类别是'嵌入式 - CPLD(复杂可编程逻辑器件)'
嵌入式 - CPLD(复杂可编程逻辑器件) (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 可编程类型 | 最大电源电压 | 最小电源电压 | 工作电源电流 | 电源电流 | 最大电源电流 | 时钟频率 | 传播延迟 | 接通延迟时间 | 建筑学 | 可编程逻辑类型 | 逻辑元件/单元数 | 阀门数量 | 最高频率 | 可编程I/O数 | 逻辑块数(LABs) | 速度等级 | 输出功能 | 宏细胞数 | JTAG BST | 专用输入数量 | 内部供电电压 | 延迟时间 tpd(1)最大 | 逻辑元素/块的数量 | 系统内可编程 | 产品条款数量 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |||
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![]() | EPM7128EQC100-20 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 100-BQFP | YES | 84 | 0°C~70°C TA | Tray | MAX® 7000 | e0 | Obsolete | 3 (168 Hours) | 100 | EAR99 | 锡铅 | CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | QUAD | 鸥翼 | 220 | 5V | 0.65mm | compliant | 30 | EPM7128 | R-PQFP-G100 | 不合格 | 5.25V | 3.3/55V | 4.75V | EE PLD | 20 ns | 2500 | MACROCELL | 128 | NO | 4.75V~5.25V | 20ns | 8 | 3.65mm | 20mm | 14mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||
![]() | ISPGAL22V10C-15LJN | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 28-LCC (J-Lead) | 28 | 10 | 0°C~75°C TA | Tube | 2000 | ispGAL™22V10 | e3 | yes | Obsolete | 1 (Unlimited) | 28 | EAR99 | Matte Tin (Sn) | 8542.39.00.01 | QUAD | J BEND | 245 | 5V | 1.27mm | 83.3MHz | 40 | ISPGAL22V10 | 28 | 10 | 5V | 5V | 系统内可编程 | 5.25V | 4.75V | 140mA | 140mA | 15 ns | 15 ns | PAL-TYPE | MACROCELL | 10 | 11 | 4.75V~5.25V | 132 | 4.572mm | 11.5062mm | 11.5062mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||
![]() | EPM7128BFC100-4 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 100-LBGA | YES | 84 | 0°C~70°C TA | Tray | MAX® 7000B | e0 | Obsolete | 3 (168 Hours) | 100 | 3A991 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | 235 | 2.5V | 1mm | compliant | 30 | EPM7128 | S-PBGA-B100 | 不合格 | 2.625V | 2.375V | 系统内可编程 | 243.9MHz | 4 ns | 2500 | MACROCELL | 128 | YES | 2.375V~2.625V | 4ns | 8 | 1.7mm | 11mm | 11mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||
![]() | EPM7064BFC100-7 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 100-LBGA | YES | 68 | 0°C~70°C TA | Tray | MAX® 7000B | e0 | Obsolete | 3 (168 Hours) | 100 | EAR99 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | 235 | 2.5V | 1mm | compliant | 30 | EPM7064 | S-PBGA-B100 | 不合格 | 2.625V | 1.8/3.32.5V | 2.375V | 系统内可编程 | 303MHz | 3.5 ns | 1250 | MACROCELL | 64 | YES | 2.375V~2.625V | 7.5ns | 4 | 1.7mm | 11mm | 11mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||
![]() | LC4064ZC-75TN48E | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 32 | 表面贴装 | 表面贴装 | 48-LQFP | 48 | EEPROM | -40°C~130°C TJ | Tray | 2000 | ispMACH® 4000Z | e3 | yes | 活跃 | 3 (168 Hours) | 48 | EAR99 | Matte Tin (Sn) | YES | QUAD | 鸥翼 | 260 | 1.8V | 0.5mm | 178.57MHz | 40 | LC4064 | 48 | 不合格 | 1.8V | 系统内可编程 | 1.9V | 1.6V | 80μA | 80μA | 7.5 ns | 36 | 484 | MACROCELL | 64 | YES | 4 | 1.7V~1.9V | 4 | 1.2mm | 7mm | 7mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||
