类别是'嵌入式 - CPLD（复杂可编程逻辑器件）'
嵌入式 - CPLD（复杂可编程逻辑器件） (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 可编程类型 | 电压 | 最大电源电压 | 最小电源电压 | 工作电源电流 | 电源电流 | 最大电源电流 | 时钟频率 | 传播延迟 | 接通延迟时间 | 建筑学 | 输入数量 | 组织结构 | 逻辑元件/单元数 | 阀门数量 | 最高频率 | 可编程I/O数 | 速度等级 | 输出功能 | 宏细胞数 | JTAG BST | 专用输入数量 | 内部供电电压 | 延迟时间 tpd(1)最大 | 逻辑元素/块的数量 | 产品条款数量 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | EPM570ZM256C7N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 256-TFBGA | YES | 160 | 0°C~85°C TJ | Tray | MAX® II | e1 | 活跃 | 3 (168 Hours) | 256 | EAR99 | 锡银铜 | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.8V | 0.5mm | 40 | EPM570 | R-PBGA-B256 | 不合格 | 1.89V | 1.5/3.31.8V | 1.71V | 系统内可编程 | 15.1 ns | MACROCELL | 440 | YES | 1.71V~1.89V | 9ns | 570 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||
 | M4A3-256/128-7YC | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 128 | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | EEPROM | 0°C~70°C TA | Tray | 1998 | ispMACH® 4A | e0 | no | Obsolete | 3 (168 Hours) | 208 | EAR99 | Tin/Lead (Sn85Pb15) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 225 | 3.3V | 0.5mm | 30 | M4A3-256 | 208 | 不合格 | 3.3V | 系统内可编程 | 3.6V | 3V | 7.5 ns | 10000 | 125MHz | 97 | MACROCELL | 256 | YES | 14 | 3V~3.6V | 4.1mm | 28mm | 28mm | Non-RoHS Compliant | |||||||||||||||||||||||||||
 | LC4064V-5TN44I | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 30 | 表面贴装 | 表面贴装 | 44-TQFP | 44 | EEPROM | -40°C~105°C TJ | Tray | 2000 | ispMACH® 4000V | e3 | yes | 活跃 | 3 (168 Hours) | 44 | EAR99 | Matte Tin (Sn) | YES | QUAD | 鸥翼 | 260 | 3.3V | 0.8mm | 227.27MHz | 40 | LC4064 | 44 | 不合格 | 3.3V | 系统内可编程 | 3.6V | 3V | 12mA | 12mA | 5 ns | 4 | 352 | MACROCELL | 64 | YES | 2 | 3V~3.6V | 1.2mm | 10mm | 10mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||
 | XCR3256XL-12PQG208C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 164 | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | EEPROM | 0°C~70°C TA | Tray | 2003 | CoolRunner XPLA3 | e3 | yes | 活跃 | 3 (168 Hours) | 208 | EAR99 | Matte Tin (Sn) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 245 | 3.3V | 0.5mm | 30 | 208 | 不合格 | 3.3V | 3.6V | In System Programmable (min 1K program/erase cycles) | 12 ns | 16 | 6000 | 88MHz | 12 | MACROCELL | 256 | YES | 3V~3.6V | 10.8ns | 4.1mm | 28mm | 28mm | ROHS3 Compliant | |||||||||||||||||||||||||||
 | 5M1270ZT144I5 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 144-LQFP | YES | 114 | -40°C~100°C TJ | Tray | MAX® V | e0 | 活跃 | 3 (168 Hours) | 144 | 锡铅 | 8542.39.00.01 | QUAD | 鸥翼 | 未说明 | 1.8V | 0.5mm | 未说明 | 5M1270 | S-PQFP-G144 | 不合格 | 1.89V | 1.71V | 系统内可编程 | 201.1MHz | 10 ns | MACROCELL | 980 | 1.71V~1.89V | 6.2ns | 1270 | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
