类别是'嵌入式 - CPLD(复杂可编程逻辑器件)'
嵌入式 - CPLD(复杂可编程逻辑器件) (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 可编程类型 | 最大电源电压 | 最小电源电压 | 工作电源电流 | 电源电流 | 时钟频率 | 传播延迟 | 接通延迟时间 | 建筑学 | 逻辑元件/单元数 | 阀门数量 | 最高频率 | 筛选水平 | 可编程I/O数 | 逻辑块数(LABs) | 速度等级 | 输出功能 | 宏细胞数 | JTAG BST | 专用输入数量 | 内部供电电压 | 延迟时间 tpd(1)最大 | 逻辑元素/块的数量 | 产品条款数量 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |||
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![]() | EPM7512BBC256-10 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 256-LBGA | YES | 212 | 0°C~70°C TA | Tray | MAX® 7000B | e0 | Obsolete | 3 (168 Hours) | 256 | 3A991 | Tin/Lead (Sn/Pb) | YES | 8542.39.00.01 | BOTTOM | BALL | 220 | 2.5V | 1.27mm | 30 | EPM7512 | S-PBGA-B256 | 不合格 | 2.625V | 1.8/3.32.5V | 2.375V | 系统内可编程 | 163.9MHz | 5.5 ns | 10000 | MACROCELL | 512 | YES | 2.375V~2.625V | 10ns | 32 | 1.7mm | 27mm | 27mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||
![]() | EPM7512BFC256-7N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 256-BGA | YES | 212 | 0°C~70°C TA | Tray | MAX® 7000B | e1 | Obsolete | 3 (168 Hours) | 256 | 3A991 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | 8542.39.00.01 | BOTTOM | BALL | 260 | 2.5V | 1mm | compliant | 40 | EPM7512 | S-PBGA-B256 | 不合格 | 2.625V | 1.8/3.32.5V | 2.375V | 系统内可编程 | 163.9MHz | 5.5 ns | 10000 | MACROCELL | 512 | YES | 2.375V~2.625V | 7.5ns | 32 | 3.5mm | 17mm | 17mm | 符合RoHS标准 | ||||||||||||||||||||||||||||
![]() | M4A3-128/64-12VNI | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 64 | 表面贴装 | 表面贴装 | 100-LQFP | 100 | EEPROM | -40°C~85°C TA | Tray | 1998 | ispMACH® 4A | e3 | yes | 不用于新设计 | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | M4A3-128 | 100 | 3.3V | 系统内可编程 | 3.6V | 3V | 12 ns | 12 ns | 5000 | 83.3MHz | 400 | MACROCELL | 128 | YES | 2 | 3V~3.6V | 1.6mm | 14mm | 14mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||
![]() | XC2C384-10PQG208C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 173 | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | ROMless | 0°C~70°C TA | Tray | 2001 | CoolRunner II | e3 | yes | 活跃 | 3 (168 Hours) | 208 | EAR99 | Matte Tin (Sn) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 245 | 1.8V | 0.5mm | 30 | XC2C384 | 208 | 不合格 | 1.8V | 1.9V | 系统内可编程 | 10 ns | 24 | 9000 | 125MHz | 10 | MACROCELL | 384 | YES | 1.7V~1.9V | 9.2ns | 4.1mm | 28mm | 28mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||
![]() | CY37032VP44-143AXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 37 | 表面贴装 | 表面贴装 | 44-LQFP | 44 | EEPROM | 0°C~70°C TA | Tray | 2003 | Ultra37000™ | e4 | Obsolete | 3 (168 Hours) | 44 | Nickel/Palladium/Gold (Ni/Pd/Au) | QUAD | 鸥翼 | 260 | 3.3V | 0.8mm | 143MHz | 20 | CY37032 | 44 | 3.3V | In-System Reprogrammable™ (ISR™) CMOS | 3.6V | 3V | 8.5 ns | 8.5 ns | 960 | 2 | MACROCELL | 32 | YES | 1 | 3V~3.6V | 1.6mm | 10mm | 10mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||