![]() | 5M80ZM64C5N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 64-TFBGA | YES | 30 | 0°C~85°C TJ | Tray | MAX® V | e1 | 活跃 | 3 (168 Hours) | 64 | EAR99 | 锡银铜 | YES | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.8V | 0.5mm | 30 | 5M80Z | 不合格 | 1.89V | 1.81.2/3.3V | 1.71V | 系统内可编程 | 118.3MHz | 14 ns | MACROCELL | 64 | YES | 1.71V~1.89V | 7.5ns | 80 | 1.2mm | 4.5mm | 4.5mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||
![]() | EPM240GT100C3 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 100-TQFP | YES | 80 | 0°C~85°C TJ | Tray | MAX® II | e0 | 活跃 | 3 (168 Hours) | 100 | EAR99 | 锡铅 | YES | 8542.39.00.01 | QUAD | 鸥翼 | 235 | 1.8V | 0.5mm | 30 | EPM240 | S-PQFP-G100 | 不合格 | 1.89V | 1.5/3.31.8V | 1.71V | 系统内可编程 | 4.7 ns | MACROCELL | 192 | YES | 1.71V~1.89V | 4.7ns | 240 | 1.2mm | 14mm | 14mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||
![]() | EPM7032STI44-7 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 44-TQFP | 36 | -40°C~85°C TA | Tray | MAX® 7000S | Obsolete | 3 (168 Hours) | EPM7032 | 系统内可编程 | 600 | 32 | 4.5V~5.5V | 7.5ns | 2 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EPM7064AETA100-10N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 100-LBGA | 100-FBGA (11x11) | 68 | -40°C~130°C TJ | Tray | MAX® 7000A | 活跃 | 3 (168 Hours) | EPM7064 | 系统内可编程 | 1250 | 64 | 3V~3.6V | 10ns | 4 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EPM2210GF256C3 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 256-BGA | YES | 204 | 0°C~85°C TJ | Tray | MAX® II | e0 | 活跃 | 3 (168 Hours) | 256 | 3A991 | 锡铅 | YES | 8542.39.00.01 | BOTTOM | BALL | 220 | 1.8V | 1mm | 30 | EPM2210 | S-PBGA-B256 | 不合格 | 1.89V | 1.5/3.31.8V | 1.71V | 系统内可编程 | 7 ns | MACROCELL | 1700 | YES | 1.71V~1.89V | 7ns | 2210 | 2.2mm | 17mm | 17mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||
![]() | EPM7160EQC100-15 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 100-BQFP | YES | 84 | 0°C~70°C TA | Tray | MAX® 7000 | e0 | Obsolete | 3 (168 Hours) | 100 | EAR99 | 锡铅 | CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 8542.39.00.01 | QUAD | 鸥翼 | 220 | 5V | 0.65mm | compliant | 30 | EPM7160 | 不合格 | 5.25V | 3.3/55V | 4.75V | EE PLD | 15 ns | 3200 | MACROCELL | 160 | NO | 4.75V~5.25V | 15ns | 10 | 3.65mm | 20mm | 14mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||
![]() | XCR3064XL-10CS48C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | EEPROM | 40 | 表面贴装 | 48 | 95MHz | Bulk | e0 | no | 3 (168 Hours) | 48 | EAR99 | Tin/Lead (Sn63Pb37) | 70°C | 0°C | YES | BOTTOM | BALL | 240 | 3.3V | 0.8mm | 30 | 48 | 3.3V | 3.6V | COMMERCIAL | 10 ns | 10 ns | EE PLD | 1500 | 4 | 10 | MACROCELL | 64 | YES | YES | 1.8mm | 7mm | 7mm | 无 | 符合RoHS标准 | 含铅 | ||||||||||||||||||||||||||||||||||||