 | EPM7256SRC208-15N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 208-BFQFP Exposed Pad | YES | 164 | 0°C~70°C TA | Tray | MAX® 7000S | e3 | Obsolete | 3 (168 Hours) | 208 | EAR99 | MATTE TIN (472) OVER COPPER | CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 8542.39.00.01 | QUAD | 鸥翼 | 245 | 5V | 0.5mm | compliant | 40 | EPM7256 | S-PQFP-G208 | 不合格 | 5.25V | 3.3/55V | 4.75V | 系统内可编程 | 100MHz | 15 ns | 5000 | MACROCELL | 256 | YES | 4.75V~5.25V | 15ns | 16 | 4.1mm | 28mm | 28mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||
 | EPM7512BFI256-7 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 256-BGA | YES | 212 | -40°C~85°C TA | Tray | MAX® 7000B | e0 | Obsolete | 3 (168 Hours) | 256 | 3A991 | Tin/Lead (Sn/Pb) | YES | 8542.39.00.01 | BOTTOM | BALL | 220 | 2.5V | 1mm | compliant | 30 | EPM7512 | S-PBGA-B256 | 不合格 | 2.625V | 1.8/3.32.5V | 2.375V | 系统内可编程 | 163.9MHz | 5.5 ns | 10000 | MACROCELL | 512 | YES | 2.375V~2.625V | 7.5ns | 32 | 3.5mm | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
| XCR3512XL-12PQG208I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 180 | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | EEPROM | -40°C~85°C TA | Tray | 1996 | CoolRunner XPLA3 | e3 | yes | 活跃 | 3 (168 Hours) | 208 | EAR99 | Matte Tin (Sn) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 245 | 3.3V | 0.5mm | 30 | 208 | 不合格 | 3.3V | 3.6V | In System Programmable (min 1K program/erase cycles) | 12 ns | 32 | 12000 | 77MHz | 12 | MACROCELL | 512 | YES | 2.7V~3.6V | 10.8ns | 4.1mm | 28mm | 28mm | ROHS3 Compliant | |||||||||||||||||||||||||||
| EPM7128BFC256-4 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 256-BGA | YES | 100 | 0°C~70°C TA | Tray | MAX® 7000B | e0 | Obsolete | 3 (168 Hours) | 256 | 3A991 | Tin/Lead (Sn/Pb) | YES | BOTTOM | BALL | 220 | 2.5V | 1mm | compliant | 30 | EPM7128 | S-PBGA-B256 | 不合格 | 2.625V | 2.375V | 系统内可编程 | 243.9MHz | 4 ns | 2500 | MACROCELL | 128 | YES | 2.375V~2.625V | 4ns | 8 | 3.5mm | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
| EPM2210GF256I5 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 256-BGA | YES | 204 | -40°C~100°C TJ | Tray | MAX® II | e0 | 活跃 | 3 (168 Hours) | 256 | 3A991 | 锡铅 | YES | 8542.39.00.01 | BOTTOM | BALL | 220 | 1.8V | 1mm | 30 | EPM2210 | S-PBGA-B256 | 不合格 | 1.89V | 1.5/3.31.8V | 1.71V | 系统内可编程 | 11.2 ns | MACROCELL | 1700 | YES | 1.71V~1.89V | 7ns | 2210 | 2.2mm | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
| XCR3512XL-10PQ208I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 180 | 表面贴装 | 208-BFQFP | YES | EEPROM | -40°C~85°C TA | Bulk | 1996 | CoolRunner XPLA3 | e0 | no | 活跃 | 3 (168 Hours) | 208 | EAR99 | Tin/Lead (Sn85Pb15) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 225 | 3.3V | 0.5mm | 30 | 208 | S-PQFP-G208 | 不合格 | 3.3V | 3.6V | In System Programmable (min 1K program/erase cycles) | 10 ns | 12000 | 97MHz | 10 | MACROCELL | 512 | YES | 2.7V~3.6V | 9ns | 32 | 4.1mm | 28mm | 28mm | Non-RoHS Compliant | |||||||||||||||||||||||||||
 | EPM240ZM68C6N | Intel | 数据表 | 5230 In Stock |
| 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 68-TFBGA | YES | 54 | 0°C~85°C TJ | Tray | MAX® II | e1 | 活跃 | 3 (168 Hours) | 68 | EAR99 | 锡银铜 | IT CAN ALSO OPERATE AT 3.3V | BOTTOM | BALL | 260 | 1.8V | 0.5mm | 40 | EPM240 | R-PBGA-B68 | 不合格 | 1.89V | 1.5/3.31.8V | 1.71V | 系统内可编程 | 7.9 ns | 0 DEDICATED INPUTS | MACROCELL | 192 | YES | 1.71V~1.89V | 7.5ns | 240 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||
