类别是'嵌入式 - CPLD（复杂可编程逻辑器件）'
嵌入式 - CPLD（复杂可编程逻辑器件） (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 可编程类型 | 最大电源电压 | 最小电源电压 | 工作电源电流 | 电源电流 | 内存大小 | 最大电源电流 | 时钟频率 | 传播延迟 | 接通延迟时间 | 建筑学 | 逻辑元件/单元数 | 阀门数量 | 最高频率 | 可编程I/O数 | 逻辑块数(LABs) | 速度等级 | 输出功能 | 宏细胞数 | JTAG BST | 专用输入数量 | 内部供电电压 | 延迟时间 tpd(1)最大 | 逻辑元素/块的数量 | 产品条款数量 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||
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 | XC2C384-10PQ208I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 173 | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | ROMless | -40°C~85°C TA | Tray | 2001 | CoolRunner II | e0 | no | 活跃 | 3 (168 Hours) | 208 | EAR99 | Tin/Lead (Sn85Pb15) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 225 | 1.8V | 0.5mm | 30 | XC2C384 | 208 | 不合格 | 1.8V | 1.9V | 系统内可编程 | 10 ns | 24 | 9000 | 125MHz | 10 | MACROCELL | 384 | YES | 1.7V~1.9V | 9.2ns | 4.1mm | 28mm | 28mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||
 | LC4256V-5FN256BC | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 160 | 表面贴装 | 表面贴装 | 256-BGA | EEPROM | 0°C~90°C TJ | Tray | 2000 | ispMACH® 4000V | e1 | Obsolete | 3 (168 Hours) | 256 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | 8542.39.00.01 | BOTTOM | BALL | 250 | 3.3V | 1mm | 40 | LC4256 | 256 | 不合格 | 3.3V | 系统内可编程 | 3.6V | 3V | 12.5mA | 12.5mA | 5 ns | 322MHz | 388 | MACROCELL | 256 | YES | 4 | 3V~3.6V | 5ns | 16 | 2.1mm | 17mm | 17mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||
 | EPM7064BTC44-7N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 44-TQFP | YES | 36 | 0°C~70°C TA | Tray | MAX® 7000B | e3 | Obsolete | 3 (168 Hours) | 44 | EAR99 | Matte Tin (Sn) | YES | QUAD | 鸥翼 | 260 | 2.5V | 0.8mm | compliant | 40 | EPM7064 | 不合格 | 2.625V | 1.8/3.32.5V | 2.375V | 系统内可编程 | 303MHz | 3.5 ns | 1250 | MACROCELL | 64 | YES | 2.375V~2.625V | 7.5ns | 4 | 1.27mm | 10mm | 10mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||
 | XC95144-15TQ100C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 81 | 表面贴装 | 表面贴装 | 100-LQFP | 100 | FLASH | 0°C~70°C TA | Tray | 1996 | XC9500 | e0 | no | Obsolete | 3 (168 Hours) | 100 | EAR99 | YES | QUAD | 鸥翼 | 225 | 5V | 0.5mm | 30 | XC95144 | 100 | 5V | In System Programmable (min 10K program/erase cycles) | 15 ns | 15 ns | 8 | 3200 | 55.6MHz | 15 | MACROCELL | 144 | YES | 4.75V~5.25V | 1.6mm | 14mm | 14mm | 无 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||
 | M4A5-192/96-7VNC | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 96 | 表面贴装 | 表面贴装 | 144-LQFP | 176 | EEPROM | 0°C~70°C TA | Tray | 1998 | ispMACH® 4A | e3 | yes | 不用于新设计 | 3 (168 Hours) | 144 | EAR99 | Matte Tin (Sn) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.5mm | 未说明 | M4A5-192 | 144 | S-PQFP-G144 | 不合格 | 5V | 5V | 系统内可编程 | 5.25V | 4.75V | 7.5 ns | 7.5 ns | 7500 | 125MHz | 900 | MACROCELL | 192 | YES | 16 | 4.75V~5.25V | 1.6mm | 20mm | 20mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||
