A/D 13x10b | -40°C~85°C TA | Tube | 2004 | PIC® 18F | e3 | yes | 活跃 | 1 (Unlimited) | 44 | 3A991.A.2 | Matte Tin (Sn) | 1W | QUAD | 260 | 5V | 0.65mm | 40MHz | 40 | PIC18LF4510 | 44 | 5.5V | 2/5.5V | I2C, SPI, UART, USART | Internal | 32kB | 2V~5.5V | MICROCONTROLLER | PIC | Brown-out Detect/Reset, HLVD, POR, PWM, WDT | FLASH | 8-Bit | 32KB 16K x 16 | I2C, SPI, UART/USART | 8 | 40 μs | YES | NO | 8b | YES | NO | 4 | 16 | PIC | 1mm | 8mm | 无 | ROHS3 Compliant | 无铅 |