![]() | EPM7128BFC100-4N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 100-LBGA | YES | 84 | 0°C~70°C TA | Tray | MAX® 7000B | e1 | Obsolete | 3 (168 Hours) | 100 | 3A991 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 2.5V | 1mm | compliant | 40 | EPM7128 | S-PBGA-B100 | 不合格 | 2.625V | 2.375V | 系统内可编程 | 243.9MHz | 4 ns | 2500 | MACROCELL | 128 | YES | 2.375V~2.625V | 4ns | 8 | 1.7mm | 11mm | 11mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||
![]() | XCR3512XL-7FG324C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 260 | 表面贴装 | 324-BBGA | YES | EEPROM | 0°C~70°C TA | Bulk | 1996 | CoolRunner XPLA3 | e0 | no | 活跃 | 3 (168 Hours) | 324 | 3A991.D | YES | 8542.39.00.01 | BOTTOM | BALL | 225 | 3.3V | 1mm | not_compliant | 30 | 324 | 不合格 | 3.3V | 3.6V | In System Programmable (min 1K program/erase cycles) | 7.5 ns | 12000 | 135MHz | 7 | MACROCELL | 512 | YES | 3V~3.6V | 7ns | 32 | 2.5mm | 23mm | 23mm | Non-RoHS Compliant | ||||||||||||||||||||||||||
![]() | ISPLSI 2032A-80LT44 | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 44-TQFP | YES | 32 | 0°C~70°C TA | Tube | 2013 | ispLSI® 2000A | e0 | no | Obsolete | 3 (168 Hours) | 44 | EAR99 | Tin/Lead (Sn/Pb) | YES | QUAD | 鸥翼 | 未说明 | 5V | 未说明 | ISPLSI 2032 | 44 | S-PQFP-G44 | 不合格 | 5.25V | 5V | 4.75V | 系统内可编程 | 57MHz | 1000 | MACROCELL | 32 | NO | 4.75V~5.25V | 15ns | 8 | 10mm | 10mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
![]() | EPM7512AETC144-10N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 144-LQFP | YES | 120 | 0°C~70°C TA | Tray | MAX® 7000A | e3 | 活跃 | 3 (168 Hours) | 144 | 3A991 | Matte Tin (Sn) | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | EPM7512 | S-PQFP-G144 | 不合格 | 3.6V | 2.5/3.33.3V | 3V | 系统内可编程 | 87MHz | 10 ns | 10000 | MACROCELL | 512 | YES | 3V~3.6V | 10ns | 32 | 1.6mm | 20mm | 20mm | 符合RoHS标准 | |||||||||||||||||||||||||||||
![]() | M4A3-32/32-10VNC48 | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 32 | 表面贴装 | 表面贴装 | 48-LQFP | 48 | EEPROM | 0°C~70°C TA | Tray | 1998 | ispMACH® 4A | e3 | yes | 不用于新设计 | 3 (168 Hours) | 48 | EAR99 | Matte Tin (Sn) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 30 | M4A3-32 | 48 | 3.3V | 系统内可编程 | 3.6V | 3V | 10 ns | 10 ns | 1250 | 100MHz | 160 | MACROCELL | 32 | YES | 3V~3.6V | 1.6mm | 7mm | 7mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||
![]() | EPM1270GT144I5N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 144-LQFP | YES | 116 | -40°C~100°C TJ | Tray | MAX® II | e3 | 活跃 | 3 (168 Hours) | 144 | 3A991 | MATTE TIN (472) OVER COPPER | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 1.8V | 0.5mm | 40 | EPM1270 | S-PQFP-G144 | 不合格 | 1.89V | 1.5/3.31.8V | 1.71V | 系统内可编程 | 10 ns | MACROCELL | 980 | YES | 1.71V~1.89V | 6.2ns | 1270 | 1.6mm | 20mm | 20mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||
![]() | EPM7192SQC160-15F | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 160-BQFP | 124 | 0°C~70°C TA | Tray | MAX® 7000S | Obsolete | 3 (168 Hours) | EPM7192 | 系统内可编程 | 3750 | 192 | 4.75V~5.25V | 15ns | 12 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5M80ZT100A5N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Automotive grade | 表面贴装 | 100-TQFP | YES | 79 | -40°C~125°C TJ | Tray | MAX® V | 活跃 | 3 (168 Hours) | 100 | YES | 8542.39.00.01 | QUAD | 鸥翼 | 0.5mm | 5M80Z | S-PQFP-G100 | 不合格 | 1.81.2/3.3V | 系统内可编程 | 14 ns | AEC-Q100 | 64 | YES | 1.71V~1.89V | 7.5ns | 80 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||