 | EPM7192EGC160-12 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 160-BPGA | NO | 124 | 0°C~70°C TA | Tray | MAX® 7000 | Obsolete | 3 (168 Hours) | 160 | TIN/LEAD (SN/PB) | CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 8542.39.00.01 | PERPENDICULAR | PIN/PEG | 220 | 5V | 2.54mm | compliant | 30 | EPM7192 | S-CPGA-P160 | 不合格 | 5.25V | 3.3/55V | 4.75V | EE PLD | 3750 | MACROCELL | 192 | NO | 4.75V~5.25V | 12ns | 12 | 5.34mm | 39.624mm | 39.624mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||
 | ATF1500AL-20JU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 32 | Industrial grade | Tin | 表面贴装 | 表面贴装 | 44-LCC (J-Lead) | 44 | 2.386605g | FLASH | -40°C~85°C TA | Tube | 1997 | ATF15xx | e3 | yes | 活跃 | 3 (168 Hours) | 44 | NO | QUAD | J BEND | 245 | 5V | 1.27mm | 41.7MHz | 40 | ATF1500 | 5V | 5V | In System Programmable (min 100 program/erase cycles) | 5.5V | 4.5V | 20 ns | 20 ns | 1000 | 20 | MACROCELL | 32 | NO | 4.5V~5.5V | 4.572mm | 16.586mm | 16.586mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||
| CY37064P44-125AC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 44-LQFP | 37 | 0°C~70°C TA | Tray | 2003 | Ultra37000™ | e0 | Obsolete | 3 (168 Hours) | 44 | Tin/Lead (Sn/Pb) | QUAD | 鸥翼 | 240 | 5V | 0.8mm | not_compliant | 30 | CY37064 | 44 | 不合格 | 5V | In-System Reprogrammable™ (ISR™) CMOS | 83MHz | 10 ns | 4 | MACROCELL | 64 | YES | 1 | 4.75V~5.25V | 1.6mm | 10mm | 10mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||
 | EPM7096LC84-12 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 84-LCC (J-Lead) | 84-PLCC (29.31x29.31) | 68 | 0°C~70°C TA | Tray | MAX® 7000 | Obsolete | 3 (168 Hours) | EPM7096 | EE PLD | 1800 | 96 | 4.75V~5.25V | 12ns | 6 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | GAL16LV8C-10LJN | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 20-LCC (J-Lead) | 20 | 8 | 0°C~75°C TA | Tube | 2000 | GAL®16LV8 | e3 | Obsolete | 1 (Unlimited) | 20 | EAR99 | Matte Tin (Sn) | REGISTER PRELOAD; POWER-UP RESET | QUAD | J BEND | 250 | 3.3V | 1.27mm | 83.3MHz | GAL16LV8 | 20 | 8 | 3.3V | EE PLD | 3.6V | 3V | 65mA | 10 ns | 10 ns | PAL-TYPE | MACROCELL | 8 | 8 | 3V~3.6V | 64 | 4.57mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||
| EPM7032STC44-5 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 44-TQFP | 36 | 0°C~70°C TA | Tray | MAX® 7000S | Obsolete | 3 (168 Hours) | EPM7032 | 系统内可编程 | 600 | 32 | 4.75V~5.25V | 5ns | 2 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png) | XC95288-15BG352C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 352-LBGA Exposed Pad, Metal | 192 | 0°C~70°C TA | Tray | 1996 | XC9500 | e0 | no | Obsolete | 3 (168 Hours) | 352 | EAR99 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 5V | 1.27mm | not_compliant | 30 | XC95288 | 352 | S-PBGA-B352 | 不合格 | 5V | In System Programmable (min 10K program/erase cycles) | 55.6MHz | 15 ns | 8 | 6400 | MACROCELL | 288 | YES | 4.75V~5.25V | 16 | 1.7mm | 35mm | 35mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||