 | EPM3256AQC208-7 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 208-BFQFP | YES | 158 | 0°C~70°C TA | Tray | MAX® 3000A | e0 | Obsolete | 3 (168 Hours) | 208 | Tin/Lead (Sn/Pb) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 220 | 3.3V | 0.5mm | 30 | EPM3256 | S-PQFP-G208 | 不合格 | 3.6V | 2.5/3.33.3V | 3V | 系统内可编程 | 126.6MHz | 7.5 ns | 5000 | MACROCELL | 256 | YES | 3V~3.6V | 7.5ns | 16 | 4.1mm | 28mm | 28mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
| LC4064V-75T44C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 30 | 表面贴装 | 表面贴装 | 44-TQFP | 44 | EEPROM | 0°C~90°C TJ | Tray | 2000 | ispMACH® 4000V | e0 | no | Obsolete | 3 (168 Hours) | 44 | EAR99 | Tin/Lead (Sn85Pb15) | YES | QUAD | 鸥翼 | 240 | 3.3V | 0.8mm | not_compliant | 178.57MHz | 30 | LC4064 | 44 | 不合格 | 3.3V | 系统内可编程 | 3.6V | 3V | 12mA | 12mA | 7.5 ns | 4 | 388 | MACROCELL | 64 | YES | 2 | 3V~3.6V | 1.2mm | 10mm | 10mm | Non-RoHS Compliant | 无铅 | ||||||||||||||||||||||||
 | EPM7128SLC84-7N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 84-LCC (J-Lead) | YES | 68 | 0°C~70°C TA | Tray | MAX® 7000S | e3 | Obsolete | 3 (168 Hours) | 84 | EAR99 | Matte Tin (Sn) | CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | QUAD | J BEND | 245 | 5V | 1.27mm | compliant | 40 | EPM7128 | 不合格 | 5.25V | 3.3/55V | 4.75V | 系统内可编程 | 166.7MHz | 7.5 ns | 2500 | MACROCELL | 128 | YES | 4.75V~5.25V | 7.5ns | 8 | 29.3116mm | 29.3116mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
 | LC4512V-75T176C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 128 | 表面贴装 | 表面贴装 | 176-LQFP | 176 | EEPROM | 0°C~90°C TJ | Tray | 2000 | ispMACH® 4000V | e0 | no | Obsolete | 3 (168 Hours) | 176 | EAR99 | Tin/Lead (Sn85Pb15) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 225 | 3.3V | 0.5mm | 178.57MHz | 30 | LC4512 | 176 | 3.3V | 系统内可编程 | 3.6V | 3V | 14mA | 14mA | 7.5 ns | 7.5 ns | 36 | 100 | MACROCELL | 512 | YES | 4 | 3V~3.6V | 32 | 1.6mm | 24mm | 24mm | 无 | Non-RoHS Compliant | 无铅 | ||||||||||||||||||||||
 | GAL16V8D-15QJN | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 20-LCC (J-Lead) | 20 | 8 | 0°C~75°C TA | Bulk | 1996 | GAL®16V8 | e3 | yes | Obsolete | 1 (Unlimited) | 20 | EAR99 | Matte Tin (Sn) | QUAD | J BEND | 250 | 5V | 1.27mm | 62.5MHz | 40 | GAL16V8 | 20 | 8 | 5V | 5V | EE PLD | 5V | 5.25V | 4.75V | 55mA | 55mA | 15 ns | 15 ns | PAL-TYPE | 16 | MACROCELL | 8 | 8 | 4.75V~5.25V | 64 | 4.572mm | 无 | 无SVHC | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||