![]() | XA2C32A-6VQG44I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Automotive grade | 表面贴装 | 表面贴装 | 44-TQFP | 44 | 33 | -40°C~85°C TA | Tray | 2001 | CoolRunner II | e3 | yes | 活跃 | 3 (168 Hours) | 44 | EAR99 | Matte Tin (Sn) | 真正的数字设计技术 | QUAD | 鸥翼 | 260 | 1.8V | 0.8mm | 30 | XA2C32A | 44 | 不合格 | 1.8V | 1.9V | 系统内可编程 | 6 ns | 2 | 750 | 200MHz | AEC-Q100 | 6 | MACROCELL | 32 | YES | 1.7V~1.9V | 5.5ns | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||
![]() | EPM7128AELC84-10N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 84-LCC (J-Lead) | YES | 68 | 0°C~70°C TA | Tray | MAX® 7000A | e3 | Obsolete | 3 (168 Hours) | 84 | 3A991 | MATTE TIN (472) OVER COPPER | YES | QUAD | J BEND | 245 | 3.3V | 1.27mm | compliant | 40 | EPM7128 | 不合格 | 3.6V | 2.5/3.33.3V | 3V | 系统内可编程 | 10 ns | 2500 | MACROCELL | 128 | YES | 3V~3.6V | 10ns | 8 | 29.3116mm | 29.3116mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
![]() | LC4256V-3T100C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 64 | 表面贴装 | 表面贴装 | 100-LQFP | 100 | EEPROM | 0°C~90°C TJ | Tray | 2000 | ispMACH® 4000V | e0 | no | Obsolete | 3 (168 Hours) | 100 | EAR99 | Tin/Lead (Sn/Pb) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 240 | 3.3V | 0.5mm | 384.6MHz | 30 | LC4256 | 100 | 3.3V | 系统内可编程 | 3.6V | 3V | 12.5mA | 12.5mA | 3 ns | 3 ns | 128 | 36 | MACROCELL | 256 | YES | 10 | 3V~3.6V | 16 | 1.6mm | 14mm | 14mm | 无 | Non-RoHS Compliant | 无铅 | ||||||||||||||||||||
![]() | XCR3064XL-7CPG56I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 48 | 表面贴装 | 表面贴装 | 56-LFBGA, CSPBGA | 56 | EEPROM | -40°C~85°C TA | Tray | 1996 | CoolRunner XPLA3 | e1 | yes | 活跃 | 3 (168 Hours) | 56 | EAR99 | YES | BOTTOM | BALL | 260 | 3.3V | 0.5mm | 30 | 56 | 不合格 | 3.3V | 3.6V | In System Programmable (min 1K program/erase cycles) | 7.5 ns | 4 | 1500 | 119MHz | 7 | MACROCELL | 64 | YES | 2.7V~3.6V | 7ns | 1.35mm | 6mm | 6mm | ROHS3 Compliant | |||||||||||||||||||||||||||
![]() | LC4128V-10T100I | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 64 | 表面贴装 | 表面贴装 | 100-LQFP | 100 | EEPROM | -40°C~105°C TJ | Tray | 2000 | ispMACH® 4000V | e0 | no | Obsolete | 3 (168 Hours) | 100 | EAR99 | Tin/Lead (Sn/Pb) | YES | QUAD | 鸥翼 | 240 | 3.3V | 0.5mm | 125MHz | 30 | LC4128 | 100 | 3.3V | 系统内可编程 | 3.6V | 3V | 12mA | 12mA | 10 ns | 10 ns | 36 | MACROCELL | 128 | YES | 10 | 3V~3.6V | 8 | 1.6mm | 14mm | 14mm | 无 | Non-RoHS Compliant | 无铅 | ||||||||||||||||||||||
![]() | XCR3384XL-12PQG208I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 172 | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | EEPROM | -40°C~85°C TA | Tray | 1996 | CoolRunner XPLA3 | e3 | yes | 活跃 | 3 (168 Hours) | 208 | EAR99 | Matte Tin (Sn) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 245 | 3.3V | 0.5mm | 30 | 208 | 不合格 | 3.3V | 3.6V | In System Programmable (min 1K program/erase cycles) | 12 ns | 24 | 9000 | 83MHz | 12 | MACROCELL | 384 | YES | 2.7V~3.6V | 10.8ns | 4.1mm | 28mm | 28mm | ROHS3 Compliant | |||||||||||||||||||||||||