![]() | EPM7064STC100-10F | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 100-TQFP | YES | 68 | 0°C~70°C TA | Tray | MAX® 7000S | e0 | Obsolete | 3 (168 Hours) | 100 | EAR99 | Tin/Lead (Sn/Pb) | QUAD | 鸥翼 | 235 | 5V | 0.5mm | 30 | EPM7064 | S-PQFP-G100 | 不合格 | 5.25V | 3.3/55V | 系统内可编程 | 125MHz | 10 ns | 1250 | MACROCELL | 64 | YES | 4.75V~5.25V | 10ns | 4 | 1.27mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||
![]() | EPM3128ATI144-10 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 144-LQFP | YES | 96 | -40°C~85°C TA | Tray | MAX® 3000A | e0 | Obsolete | 3 (168 Hours) | 144 | Tin/Lead (Sn/Pb) | YES | QUAD | 鸥翼 | 220 | 3.3V | 0.5mm | compliant | 30 | EPM3128 | S-PQFP-G144 | 不合格 | 3.6V | 2.5/3.33.3V | 3V | 系统内可编程 | 10 ns | 2500 | MACROCELL | 128 | YES | 3V~3.6V | 10ns | 8 | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||
![]() | EPM7064LC84-12 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 84-LCC (J-Lead) | YES | 68 | 0°C~70°C TA | Tray | MAX® 7000 | e0 | Obsolete | 3 (168 Hours) | 84 | 锡铅 | CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | QUAD | J BEND | 220 | 5V | 1.27mm | compliant | 30 | EPM7064 | 不合格 | 5.25V | 3.3/55V | EE PLD | 125MHz | 12 ns | 1250 | MACROCELL | 64 | NO | 4.75V~5.25V | 12ns | 4 | 5.08mm | 29.3116mm | 29.3116mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||
![]() | XCR3032XL-5CSG48C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 36 | 表面贴装 | 表面贴装 | 48-FBGA, CSPBGA | 48 | EEPROM | 0°C~70°C TA | Tray | 2003 | CoolRunner XPLA3 | e1 | yes | 活跃 | 3 (168 Hours) | 48 | EAR99 | YES | BOTTOM | BALL | 260 | 3.3V | 0.8mm | 30 | 48 | 不合格 | 3.3V | 3.6V | In System Programmable (min 1K program/erase cycles) | 5 ns | 2 | 750 | 213MHz | 5 | MACROCELL | 32 | YES | 3V~3.6V | 4.5ns | 1.8mm | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||
![]() | EPM7064SLC84-5 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 84-LCC (J-Lead) | YES | 68 | 0°C~70°C TA | Tray | MAX® 7000S | e0 | Obsolete | 3 (168 Hours) | 84 | Tin/Lead (Sn/Pb) | QUAD | J BEND | 220 | 5V | 1.27mm | 30 | EPM7064 | 不合格 | 5.25V | 3.3/55V | 系统内可编程 | 250MHz | 5 ns | 1250 | MACROCELL | 64 | YES | 4.75V~5.25V | 5ns | 4 | 5.08mm | 29.3116mm | 29.3116mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||
![]() | EPM7256EQC160-20 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 160-BQFP | YES | 132 | 0°C~70°C TA | Tray | MAX® 7000 | e0 | Obsolete | 3 (168 Hours) | 160 | EAR99 | 锡铅 | CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 8542.39.00.01 | QUAD | 鸥翼 | 220 | 5V | 0.65mm | compliant | 30 | EPM7256 | 不合格 | 5.25V | 3.3/55V | 4.75V | EE PLD | 83.3MHz | 20 ns | 5000 | MACROCELL | 256 | NO | 4.75V~5.25V | 20ns | 16 | 4.07mm | 28mm | 28mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||
![]() | EPM2210GF324C3N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 324-BGA | YES | 272 | 0°C~85°C TJ | Tray | MAX® II | e1 | 活跃 | 3 (168 Hours) | 324 | 3A991 | 锡银铜 | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.8V | 1mm | 40 | EPM2210 | S-PBGA-B324 | 不合格 | 1.89V | 1.5/3.31.8V | 1.71V | 系统内可编程 | 7 ns | MACROCELL | 1700 | YES | 1.71V~1.89V | 7ns | 2210 | 2.2mm | 19mm | 19mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||