 | GAL16LV8C-15LJN | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 20-LCC (J-Lead) | 20 | 8 | 0°C~75°C TA | Tube | 2000 | GAL®16LV8 | e3 | Obsolete | 1 (Unlimited) | 20 | EAR99 | Matte Tin (Sn) | REGISTER PRELOAD; POWER-UP RESET | QUAD | J BEND | 250 | 3.3V | 1.27mm | 62.5MHz | GAL16LV8 | 20 | 8 | 3.3V | EE PLD | 3.6V | 3V | 65mA | 15 ns | 15 ns | PAL-TYPE | MACROCELL | 8 | 8 | 3V~3.6V | 64 | 4.57mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||
 | LC5512MV-75F256C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 193 | 表面贴装 | 表面贴装 | 256-BGA | 256 | EEPROM, SRAM | 0°C~90°C TJ | Tray | 2000 | ispXPLD® 5000MV | e0 | no | Obsolete | 3 (168 Hours) | 256 | EAR99 | Tin/Lead (Sn63Pb37) | YES | 8542.39.00.01 | BOTTOM | BALL | 225 | 3.3V | 1mm | not_compliant | 200MHz | 30 | LC5512 | 256 | 不合格 | 3.3V | 系统内可编程 | 3.6V | 3V | 33mA | 33mA | 32kB | 7.5 ns | MACROCELL | 512 | YES | 3V~3.6V | 16 | 2.1mm | 17mm | 17mm | Non-RoHS Compliant | 无铅 | |||||||||||||||||||||||||||||
 | XC95108-20PQ100I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 100-BQFP | 100 | 81 | -40°C~85°C TA | Tray | 1996 | XC9500 | e0 | no | Obsolete | 3 (168 Hours) | 100 | EAR99 | YES | QUAD | 鸥翼 | 225 | 5V | not_compliant | 30 | XC95108 | 100 | 不合格 | 5V | In System Programmable (min 10K program/erase cycles) | 20 ns | 8 | 2400 | MACROCELL | 108 | YES | 4.5V~5.5V | 6 | 3.4mm | 20mm | 14mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||
 | GAL20V8C-7LJ | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 28-LCC (J-Lead) | 28 | 8 | 0°C~75°C TA | Tube | 2000 | GAL®20V8 | e0 | Obsolete | 3 (168 Hours) | 28 | EAR99 | REGISTER PRELOAD; POWER-UP RESET | QUAD | J BEND | 5V | 1.27mm | 125MHz | GAL20V8 | 28 | 8 | 5V | 5V | EE PLD | 5.25V | 4.75V | 115mA | 7.5 ns | 7.5 ns | PAL-TYPE | MACROCELL | 8 | 12 | 4.75V~5.25V | 64 | 4.572mm | 11.5062mm | 11.5062mm | 无 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||
| XC95216-20BG352C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 166 | 表面贴装 | 表面贴装 | 352-LBGA Exposed Pad, Metal | 352 | FLASH | 0°C~70°C TA | Tray | 1996 | XC9500 | e0 | no | Obsolete | 3 (168 Hours) | 352 | EAR99 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 5V | 1.27mm | 30 | XC95216 | 352 | 5V | In System Programmable (min 10K program/erase cycles) | 20 ns | 20 ns | 8 | 4800 | 50MHz | 20 | MACROCELL | 216 | YES | 4.75V~5.25V | 12 | 1.4mm | 35mm | 35mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||
 | EPM2210GF324C3 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 324-BGA | YES | 272 | 0°C~85°C TJ | Tray | MAX® II | e0 | 活跃 | 3 (168 Hours) | 324 | 3A991 | 锡铅 | YES | 8542.39.00.01 | BOTTOM | BALL | 220 | 1.8V | 1mm | 30 | EPM2210 | S-PBGA-B324 | 不合格 | 1.89V | 1.5/3.31.8V | 1.71V | 系统内可编程 | 7 ns | MACROCELL | 1700 | YES | 1.71V~1.89V | 7ns | 2210 | 2.2mm | 19mm | 19mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||
 | XA95144XL-15CSG144I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 144-TFBGA, CSPBGA | 117 | -40°C~85°C TA | Tray | 2003 | XA9500XL XA | e1 | 活跃 | 3 (168 Hours) | 144 | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | BOTTOM | BALL | 260 | 3.3V | 30 | XA95144XL | 144 | 不合格 | 3.3V | 3.6V | 系统内可编程 | 15.5 ns | 15.5 ns | 8 | 3200 | 64.5MHz | 15 | MACROCELL | 144 | 3V~3.6V | 1.2mm | 12mm | 12mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||