 | EPM7032LC44-15 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 44-LCC (J-Lead) | 36 | 0°C~70°C TA | Tray | MAX® 7000 | Obsolete | 1 (Unlimited) | EPM7032 | EE PLD | 600 | 32 | 4.75V~5.25V | 15ns | 2 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EPM7256BFC256-5 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 256-BGA | YES | 164 | 0°C~70°C TA | Tray | MAX® 7000B | e0 | Obsolete | 3 (168 Hours) | 256 | EAR99 | Tin/Lead (Sn/Pb) | YES | 8542.39.00.01 | BOTTOM | BALL | 220 | 2.5V | 1mm | compliant | 30 | EPM7256 | 不合格 | 2.625V | 1.8/3.32.5V | 2.375V | 系统内可编程 | 188.7MHz | 5 ns | 5000 | MACROCELL | 256 | YES | 2.375V~2.625V | 5ns | 16 | 3.5mm | 17mm | 17mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||
 | XC95144-15PQ100I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 81 | 表面贴装 | 表面贴装 | 100-BQFP | 100 | FLASH | -40°C~85°C TA | Tray | 1996 | XC9500 | e0 | no | Obsolete | 3 (168 Hours) | 100 | EAR99 | YES | QUAD | 鸥翼 | 225 | 5V | 0.65mm | 30 | XC95144 | 100 | 5V | In System Programmable (min 10K program/erase cycles) | 15 ns | 15 ns | 8 | 3200 | 55.6MHz | 15 | MACROCELL | 144 | YES | 4.5V~5.5V | 3.4mm | 20mm | 14mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||
| EPM7032SLC44-10N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 44-LCC (J-Lead) | 36 | 0°C~70°C TA | Tray | 1998 | MAX® 7000S | Obsolete | 3 (168 Hours) | EPM7032 | 系统内可编程 | 600 | 32 | 4.75V~5.25V | 10ns | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | GAL16V8D-25QP | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 通孔 | 20-DIP (0.300, 7.62mm) | 20 | 8 | 0°C~75°C TA | Bulk | 1996 | GAL®16V8 | e0 | no | Obsolete | 3 (168 Hours) | 20 | EAR99 | Tin/Lead (Sn/Pb) | DUAL | 225 | 5V | 2.54mm | 41.6MHz | 30 | GAL16V8 | 20 | 8 | 5V | 5V | EE PLD | 5.25V | 4.75V | 75mA | 55mA | 25 ns | 25 ns | PAL-TYPE | MACROCELL | 8 | 8 | 4.75V~5.25V | 64 | 5.334mm | 26.162mm | 7.62mm | 无 | Non-RoHS Compliant | 无铅 | ||||||||||||||||||||||||||
 | M4A3-64/64-10VNI | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 64 | 表面贴装 | 表面贴装 | 100-LQFP | 100 | EEPROM | -40°C~85°C TA | Tray | 1998 | ispMACH® 4A | e3 | yes | 不用于新设计 | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 未说明 | M4A3-64 | 100 | 不合格 | 3.3V | 系统内可编程 | 3.6V | 3V | 10 ns | 10 ns | 2500 | 100MHz | 97 | MACROCELL | 64 | YES | 3V~3.6V | 1.6mm | 14mm | 14mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||
 | LC4256C-5FT256AI | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 128 | 表面贴装 | 表面贴装 | 256-LBGA | EEPROM | -40°C~105°C TJ | Tray | 2000 | ispMACH® 4000C | e0 | no | Obsolete | 3 (168 Hours) | 256 | EAR99 | Tin/Lead (Sn63Pb37) | YES | 8542.39.00.01 | BOTTOM | BALL | 225 | 1.8V | 1mm | not_compliant | 227.27MHz | 30 | LC4256 | 256 | 不合格 | 1.8V | 系统内可编程 | 1.95V | 1.65V | 2.5mA | 2.5mA | 5 ns | 36 | 160 | MACROCELL | 256 | YES | 4 | 1.65V~1.95V | 16 | Non-RoHS Compliant | 无铅 | ||||||||||||||||||||||||||
 | XCR3512XL-7FT256C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 212 | 表面贴装 | 256-LBGA | YES | 256 | EEPROM | 0°C~70°C TA | Bulk | 1996 | CoolRunner XPLA3 | e0 | no | 活跃 | 3 (168 Hours) | 256 | 3A991.D | YES | 8542.39.00.01 | BOTTOM | BALL | 240 | 3.3V | 1mm | 30 | 256 | 3.3V | 3.6V | In System Programmable (min 1K program/erase cycles) | 7.5 ns | 12000 | 135MHz | 7 | MACROCELL | 512 | YES | 3V~3.6V | 7ns | 32 | 1.55mm | 无 | Non-RoHS Compliant |