![]() | XC95144-15TQG100C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 81 | 表面贴装 | 表面贴装 | 100-LQFP | 100 | FLASH | 0°C~70°C TA | Tray | 1996 | XC9500 | e3 | yes | Obsolete | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | YES | QUAD | 鸥翼 | 260 | 5V | 0.5mm | 30 | XC95144 | 100 | 5V | In System Programmable (min 10K program/erase cycles) | 15 ns | 15 ns | 8 | 3200 | 55.6MHz | 15 | MACROCELL | 144 | YES | 4.75V~5.25V | 1.6mm | 14mm | 14mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||
![]() | GAL22V10D-25LP | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 通孔 | 24-DIP (0.300, 7.62mm) | 24 | 10 | 0°C~75°C TA | Bulk | 2000 | GAL®22V10 | e0 | no | Obsolete | 3 (168 Hours) | 24 | EAR99 | Tin/Lead (Sn85Pb15) | 8542.39.00.01 | DUAL | 225 | 5V | 2.54mm | 38.5MHz | 30 | GAL22V10 | 24 | 10 | 5V | 5V | EE PLD | 5.25V | 4.75V | 90mA | 25 ns | 25 ns | PAL-TYPE | MACROCELL | 10 | 11 | 4.75V~5.25V | 132 | 5.334mm | 31.75mm | 7.62mm | 无 | Non-RoHS Compliant | 无铅 | ||||||||||||||||||||||||
![]() | XCR3384XL-12PQG208C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 172 | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | EEPROM | 0°C~70°C TA | Tray | 1996 | CoolRunner XPLA3 | e3 | yes | 活跃 | 3 (168 Hours) | 208 | EAR99 | Matte Tin (Sn) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 245 | 3.3V | 0.5mm | 30 | 208 | 不合格 | 3.3V | 3.6V | In System Programmable (min 1K program/erase cycles) | 12 ns | 24 | 9000 | 83MHz | 12 | MACROCELL | 384 | YES | 3V~3.6V | 10.8ns | 4.1mm | 28mm | 28mm | ROHS3 Compliant | |||||||||||||||||||||||||
![]() | EPM7256AEQC208-5 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 208-BFQFP | YES | 164 | 0°C~70°C TA | Tray | MAX® 7000A | e0 | Obsolete | 3 (168 Hours) | 208 | 3A991 | 锡铅 | YES | 8542.39.00.01 | QUAD | 鸥翼 | 220 | 3.3V | 0.5mm | 30 | EPM7256 | S-PQFP-G208 | 不合格 | 3.6V | 2.5/3.33.3V | 3V | 系统内可编程 | 172.4MHz | 5.5 ns | 5000 | MACROCELL | 256 | YES | 3V~3.6V | 5.5ns | 16 | 4.1mm | 28mm | 28mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||
![]() | EPM7064SLC84-6 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 84-LCC (J-Lead) | YES | 68 | 0°C~70°C TA | Tray | MAX® 7000S | e0 | Obsolete | 3 (168 Hours) | 84 | Tin/Lead (Sn/Pb) | CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | QUAD | J BEND | 220 | 5V | 1.27mm | 30 | EPM7064 | 不合格 | 5.25V | 3.3/55V | 系统内可编程 | 200MHz | 6 ns | 1250 | MACROCELL | 64 | YES | 4.75V~5.25V | 6ns | 4 | 5.08mm | 29.3116mm | 29.3116mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
![]() | XCR3384XL-7FTG256C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 212 | 表面贴装 | 表面贴装 | 256-LBGA | 256 | EEPROM | 0°C~70°C TA | Tray | 1996 | CoolRunner XPLA3 | e1 | yes | 活跃 | 3 (168 Hours) | 256 | 3A991.D | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | 8542.39.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 30 | 256 | 不合格 | 3.3V | 3.6V | In System Programmable (min 1K program/erase cycles) | 7.5 ns | 24 | 9000 | 135MHz | 7 | MACROCELL | 384 | YES | 3V~3.6V | 7ns | 1.55mm | ROHS3 Compliant |