![]() | CY37256P160-125AXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 133 | Tin | 表面贴装 | 表面贴装 | 160-LQFP | 160 | EEPROM | -40°C~85°C TA | Tray | 2003 | Ultra37000™ | e3 | Obsolete | 3 (168 Hours) | 160 | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.5mm | 125MHz | 20 | CY37256 | 160 | 5V | In-System Reprogrammable™ (ISR™) CMOS | 5.5V | 4.5V | 10 ns | 10 ns | 7700 | 16 | 125 | MACROCELL | 256 | YES | 1 | 4.5V~5.5V | 1.6mm | 24mm | 24mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||
![]() | LC4512V-75FT256C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 208 | 表面贴装 | 表面贴装 | 256-LBGA | 256 | EEPROM | 0°C~90°C TJ | Tray | 2000 | ispMACH® 4000V | no | Obsolete | 3 (168 Hours) | EAR99 | 8542.39.00.01 | not_compliant | 178.57MHz | LC4512 | 256 | 3.3V | 系统内可编程 | 3.6V | 3V | 14mA | 14mA | 7.5 ns | 7.5 ns | 36 | 512 | 3V~3.6V | 32 | Non-RoHS Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||
![]() | LC4064V-10T48I | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 32 | 表面贴装 | 表面贴装 | 48-LQFP | 48 | EEPROM | -40°C~105°C TJ | Tray | 2000 | ispMACH® 4000V | e0 | no | Obsolete | 3 (168 Hours) | 48 | EAR99 | Tin/Lead (Sn85Pb15) | YES | QUAD | 鸥翼 | 240 | 3.3V | 0.5mm | 125MHz | LC4064 | 48 | 3.3V | 系统内可编程 | 3.6V | 3V | 12mA | 12mA | 10 ns | 10 ns | 272 | 36 | MACROCELL | 64 | YES | 4 | 3V~3.6V | 4 | 1.2mm | 7mm | 7mm | 无 | Non-RoHS Compliant | 无铅 | |||||||||||||||||||||||||||||
![]() | EPM7064BFC100-5 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 100-LBGA | YES | 68 | 0°C~70°C TA | Tray | MAX® 7000B | e0 | Obsolete | 3 (168 Hours) | 100 | EAR99 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | 235 | 2.5V | 1mm | compliant | 30 | EPM7064 | S-PBGA-B100 | 不合格 | 2.625V | 1.8/3.32.5V | 2.375V | 系统内可编程 | 303MHz | 3.5 ns | 1250 | MACROCELL | 64 | YES | 2.375V~2.625V | 5ns | 4 | 1.7mm | 11mm | 11mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||
![]() | XC95108-15PQG100C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FLASH | 81 | PQFP | YES | 100 | 55.6MHz | e3 | yes | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | 70°C | 0°C | YES | QUAD | 鸥翼 | 245 | 5V | 0.65mm | 30 | 100 | 5V | COMMERCIAL | 15 ns | 8 | 15 | MACROCELL | 108 | YES | YES | 3.4mm | 20mm | 14mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||
![]() | LC4128C-27TN100C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 64 | 表面贴装 | 表面贴装 | 100-LQFP | 100 | EEPROM | 0°C~90°C TJ | Tray | 2000 | ispMACH® 4000C | e3 | yes | Obsolete | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | YES | QUAD | 鸥翼 | 260 | 1.8V | 0.5mm | 384.6MHz | 40 | LC4128 | 100 | 1.8V | 系统内可编程 | 1.95V | 1.65V | 2mA | 2mA | 2.7 ns | 2.7 ns | 484 | 36 | MACROCELL | 128 | YES | 10 | 1.65V~1.95V | 8 | 1.6mm | 14mm | 14mm | 无 | 符合RoHS标准 | 无铅 |