 | LC4128C-75T128C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 92 | 表面贴装 | 表面贴装 | 128-LQFP | EEPROM | 0°C~90°C TJ | Tray | 2000 | ispMACH® 4000C | e0 | no | Obsolete | 3 (168 Hours) | 128 | EAR99 | YES | QUAD | 鸥翼 | 240 | 1.8V | 0.4mm | not_compliant | 30 | LC4128 | 128 | 不合格 | 1.8V | 系统内可编程 | 1.95V | 1.65V | 2mA | 2mA | 7.5 ns | 333MHz | MACROCELL | 128 | YES | 4 | 1.65V~1.95V | 7.5ns | 8 | 1.6mm | 14mm | 14mm | Non-RoHS Compliant | 无铅 | |||||||||||||||||||||||||||||||
 | XCR3384XL-12TQ144C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 118 | 表面贴装 | 144-LQFP | YES | 144 | EEPROM | 0°C~70°C TA | Bulk | 1996 | CoolRunner XPLA3 | e0 | no | 活跃 | 3 (168 Hours) | 144 | EAR99 | Tin/Lead (Sn85Pb15) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 225 | 3.3V | 0.5mm | 30 | 144 | 不合格 | 3.3V | 3.6V | In System Programmable (min 1K program/erase cycles) | 12 ns | 9000 | 83MHz | 12 | MACROCELL | 384 | YES | 3V~3.6V | 10.8ns | 24 | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
 | ATF1502AS-10AC44 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 32 | Lead, Tin | 表面贴装 | 表面贴装 | 44-TQFP | 44 | 44-TQFP (10x10) | EEPROM | 0°C~70°C TA | Tray | 1997 | ATF15xx | Obsolete | 3 (168 Hours) | 70°C | 0°C | 125MHz | ATF1502AS | 5V | In System Programmable (min 10K program/erase cycles) | 5.25V | 4.75V | 10 ns | 10 ns | 40 | 750 | 125MHz | 32 | 2 | 10 | 32 | 4.75V~5.25V | 10ns | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||
 | GAL20V8B-10LP | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 通孔 | 24-DIP (0.300, 7.62mm) | 24 | 8 | 0°C~75°C TA | Tube | 2000 | GAL®20V8 | e0 | Obsolete | 1 (Unlimited) | 24 | EAR99 | REGISTER PRELOAD; POWER-UP RESET | DUAL | 5V | 2.54mm | 62.5MHz | GAL20V8 | 24 | 8 | 5V | 5V | EE PLD | 5.25V | 4.75V | 115mA | 10 ns | 10 ns | PAL-TYPE | MACROCELL | 8 | 12 | 4.75V~5.25V | 64 | 5.334mm | 31.75mm | 7.62mm | 无 | Non-RoHS Compliant | 无铅 | |||||||||||||||||||||||||||||||||||
| CY37064P44-125AXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 99 Weeks | 37 | Gold, Tin | 表面贴装 | 表面贴装 | 44-LQFP | 44 | EEPROM | 0°C~70°C TA | Tray | 2003 | Ultra37000™ | e4 | Obsolete | 3 (168 Hours) | 44 | Nickel/Palladium/Gold (Ni/Pd/Au) | QUAD | 鸥翼 | 260 | 5V | 0.8mm | 125MHz | 20 | CY37064 | 44 | 5V | In-System Reprogrammable™ (ISR™) CMOS | 5.25V | 4.75V | 10μA | 10 ns | 10 ns | 2000 | 4 | 125 | MACROCELL | 64 | YES | 1 | 4.75V~5.25V | 1.6mm | 10mm | 10mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||
 | LC4256ZE-5TN144C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 96 | 表面贴装 | 表面贴装 | 144-LQFP | 144 | EEPROM | 0°C~90°C TJ | Tray | 2000 | ispMACH® 4000ZE | e3 | 活跃 | 3 (168 Hours) | 144 | EAR99 | Matte Tin (Sn) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 1.8V | 0.5mm | 277.78MHz | LC4256 | 144 | 1.8V | 系统内可编程 | 1.9V | 1.7V | 341μA | 341μA | 5.8 ns | 5.8 ns | 16 | MACROCELL | 256 | YES | 14 | 1.7V~1.9V | 1.6mm | 20mm | 20mm | 无 | ROHS3 Compliant | 无铅 |